CN201994282U - Composite material heat sink assembly with heat-dissipating structure for electronic packaging - Google Patents
Composite material heat sink assembly with heat-dissipating structure for electronic packaging Download PDFInfo
- Publication number
- CN201994282U CN201994282U CN201020650449XU CN201020650449U CN201994282U CN 201994282 U CN201994282 U CN 201994282U CN 201020650449X U CN201020650449X U CN 201020650449XU CN 201020650449 U CN201020650449 U CN 201020650449U CN 201994282 U CN201994282 U CN 201994282U
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- China
- Prior art keywords
- composite material
- heat sink
- electronic packaging
- heat
- water pipe
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of electronic packaging, and discloses an electronic package composite material heat sink assembly with a heat-dissipating structure for electronic packaging, comprising a composite material heat sink and a residual metal layer which are integrally formed, wherein a cooling tube is arranged in the residual metal layer, cooling liquid is arranged in the cooling tube, a recess for placing a semiconductor chip is arranged at the middle position on the surface of the composite material heat sink, and an insulating layer is arranged on the composite material heat sink. In the utility model, as the composite material heat sink is made of a high-heat-conduction and low-expansion material, the heat produced by the chip can be quickly transmitted; as the residual metal layer and the composite material heat sink are integral formed, a welding layer between the heat sink and a base plate in the original structure is avoided, the heat resistance is reduced, and the heat radiating is facilitated; as the cooling tube is arranged, the structure for connecting the heat-dissipating assembly at the outer part of the base plate is simplified, and the lightweight is realized; and as the heat dissipation is carried out by adopting the mode of cooling liquid, the heat-dissipating efficiency is higher, and the junction temperature of the chip can be more remarkably reduced.
Description
Technical field
The utility model belongs to the used for electronic packaging technical field, particularly a kind of heat sink assembly of used for electronic packaging composite material that has radiator structure.
Background technology
Along with integrated circuit develops to high density, miniaturization and multifunction direction, Electronic Packaging is had higher requirement.The basic structure of Electronic Packaging as shown in Figure 1 at present, the chip (1a) that at first will have sapphire or SiC substrate is welded on the copper heat sink (3a), and then be welded on the aluminium alloy base plate (5a) that has line layer, aluminium alloy base plate is welded on the outside radiating subassembly (7a) again.The heat of chip conducts to heat sink then to substrate by interior heat passage, substrate conducts to heat outside radiating subassembly again, and radiating subassembly is by cross-ventilation or outside heat loss through radiation.Each assembly connects by the mode of welding in this structure, because the thermal conductivity of soldering paste is lower, thermal resistance is very big, causes heat effectively not shed, and becomes the major obstacle of restriction chip to high-power development.And along with the continuous increase of chip power, the heat sinking function of the radiating subassembly that is connected with substrate certainly will strengthen, and its volume and quality will constantly increase, and it is complicated more that structure also can become.Therefore, researching and developing more, the material and the better structure of design heat radiation of high thermal conductivity become the inexorable trend of electronic component to high power and miniaturization development.
Summary of the invention
Technical problem to be solved in the utility model provide a kind of rational in infrastructure, good heat dissipation effect, thermal resistance low, be complementary with chip, the heat sink assembly of used for electronic packaging high-thermal-conductivity low-expansibility compound material that has radiator structure of lightweight, long service life.
The technical scheme that its technical problem that solves the utility model adopts:
A kind of heat sink assembly of used for electronic packaging composite material that has radiator structure, it is heat sink by composite material, kish layer, cooling water pipe, insulating barrier and semiconductor chip are formed, described composite material is heat sink and described kish layer is formed in one, middle no any tack coat, described kish layer inside is provided with described cooling water pipe, in the described cooling water pipe cooling fluid is set, described composite material is heat sink to be provided with described insulating barrier, and the heat sink upper surface of described composite material is provided with a depression and places semiconductor chip.Described depression can be located at place, the heat sink upper surface of described composite material centre position.
The heat sink material of described composite material is the composite material with high heat conduction, low expansion character.
Preferred diamond/the copper of the heat sink material of described composite material, diamond/aluminium, diamond/silver or carbon fiber/copper/aluminium/silver.
Described cooling water pipe cross section is circular, trapezoidal, square, V-type or other conic sections, and the longitudinal section is continuous U font, continuous V font, continuous trapezoidal or Great Wall shape.
The nozzle diameter of described cooling water pipe can be 60 μ m～5mm.
The water inlet of described cooling water pipe and delivery port can be arranged on the bottom or the side of described kish layer.
The cooling fluid of described cooling water pipe inside can be water, methyl alcohol, ethanol, liquid nitrogen, glycol or other have the liquid of cooling effect.
Described insulating barrier be plated on described composite material heat sink on.
The beneficial effects of the utility model are as follows:
(1) the heat sink assembly of used for electronic packaging high-thermal-conductivity low-expansibility compound material that has radiator structure of the present invention, the heat sink assembly of forming by gradient composites (high-thermal-conductivity low-expansibility compound material layer and metal) and water-cooling channel; Because the high heat conduction of the heat sink employing of composite material, low-expansion material are made, can transmit the heat that chip produces fast, be complementary with the chip thermal coefficient of expansion simultaneously, reduce thermal stress, avoid reducing because of thermal mismatching causes chip rupture damage, intensity decreases, resistance to sudden heating, produce various defectives such as encapsulation crackle, cavity, passivation and absciss layer, prolonged useful life.
(2) metal remained layer and composite material are heat sink one-body molded, middle no any tack coat; Avoid the weld layer between the heat sink and substrate in the original structure, reduced thermal resistance, helped heat radiation.
(3) the inner precision optical machinery of metal remained layer is processed into cooling water pipe, simplified in the outside structure that connects radiating subassembly of substrate, realized lightweight.
(4) adopt the mode of liquid cools to dispel the heat, radiating efficiency is higher, and junction temperature of chip reduces more obvious.
Description of drawings
Fig. 1 is the typical encapsulating structure schematic diagram of tradition.
Fig. 2 is the structural representation of embodiment 1 of the present utility model.
Fig. 3 is the structural representation of embodiment 2 of the present utility model.
Number in the figure:
In Fig. 1, the 1a-chip, the 2a-weld layer, 3a-is heat sink, 4a-weld layer, 5a-substrate, 6a-weld layer, the outside radiating subassembly of 7a-.
In Fig. 2,3, the 1-composite material is heat sink, 2-kish layer, 3-cooling water pipe, the heat sink insulating barrier of 4-, 5-chip.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing:
Embodiment 1 (see figure 2):
As shown in Figure 2, present embodiment has the heat sink assembly of used for electronic packaging composite material of radiator structure, and it is heat sink 1 by composite material, kish layer 2, cooling water pipe 3, insulating barrier 4 and semiconductor chip 5 are formed; Composite material is heat sink 1 to be formed in one middle no any tack coat with kish layer 2; Kish layer 2 inner precision optical machinery are processed with cooling water pipe 3, in the cooling water pipe 3 cooling fluid are set, and composite material is heat sink 1 to be provided with insulating barrier 4, and composite material is heat sink, and place, 1 upper surface centre position is provided with a depression places semiconductor chip 5.
Described composite material is heat sink 1 to be the diamond/carbon/carbon-copper composite material of high-thermal-conductivity low-expansibility.
Described remained on surface metal level 2 inner precision machined cooling water pipe 3 cross sections are Great Wall shape for circular, longitudinal section.
The nozzle diameter of described cooling water pipe 3 is 2mm.
The water inlet of described cooling water pipe 3 and delivery port are in the bottom of kish layer 2.
The cooling fluid of described cooling water pipe 3 inside is a water.
The electronic encapsulation device heat sink with adopting tradition compared, and the junction temperature of chip of the electronic encapsulation device that the composite material that adopts this to have radiator structure is heat sink reduces about 20%.
Embodiment 2 (see figure 3)s:
As shown in Figure 3, embodiment 2 composite material heat sink 1 as different from Example 1 is the carbon fiber/silver composite material of high-thermal-conductivity low-expansibility, the longitudinal section of cooling water pipe 3 is continuous V font, and the nozzle diameter of cooling water pipe 3 is 1mm, and the cooling fluid of cooling water pipe 3 inside is an ethanol.
Claims (9)
1. heat sink assembly of used for electronic packaging composite material that has radiator structure, it is characterized in that: it is by composite material heat sink (1), kish layer (2), cooling water pipe (3), insulating barrier (4) and semiconductor chip (5) are formed, described composite material is heat sink (1) and described kish layer (2) is formed in one, middle no any tack coat, described kish layer (2) inside is provided with described cooling water pipe (3), described cooling water pipe is provided with cooling fluid in (3), described composite material is heat sink (1) is provided with described insulating barrier (4), and described composite material is heat sink (1), and upper surface is provided with depression placement semiconductor chip (5).
2. the heat sink assembly of used for electronic packaging composite material that has radiator structure according to claim 1, it is characterized in that: described composite material is heat sink (1), and material is the composite material with high heat conduction, low expansion character.
3. the heat sink assembly of used for electronic packaging composite material that has radiator structure according to claim 4 is characterized in that: material that described composite material is heat sink (1) is diamond/copper, diamond/aluminium, diamond/silver or is carbon fiber/copper/aluminium/silver.
4. the heat sink assembly of used for electronic packaging composite material that has radiator structure according to claim 1, it is characterized in that: described cooling water pipe (3) cross section is circular, trapezoidal, square, V-type or other conic sections, and the longitudinal section is continuous U font, continuous V font, continuous trapezoidal or Great Wall shape.
5. the heat sink assembly of used for electronic packaging composite material that has radiator structure according to claim 1 is characterized in that: the nozzle diameter of described cooling water pipe (3) is 60 μ m～5mm.
6. the heat sink assembly of used for electronic packaging composite material that has radiator structure according to claim 1, it is characterized in that: the water inlet of described cooling water pipe (3) and delivery port are arranged on the bottom or the side of described kish layer (2).
7. the heat sink assembly of used for electronic packaging composite material that has radiator structure according to claim 1 is characterized in that: the inner cooling fluid of described cooling water pipe (3) is that water, methyl alcohol, ethanol, liquid nitrogen, glycol or other have the liquid of cooling effect.
8. the heat sink assembly of used for electronic packaging composite material that has radiator structure according to claim 1 is characterized in that: described insulating barrier (4) is plated on the described composite material heat sink (1).
9. the heat sink assembly of used for electronic packaging composite material that has radiator structure according to claim 1 is characterized in that: described depression is located at place, described composite material heat sink (1) upper surface centre position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020650449XU CN201994282U (en) | 2010-12-03 | 2010-12-03 | Composite material heat sink assembly with heat-dissipating structure for electronic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020650449XU CN201994282U (en) | 2010-12-03 | 2010-12-03 | Composite material heat sink assembly with heat-dissipating structure for electronic packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201994282U true CN201994282U (en) | 2011-09-28 |
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ID=44670762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020650449XU Expired - Lifetime CN201994282U (en) | 2010-12-03 | 2010-12-03 | Composite material heat sink assembly with heat-dissipating structure for electronic packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201994282U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870086A (en) * | 2016-05-23 | 2016-08-17 | 深圳市瑞世兴科技有限公司 | Composite heat sink assembly for electronic packaging |
| CN108831986A (en) * | 2018-05-07 | 2018-11-16 | 深圳技术大学（筹） | heat sink device and preparation method thereof |
| CN109411426A (en) * | 2017-08-16 | 2019-03-01 | 马勒国际有限公司 | Cooling device and method for producing cooling device |
| CN110335854A (en) * | 2019-06-17 | 2019-10-15 | 中国科学院微电子研究所 | A kind of forced convertion fluid channel radiator structure, manufacturing method and electronic device |
-
2010
- 2010-12-03 CN CN201020650449XU patent/CN201994282U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870086A (en) * | 2016-05-23 | 2016-08-17 | 深圳市瑞世兴科技有限公司 | Composite heat sink assembly for electronic packaging |
| CN109411426A (en) * | 2017-08-16 | 2019-03-01 | 马勒国际有限公司 | Cooling device and method for producing cooling device |
| CN108831986A (en) * | 2018-05-07 | 2018-11-16 | 深圳技术大学（筹） | heat sink device and preparation method thereof |
| CN110335854A (en) * | 2019-06-17 | 2019-10-15 | 中国科学院微电子研究所 | A kind of forced convertion fluid channel radiator structure, manufacturing method and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190411 Address after: 101407 No. 11 Xingke East Street, Yanqi Economic Development Zone, Huairou District, Beijing Patentee after: Research Institute of engineering and Technology Co., Ltd. Address before: 100088, 2, Xinjie street, Beijing Patentee before: General Research Institute for Nonferrous Metals |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110928 |