CN105870086A - Composite heat sink assembly for electronic packaging - Google Patents
Composite heat sink assembly for electronic packaging Download PDFInfo
- Publication number
- CN105870086A CN105870086A CN201610346207.3A CN201610346207A CN105870086A CN 105870086 A CN105870086 A CN 105870086A CN 201610346207 A CN201610346207 A CN 201610346207A CN 105870086 A CN105870086 A CN 105870086A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- carbon
- diamond
- copper composite
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3732—Diamonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
Abstract
The invention provides a composite heat sink assembly for electronic packaging. The composite heat sink assembly comprises a diamond and copper composite heat sink, a metal layer, an insulating layer, a fan and a semiconductor chip, wherein the metal layer is located under the diamond and copper composite heat sink and integrally formed with the diamond and copper composite heat sink; the diamond and copper composite heat sink is further connected with the fan; the outer surface of the diamond and copper composite heat sink is coated with the insulating layer; the upper surface of the diamond and copper composite heat sink is sunken to form a recess, and the semiconductor chip is arranged in the recess. The heat sink assembly has a good heat dissipation effect, and the service life of the heat sink assembly is prolonged.
Description
Technical field
The invention belongs to technical field of electronic encapsulation, be specifically related to heat sink group of a kind of composite used for electronic packaging
Part.
Background technology
In recent years, along with computer microprocessor (CPU) is gradually towards miniaturization, multifunction and high frequency
Trend development, relatively, the heat (heat generation density) that its unit volume is shed is the highest, therefore
The problem of electronic radiation the most more and more comes into one's own.Micro-place is damaged for avoiding accumulation of heat to cause temperature too high
Reason device, generally installs radiator on CPU additional, and increases its heat biography with fan forced air convection current.How
Coordination fansink designs parameter promotes its integral heat sink efficiency thus effectively reduces cpu temperature, is current electronics
The important key subject that thermal design industry is faced.
Current electronic equipment damages it and is primarily due to caused by its heat dissipation problem, such as i Phone heat radiation
System just has precedence over Samsung mobile phone, and Samsung mobile phone the situation such as card machine, deadlock easily occurs because of heating problem,
Additionally Android system also results in heating affects system operation.Computer, mobile phone cpu heat, by tungsten-copper material
Material, aluminum alloy materials and fan composition, its heat radiation once goes wrong and results in CPU and burn out, computer, hands
Machine cannot be started up.General 70 DEG C of the operating temperature of IC, the temperature of radiator can reach 80 DEG C, radiator periphery
Temperature can reach 90 DEG C, if we can control IC with extraneous temperature is all 70 DEG C, thus can prolong
The service life of long radiator always extends the service life of electronic equipment.
Summary of the invention
For solving the problem of existing heat sink component heat dispersion difference, the present invention proposes a kind of used for electronic packaging compound
Material is heat sink assembly, this is heat sink, and assembly radiating is effective, extends the service life of heat sink assembly.
The technical scheme is that and be achieved in that:
A kind of heat sink assembly of composite used for electronic packaging, metal level heat sink including diamond carbon/carbon-copper composite material,
Insulating barrier, fan and semiconductor chip, described metal level be positioned at described diamond carbon/carbon-copper composite material heat sink below,
And it is heat sink one-body molded with described diamond carbon/carbon-copper composite material；Described diamond carbon/carbon-copper composite material is heat sink also with
Described fan connects, and the described heat sink outer surface of diamond carbon/carbon-copper composite material is also coated with described insulating barrier, described
The upper surface depression that diamond carbon/carbon-copper composite material is heat sink forms depression, and described semiconductor chip is placed on described recessed
In cave.
Further, the material that described diamond carbon/carbon-copper composite material is heat sink is diamond carbon/carbon-copper composite material, its thermal conductance
Rate >=500W/ (m.K), thermal coefficient of expansion is 6.4 ± 1.0 × 10-6M/K, bending strength >=450Mpa；Surface
Roughness≤1.6.
Further, described depression is located at the upper surface middle position that described diamond carbon/carbon-copper composite material is heat sink.
Beneficial effects of the present invention:
1, diamond carbon/carbon-copper composite material is for having high thermal conductivity, low-expansion coefficient, the composite wood that mechanical strength is high
Material, can quickly transmit the heat that chip produces, and matches with chip CTE simultaneously, reduces thermal stress,
Avoid because thermal mismatching causes chip rupture damage, intensity decline, resistance to sudden heating to reduce, generation encapsulation crackle,
The various defects such as cavity, passivation and absciss layer, extend service life, chip temperature can be made to reduce by 20% left
Right.
2, diamond carbon/carbon-copper composite material is heat sink reduces thermal resistance with metal level is one-body molded, is conducive to heat radiation.
3, diamond carbon/carbon-copper composite material is heat sink is joined directly together can chip heat be derived efficiently with fan.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to enforcement
In example or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, describe below
In accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, do not paying
On the premise of going out creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of the present invention heat sink assembly of composite used for electronic packaging.
Accompanying drawing indicates: 1, diamond carbon/carbon-copper composite material is heat sink, and 2, metal level, 3, insulating barrier, 4, fan,
5, semiconductor chip.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly
Chu, be fully described by, it is clear that described embodiment be only a part of embodiment of the present invention rather than
Whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creation
The every other embodiment obtained under property work premise, broadly falls into the scope of protection of the invention.
Reference Fig. 1, a kind of heat sink assembly of composite used for electronic packaging, heat sink including diamond carbon/carbon-copper composite material
1, metal level 2, insulating barrier 3, fan 4 and semiconductor chip 5.Metal level 2 is positioned at diamond composite copper material
Expect below heat sink 1, and heat sink with diamond carbon/carbon-copper composite material 1 one-body molded.Diamond carbon/carbon-copper composite material
Heat sink 1 is also connected with fan 4.Diamond carbon/carbon-copper composite material is heat sink, and 1 outer surface is also coated with insulating barrier 3.Gold
Hard rock carbon/carbon-copper composite material is heat sink 1 upper surface intermediate recess formed depression, semiconductor chip 5 is placed on recessed
In cave.Diamond carbon/carbon-copper composite material is heat sink 1 material be diamond carbon/carbon-copper composite material, its thermal conductivity
>=500W/ (m.K), thermal coefficient of expansion is 6.4 ± 1.0 × 10-6M/K, bending strength >=450Mpa；Surface is thick
Rugosity≤1.6.
Diamond carbon/carbon-copper composite material for having high thermal conductivity, low-expansion coefficient, the composite that mechanical strength is high,
Can quickly transmit the heat that chip produces, match with chip CTE simultaneously, reduce thermal stress, keep away
Exempt from because thermal mismatching causes chip rupture damage, intensity decline, resistance to sudden heating to reduce, generation encapsulation crackle,
The various defects such as cavity, passivation and absciss layer, extend service life, chip temperature can be made to reduce by 20% left
Right.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all at this
Within bright spirit and principle, any modification, equivalent substitution and improvement etc. made, should be included in this
Within bright protection domain.
Claims (3)
1. the heat sink assembly of composite used for electronic packaging, it is characterised in that include diamond composite copper material
Expecting heat sink, metal level, insulating barrier, fan and semiconductor chip, described metal level is positioned at described diamond copper
Below composite is heat sink and heat sink one-body molded with described diamond carbon/carbon-copper composite material；Described diamond
Carbon/carbon-copper composite material is heat sink to be also connected with described fan, and the described heat sink outer surface of diamond carbon/carbon-copper composite material also coats
Having described insulating barrier, upper surface that described diamond carbon/carbon-copper composite material is heat sink depression forms depression, described partly leads
Body chip is placed in described depression.
The heat sink assembly of composite used for electronic packaging the most according to claim 1, it is characterised in that institute
Stating the heat sink material of diamond carbon/carbon-copper composite material is diamond carbon/carbon-copper composite material, its thermal conductivity >=500W/ (m.K),
Thermal coefficient of expansion is 6.4 ± 1.0 × 10-6M/K, bending strength >=450Mpa；Surface roughness≤1.6.
The heat sink assembly of composite used for electronic packaging the most according to claim 1 and 2, it is characterised in that
Described depression is located at the upper surface middle position that described diamond carbon/carbon-copper composite material is heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610346207.3A CN105870086A (en) | 2016-05-23 | 2016-05-23 | Composite heat sink assembly for electronic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610346207.3A CN105870086A (en) | 2016-05-23 | 2016-05-23 | Composite heat sink assembly for electronic packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105870086A true CN105870086A (en) | 2016-08-17 |
Family
ID=56634510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610346207.3A Pending CN105870086A (en) | 2016-05-23 | 2016-05-23 | Composite heat sink assembly for electronic packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105870086A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539993A (en) * | 2021-07-07 | 2021-10-22 | 江西龙芯微科技有限公司 | Integrated semiconductor device and method of manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101692448A (en) * | 2009-09-30 | 2010-04-07 | 李峰 | Multi-chip LED centralized-encapsulated radiating structure and encapsulation technology thereof |
| CN201994282U (en) * | 2010-12-03 | 2011-09-28 | 北京有色金属研究总院 | Composite material heat sink assembly with heat-dissipating structure for electronic packaging |
| CN102487052A (en) * | 2010-12-03 | 2012-06-06 | 北京有色金属研究总院 | Composite material packaging assembly with integration of chip substrate, heat sink and substrate and manufacture method thereof |
-
2016
- 2016-05-23 CN CN201610346207.3A patent/CN105870086A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101692448A (en) * | 2009-09-30 | 2010-04-07 | 李峰 | Multi-chip LED centralized-encapsulated radiating structure and encapsulation technology thereof |
| CN201994282U (en) * | 2010-12-03 | 2011-09-28 | 北京有色金属研究总院 | Composite material heat sink assembly with heat-dissipating structure for electronic packaging |
| CN102487052A (en) * | 2010-12-03 | 2012-06-06 | 北京有色金属研究总院 | Composite material packaging assembly with integration of chip substrate, heat sink and substrate and manufacture method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539993A (en) * | 2021-07-07 | 2021-10-22 | 江西龙芯微科技有限公司 | Integrated semiconductor device and method of manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160817 |
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| RJ01 | Rejection of invention patent application after publication |