CN208489182U - A kind of New chip heat dissipating double-fuselage - Google Patents
A kind of New chip heat dissipating double-fuselage Download PDFInfo
- Publication number
- CN208489182U CN208489182U CN201820922745.7U CN201820922745U CN208489182U CN 208489182 U CN208489182 U CN 208489182U CN 201820922745 U CN201820922745 U CN 201820922745U CN 208489182 U CN208489182 U CN 208489182U
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- China
- Prior art keywords
- cooling fin
- heat
- chip
- bulge
- heat dissipating
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Abstract
The utility model discloses a kind of New chip heat dissipating double-fuselages, if being connected between adjacent cooling fin by heat bulge, and linked together by way of bonding between cooling fin and heat bulge including the dry plate cooling fin for connecting chip；The inner transverse of the cooling fin is provided with several thermal vias, and thermal vias runs through cooling fin；Several radiating fins are provided on the lower surface of the cooling fin；The two sides of the cooling fin are connected separately with U-shaped radiator.Cooling fin and heat bulge segmentation design are cooperated the U-shaped radiator of side, considerably increase heat dissipation area, ensure that heat dissipation effect, also ensure the normal work of chip by the utility model is designed reasonably, the popularization suitable for large area.
Description
Technical field
The utility model belongs to chip heat radiator field, more specifically to a kind of New chip heat dissipating double-fuselage.
Background technique
As integrated circuit function is stronger and stronger, the volume of electronic equipment is smaller and smaller.To which component is in circuit board
On heat dissipation become a problem.Each enterprise is working hard for the heat dissipation of component operation.
In current design, many enterprises can be laid with one piece of heat dissipation copper sheet in back of circuit board, and such purpose is logical
It crosses copper sheet to come the heat importing of chip, then radiate, it is increasing then as power device integrated level, it is this kind of to set
Meter has been unsatisfactory for the cooling requirements of component in some cases, and it is higher sometimes to will lead to chip temperature, chip failure.
Summary of the invention
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of heat dissipations of novel chip to fill
It sets, design rationally, by cooling fin and heat bulge segmentation design, cooperates the U-shaped radiator of side, considerably increases radiating surface
Product, ensure that heat dissipation effect, also ensures the normal work of chip, the popularization suitable for large area.
To achieve the above object, the utility model provides following technical solution:
A kind of New chip heat dissipating double-fuselage, it is corresponding with chip, it is characterised in that: if including the dry plate heat dissipation for connecting chip
Piece is connected between adjacent cooling fin by heat bulge, and is connected by way of bonding between cooling fin and heat bulge
Together；The inner transverse of the cooling fin is provided with several thermal vias, and thermal vias runs through cooling fin；The cooling fin
Several radiating fins are provided on lower surface；The two sides of the cooling fin are connected separately with U-shaped radiator.
As a kind of technical solution of optimization, the heat bulge and cooling fin integrated design are manufactured；The heat bulge
It is the heat bulge made of copper sheet or aluminum alloy materials and cooling fin with cooling fin.
As a kind of technical solution of optimization, the diameter of the thermal vias is a quarter of fin thickness to five points
One of.
As a kind of technical solution of optimization, the U-shaped radiator includes the U-shaped heat dissipation for being bonded in cooling fin two sides
Piece is provided with the additional heat sink that length is 1-3cm on the outside of U-shaped cooling fin.
As a kind of technical solution of optimization, the U-shaped cooling fin includes two straight plate parts of straight plate part and connection of two sides
Bending section；The radian of bending section is between 30 ° -50 °.
By adopting the above-described technical solution, compared with prior art, the utility model is designed reasonably by cooling fin and dissipates
Hot protrusion segmentation design, cooperates the U-shaped radiator of side, considerably increases heat dissipation area, ensure that heat dissipation effect, also guarantee
The normal work of chip, popularization suitable for large area.
The utility model is described further referring to drawings and examples.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of embodiment of the utility model.
Specific embodiment
Embodiment
As shown in Figure 1, a kind of New chip heat dissipating double-fuselage, corresponding with chip, if including the dry plate heat dissipation for connecting chip
Piece 4 is connected by heat bulge 5 between adjacent cooling fin 4, and between cooling fin 4 and heat bulge 5 by way of bonding
It links together.The heat bulge 4 and cooling fin 5 are the heat bulge made of copper sheet or aluminum alloy materials and heat dissipation
Piece.
The inner transverse of the cooling fin 4 is provided with several thermal vias 6, and thermal vias 6 runs through cooling fin.The heat dissipation
The diameter of through-hole is a quarter of fin thickness to 1/5th.
Several radiating fins 7 are provided on the lower surface of the cooling fin 4.The two sides of the cooling fin 4 are connected separately with U
Type radiator.
The U-shaped radiator includes the U-shaped cooling fin for being bonded in cooling fin two sides, is provided on the outside of U-shaped cooling fin
Length is the additional heat sink 1 of 1-3cm.The U-shaped cooling fin includes the bending of two straight plate parts of straight plate part 2 and connection of two sides
Portion 3, bending, 3 radian are between 30 ° -50 °.
Cooling fin and heat bulge segmentation design are cooperated the U-shaped radiator of side by the utility model is designed reasonably,
Heat dissipation area is considerably increased, ensure that heat dissipation effect, also ensures the normal work of chip, the popularization suitable for large area.
The protection scope of the utility model is not limited merely to above-described embodiment, skill belonging to the idea of the present invention
Art scheme belongs to the protection scope of the utility model.It should be pointed out that for those skilled in the art,
Several improvements and modifications under the premise of the utility model principle are not departed from, these improvements and modifications also should be regarded as the utility model
Protection scope.
Claims (5)
1. a kind of New chip heat dissipating double-fuselage, corresponding with chip, it is characterised in that: if including the dry plate heat dissipation for connecting chip
Piece is connected between adjacent cooling fin by heat bulge, and is connected by way of bonding between cooling fin and heat bulge
Together；The inner transverse of the cooling fin is provided with several thermal vias, and thermal vias runs through cooling fin；The cooling fin
Several radiating fins are provided on lower surface；The two sides of the cooling fin are connected separately with U-shaped radiator.
2. a kind of New chip heat dissipating double-fuselage according to claim 1, it is characterised in that: the heat bulge and cooling fin
Integrated design manufacture；The heat bulge and cooling fin are the heat bulge made of copper sheet or aluminum alloy materials and heat dissipation
Piece.
3. a kind of New chip heat dissipating double-fuselage according to claim 2, it is characterised in that: the diameter of the thermal vias is
The a quarter of fin thickness is to 1/5th.
4. a kind of New chip heat dissipating double-fuselage according to claim 3, it is characterised in that: the U-shaped radiator includes
It is bonded in the U-shaped cooling fin of cooling fin two sides, the additional heat sink that length is 1-3cm is provided on the outside of U-shaped cooling fin.
5. a kind of New chip heat dissipating double-fuselage according to claim 4, it is characterised in that: described, U-shaped cooling fin includes two
The bending section of two straight plate parts of straight plate part and connection of side；The radian of bending section is between 30 ° -50 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820922745.7U CN208489182U (en) | 2018-06-14 | 2018-06-14 | A kind of New chip heat dissipating double-fuselage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820922745.7U CN208489182U (en) | 2018-06-14 | 2018-06-14 | A kind of New chip heat dissipating double-fuselage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208489182U true CN208489182U (en) | 2019-02-12 |
Family
ID=65251623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820922745.7U Active CN208489182U (en) | 2018-06-14 | 2018-06-14 | A kind of New chip heat dissipating double-fuselage |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208489182U (en) |
-
2018
- 2018-06-14 CN CN201820922745.7U patent/CN208489182U/en active Active
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