CN202697133U - Component radiating structure - Google Patents
Component radiating structure Download PDFInfo
- Publication number
- CN202697133U CN202697133U CN 201220342391 CN201220342391U CN202697133U CN 202697133 U CN202697133 U CN 202697133U CN 201220342391 CN201220342391 CN 201220342391 CN 201220342391 U CN201220342391 U CN 201220342391U CN 202697133 U CN202697133 U CN 202697133U
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- printed board
- components
- heat
- parts
- component
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Abstract
The utility model provides a component radiating structure which comprises a first printed board, a bonding pad, a component, a heat conducting piece, a heat conducting bonding pad, a second printed board and a fixing piece, wherein the second printed board has a copper-coated surface; the first printed board and the second printed board are arranged in parallel and connected through the fixing piece; the bonding pad, the component, the heat conducting piece and the heat conducting bonding pad are positioned between the first printed board and the second printed board; the component is welded on the first printed board through the bonding pad; the heat conducting bonding pad is clung to the copper-coated surface of the second printed board; and the heat conducting piece is clamped between the component and the heat conducting bonding pad. The problem that a radiator cannot be installed when the head space of the component is limited in an integrated circuit is solved by using the component radiating structure, the radiating capacity of the component can be effectively increased, and the purposes of reducing the purchase cost of a radiating fin and saving space can be achieved.
Description
Technical field
The utility model relates to the cooling electronic component technology, especially relates to a kind of components and parts radiator structure.
Background technology
Along with the continuous progress of electronic design technology, the miniaturization of electronic devices and components, microminaturization, highly integrated and little assembling of integrated circuit has caused the density of heat flow rate of components and parts, assembly to improve constantly, and the heat dissipation design of electronic devices and components is faced with stern challenge.Show that according to the study temperature is particularly important on the impact of electronic devices and components, high temperature, low temperature and circulation meeting thereof produce most of electronic devices and components in the electronic system and have a strong impact on, and it can cause the inefficacy of electronic devices and components, and then affects the inefficacy of whole electronic equipment.There is data to show, in some electronic equipment, 10 ℃ of the every increases of the junction temperature of power transistor, its reliability will descend 60%.
At present, the radiating mode of components and parts mainly contains two kinds, a kind of is the packing forms that the exposed heat dissipation bonding pad of a large tracts of land is arranged in the components and parts bottom, and radiating mode is that components and parts are transmitted to the components and parts heat in the printed board of welding component by the exposed heat dissipation bonding pad in its bottom; Another kind is by connecting heat abstractor at the components and parts top, the components and parts heat being transmitted to the radiating mode of heat abstractor.For the second radiating mode, if the space at components and parts top is restricted, then can not heat abstractor be installed at the components and parts top and reaches radiating effect, this causes obstruction for the miniaturization of integrated circuit, therefore must head it off.
Summary of the invention
The purpose of this utility model is: the problem for prior art exists, and provide a kind of and solved when the components and parts headroom is limited, the components and parts radiator structure of the problem of heat abstractor can not be installed.
The purpose of this utility model is achieved through the following technical solutions:
A kind of components and parts radiator structure, it is characterized in that, this structure comprises that the first printed board, pad, components and parts, heat-conducting piece, thermal land, band cover the second printed board and the fixture of copper face, described the first printed board and the second printed board are set up in parallel, between connect by fixture, described pad, components and parts, heat-conducting piece, thermal land are between the first printed board and the second printed board, components and parts are welded in the first printed board by pad, thermal land is close to the copper face that covers of the second printed board, and heat-conducting piece is clipped between components and parts and the thermal land.
As preferably, be laid with the heat conduction via hole on the described thermal land.
As preferably, described the first printed board is two-layer at least printed board.
As preferably, described the second printed board is two-layer at least printed board.
As preferably, described heat-conducting piece is the heat-conducting piece that heat conductive silica gel or heat-conducting silicone grease are made.
Compared with prior art, the utility model has solved when the components and parts headroom limited, and the problem that heat abstractor can not be installed not only can effectively increase the heat-sinking capability of components and parts, can also reach to reduce fin purchase cost and space-saving purpose.
Description of drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of thermal land of the present utility model.
The drawing reference numeral explanation:
1 is that the first printed board, 2 is that components and parts, 3 are that pad, 4 is that heat-conducting piece, 5 is that thermal land, 6 is that the second printed board, 7 is that fixture, 8 is the heat conduction via hole.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is elaborated.
EmbodimentA kind of components and parts radiator structure
In two closer ad hoc structures of printed board distance, have the radiating mode that connects heat abstractor at the components and parts top now, owing to being subject to the restriction in space, can not heat abstractor being installed at the components and parts top and reaching radiating effect.The utility model is by improving existing components and parts radiation design method, utilize the characteristic that copper face has radiating effect of covering of printed board, the components and parts heat is conducted another adjacent with it piece printed board to be covered on the copper face, adopt the utility model not only can effectively increase the heat-sinking capability of components and parts, can also reach and reduce fin purchase cost and conserve space.
As shown in Figure 1 and Figure 2, the components and parts radiator structure comprises that the first printed board 1, pad 3, components and parts 2, heat-conducting piece 4, thermal land 5, band cover the second printed board 6 and the fixture 7 of copper face.The first printed board 1 and the second printed board 6 are set up in parallel, between by fixture 7 both are connected.Pad 3, components and parts 2, heat-conducting piece 4, thermal land 5 are between the first printed board 1 and the second printed board 6, components and parts 2 are welded in the first printed board 1 by pad 3, thermal land 5 is close to the copper face that covers of the second printed board 6, and heat-conducting piece 4 is clipped between components and parts 2 and the thermal land 5.For the ease of the heat conduction, also be laid with heat conduction via hole 8 on the thermal land 5.The first printed board 1 is the printed board of two-layer or multilayer.The second printed board is the printed board of two-layer or multilayer also.Heat-conducting piece is the heat-conducting piece that heat conductive silica gel, heat-conducting silicone grease or other Heat Conduction Materials are made.The large I of heat-conducting piece 4 is determined according to the size of pad 3 in components and parts 2 and the printed board.The thickness of heat-conducting piece 4 is determined by the distance between the height of components and parts 2 and two printed boards.
The heat dissipation path of components and parts 2 is: components and parts 2 → heat-conducting piece 4 → thermal land 5 → heat conduction via hole 8 → cover the copper plane with thermal land 5 is connected with heat conduction via hole 8.
The radiating mode of under the utility model radiating mode and the prior art heat abstractor being installed at the components and parts top is compared, and identical point is, the components and parts heat all is by the components and parts top, on the heat heat loss through conduction device in the components and parts; Identical point is not, the radiating mode of under the prior art heat abstractor being installed at the components and parts top need to be installed independently heat abstractor, the utility model utilizes printed board to cover the copper plane to have heat dissipation characteristics, printed board is not needed to install independently heat abstractor as heat abstractor; Identical point also is not, in two closer ad hoc structures of printed board distance, the radiating mode that connects heat abstractor under the prior art at the components and parts top, owing to being subject to the restriction in space, the mode that heat abstractor can not be installed at the components and parts top reaches radiating effect, and the utility model has been saved the space because do not need to install independently heat abstractor, directly conduct heat in the printed board, reach good radiating effect.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; should be pointed out that all any modifications of within spirit of the present utility model and principle, doing, be equal to replacement and improvement etc., all should be included within the protection range of the present utility model.
Claims (5)
1. components and parts radiator structure, it is characterized in that, this structure comprises that the first printed board, pad, components and parts, heat-conducting piece, thermal land, band cover the second printed board and the fixture of copper face, described the first printed board and the second printed board are set up in parallel, between connect by fixture, described pad, components and parts, heat-conducting piece, thermal land are between the first printed board and the second printed board, components and parts are welded in the first printed board by pad, thermal land is close to the copper face that covers of the second printed board, and heat-conducting piece is clipped between components and parts and the thermal land.
2. a kind of components and parts radiator structure according to claim 1 is characterized in that, is laid with the heat conduction via hole on the described thermal land.
3. a kind of components and parts radiator structure according to claim 1 and 2 is characterized in that, described the first printed board is two-layer at least printed board.
4. a kind of components and parts radiator structure according to claim 1 and 2 is characterized in that, described the second printed board is two-layer at least printed board.
5. root a kind of components and parts radiator structure according to claim 1 and 2 is characterized in that, described heat-conducting piece is the heat-conducting piece that heat conductive silica gel or heat-conducting silicone grease are made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220342391 CN202697133U (en) | 2012-07-16 | 2012-07-16 | Component radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220342391 CN202697133U (en) | 2012-07-16 | 2012-07-16 | Component radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202697133U true CN202697133U (en) | 2013-01-23 |
Family
ID=47552682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220342391 Expired - Fee Related CN202697133U (en) | 2012-07-16 | 2012-07-16 | Component radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202697133U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281875A (en) * | 2013-05-28 | 2013-09-04 | 中国电子科技集团公司第十研究所 | Method for manufacturing embedded electronic circuit three-dimensional assembly substrate |
-
2012
- 2012-07-16 CN CN 201220342391 patent/CN202697133U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281875A (en) * | 2013-05-28 | 2013-09-04 | 中国电子科技集团公司第十研究所 | Method for manufacturing embedded electronic circuit three-dimensional assembly substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20180716 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |