CN201298958Y - MOSFET soldering pad design circuit board with heat dissipation holes - Google Patents
MOSFET soldering pad design circuit board with heat dissipation holes Download PDFInfo
- Publication number
- CN201298958Y CN201298958Y CNU2008201373574U CN200820137357U CN201298958Y CN 201298958 Y CN201298958 Y CN 201298958Y CN U2008201373574 U CNU2008201373574 U CN U2008201373574U CN 200820137357 U CN200820137357 U CN 200820137357U CN 201298958 Y CN201298958 Y CN 201298958Y
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- CN
- China
- Prior art keywords
- heat dissipation
- mosfet
- circuit board
- dissipation holes
- soldering pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an MOSFET soldering pad design circuit board with heat dissipation holes. An MOSFET triode soldering pad includes two small rectangular soldering pads 4 and a large square soldering pad 1. A ring of heat dissipation holes 2 is added on the periphery of the large square soldering pad 1. The heat dissipation holes are through holes. The internal surfaces of the heat dissipation holes are copper-plated. The signal attribute of the heat dissipation holes 2 is the same as the signal attribute of the large square soldering pad 1. Copper foils 3 are used to connect the heat dissipation holes 2 with the large square soldering pad 1, so as to facilitate the transmission of heat generated by an MOSFET triode from the large square soldering pad 1 to the heat dissipation holes 2 and the heat transmission to the back of the circuit board through the heat dissipation holes 2. By using the MOSFET soldering pad design circuit board with heat dissipation holes, a large amount of heat generated by the MOSFET triode can be dissipated to the back of the circuit board through the ring of heat dissipation holes arranged on the periphery of the large square soldering pad other than to the circumference, thus greatly increasing the heat dissipation speed and area and having good heat dissipation effect.
Description
Technical field
The utility model relates to a kind of circuit board, in particular, relates to a kind of circuit board of MOSFET pad design with the heat radiation via hole.
Background technology
Circuit board is a part the most important and indispensable in the general electric equipment products, is mainly used in various electronic components, chip are communicated with to reach specific effect.General circuit board can be installed some MOSFET parts, i.e. field-effect transistor or be triode.
The MOSFET triode has multiple encapsulation, and as TO-263, TO-252 etc. are generally 3 or 3 above pads, and one of them is square large bonding pad.In real work, the MOSFET triode can produce heat, and wherein heat mainly concentrates on the residing position of square large bonding pad.Do not cause that MOSFET triode thermal accumlation is too much if heat in time leaves, may cause the MOSFET triode to quit work even burn, thereby the monoblock circuit board is quit work, have serious consequences.For solving the heat radiation of MOSFET triode, now adopted multiple mode to dispel the heat as adding tin bar, go up to MOSFET and add metal fin, system fan blowing etc., but these modes are increasing cost virtually.
Summary of the invention
The technical problems to be solved in the utility model is, at the above-mentioned defective of prior art, provides a kind of circuit board of the MOSFET pad design with the heat radiation via hole.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of circuit board of MOSFET pad design with the heat radiation via hole is provided, MOSFET triode pad comprises two little pads of rectangle and a square large bonding pad, at the peripheral circle heat radiation via hole that increases of square large bonding pad, this hole is a through hole, copper facing in the hole.The signal attribute of heat radiation via hole is identical with square large bonding pad.Link to each other with square large bonding pad with the Copper Foil via hole that will dispel the heat, be convenient to the heat that the MOSFET triode produces and better be sent to the heat radiation via hole, by the heat radiation via hole heat is dispersed into back of circuit board again from square large bonding pad.
Implement circuit board of the present utility model, have following beneficial effect: a large amount of heats that the MOSFET triode is produced are except that periphery scatters, also can heat be dispersed into back of circuit board by the circle heat radiation via hole that square large bonding pad periphery is set up, accelerate the speed and the area of heat radiation greatly, thereby brought better radiating effect.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing;
Fig. 1 is existing MOSFET triode pad schematic diagram;
Fig. 2 is the heat radiation via hole MOSFET triode pad schematic diagram that has of the present utility model.
Embodiment
As shown in Figure 1, existing MOSFET triode pad comprises little pad 4 and square large bonding pad 1 of two rectangles.
As shown in Figure 2, the circuit board of the MOSFET pad design of the band heat radiation via hole that the utility model provides comprises two little pads 4 of rectangle and a square large bonding pad 1 and square large bonding pad 1 a peripheral circle heat radiation via hole 2 that increases.During practical operation, the pad of MOSFET triode is welded on the circuit board, and temperature cooling to be welded back is at its square large bonding pad 1 peripheral circle heat radiation via hole 2 that increases, and this hole is a through hole, copper facing in the hole.Signal attribute is identical between heat radiation via hole 2 and the square large bonding pad 1, link to each other with square large bonding pad 1 with Copper Foil 3 via hole 2 that will dispel the heat, be convenient to the heat that the MOSFET triode produces and better be sent to heat radiation via hole 2, by heat radiation via hole 2 heat is dispersed into back of circuit board again from square large bonding pad 1.
The above only is a preferred embodiment of the present utility model, can not limit the scope that the utility model is implemented with it, and promptly the equalization of doing according to the utility model generally changes and modifies, and all should still belong to the scope of the utility model patent protection.
Claims (4)
1, a kind of circuit board of MOSFET pad design with the heat radiation via hole, MOSFET triode pad comprises two little pads of rectangle and a square large bonding pad, it is characterized in that, at the peripheral circle heat radiation via hole that increases of square large bonding pad.
2, the circuit board of the MOSFET pad design of band heat radiation via hole according to claim 1 is characterized in that the heat radiation via hole is a through hole, copper facing in the hole.
3, the circuit board of the MOSFET pad design of band according to claim 1 heat radiation via hole is characterized in that, links to each other with square large bonding pad with the Copper Foil via hole that will dispel the heat.
4, the circuit board of the MOSFET pad design of band heat radiation via hole according to claim 1 is characterized in that, the signal attribute of heat radiation via hole is identical with square large bonding pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201373574U CN201298958Y (en) | 2008-09-20 | 2008-09-20 | MOSFET soldering pad design circuit board with heat dissipation holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201373574U CN201298958Y (en) | 2008-09-20 | 2008-09-20 | MOSFET soldering pad design circuit board with heat dissipation holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201298958Y true CN201298958Y (en) | 2009-08-26 |
Family
ID=41044948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201373574U Expired - Fee Related CN201298958Y (en) | 2008-09-20 | 2008-09-20 | MOSFET soldering pad design circuit board with heat dissipation holes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201298958Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104703387A (en) * | 2015-03-27 | 2015-06-10 | 航天科技控股集团股份有限公司 | PCB of power circuit for automobile instrument and design method of PCB |
| CN105397221A (en) * | 2015-12-01 | 2016-03-16 | 长沙奥托自动化技术有限公司 | PCB packaging design and welding method of TQFP chip |
| CN108471669A (en) * | 2018-02-28 | 2018-08-31 | 宁波央腾汽车电子有限公司 | A kind of welding method reducing printed circuit board thermal resistance |
-
2008
- 2008-09-20 CN CNU2008201373574U patent/CN201298958Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104703387A (en) * | 2015-03-27 | 2015-06-10 | 航天科技控股集团股份有限公司 | PCB of power circuit for automobile instrument and design method of PCB |
| CN105397221A (en) * | 2015-12-01 | 2016-03-16 | 长沙奥托自动化技术有限公司 | PCB packaging design and welding method of TQFP chip |
| CN108471669A (en) * | 2018-02-28 | 2018-08-31 | 宁波央腾汽车电子有限公司 | A kind of welding method reducing printed circuit board thermal resistance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150918 Address after: Yushan town of Kunshan City, Jiangsu province 215316 highway 339 West Road South, Yuanfeng Patentee after: Kunshan Shenzhou Computer Co., Ltd. Address before: 518112 new world industrial city, Shenzhen, Longgang, Guangdong Patentee before: Shenzhen Hasee Computer Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090826 Termination date: 20170920 |