CN103281875A - Method for manufacturing embedded electronic circuit three-dimensional assembly substrate - Google Patents
Method for manufacturing embedded electronic circuit three-dimensional assembly substrate Download PDFInfo
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- CN103281875A CN103281875A CN2013102017233A CN201310201723A CN103281875A CN 103281875 A CN103281875 A CN 103281875A CN 2013102017233 A CN2013102017233 A CN 2013102017233A CN 201310201723 A CN201310201723 A CN 201310201723A CN 103281875 A CN103281875 A CN 103281875A
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- printed board
- substrate
- electronic circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a method for manufacturing an embedded electronic circuit three-dimensional assembly substrate, which can be used for increasing the interconnection assembling density and supplementing technical cryptosecurity for the three-dimensional assembly substrate. According to the technical scheme, the method is implemented by the following steps of: in the manufacturing process of a printed board, setting a planar printed board as an embedded substrate, and designing a cavity of which the area and height are matched with the size, height and printed board thickness of a layout device; assembling a device to be embedded on the bottom surface of the cavity in a surface mounting way, or directly laminating and burying into a designed and planed cavity position of the printed board, laminating, connecting a printed lead in the printed board with a device outside the substrate, and covering a printed board substrate with a certain thickness above and below the buried device; and after laminating the printed board, perforating at the pin position of the buried device, performing hole metallization through a buried blind via technique, surface device mounting and through hole insertion to realize interconnection so as to form a three-dimensional laminated assembly structure in which the embedded substrate is taken as a carrier.
Description
Technical field
The invention relates on the high-density multi-layer circuit substrate, adopt microwelding and packaging technology that various semiconductor integrated circuit chips or the microdevice of forming circuit are assembled, form the three-dimensional assembling substrates of solid assembling electronic product plate level of high density, highly reliable stereochemical structure.
Background technology
Modern electronic product just towards weak point, little, light, thin and highly reliable, high-speed, high-performance and cheaply direction develop, particularly airborne, arrow carries and spaceborne electronic product, and portable type electronic product is more and more harsher to the requirement of volume, weight and reliability, requirement improves constantly assembling and the interconnection density of circuit, realize microminiaturization, the lightweight and highly reliable of electronic product, electrical interconnection structure and packaging technology are had higher requirement, therefore, the three-dimensional package assembly form of all kinds of plate levels and interconnected new method have obtained broad research and application.
The three-dimensional package assembly form of plate level from a plurality of printed boards adopt vertical interconnect, side plate is interconnected, the interconnected cable of salient point is interconnected etc., and mutual contact mode realizes that plate is interconnected with the various versions of plate, progressively develop into and adopt various structures such as device (comprising the little printed board assembly of be with standalone feature) is stacked, two-sided assembling to realize that the surperficial solids of printed boards (referring to all kinds of printed boards of surfacing) assemble in single printed board.
More than the three-dimensional assembling of all kinds of plate levels, all based on positive and negative two of printed board table (put down) faces (also have only two surface is installed) are installed, adopt multiple interconnected means to realize that the solid of printed board and components and parts assembles.
But along with constantly widening of development of technology and product demand, present all kinds of three-dimensional package assembly form and interconnected method can not satisfy diversified demand, miniaturization, multi-functional demand force the printing board surface device density high, have had a strong impact on product and have realized; Simultaneously, present signal transmission and information processing requirement, require extremely tight to signal transmission path length and impedance matching between the device of pairing use, particularly the signal frequency of system's needs is when several GHz magnitudes, just can't realize by too much interconnected path on long bonding wire and the circuit board, for inhibit signal transmission time sequence consistency and integrality, need the interconnected of shorter and impedance matching, therefore, prior art solves the method for signal transmission time sequence between the interior device of printed board, the main device that will match that adopts designs back-to-back, (namely designing the positive and negative in the printed board same position), or it is arranged in one side, adopt serpentine to guarantee the path distance one of the signal transmission transfer impedance coupling of making peace, to guarantee the sequential consistency of transmission signal.Moreover in conventional printed board designing wiring process, being the sequential of signal transmission between guarantee two chips (device) sometimes, meeting is the transmission path of prolongation signal specially, but along with the prolongation of transmission path can influence high frequency response again, increase loss.
Summary of the invention
The objective of the invention is to be difficult to guarantee at the sequential that signal transmits between device in the present printed board, and make after the densification, the assembling difficulty is big, caused technical know-how to be difficult for the problem that realizes by flight easily, a kind of new project organization form and electrical interconnection new method are provided, can improve interconnected packaging density, replenish the method for the three-dimensional assembling substrates of embedded electronic circuit of technical know-how measure.
In order to realize above-mentioned purpose of the present invention, the method for the three-dimensional assembling substrates of a kind of embedded electronic circuit provided by the invention is characterized in that comprising the following steps:
A) in the printed board manufacture process, the plane printed board is set to imbed embedded substrate, design area and height with the layout size of devices, highly, the cavity of printed board thickness coupling;
B) by control forms cavity to each layer of printed board profile, with thin, little, core devices layout in the printed board cavity, the device of earlier needs being imbedded is assembled in cavity floor by the surface mount mode, or contact laminating is imbedded printed board design planning empty cavity position, and then carry out lamination, and interconnected by printed conductor in the printed board and the outer components and parts of substrate, imbedding the device above and below, cover certain thickness pcb substrate, form the outward appearance the same with the ordinary printed plate;
C) behind the printed board lamination, imbedding the device pin position by punching, adopting printed board buried blind via technology to carry out hole metallization and realize interconnected;
D) embedded substrate surface components and parts are adopted surface mount, Through-Hole Technology, forming with embedded substrate is the three-dimensional lamination package assembly of carrier.
The present invention has following beneficial effect than prior art:
The present invention designs components and parts and be embedded in the printed board, forms embedded substrate, and assembles components and parts at embedded substrate, forms the stereochemical structure form of the inside and outside device stack assembling of embedded substrate, can save the space, realizes product miniaturization demand.In the area identical scope, because part of devices is imbedded in the printed board, make the printed board of identical table area can lay more components and parts, be analogous to " the piling up " of having carried out components and parts, thereby dwindled area, taken full advantage of the space, realized miniaturization.
The embedded substrate that the present invention takes forms the stereochemical structure form as three-dimensional built-up foundation, for solving the sequential that signal transmits between device in the printed board, provides new approaches and methods.
" embedded substrate " stereochemical structure form that the present invention takes has been expanded in " face " of double-clad board.In a printed board, can realize that to such an extent as to three " faces " of components and parts are four " faces " (printed board one " face ", and can assemble one deck components and parts, the single-sided printed board of often saying as us, namely be to assemble components and parts in one side, double-clad board namely is all can assemble components and parts at two faces).
The embedded substrate stereochemical structure form that the present invention takes has been expanded electronic product technical know-how approach, can be as required, core circuit, core devices are carried out " hiding " by imbedding the printed board mode, can effectively prevent by flight, avoid technology to reveal, thereby realize technical know-how.
The present invention takes the process implementation method of embedded substrate stereochemical structure form, by existing technology, improves a little or optimization, can realize the reliable assembling to this class formation.
Description of drawings
In order more to be expressly understood the present invention, now will simultaneously with reference to accompanying drawing, the present invention be described by the embodiment of the invention, wherein:
What Fig. 1 showed is the cutaway view of the three-dimensional assembling substrates of embedded electronic circuit of the present invention.
Fig. 2 shows the three-dimensional assembling substrates manufacturing process flow diagram of employing embedded electronic circuit.
Among the figure: 1 pcb substrate, 2 surface pads, 3 surface mounting devices, 4 surface device pins, interconnected via hole between 5 pcb layers, 6 are embedded in device, 7 cavitys, 8 printed boards are embedded in the components and parts solder joint, 9 printed board internal layer transfer wires, the inner packing material of 10 printed boards.
Embodiment
Consult Fig. 1.In printed circuit assembly design, manufacturing process, when the printed board layout, at part of devices, when printed board designs, as required, in conjunction with components and parts encapsulation, planning forms in the printed board and imbeds all kinds of cavitys 7, the printed board that device is complementary and be embedded in components and parts solder joint 8 and printed board internal layer transfer wire 9, the inside of printed board in case of necessity packing material 10 pcb substrate 1 in.In the printed board manufacture process, the plane printed board is set to imbed embedded substrate, design area and height with the layout size of devices, highly, the cavity 7 of printed board thickness coupling.According to circuit design, carry out wires design layout surface mounting devices 3, device surface pad 2 and surface device pin 4 in the pcb substrate 1, interconnected via hole 5 comprises blind hole, buried via hole etc. between arranging devices inside and outside the cavity and pcb layer, finishes the interconnected transmission channel laying of the signal of telecommunication between each device.By the printed board manufacturing, in pcb substrate 1 plate, imbed active, passive device etc. and be embedded in device 6, form the three-dimensional assembling substrates of embedded electronic circuit.By control forms cavity to each layer of printed board profile, with thin, little, core devices layout in the printed board cavity, the device of earlier needs being imbedded is assembled in cavity floor by the surface mount mode, or contact laminating is imbedded printed board design planning empty cavity position, and then carry out lamination, and interconnected by printed conductor in the printed board and the outer components and parts of substrate, imbedding the device above and below, cover certain thickness pcb substrate, form the outward appearance the same with the ordinary printed plate.In the printed board manufacture process, the device of earlier needs being imbedded is assemblied in the printed board intermediate layer, or encloses printed board earlier, by laser drilling, carries out hole metallization then, forms interconnected path, realizes the interconnected of the interior components and parts of plate and other components and parts.By interconnected means such as surface mounting technology, through hole mount technologies, realize the assembling of all components and parts in the printed board.Behind the printed board lamination, imbedding the device pin position by punching, adopting printed board buried blind via technology to carry out hole metallization and realize interconnected; Embedded substrate surface components and parts are adopted surface mount, Through-Hole Technology, and forming with embedded substrate is the three-dimensional lamination package assembly of carrier.
Consult Fig. 2.At first carry out printed board planning, determine to need to adopt components and parts and the position of the three-dimensional assembling substrates stereochemical structure of embedded electronic circuit form, and imbed device in definite printed board and need cavity area size, the degree of depth etc., carry out the printed board structural design; On this basis, carry out the components and parts pad and lay, then according to the circuit design needs, carry out printed board interconnected lead and lay, form the electrical property path.
After finishing the printed board design, imbed the printed board manufacturing of the three-dimensional assembling substrates of embedded electronic circuit of device, by adopting the printed board layering, in the middle of employing assembling device layer interconnected or that directly needs are imbedded in intermediate layer is pressed on printed board, and by the printed board manufacturing technology, make interconnected via hole, realize imbedding in the three-dimensional assembling substrates of embedded electronic circuit the electrical interconnection of device and other components and parts.
Components and parts in the printed board of the three-dimensional assembling substrates of embedded electronic circuit, adopt surface mount, reflow welding connection technology or ladder welding technique, realize the reliable assembling of all components and parts in the printed board, form the three-dimensional assembled components of " embedded substrate " structure, reach purpose of design.
Claims (5)
1. the method for the three-dimensional assembling substrates of embedded electronic circuit is characterized in that comprising the following steps:
A) in the printed board manufacture process, the plane printed board is set to imbed embedded substrate, design area and height with the layout size of devices, highly, the cavity of printed board thickness coupling;
B) by control forms cavity to each layer of printed board profile, with thin, little, core devices layout in the printed board cavity, the device of earlier needs being imbedded is assembled in cavity floor by the surface mount mode, or contact laminating is imbedded printed board design planning empty cavity position, and then carry out lamination, and interconnected by printed conductor in the printed board and the outer components and parts of substrate, imbedding the device above and below, cover certain thickness pcb substrate, form the outward appearance the same with the ordinary printed plate;
C) behind the printed board lamination, imbedding the device pin position by punching, adopting printed board buried blind via technology to carry out hole metallization and realize interconnected;
D) embedded substrate surface components and parts are adopted surface mount, Through-Hole Technology, forming with embedded substrate is the three-dimensional lamination package assembly of carrier.
2. the method for the three-dimensional assembling substrates of embedded electronic circuit as claimed in claim 1, it is characterized in that, according to circuit design, carry out wires design layout surface mounting devices 3, device surface pad 2 and surface device pin 4 in the pcb substrate 1, interconnected via hole 5 between arranging devices inside and outside the cavity and pcb layer, comprise the good buried via hole of blind hole, finish the interconnected transmission channel laying of the signal of telecommunication between each device.
3. the method for the three-dimensional assembling substrates of embedded electronic circuit as claimed in claim 1, it is characterized in that, in the printed board manufacture process, the device of earlier needs being imbedded is assemblied in the printed board intermediate layer, or enclose printed board earlier, by laser drilling, carry out hole metallization then, form interconnected path, realize the interconnected of the interior components and parts of plate and other components and parts.
4. the method for the three-dimensional assembling substrates of embedded electronic circuit as claimed in claim 1, it is characterized in that, after finishing the printed board design, imbed the printed board manufacturing of the three-dimensional assembling substrates of embedded electronic circuit of device, by adopting the printed board layering, in the middle of employing assembling device layer interconnected or that directly needs are imbedded in intermediate layer is pressed on printed board, and by the printed board manufacturing technology, make interconnected via hole, realize imbedding in the three-dimensional assembling substrates of embedded electronic circuit the electrical interconnection of device and other components and parts.
5. the method for the three-dimensional assembling substrates of embedded electronic circuit as claimed in claim 1, it is characterized in that, components and parts in the printed board of the three-dimensional assembling substrates of embedded electronic circuit, adopt surface mount, reflow welding connection technology or ladder welding technique, realize the reliable assembling of all components and parts in the printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2013102017233A CN103281875A (en) | 2013-05-28 | 2013-05-28 | Method for manufacturing embedded electronic circuit three-dimensional assembly substrate |
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| CN2013102017233A CN103281875A (en) | 2013-05-28 | 2013-05-28 | Method for manufacturing embedded electronic circuit three-dimensional assembly substrate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104028869A (en) * | 2014-06-30 | 2014-09-10 | 哈尔滨工业大学 | Welding method for inter-board connection in board level stereoscopic packaging through resistance heat |
| CN105792504B (en) * | 2016-03-01 | 2018-09-28 | 中国电子科技集团公司第五十四研究所 | A kind of holes PCB embedding device and preparation process with shielding measure |
| CN109819590A (en) * | 2019-01-02 | 2019-05-28 | 华为终端有限公司 | A kind of photoelectric device and terminal |
| CN111134671A (en) * | 2019-12-27 | 2020-05-12 | 上海交通大学 | Flexible multi-channel repeatable array type HD-sEMG sensor and preparation |
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| CN101299908A (en) * | 2007-04-30 | 2008-11-05 | 三星电机株式会社 | Method for manufacturing printed circuit board having embedded component |
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Patent Citations (6)
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| US5331203A (en) * | 1990-04-05 | 1994-07-19 | General Electric Company | High density interconnect structure including a chamber |
| CN1449583A (en) * | 2000-07-25 | 2003-10-15 | Ssi株式会社 | Plastic package base, air cavity type package and their manufacturing methods |
| CN1615676A (en) * | 2002-09-12 | 2005-05-11 | 松下电器产业株式会社 | Circuit-component-containing module |
| DE102007006462A1 (en) * | 2007-02-05 | 2008-08-14 | Siemens Ag | Electronic switching arrangement, has printed circuit board laid against another printed circuit board such that electronic component i.e. high-frequency component, of latter circuit board is taken up by recess of former circuit board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104028869A (en) * | 2014-06-30 | 2014-09-10 | 哈尔滨工业大学 | Welding method for inter-board connection in board level stereoscopic packaging through resistance heat |
| CN105792504B (en) * | 2016-03-01 | 2018-09-28 | 中国电子科技集团公司第五十四研究所 | A kind of holes PCB embedding device and preparation process with shielding measure |
| CN109819590A (en) * | 2019-01-02 | 2019-05-28 | 华为终端有限公司 | A kind of photoelectric device and terminal |
| WO2020140724A1 (en) * | 2019-01-02 | 2020-07-09 | 华为技术有限公司 | Photoelectric device and terminal |
| CN111134671A (en) * | 2019-12-27 | 2020-05-12 | 上海交通大学 | Flexible multi-channel repeatable array type HD-sEMG sensor and preparation |
| CN111134671B (en) * | 2019-12-27 | 2021-07-06 | 上海交通大学 | Flexible multi-channel repeatable array type HD-sEMG sensor and preparation |
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Application publication date: 20130904 |