CN104028869A - Welding method for inter-board connection in board level stereoscopic packaging through resistance heat - Google Patents
Welding method for inter-board connection in board level stereoscopic packaging through resistance heat Download PDFInfo
- Publication number
- CN104028869A CN104028869A CN201410303793.4A CN201410303793A CN104028869A CN 104028869 A CN104028869 A CN 104028869A CN 201410303793 A CN201410303793 A CN 201410303793A CN 104028869 A CN104028869 A CN 104028869A
- Authority
- CN
- China
- Prior art keywords
- plate
- circuit board
- board
- keyset
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0004—Resistance soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention discloses a welding method for inter-board connection in board level stereoscopic packaging through resistance heat. The welding method comprises the steps that (1) inter-board outgoing lines of an upper circuit board and a lower circuit board are collected to two sides of the circuit boards, and a front-face lead bonding pad and a back-face lead bonding pad are communicated through hole metallization; (2) the upper circuit board and the lower circuit board are welded; (3) an adapter board is planted with balls; (4) the adapter board, the upper circuit board and the lower circuit board are overlaid in an aligned mode; (5) an upper electrode board with a positive electrode contact is arranged on the upper portion of the upper circuit board, a lower electrode board with a negative electrode contact is arranged on the lower portion of the lower circuit board, and the lower end of the positive electrode contact and the upper end of the negative electrode contact are compressed with the lead bonding pads in an array mode; (6) a welding power source is switched on, and the upper circuit board and the lower circuit board are welded to the adapter board through the generated resistance heat. The two circuit boards and the double-face bumped connecting board are welded based on the resistance heat principle, and the method has the advantages that secondary local heating welding is adopted, and the original process and welding parameters of the circuit boards do not need to be changed; the original circuit boards are rarely influenced in the connecting process of the boards.
Description
Technical field
The present invention relates to the three-dimensional assemble method of a kind of plate level.
Background technology
Three-dimensional assembling refers to two dimensional surface circuit closed assembly, utilizes bottom surface or the interconnected assembling mode of lateral edge of planar circuit.
Three-dimensional assembling can be divided into the three-dimensional assembling of plate level and the three-dimensional assembling of chip-scale two large classes.Wherein, plate level solid is assembled and is referred between printed board, and the interconnection techniques such as employing is vertical, salient point, side direction, had both realized electrical communication, realized again the package technique of mechanical connection.
Compared with traditional group packing technique, the maximum feature of three-dimensional assembling is exactly greatly to reduce the volume and weight of product (even can reduce 90%), improve circuit performance simultaneously, reduced signal delay, reduced noise and power attenuation, improved arithmetic speed and bandwidth.
Along with weaponry is constantly to miniaturization, lightweight, development at a high speed, adopt two-dimentional package technique cannot meet the demand of many Weapon Developments.Adopt three-dimensional package technique can effectively utilize limited space in electronics, increase the packing density of components and parts, reach and further dwindle weaponry volume and weight, put forward high performance object.Current at receiver module airborne, spaceborne phase array radar, and on type aircraft airborne station, obtain application.
?utilizing two-sided salient point connecting plate as connecting between plate, is important a kind of method of attachment in the research of plate level three-dimensional encapsulation, as depicted in figs. 1 and 2.
?if one thinks synchronous welding of plate level stereochemical structure, need upper and lower two to paste device circuitry plate and sticked the two-sided salient point connecting plate aligning of tin ball to stack into reflow welding stove, through once welding all and complete, mainly there is following technical barrier and hidden danger in the enforcement of the method at present:
(1) on two-sided salient point connecting plate not the double-deck tin ball of weldering mobile and with circuit board alignment procedures in be difficult to ensure be not shifted and drop;
Between (2) two circuit boards, spacing is minimum, adds the numerous obstruction hot blasts of device, very easily causes being positioned at the components and parts cold welding rosin joint of circuit board inner side in reflow welding process;
(3), due to the covering of circuit board above, circuit board below cannot carry out postwelding quality testing.
If two think that plate level stereochemical structure welds at twice, be that upper and lower two circuit boards are soldered according to routine, two-sided salient point connecting plate also forms well salient point by double-deck tin ball bonding, after being aimed at, three welds for the second time, this method has solved a difficult problem for a synchronous welding substantially, but has brought again new problem simultaneously:
(1) circuit board will bear secondary welding, in tip-off process, and the possibility that components and parts have displacement to drop;
(2) live through circuit board below secondary welding and cannot carry out equally postwelding quality testing.
Summary of the invention
The deficiency existing for existing plate level three-dimensional encapsulation method, the invention provides in the simple and reliable plate level three-dimensional encapsulation of a kind of welding procedure contact resistance hot weld method between plate.
The object of the invention is to be achieved through the following technical solutions:
A kind of contact resistance hot weld method between plate in plate level three-dimensional encapsulation, its concrete steps are:
1) lead-out wire between the plate of upper and lower circuit plate is pooled to the both sides of circuit board, evenly distributed, by hole metallization, plate positive and negative lead pad is communicated with.Lead pad array arrangement and spacing and keyset tin ball position are in full accord, corresponding one by one.
(2) weld upper and lower circuit plate according to routine;
(3) utilize laser ball implanting or reflow soldering process that keyset is planted to full ball;
(4) keyset and upper and lower circuit plate are aligned to stack;
(5) above upper circuit board, be provided with the electric pole plate of positive contact, below lower circuit board, be provided with the lower electrode plate of negative contact terminal, the lower end of positive contact and upper circuit board lead pad array are compressed, the upper end of negative contact terminal and lower circuit board leads pad array are compressed;
(6) open the source of welding current, electric current by positive contact successively on upper circuit board lead pad, keyset under tin ball, keyset copper post, keyset tin ball, lower circuit board leads pad flow through, tin ball is relative large with upper and lower circuit plate lead pad Contact resistance, the heat that has a resistance is thus until keyset tin ball fusing, thereby upper and lower two circuit boards and keyset are welded together.
The present invention utilizes resistance heat principle that two circuit boards and two-sided salient point connecting plate are welded, and its advantage is the welding of secondary local heat, without changing the original technique of circuit board and welding parameter; In plate and plate connection procedure, primary circuit plate is exerted an influence hardly.
Brief description of the drawings
Fig. 1 is that plate level three-dimensional encapsulation forms schematic diagram;
Fig. 2 is the plate level three-dimensional encapsulation generalized section after packaged;
Fig. 3 is upper and lower circuit plate and keyset Fundamentals of Welding generalized section;
Fig. 4 is welding process schematic diagram;
Fig. 5 is keyset boss schematic diagram;
Fig. 6 is the rear spherical looks of tin of welding and boss schematic diagram;
In figure, 1-device, the upper circuit board of 2-, 3-keyset, 4-laser double-surface is planted ball, 5-copper pad, 6-soldered ball, circuit board under 7-, 8-positive contact, 9-spring, 10-guide rail, 11-electric pole plate, 12-negative contact terminal, 13-lower electrode plate, 14-positive pole, 15-negative pole, 16-location-plate, 17-pressure, 18-power supply, 19-wire.
Detailed description of the invention
Below in conjunction with accompanying drawing, technical scheme of the present invention is further described; but be not limited to this; every technical solution of the present invention is modified or is equal to replacement, and not departing from the spirit and scope of technical solution of the present invention, all should be encompassed in protection scope of the present invention.
As shown in Figure 4, contact resistance hot weld method between plate in plate level three-dimensional encapsulation provided by the invention, its concrete steps are:
(1) upper circuit board 2 and lower circuit board 7 are all pooled to lead-out wire between plate the both sides of circuit board, evenly distributed, by hole metallization, plate positive and negative lead pad are communicated with.Lead pad array arrangement and spacing and keyset 3 tin ball positions are in full accord, corresponding one by one.
(2) weld upper circuit board 2 and lower circuit board 7 according to routine;
(3) utilize laser ball implanting or reflow soldering process that keyset 3 is planted to full ball;
(4) keyset 3 and upper circuit board 2 and lower circuit board 7 are aligned to stack, ensure that solder ball array is corresponding one by one with circuit board leads pad array, dislocation-free;
(5) above upper circuit board 2, electric pole plate 11 is set, the below of lower circuit board 7 arranges lower electrode plate 13, and electric pole plate 11 and lower circuit board 7 are aligned to clamping;
(6) open the source of welding current, electric current flows through respectively each path, and the heat that has a resistance is until keyset tin ball fusing, thereby upper circuit board 2 and lower circuit board 7 are welded together with keyset 3.
As shown in Figure 3, one end of electric pole plate 11 and lower electrode plate 13 is connected with guide rail 10, electric pole plate 11 and lower electrode plate 13 can move up and down along guide rail 10.On described electric pole plate 11 with multiple positive contact 8, in positive contact 8, cover has spring 9, spring 9, between positive contact 8 lower ends and electric pole plate 11, is slidably matched between positive contact 8 and electric pole plate 11, and positive contact 8 can slide up and down in electric pole plate 11.On described lower electrode plate 13 with multiple negative contact terminal 12, on lower utmost point contact 12, cover has spring 9, spring 9, between negative contact terminal 12 upper ends and lower electrode plate 13, is slidably matched between negative contact terminal 12 and lower electrode plate 13, and negative contact terminal 12 can slide up and down in lower electrode plate 13.The quantity of described positive contact 8 and negative contact terminal 12 is consistent with arrangement, spacing and keyset 3 tin balls.The effect of spring 9 ensures exactly in the time of clamping electrode plate, spring 9 can be given power of electrode contact, ensure that electrode contact contacts with board pads well in welding process, can dwindle when the spacing between upper circuit board 2 and lower circuit board 7 and keyset 3 after the fusing of tin ball, can not cause electrode and pad to be thrown off.
As illustrated in Figures 5 and 6, in welding process, work as tin ball and become liquid from solid, under the pressure of spring 9, the spacing between upper circuit board 2 and lower circuit board 7 and keyset 3 can diminish, without restriction, tin club is crushed, cause bridging (being to be shorted together between tin ball), be therefore designed with two sides boss (being location-plate 16) at keyset 3 two ends, it can ensure the spacing between circuit board 2 and lower circuit board 7 and keyset 3, welding is good, and tin deformation of ball amount can not form bridging.
Claims (7)
1. a contact resistance hot weld method between plate in plate level three-dimensional encapsulation, is characterized in that described method step is as follows:
1) lead-out wire between the plate of upper and lower circuit plate is pooled to the both sides of circuit board, evenly distributed, by hole metallization, plate positive and negative lead pad is communicated with;
(2) weld upper and lower circuit plate according to routine;
(3) keyset is planted to full tin ball;
(4) keyset and upper and lower circuit plate are aligned to stack;
(5) above upper circuit board, be provided with the electric pole plate of positive contact, below lower circuit board, be provided with the lower electrode plate of negative contact terminal, the lower end of positive contact and upper circuit board lead pad array are compressed, the upper end of negative contact terminal and lower circuit board leads pad array are compressed;
(6) open the source of welding current, electric current by positive contact successively on upper circuit board lead pad, keyset under tin ball, keyset copper post, keyset tin ball, lower circuit board leads pad flow through, the heat that has a resistance between tin ball and upper and lower circuit plate lead pad is until keyset tin ball fusing, thereby upper and lower two circuit boards and keyset are welded together.
2. contact resistance hot weld method between plate in plate level three-dimensional encapsulation according to claim 1, is characterized in that described lead pad array arrangement and spacing are corresponding one by one with keyset tin ball position.
3. contact resistance hot weld method between plate in plate level three-dimensional encapsulation according to claim 1, is characterized in that utilizing laser ball implanting or reflow soldering process that keyset is planted to full tin ball.
4. contact resistance hot weld method between plate in plate level three-dimensional encapsulation according to claim 1, is characterized in that the quantity of described positive contact and negative contact terminal and position are all corresponding one by one with position with tin nodule number amount on keyset.
5. according to contact resistance hot weld method between plate in the plate level three-dimensional encapsulation described in claim 1 or 4, it is characterized in that in described positive contact, cover has spring, spring is between positive contact lower end and electric pole plate, and positive contact can slide up and down in electric pole plate.
6. according to contact resistance hot weld method between plate in the plate level three-dimensional encapsulation described in claim 1 or 4, it is characterized in that on described lower utmost point contact, cover has spring, spring is between negative contact terminal upper end and lower electrode plate, and negative contact terminal can slide up and down in lower electrode plate.
7. according to contact resistance hot weld method between plate in the plate level three-dimensional encapsulation described in claim 1,2,3 or 4, it is characterized in that described keyset two ends are designed with location-plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410303793.4A CN104028869A (en) | 2014-06-30 | 2014-06-30 | Welding method for inter-board connection in board level stereoscopic packaging through resistance heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410303793.4A CN104028869A (en) | 2014-06-30 | 2014-06-30 | Welding method for inter-board connection in board level stereoscopic packaging through resistance heat |
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| CN104028869A true CN104028869A (en) | 2014-09-10 |
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| CN201410303793.4A Pending CN104028869A (en) | 2014-06-30 | 2014-06-30 | Welding method for inter-board connection in board level stereoscopic packaging through resistance heat |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4460817A (en) * | 1981-06-19 | 1984-07-17 | Hitachi, Ltd. | Resistance reflow soldering apparatus |
| JPH07214295A (en) * | 1994-02-03 | 1995-08-15 | Ishikawajima Harima Heavy Ind Co Ltd | Method for connecting lead wire to thin film-like metallic body |
| DE19846705A1 (en) * | 1997-04-10 | 2000-04-13 | Schweistechnische Lehr Und Ver | Soldering of low melting point highly conductive thin sheet components, especially stud soldering to a sheet, is effected using a solder deposit of low melting solder and high electrical resistance high melting solder |
| WO2001020957A1 (en) * | 1999-09-14 | 2001-03-22 | Lee John Robinson | Laminated reflow soldering |
| US20090197103A1 (en) * | 2007-01-30 | 2009-08-06 | Da-Yuan Shih | Modification of pb-free solder alloy compositions to improve interlayer dielectric delamination in silicon devices and electromigration resistance in solder joints |
| CN103281875A (en) * | 2013-05-28 | 2013-09-04 | 中国电子科技集团公司第十研究所 | Method for manufacturing embedded electronic circuit three-dimensional assembly substrate |
-
2014
- 2014-06-30 CN CN201410303793.4A patent/CN104028869A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4460817A (en) * | 1981-06-19 | 1984-07-17 | Hitachi, Ltd. | Resistance reflow soldering apparatus |
| JPH07214295A (en) * | 1994-02-03 | 1995-08-15 | Ishikawajima Harima Heavy Ind Co Ltd | Method for connecting lead wire to thin film-like metallic body |
| DE19846705A1 (en) * | 1997-04-10 | 2000-04-13 | Schweistechnische Lehr Und Ver | Soldering of low melting point highly conductive thin sheet components, especially stud soldering to a sheet, is effected using a solder deposit of low melting solder and high electrical resistance high melting solder |
| WO2001020957A1 (en) * | 1999-09-14 | 2001-03-22 | Lee John Robinson | Laminated reflow soldering |
| US20090197103A1 (en) * | 2007-01-30 | 2009-08-06 | Da-Yuan Shih | Modification of pb-free solder alloy compositions to improve interlayer dielectric delamination in silicon devices and electromigration resistance in solder joints |
| CN103281875A (en) * | 2013-05-28 | 2013-09-04 | 中国电子科技集团公司第十研究所 | Method for manufacturing embedded electronic circuit three-dimensional assembly substrate |
Non-Patent Citations (2)
| Title |
|---|
| 中国机械工程学会焊接学会: "《焊接手册》", 30 January 2008, 机械工业出版社 * |
| 吴伟伟: "双面凸点转接板垂直互连技术研究", 《中国优秀硕士学位论文全文数据库 工程Ⅰ辑》 * |
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Application publication date: 20140910 |