CN202455710U - Hot-fluid channel heat conduction device and electronic product - Google Patents
Hot-fluid channel heat conduction device and electronic product Download PDFInfo
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- CN202455710U CN202455710U CN2011204021456U CN201120402145U CN202455710U CN 202455710 U CN202455710 U CN 202455710U CN 2011204021456 U CN2011204021456 U CN 2011204021456U CN 201120402145 U CN201120402145 U CN 201120402145U CN 202455710 U CN202455710 U CN 202455710U
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Abstract
The present utility model discloses a hot-fluid channel heat conduction device and an electronic product. The hot-fluid channel heat conduction device comprises a heat conduction component which comprises a first heat conduction part and a second heat conduction part, the first heat conduction part is connected with a chip of a printed circuit board, and the second heat conduction part is connected with a shell body of the electronic product. In the hot-fluid channel heat conduction device, heat of a light module and other chips of high height can be conducted to the shell body of the electronic product to be effectively dissipated, thus the aim of effectively reducing chip temperature and system temperature can be realized, the system reliability can be greatly enhanced, and safe, reliable and stable working of a whole machine is guaranteed. Moreover, the hot-fluid channel heat conduction device is easy in structure processing, low in costs, convenient for installing and strong in maintainability, can reliably and safely operate under outdoor conditions for a long time, and reliability of structure installing can be greatly enhanced.
Description
Technical field
The utility model relates to the heat radiation field of electronic product, relates in particular to a kind of heat passage heat transfer device and electronic product.
Background technology
Moore's Law points out that the performance of electronic product doubled in per 18 months, and the power consumption of chip is inevitable to be increased along with the raising of electronic product performance, and the hear rate of generation also can be increasing.Simultaneously; Development along with microelectron-mechanical; Increasing electronic devices and components are packaged in the littler space; Package dimension is more and more littler with regard to the hear rate that has caused electronic device is increasing for this, so the density of heat flow rate on the unit are is increasing, and the heat flow on the unit volume is also increasing.Heat if can't be instant loose, the temperature of chip can be increasingly high.
Research and practical application show; 55% electronic equipment lost efficacy and caused by temperature is too high, 10 ℃ of the every risings of the temperature of single semiconductor element, and the reliability of system will reduce by 50%; Therefore, the good heat dissipation of electronic product higher stable sexual needs guarantees.
Effectively cooling measure is the prerequisite that guarantees electronic product safety, stable and reliably working.For the heat-sensitive device that is similar to the optical module class, the height of self-temperature has directly determined the stability of system.When chip temperature is too high, should take effective cooling measure, reduce the temperature of itself.
When electronic product adopted the aluminium shell housing, the chip big, that density of heat flow rate is high, highly low of some caloric values in the housing on the veneer can be attached on the housing and dispel the heat.Because these chip heights are lower, through being arranged in the PCB front, and on the aluminium shell of chip relevant position suitable some boss that are provided with, the space with between heat conduction pad filling boss and the chip can solve a heat radiation difficult problem.
But,, adopt the radiating mode same (positive layout of PCB and natural heat dissipation) bring difficulty will inevitably for the subsides housing heat radiation of other chips with the low chip of height to being similar to the higher chip of optical module (highly reaching 10mm) equal altitudes.If be employed on the aluminium shell body and dig a hole meeting because aluminium casing thickness (general 2mm) is thinner corresponding to the optical module position; And can't reach radiating effect; Promptly enable to solve the heat dissipation problem of optical module, the heat radiation cost of cost is also bigger, therefore; Such chip can only be placed on the back side of PCB, through solving of suitable cooling measure.
For optical module, traditional cooling measure is that aluminium block is set on housing, and aluminium block is connected with shell.This kind heat dissipating method generally hour can reach better heat radiating effect in the complete machine degree of depth.But when big, use this kind radiating mode promptly to enable to solve heat dissipation problem for the complete machine degree of depth, install and also will spend bigger cost, this external cause installation question and the long-term reliability that brings also can't guarantee.
The utility model content
The technical problem that the utility model will solve provides a kind of heat passage heat transfer device and electronic product, can be reduced in the installation cost that highly higher chip is set in the bigger electronic product of the complete machine degree of depth, and improves the stability of chip.
For solving the problems of the technologies described above; A kind of heat passage heat transfer device of the utility model comprises: conducting-heat elements, said conducting-heat elements comprise first heat-conducting part and second heat-conducting part; Said first heat-conducting part is connected with chip on the printed circuit board (PCB), and said second heat-conducting part is connected with the housing of electronic product.
Further, between said first heat-conducting part and chip, and be provided with the heat conduction pad that reduces contact heat resistance between the housing of said second heat-conducting part and electronic device.
Further, between said first heat-conducting part and chip, and be provided with the heat-conducting silicone grease that reduces contact heat resistance between the housing of said second heat-conducting part and electronic device.
Further, said conducting-heat elements adopts the fold shape.
Further, the cross section of said conducting-heat elements is L type or U type.
Further; A kind of electronic product comprises: housing and printed circuit board (PCB) also comprise: the heat passage heat transfer device; This heat passage heat transfer device comprises: conducting-heat elements; Said conducting-heat elements comprises first heat-conducting part and second heat-conducting part, and said first heat-conducting part is connected with chip on the said printed circuit board (PCB), and said second heat-conducting part is connected with said housing.
Further, between said first heat-conducting part and chip, and be provided with the heat conduction pad that reduces contact heat resistance between the housing of said second heat-conducting part and electronic device.
Further, between said first heat-conducting part and chip, and be provided with the heat-conducting silicone grease that reduces contact heat resistance between the housing of said second heat-conducting part and electronic device.
Further, said conducting-heat elements adopts the fold shape.
Further, the cross section of said conducting-heat elements is L type or U type.
In sum, the heat of the chip that the heat passage heat transfer device of the utility model can be directly higher with the optical module equal altitudes is transmitted on the housing of electronic product and effectively dispels the heat, thereby reaches effective attenuating chip temperature and then reduce the purpose of system temperature; Improve the reliability of system greatly, guaranteed complete machine safety, reliably, stably work, and; The heat passage heat transfer device structure processing of the utility model is simple and easy; Cost is low, and is easy for installation, maintainable strong; Long-term, reliable, safe operation under the condition out of doors, the reliability that the structure that has improved is greatly installed.
Description of drawings
Fig. 1 is the sketch map of electronic product of the employing L type heat passage heat transfer device of the utility model;
Fig. 2 is the schematic perspective view of the L type heat passage heat transfer device of the utility model;
Fig. 3 is the sketch map in A-A cross section of the L type heat passage heat transfer device of the utility model;
Fig. 4 is the heat exchange schematic diagram of the L type heat passage heat transfer device of the utility model.
Embodiment
Consider in the electronic product of metal shells such as present employing such as aluminum, for highly lower chip, with chip layout in printed circuit board (PCB) (PCB) front; Be attached on the housing and dispel the heat; But for the higher heat-sensitive device of optical module equal altitudes, can only be placed on the back side of PCB, and the back side of PCB and the space between the housing are general bigger; Can cause the structure installation risk bigger when adopting traditional aluminium block cooling measure; And because the area of dissipation of optical module itself is enough big, directly installing radiator additional also can only be with heat transferred in electronic product casing, and the ambient temperature in the housing does not reduce; And the height of the interior ambient temperature of housing has directly determined the height of optical module temperature; Therefore, for the enough big heat-sensitive device of area of dissipation, have only the suitable manner of employing heat to be directly delivered to the temperature that just can effectively reduce itself on the housing.The conducting-heat elements of the heat passage heat transfer device of this execution mode comprises first heat-conducting part and second heat-conducting part; Housing with chip that is installed in the PCB back side and electronic product is connected respectively, effectively heat is delivered on the housing from chip, and and then be delivered in the peripheral environment; Reduce the temperature of optical module itself; Realization is dispelled the heat to highly higher chip, can reach better radiating effect through simple structure, can reach higher thermal diffusivity price ratio.
Heat passage heat transfer device in the face of this execution mode is elaborated down.
As shown in Figure 1; The heat passage heat transfer device of the utility model comprises: conducting-heat elements 1 and heat conduction pad 2; Conducting-heat elements 1 comprises that first heat-conducting part 11 and second heat-conducting part, 12, the first heat-conducting parts 11 are connected with the higher chip 3 of the height that is arranged on the PCB4 back side, and second heat-conducting part 12 is connected with the housing 5 of electronic product; Between first heat-conducting part 11 and chip 3, heat conduction pad 2 is set; Between second heat-conducting part 12 and housing 5, heat conduction pad 2 is set equally, heat conduction pad 2 is used to reduce contact heat resistance, reduces the adverse effect of contact heat resistance to heat radiation.
The shape of conducting-heat elements 1 can adopt any fold shape, as, be " L " type and " U " type etc.Conducting-heat elements 1 adopts the higher material of conductive coefficient, like aluminium or copper etc.
Shown in Fig. 2～3, the conducting-heat elements 1 of L type comprises first heat-conducting part 11 and second heat-conducting part 12, looks mounting condition, and heat radiation can be realized with device contacts in two sides of first heat-conducting part 11 and second heat-conducting part 12.
Please refer again to Fig. 1, when chip height was low, through being arranged in the PCB4 front, the radiating mode that boss is set with housing 5 corresponding positions dispelled the heat.This mode can be effectively with the heat transferred of high hear rate, high heat flux chip outside shell.And can only be arranged on the back side of PCB4 for the highly higher chip 3 (heat-sensitive device) of optical module class, the lateral surface through first heat-conducting part 11 connects chip 3, connects housings 5 through second heat-conducting part 12, and the heat of chip 3 is directly transferred to outside the housing 5.Between first heat-conducting part 11 and chip 3, and be provided with heat conduction pad 2 between second heat-conducting part 12 and the housing 5 to reduce of the influence of space thermal resistance to heat radiation.
As shown in Figure 4, the heat of chip 3 (optical module) directly is delivered in the peripheral environment through heat conductive pad 2, first heat-conducting part 11, second heat-conducting part 12 and housing 5, thereby effectively lowers the temperature of optical module.
Please refer again to Fig. 1; This execution mode also provides a kind of electronic product; Comprise: housing 5, printed circuit board (PCB) 4 and heat passage heat transfer device, this heat passage heat transfer device comprises: conducting-heat elements 1, conducting-heat elements 1 comprise first heat-conducting part 11 and second heat-conducting part 12; First heat-conducting part 11 is connected with chip 3 on the printed circuit board (PCB) 4, and second heat-conducting part 12 is connected with housing 5.
Between first heat-conducting part 11 and chip 3, and be provided with the heat conduction pad 2 that reduces contact heat resistance between the housing 5 of second heat-conducting part 12 and electronic device; Perhaps, between first heat-conducting part and chip, and be provided with heat-conducting silicone grease between the housing of second heat-conducting part and electronic device.
Conducting-heat elements 1 adopts the fold shape, as, the cross section is L type or U type.
The preferred embodiment that the above is merely the utility model is not limited to the utility model, and for a person skilled in the art, the utility model can have various changes and variation.All within the spirit and principle of the utility model, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection range of the utility model.
Claims (10)
1. heat passage heat transfer device; It is characterized in that, comprising: conducting-heat elements, said conducting-heat elements comprise first heat-conducting part and second heat-conducting part; Said first heat-conducting part is connected with chip on the printed circuit board (PCB), and said second heat-conducting part is connected with the housing of electronic product.
2. heat transfer device as claimed in claim 1 is characterized in that:
Between said first heat-conducting part and chip, and be provided with the heat conduction pad that reduces contact heat resistance between the housing of said second heat-conducting part and electronic device.
3. heat transfer device as claimed in claim 1 is characterized in that:
Between said first heat-conducting part and chip, and be provided with the heat-conducting silicone grease that reduces contact heat resistance between the housing of said second heat-conducting part and electronic device.
4. heat transfer device as claimed in claim 1 is characterized in that: said conducting-heat elements adopts the fold shape.
5. heat transfer device as claimed in claim 4 is characterized in that: the cross section of said conducting-heat elements is L type or U type.
6. electronic product; Comprise: housing and printed circuit board (PCB), it is characterized in that, also comprise: the heat passage heat transfer device; This heat passage heat transfer device comprises: conducting-heat elements; Said conducting-heat elements comprises first heat-conducting part and second heat-conducting part, and said first heat-conducting part is connected with chip on the said printed circuit board (PCB), and said second heat-conducting part is connected with said housing.
7. electronic product as claimed in claim 6 is characterized in that:
Between said first heat-conducting part and chip, and be provided with the heat conduction pad that reduces contact heat resistance between the housing of said second heat-conducting part and electronic device.
8. electronic product as claimed in claim 6 is characterized in that:
Between said first heat-conducting part and chip, and be provided with the heat-conducting silicone grease that reduces contact heat resistance between the housing of said second heat-conducting part and electronic device.
9. electronic product as claimed in claim 6 is characterized in that: said conducting-heat elements adopts the fold shape.
10. electronic product as claimed in claim 9 is characterized in that: the cross section of said conducting-heat elements is L type or U type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204021456U CN202455710U (en) | 2011-10-20 | 2011-10-20 | Hot-fluid channel heat conduction device and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204021456U CN202455710U (en) | 2011-10-20 | 2011-10-20 | Hot-fluid channel heat conduction device and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202455710U true CN202455710U (en) | 2012-09-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204021456U Expired - Lifetime CN202455710U (en) | 2011-10-20 | 2011-10-20 | Hot-fluid channel heat conduction device and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202455710U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050361A (en) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | Heat radiation structure assembly of electronic device and electronic device |
| CN110780280A (en) * | 2019-11-07 | 2020-02-11 | 上海禾赛光电科技有限公司 | Laser radar |
| CN114302609A (en) * | 2021-11-10 | 2022-04-08 | 世强先进(深圳)科技股份有限公司 | Optical module and electronic equipment |
-
2011
- 2011-10-20 CN CN2011204021456U patent/CN202455710U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050361A (en) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | Heat radiation structure assembly of electronic device and electronic device |
| CN110780280A (en) * | 2019-11-07 | 2020-02-11 | 上海禾赛光电科技有限公司 | Laser radar |
| CN114302609A (en) * | 2021-11-10 | 2022-04-08 | 世强先进(深圳)科技股份有限公司 | Optical module and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120926 |
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| CX01 | Expiry of patent term |