CN204442828U - A kind of PCB of high efficiency and heat radiation - Google Patents

A kind of PCB of high efficiency and heat radiation Download PDF

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Publication number
CN204442828U
CN204442828U CN201520174254.5U CN201520174254U CN204442828U CN 204442828 U CN204442828 U CN 204442828U CN 201520174254 U CN201520174254 U CN 201520174254U CN 204442828 U CN204442828 U CN 204442828U
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China
Prior art keywords
hole
components
mainboard
heat
parts
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CN201520174254.5U
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Chinese (zh)
Inventor
袁志贤
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Guangdong Gaohang Intellectual Property Operation Co ltd
Shunde Foshan Onkyo Electronics Co ltd
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Individual
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Abstract

The utility model discloses a kind of PCB of high efficiency and heat radiation, comprise mainboard, pad and the components and parts with pin, described mainboard front is range of distribution, and the back side is wiring side, and described range of distribution is provided with insulation glue-line, and described wiring side is provided with heat dissipating layer; Described mainboard is provided with through hole, and described range of distribution is located at by described components and parts, and described pad is located at described wiring side, and the pin of described components and parts is connected with described pad through described through hole, and described through-hole wall is provided with insulated thermal insulating layer; Described mainboard is provided with via hole, and described via hole is through described insulation glue-line and described heat dissipating layer.The utility model not only can dispel the heat to circuit board itself, production cost can also be reduced, also the transmission of pin heat to circuit board can be reduced, and the heat exchange of isolated circuit board and electronic devices and components, and its thickness adapts to the related request of existing frivolous circuit board.

Description

A kind of PCB of high efficiency and heat radiation
Technical field
The utility model relates to PCB technical field, particularly relates to a kind of PCB of high efficiency and heat radiation.
Background technology
At present, on the pcb board that market provides, except planning has predetermined electronic circuit, also comprise many grafting electronic devices and components thereon, especially some powerful components and parts, these components and parts disengage certain working temperature at work, improper if dispelled the heat, not only affect the life-span of these type of components and parts, also can affect the performance of PCB plate, in order to improve heat dispersion, general method on these components and parts or circuit board, adds fan or aluminium radiator fin dispels the heat, this type of heat abstractor volume is larger, can not adapt to current to the thinner lighter trend of electronic product requirement, and its radiating effect is unsatisfactory, the cooling requirements of electronic unit can not be met, great puzzlement is caused to manufacturer.
Above defect, is worth solving.
Summary of the invention
In order to overcome the deficiency of existing technology, the utility model provides a kind of PCB of high efficiency and heat radiation.
Technical solutions of the utility model are as described below:
A PCB for high efficiency and heat radiation, comprises mainboard, pad and the components and parts with pin, it is characterized in that, described mainboard front is range of distribution, and the back side is wiring side, and described range of distribution is provided with insulation glue-line, and described wiring side is provided with heat dissipating layer; Described mainboard is provided with through hole, and described range of distribution is located at by described components and parts, and described pad is located at described wiring side, and the pin of described components and parts is connected with described pad through described through hole, and described through-hole wall is provided with insulated thermal insulating layer; Described mainboard is provided with via hole, and described via hole is through described insulation glue-line and described heat dissipating layer.
Described via hole is distributed between described through hole and around described through hole.
The thickness of described insulation glue-line 200 μm ~ 300 μm.
The thickness of described heat dissipating layer is 50 μm ~ 150 μm.
According to the utility model of said structure, its beneficial effect is, the utility model adds the area of dissipation on circuit board around components and parts, not only can dispel the heat to circuit board itself, can also production cost be reduced, so that circuit board body useful life can be improved.In addition, insulated thermal insulating layer is set in the through hole that electronic devices and components pin contacts and can reduces the transmission of pin heat to circuit board, avoid heat between the two mutually to disturb.Two planes of circuit board arrange insulating barrier and heat dissipating layer respectively, the heat exchange of circuit board and electronic devices and components can be completely cut off and increase the radiating effect of circuit board, and its thickness adapts to the related request of existing frivolous circuit board.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In the drawings, 1, mainboard; 2, insulate glue-line; 3, heat dissipating layer; 4, through hole; 5, components and parts; 6, pin; 7, pad; 8, via hole; 9, insulated thermal insulating layer.
Embodiment
Below in conjunction with accompanying drawing and execution mode, the utility model is conducted further description:
As shown in Figure 1, a kind of PCB of high efficiency and heat radiation, comprises mainboard 1, pad 7 and the components and parts 5 with pin 6.
Mainboard 1 front is range of distribution, and the back side is wiring side, and range of distribution is provided with insulation glue-line 2, and wiring side is provided with heat dissipating layer 3.
On mainboard, 1 is provided with through hole 4, and range of distribution is located at by components and parts 5, and pad 7 is located at wiring side, and the pin 6 of components and parts 5 is connected with pad 7 through through hole 4, and through hole 4 inwall is provided with insulated thermal insulating layer 9.
Mainboard 1 is provided with via hole 8, and via hole 8 is distributed between through hole 4 and around through hole 4, and via hole 8 is through insulation glue-line 2 and heat dissipating layer 3.
Preferably, the thickness 200 μm ~ 300 μm of insulation glue-line 2, the thickness of heat dissipating layer 3 is 50 μm ~ 150 μm.This thickness makes circuit board under the frivolous requirement ensureing PCB, reaches better radiating effect.
Should be understood that, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to the utility model claims.
By reference to the accompanying drawings exemplary description is carried out to the utility model patent above; the realization of obvious the utility model patent is not subject to the restrictions described above; as long as have employed the various improvement that method is conceived and technical scheme is carried out of the utility model patent; or the design of the utility model patent and technical scheme directly applied to other occasion, all in protection range of the present utility model without to improve.

Claims (4)

1. a PCB for high efficiency and heat radiation, comprises mainboard, pad and the components and parts with pin, it is characterized in that, described mainboard front is range of distribution, and the back side is wiring side, and described range of distribution is provided with insulation glue-line, and described wiring side is provided with heat dissipating layer;
Described mainboard is provided with through hole, and described range of distribution is located at by described components and parts, and described pad is located at described wiring side, and the pin of described components and parts is connected with described pad through described through hole, and described through-hole wall is provided with insulated thermal insulating layer;
Described mainboard is provided with via hole, and described via hole is through described insulation glue-line and described heat dissipating layer.
2. the PCB of a kind of high efficiency and heat radiation according to claim 1, is characterized in that, described via hole is distributed between described through hole and around described through hole.
3. the PCB of a kind of high efficiency and heat radiation according to claim 1, is characterized in that, the thickness of described insulation glue-line 200 μm ~ 300 μm.
4. the PCB of a kind of high efficiency and heat radiation according to claim 1, is characterized in that, the thickness of described heat dissipating layer is 50 μm ~ 150 μm.
CN201520174254.5U 2015-03-26 2015-03-26 A kind of PCB of high efficiency and heat radiation Active CN204442828U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520174254.5U CN204442828U (en) 2015-03-26 2015-03-26 A kind of PCB of high efficiency and heat radiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520174254.5U CN204442828U (en) 2015-03-26 2015-03-26 A kind of PCB of high efficiency and heat radiation

Publications (1)

Publication Number Publication Date
CN204442828U true CN204442828U (en) 2015-07-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520174254.5U Active CN204442828U (en) 2015-03-26 2015-03-26 A kind of PCB of high efficiency and heat radiation

Country Status (1)

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CN (1) CN204442828U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107396531A (en) * 2017-07-13 2017-11-24 上海斐讯数据通信技术有限公司 A kind of pcb board of high efficiency and heat radiation, pcb board heat dissipating method
CN110267430A (en) * 2019-06-12 2019-09-20 惠州市盈帆实业有限公司 A kind of circuit board and its preparation process for blind slot film
CN110708917A (en) * 2019-11-20 2020-01-17 上海奉天电子股份有限公司 Power converter and manufacturing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107396531A (en) * 2017-07-13 2017-11-24 上海斐讯数据通信技术有限公司 A kind of pcb board of high efficiency and heat radiation, pcb board heat dissipating method
CN110267430A (en) * 2019-06-12 2019-09-20 惠州市盈帆实业有限公司 A kind of circuit board and its preparation process for blind slot film
CN110267430B (en) * 2019-06-12 2021-08-13 惠州市盈帆实业有限公司 Circuit board for blind groove coating and preparation process thereof
CN110708917A (en) * 2019-11-20 2020-01-17 上海奉天电子股份有限公司 Power converter and manufacturing method thereof

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20170512

Address after: 528000 Guangdong province Foshan city Shunde District Daliang Industrial Zone Fengxiang Fengxin Street Coopers Trade Tower A two floor of

Patentee after: Shunde Foshan ONKYO Electronics Co.,Ltd.

Address before: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China

Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd.

Effective date of registration: 20170512

Address after: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China

Patentee after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd.

Address before: 518000 Futian District, Guangdong City, Tian An Digital City, building 3 6D2

Patentee before: Yuan Zhixian