CN204442828U - A kind of PCB of high efficiency and heat radiation - Google Patents
A kind of PCB of high efficiency and heat radiation Download PDFInfo
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- CN204442828U CN204442828U CN201520174254.5U CN201520174254U CN204442828U CN 204442828 U CN204442828 U CN 204442828U CN 201520174254 U CN201520174254 U CN 201520174254U CN 204442828 U CN204442828 U CN 204442828U
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Abstract
本实用新型公开了一种高效散热的PCB电路板，包括主板、焊盘和带有引脚的元器件，所述主板正面为布局面，背面为布线面，所述布局面设有绝缘胶层，所述布线面设有散热层；所述主板上设有通孔，所述元器件设于所述布局面，所述焊盘设于所述布线面，且所述元器件的引脚穿过所述通孔与所述焊盘连接，所述通孔内壁设有绝缘隔热层；所述主板上设有辅助孔，所述辅助孔穿过所述绝缘胶层和所述散热层。本实用新型不仅可以对电路板本身进行散热，还可以减少生产成本，也可以降低引脚热量对电路板的传递，以及隔绝电路板与电子元器件的热交换，且其厚度适应现有轻薄电路板的相关要求。
The utility model discloses a high-efficiency heat dissipation PCB circuit board, which comprises a main board, pads and components with pins. The front side of the main board is a layout surface, and the back side is a wiring surface. The layout surface is provided with an insulating glue layer , the wiring surface is provided with a heat dissipation layer; the main board is provided with through holes, the components are provided on the layout surface, the pads are provided on the wiring surface, and the pins of the components pass through The through hole is connected to the pad, and the inner wall of the through hole is provided with an insulating and heat insulating layer; the main board is provided with an auxiliary hole, and the auxiliary hole passes through the insulating glue layer and the heat dissipation layer. The utility model can not only dissipate the heat of the circuit board itself, but also reduce the production cost, reduce the heat transfer of the pins to the circuit board, and isolate the heat exchange between the circuit board and electronic components, and its thickness is suitable for existing light and thin circuits board requirements.
Description
技术领域 technical field
本实用新型涉及 PCB电路板技术领域，尤其涉及一种高效散热的PCB电路板。 The utility model relates to the technical field of PCB circuit boards, in particular to a PCB circuit board with high heat dissipation.
背景技术 Background technique
目前，市场上提供的PCB板上，除了规划有预定的电子线路，还包括许多插接于其上的电子元器件，尤其是一些大功率的元器件，这些元器件在工作中释出一定的工作温度，如果散热不当，不但影响此类元器件的寿命，还会影响 PCB 板的性能，为了提高散热性能，一般的方法是在这些元器件或电路板上加设风扇或铝散热片进行散热，此类散热装置体积较大，不能适应当前对电子产品要求更薄更轻的趋势，且其散热效果并不理想，并不能满足电子部件的散热要求，对生产商造成极大的困扰。 At present, in addition to the planned electronic circuits, the PCB boards on the market also include many electronic components plugged on it, especially some high-power components. If the working temperature is not properly dissipated, it will not only affect the life of such components, but also affect the performance of the PCB board. In order to improve the heat dissipation performance, the general method is to add fans or aluminum heat sinks to these components or circuit boards for heat dissipation. , This type of cooling device is large in size and cannot adapt to the current trend of thinner and lighter electronic products, and its cooling effect is not ideal, and cannot meet the cooling requirements of electronic components, causing great troubles to manufacturers.
以上缺陷，值得解决。 The above defects are worth solving.
发明内容 Contents of the invention
为了克服现有的技术的不足, 本实用新型提供一种高效散热的PCB电路板。 In order to overcome the deficiencies of the existing technology, the utility model provides a PCB circuit board with high heat dissipation.
本实用新型技术方案如下所述： The technical scheme of the utility model is as follows:
一种高效散热的PCB电路板，包括主板、焊盘和带有引脚的元器件，其特征在于，所述主板正面为布局面，背面为布线面，所述布局面设有绝缘胶层，所述布线面设有散热层；所述主板上设有通孔，所述元器件设于所述布局面，所述焊盘设于所述布线面，且所述元器件的引脚穿过所述通孔与所述焊盘连接，所述通孔内壁设有绝缘隔热层；所述主板上设有辅助孔，所述辅助孔穿过所述绝缘胶层和所述散热层。 A high-efficiency heat-dissipating PCB circuit board, including a main board, pads and components with pins, is characterized in that the front of the main board is a layout surface, and the back is a wiring surface, and the layout surface is provided with an insulating adhesive layer. The wiring surface is provided with a heat dissipation layer; the main board is provided with through holes, the components are provided on the layout surface, the pads are provided on the wiring surface, and the pins of the components pass through The through hole is connected to the pad, and the inner wall of the through hole is provided with an insulating and heat insulating layer; the main board is provided with an auxiliary hole, and the auxiliary hole passes through the insulating glue layer and the heat dissipation layer.
所述辅助孔分布于所述通孔之间和所述通孔周围。 The auxiliary holes are distributed between and around the through holes.
所述绝缘胶层的厚度 200μm～300μm。 The thickness of the insulating adhesive layer is 200 μm to 300 μm.
所述散热层的厚度为50μm～150μm。 The thickness of the heat dissipation layer is 50 μm˜150 μm.
根据上述结构的本实用新型，其有益效果在于，本实用新型增加了电路板上元器件周围的散热面积，不仅可以对电路板本身进行散热，还可以减少生产成本，以致可提高电路板本体使用寿命。另外，电子元器件引脚所接触的通孔内设置绝缘隔热层可以降低引脚热量对电路板的传递，避免两者之间的热量相互干扰。电路板的两个平面上分别设置绝缘层和散热层，可以隔绝电路板与电子元器件的热交换以及增加电路板的散热效果，且其厚度适应现有轻薄电路板的相关要求。 According to the utility model with the above-mentioned structure, its beneficial effect is that the utility model increases the heat dissipation area around the components on the circuit board, which can not only dissipate heat on the circuit board itself, but also reduce production costs, so that the use of the circuit board body can be improved. life. In addition, an insulating and heat-insulating layer is provided in the through holes where the pins of the electronic components are in contact with, which can reduce the heat transfer from the pins to the circuit board, and avoid mutual interference of the heat between the two. The two planes of the circuit board are respectively provided with an insulating layer and a heat dissipation layer, which can isolate the heat exchange between the circuit board and electronic components and increase the heat dissipation effect of the circuit board, and its thickness meets the relevant requirements of the existing light and thin circuit board.
附图说明 Description of drawings
图1为本实用新型的结构示意图。 Fig. 1 is the structural representation of the utility model.
在图中，1、主板；2、绝缘胶层；3、散热层；4、通孔；5、元器件；6、引脚；7、焊盘；8、辅助孔；9、绝缘隔热层。 In the figure, 1. Main board; 2. Insulation layer; 3. Heat dissipation layer; 4. Through hole; 5. Components; 6. Pin; 7. Pad; 8. Auxiliary hole; 9. Insulation layer .
具体实施方式 Detailed ways
下面结合附图以及实施方式对本实用新型进行进一步的描述： Below in conjunction with accompanying drawing and embodiment the utility model is further described:
如图1所示，一种高效散热的PCB电路板，包括主板1、焊盘7和带有引脚6的元器件5。 As shown in FIG. 1 , a high-efficiency heat dissipation PCB circuit board includes a main board 1 , pads 7 and components 5 with pins 6 .
主板1正面为布局面，背面为布线面，布局面设有绝缘胶层2，布线面设有散热层3。 The front of the motherboard 1 is a layout surface, and the back is a wiring surface. The layout surface is provided with an insulating adhesive layer 2 , and the wiring surface is provided with a heat dissipation layer 3 .
主板上1设有通孔4，元器件5设于布局面，焊盘7设于布线面，且元器件5的引脚6穿过通孔4与焊盘7连接，通孔4内壁设有绝缘隔热层9。 The main board 1 is provided with a through hole 4, the component 5 is provided on the layout surface, the pad 7 is provided on the wiring surface, and the pin 6 of the component 5 is connected to the pad 7 through the through hole 4, and the inner wall of the through hole 4 is provided with Insulation and heat insulation layer 9.
主板1上设有辅助孔8，辅助孔8分布于通孔4之间和通孔4周围，且辅助孔8穿过绝缘胶层2和散热层3。 The main board 1 is provided with auxiliary holes 8 distributed between and around the through holes 4 , and the auxiliary holes 8 pass through the insulating glue layer 2 and the heat dissipation layer 3 .
优选的，绝缘胶层2的厚度 200μm～300μm，散热层3的厚度为50μm～150μm。该厚度使得电路板在保证PCB电路板的轻薄要求下，达到更好的散热效果。 Preferably, the thickness of the insulating adhesive layer 2 is 200 μm to 300 μm, and the thickness of the heat dissipation layer 3 is 50 μm to 150 μm. This thickness enables the circuit board to achieve a better heat dissipation effect under the requirement of ensuring the lightness and thinness of the PCB circuit board.
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本实用新型所附权利要求的保护范围。 It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should belong to the protection scope of the appended claims of the present utility model.
上面结合附图对本实用新型专利进行了示例性的描述，显然本实用新型专利的实现并不受上述方式的限制，只要采用了本实用新型专利的方法构思和技术方案进行的各种改进，或未经改进将本实用新型专利的构思和技术方案直接应用于其它场合的，均在本实用新型的保护范围内。 The utility model patent has been exemplarily described above in conjunction with the accompanying drawings. Obviously, the implementation of the utility model patent is not limited by the above-mentioned methods, as long as various improvements made by the method concept and technical solutions of the utility model patent are adopted, or Directly applying the ideas and technical solutions of the utility model patent to other occasions without improvement is within the protection scope of the utility model.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520174254.5U CN204442828U (en) | 2015-03-26 | 2015-03-26 | A kind of PCB of high efficiency and heat radiation |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520174254.5U CN204442828U (en) | 2015-03-26 | 2015-03-26 | A kind of PCB of high efficiency and heat radiation |
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| CN204442828U true CN204442828U (en) | 2015-07-01 |
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| CN201520174254.5U Expired - Lifetime CN204442828U (en) | 2015-03-26 | 2015-03-26 | A kind of PCB of high efficiency and heat radiation |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107396531A (en) * | 2017-07-13 | 2017-11-24 | 上海斐讯数据通信技术有限公司 | A kind of pcb board of high efficiency and heat radiation, pcb board heat dissipating method |
| CN110267430A (en) * | 2019-06-12 | 2019-09-20 | 惠州市盈帆实业有限公司 | A kind of circuit board and its preparation process for blind slot film |
| CN110708917A (en) * | 2019-11-20 | 2020-01-17 | 上海奉天电子股份有限公司 | A power converter and its manufacturing method |
-
2015
- 2015-03-26 CN CN201520174254.5U patent/CN204442828U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107396531A (en) * | 2017-07-13 | 2017-11-24 | 上海斐讯数据通信技术有限公司 | A kind of pcb board of high efficiency and heat radiation, pcb board heat dissipating method |
| CN110267430A (en) * | 2019-06-12 | 2019-09-20 | 惠州市盈帆实业有限公司 | A kind of circuit board and its preparation process for blind slot film |
| CN110267430B (en) * | 2019-06-12 | 2021-08-13 | 惠州市盈帆实业有限公司 | Circuit board for blind groove coating and preparation process thereof |
| CN110708917A (en) * | 2019-11-20 | 2020-01-17 | 上海奉天电子股份有限公司 | A power converter and its manufacturing method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170512 Address after: 528000 Guangdong province Foshan city Shunde District Daliang Industrial Zone Fengxiang Fengxin Street Coopers Trade Tower A two floor of Patentee after: Shunde Foshan ONKYO Electronics Co.,Ltd. Address before: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Effective date of registration: 20170512 Address after: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Address before: 518000 Futian District, Guangdong City, Tian An Digital City, building 3 6D2 Patentee before: Yuan Zhixian |
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| TR01 | Transfer of patent right |