CN103747662A - Fan controller - Google Patents
Fan controller Download PDFInfo
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- CN103747662A CN103747662A CN201410029144.XA CN201410029144A CN103747662A CN 103747662 A CN103747662 A CN 103747662A CN 201410029144 A CN201410029144 A CN 201410029144A CN 103747662 A CN103747662 A CN 103747662A
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- circuit board
- power device
- integrated
- controller
- power
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Abstract
The invention discloses a fan controller, which comprises a first class of power devices of which the power is higher than preset power, a second class of power devices of which the power is lower than the preset power, a first circuit board on which the first class of power devices are integrated, and a second circuit board on which the second class of power devices are integrated, wherein the first and second circuit boards are superposed. According to the fan controller, high-power devices are integrated on a high thermal conductivity circuit board, and small-power devices are integrated on a common circuit board, so that the area of the high thermal conductivity circuit board is reduced, the manufacturing cost of the circuit boards is reduced, and by superposing the high thermal conductivity circuit board and the common circuit board, the space utilization rate is improved.
Description
Technical field
The present invention relates to field of automobile, relate in particular to a kind of controller of fan for automobile.
Background technology
In the process of Bus & Coach Design and manufacture, cooling system is an important component part, and controller of fan in cooling system is as a core of cooling system running, ensures that the operation that it can efficient stable also seems particularly important.Usually, larger device and the relatively little device of power of the integrated meritorious rate of meeting in controller of fan, the device larger due to power can produce more heat when working, therefore need to ensure the secure heat dissipation of controller, in prior art, by employing, having had pcb board that conductive coefficient is higher and configuration fan etc. dispels the heat to controller, but, the pcb board relative cost that conductive coefficient is higher is high, reduce the competitiveness of product, and configuration fan can increase the volume of controller, be unfavorable for the miniaturization of product.
In view of this, need to provide a kind of controller of fan, to address the above problem.
Summary of the invention
The present invention proposes a kind of new structure of controller of fan, by reducing the area of high heat-conduction circuit board, thereby realize, saves cost of manufacture.
In order to achieve the above object, the technical solution adopted in the present invention is:
A controller of fan, comprising:
Power is the Equations of The Second Kind power device lower than predetermined power higher than the first kind power device of predetermined power and power;
First circuit board, integrated described first kind power device on described first circuit board;
Second circuit board, integrated described Equations of The Second Kind power device on described second circuit board;
Wherein, described first circuit board and described second circuit board lamination arrange.
As a further improvement on the present invention, described first circuit board is integrated with a side of power device and a side that described second circuit board is integrated with power device is oppositely arranged.
As a further improvement on the present invention, described first circuit board is integrated with the side that the opposing opposite side of power device one side and described second circuit board be integrated with power device and is oppositely arranged.
As a further improvement on the present invention, described first circuit board is integrated with a side of power device and described second circuit board and is integrated with the opposing opposite side of power device one side and is oppositely arranged.
As a further improvement on the present invention, described first circuit board is integrated with the opposing opposite side of power device one side and described second circuit board and is integrated with the opposing opposite side of power device one side and is oppositely arranged.
As a further improvement on the present invention, between described first circuit board and described second circuit board, by connector, be electrically connected.
As a further improvement on the present invention, be printed with the circuit that 2oz copper is thick on described first circuit board, described circuit live width is 5.95mm.
As a further improvement on the present invention, be printed with the circuit that 1oz copper is thick on described second circuit board, described line width is 11.9mm.
As a further improvement on the present invention, described first kind power device comprises inductance and/or electric capacity and/or metal-oxide-semiconductor and and/or detection resistance.
As a further improvement on the present invention, described Equations of The Second Kind power device comprises predrive chip and/or MCU chip and and/or sampling filter.
Compared with prior art, controller of fan of the present invention is by the integrated paramount heat-conduction circuit board of high power device, low-power device is integrated into ordinary circuit board, thereby reduced the area of high heat-conduction circuit board, saved the cost of manufacture of circuit board, high heat-conduction circuit board and ordinary circuit board lamination are arranged simultaneously, improved space availability ratio.
Accompanying drawing explanation
Fig. 1 is the structural representation of controller of fan one execution mode of the present invention;
Fig. 2 is the structural representation of the another execution mode of controller of fan of the present invention;
Fig. 3 is the structural representation of the another execution mode of controller of fan of the present invention;
Fig. 4 is the structural representation of the another execution mode of controller of fan of the present invention.
Embodiment
Below with reference to embodiment shown in the drawings, describe the present invention.But these execution modes do not limit the present invention, the conversion in the structure that those of ordinary skill in the art makes according to these execution modes, method or function is all included in protection scope of the present invention.
In the present invention, controller of fan includes some power devices, and it is integrated on circuit board, the work that cooperatively interacts between each power device, thus form controller of fan, play the effect of heat radiation.These some power devices comprise power higher than the first kind power device of predetermined power and power the Equations of The Second Kind power device lower than predetermined power, it is very little that this Equations of The Second Kind power can be considered produced heat.Especially, in present embodiment, the circuit board that controller of fan is used includes first circuit board 1 and second circuit board 2.Wherein, first circuit board 1 is selected the circuit board of high heat conduction and is integrated with first kind power device, and 2 of second circuit boards are selected ordinary circuit board and are integrated with Equations of The Second Kind power device.In present embodiment, circuit board mainly needs to consider whether meet power demand, and anti-electromagnetic interference capability.Preferably, by first circuit board 1 and second circuit board 2 lamination settings, its lamination setting can reduce the volume of controller of fan module, prior can reducing production costs.
Shown in please refer to the drawing 1, in one embodiment of the present invention, first circuit board 1 is integrated with a side of power device and a side that second circuit board 2 is integrated with power device is oppositely arranged.Wherein, between first circuit board 1 and second circuit board 2, by connector 3, be electrically connected.The laminated construction of this second circuit board 2 and second circuit board 2, had both saved cost, had improved space availability ratio simultaneously.Preferably; this execution mode is preferred forms of the present invention; one side first circuit board 1 to power device and second circuit board 2 have the relative lamination setting of a side of power device; so not only improved space availability ratio; and power device is integrated on circuit board and has certain protective effect, avoid the damage causing outside because power device is exposed.In the present embodiment, first circuit board 1 is high-power plate, and first kind power device placed thereon comprises inductance and/or electric capacity and/or metal-oxide-semiconductor and and/or detects other high power devices such as resistance.On this first circuit board 1, be printed with the circuit that 2oz copper is thick, its circuit live width is 5.95mm.Second circuit board 2 is small-power plate, and Equations of The Second Kind power device placed thereon comprises predrive chip and/or MCU chip and and/or the low-power device such as sampling filter.On this second circuit board 2, be printed with the circuit that 1oz copper is thick, its line width is 11.9mm.Especially, on first circuit board 1, also can be provided with radiator, to assist first kind power device heat radiation on first circuit board 1.
As shown in Figure 2, in another embodiment of the present invention, first circuit board 1 is integrated with the side that the opposing opposite side of power device one side and second circuit board 2 be integrated with power device and is oppositely arranged.Wherein, between first circuit board 1 and second circuit board 2, by connector 3, be electrically connected.The laminated construction of this second circuit board 2 and second circuit board 2, had both saved cost, had improved space availability ratio simultaneously.In the present embodiment, first circuit board 1 is high-power plate, and first kind power device placed thereon comprises inductance and/or electric capacity and/or metal-oxide-semiconductor and and/or detects other high power devices such as resistance.On this first circuit board 1, be printed with the circuit that 2oz copper is thick, its circuit live width is 5.95mm.Second circuit board 2 is small-power plate, and Equations of The Second Kind power device placed thereon comprises predrive chip and/or MCU chip and and/or sampling filter etc.On this second circuit board 2, be printed with the circuit that 1oz copper is thick, its line width is 11.9mm.Especially, on first circuit board 1, also can be provided with radiator, to assist first kind power device heat radiation on first circuit board 1.
As shown in Figure 3, in another embodiment of the invention, first circuit board 1 is integrated with a side of power device and opposite side that second circuit board 2 is integrated with the opposing side of power device is oppositely arranged.Wherein, between first circuit board 1 and second circuit board 2, by connector 3, be electrically connected.The laminated construction of this second circuit board 2 and second circuit board 2, had both saved cost, had improved space availability ratio simultaneously.In the present embodiment, first circuit board 1 is high-power plate, and first kind power device placed thereon comprises inductance and/or electric capacity and/or metal-oxide-semiconductor and and/or detects other high power devices such as resistance.On this first circuit board 1, be printed with the circuit that 2oz copper is thick, its circuit live width is 5.95mm.Second circuit board 2 is small-power plate, and Equations of The Second Kind power device placed thereon comprises predrive chip and/or MCU chip and and/or sampling filter.On this second circuit board 2, be printed with the circuit that 1oz copper is thick, its line width is 11.9mm.Especially, on first circuit board 1, also can be provided with radiator, to assist first kind power device heat radiation on first circuit board 1.
As shown in Figure 4, in another embodiment of the invention, first circuit board 1 is integrated with the opposite side of the opposing side of power device and opposite side that second circuit board 2 is integrated with the opposing side of power device is oppositely arranged.Wherein, between first circuit board 1 and second circuit board 2, by connector 3, be electrically connected.The laminated construction of this second circuit board 2 and second circuit board 2, had both saved cost, had improved space availability ratio simultaneously.In addition, between first circuit board 1 and second circuit board 2 laminations, other structures of all right accommodating controller of fan, play the effect of protection.In the present embodiment, first circuit board 1 is high-power plate, and first kind power device placed thereon comprises inductance and/or electric capacity and/or metal-oxide-semiconductor and and/or detects other high power devices such as resistance.On this first circuit board 1, be printed with the circuit that 2oz copper is thick, its circuit live width is 5.95mm.Second circuit board 2 is small-power plate, and Equations of The Second Kind power device placed thereon comprises predrive chip and/or MCU chip and and/or sampling filter.On this second circuit board 2, be printed with the circuit that 1oz copper is thick, its line width is 11.9mm.Especially, on first circuit board 1, also can be provided with radiator, to assist first kind power device heat radiation on first circuit board 1.
In the present invention, controller of fan, by the integrated paramount heat-conduction circuit board of high power device, is integrated into ordinary circuit board by low-power device, thereby has reduced the area of high heat-conduction circuit board, has saved the cost of manufacture of circuit board.High heat-conduction circuit board and ordinary circuit board lamination are arranged simultaneously, improved space availability ratio.
Be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should make specification as a whole, technical scheme in each execution mode also can, through appropriately combined, form other execution modes that it will be appreciated by those skilled in the art that.
Listed a series of detailed description is above only illustrating for feasibility execution mode of the present invention; they are not in order to limit the scope of the invention, all disengaging within equivalent execution mode that skill spirit of the present invention does or change all should be included in protection scope of the present invention.
Claims (10)
1. a controller of fan, is characterized in that, comprising:
Power is the Equations of The Second Kind power device lower than predetermined power higher than the first kind power device of predetermined power and power;
First circuit board, integrated described first kind power device on described first circuit board;
Second circuit board, integrated described Equations of The Second Kind power device on described second circuit board;
Wherein, described first circuit board and described second circuit board lamination arrange.
2. controller of fan according to claim 1, is characterized in that, described first circuit board is integrated with a side of power device and a side that described second circuit board is integrated with power device is oppositely arranged.
3. controller of fan according to claim 1, is characterized in that, described first circuit board is integrated with the side that the opposing opposite side of power device one side and described second circuit board be integrated with power device and is oppositely arranged.
4. controller of fan according to claim 1, is characterized in that, described first circuit board is integrated with a side of power device and described second circuit board and is integrated with the opposing opposite side of power device one side and is oppositely arranged.
5. controller of fan according to claim 1, is characterized in that, described first circuit board is integrated with the opposing opposite side of power device one side and described second circuit board and is integrated with the opposing opposite side of power device one side and is oppositely arranged.
6. according to the controller of fan described in any one in claim 2 ~ 5, it is characterized in that, between described first circuit board and described second circuit board, by connector, be electrically connected.
7. controller of fan according to claim 6, is characterized in that, is printed with the circuit that 2oz copper is thick on described first circuit board, and described circuit live width is 5.95mm.
8. controller of fan according to claim 6, is characterized in that, is printed with the circuit that 1oz copper is thick on described second circuit board, and described line width is 11.9mm.
9. controller of fan according to claim 1, is characterized in that, described first kind power device comprises inductance and/or electric capacity and/or metal-oxide-semiconductor and/or detects resistance.
10. controller of fan according to claim 1, is characterized in that, described Equations of The Second Kind power device comprises predrive chip and/or MCU chip and/or sampling filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410029144.XA CN103747662A (en) | 2014-01-22 | 2014-01-22 | Fan controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410029144.XA CN103747662A (en) | 2014-01-22 | 2014-01-22 | Fan controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103747662A true CN103747662A (en) | 2014-04-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410029144.XA Pending CN103747662A (en) | 2014-01-22 | 2014-01-22 | Fan controller |
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| Country | Link |
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| CN (1) | CN103747662A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113535636A (en) * | 2021-06-30 | 2021-10-22 | 成都中微达信科技有限公司 | Computing device |
| WO2023092347A1 (en) * | 2021-11-24 | 2023-06-01 | 华为技术有限公司 | Brake system and apparatus |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4498120A (en) * | 1982-03-01 | 1985-02-05 | Kaufman Lance R | Electrical sub-assembly having a lead frame to be compressed between a circuit board and heat sink |
| DE3832856A1 (en) * | 1988-09-28 | 1990-03-29 | Standard Elektrik Lorenz Ag | Printed circuit board having a thermally conductive element |
| US20010008483A1 (en) * | 2000-01-19 | 2001-07-19 | Lee Sang-Kyun | Single module system for electric/electronic appliance |
| US20070097625A1 (en) * | 2005-11-01 | 2007-05-03 | Foxconn Technology Co., Ltd. | Printed circuit board with a heat dissipation device |
| CN101907912A (en) * | 2010-08-06 | 2010-12-08 | 威盛电子股份有限公司 | Electronic equipment |
| CN102810001A (en) * | 2011-06-02 | 2012-12-05 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation system |
| CN203251517U (en) * | 2013-05-15 | 2013-10-23 | 安波电机(宁德)有限公司 | Integratedly-designed speed-adjustable motor controller |
| CN103391699A (en) * | 2012-05-10 | 2013-11-13 | 株式会社捷太格特 | Control device, and motor unit including control device |
| CN203708741U (en) * | 2014-01-22 | 2014-07-09 | 苏州工业园区驿力机车科技有限公司 | Fan controller |
-
2014
- 2014-01-22 CN CN201410029144.XA patent/CN103747662A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4498120A (en) * | 1982-03-01 | 1985-02-05 | Kaufman Lance R | Electrical sub-assembly having a lead frame to be compressed between a circuit board and heat sink |
| DE3832856A1 (en) * | 1988-09-28 | 1990-03-29 | Standard Elektrik Lorenz Ag | Printed circuit board having a thermally conductive element |
| US20010008483A1 (en) * | 2000-01-19 | 2001-07-19 | Lee Sang-Kyun | Single module system for electric/electronic appliance |
| US20070097625A1 (en) * | 2005-11-01 | 2007-05-03 | Foxconn Technology Co., Ltd. | Printed circuit board with a heat dissipation device |
| CN101907912A (en) * | 2010-08-06 | 2010-12-08 | 威盛电子股份有限公司 | Electronic equipment |
| CN102810001A (en) * | 2011-06-02 | 2012-12-05 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation system |
| CN103391699A (en) * | 2012-05-10 | 2013-11-13 | 株式会社捷太格特 | Control device, and motor unit including control device |
| CN203251517U (en) * | 2013-05-15 | 2013-10-23 | 安波电机(宁德)有限公司 | Integratedly-designed speed-adjustable motor controller |
| CN203708741U (en) * | 2014-01-22 | 2014-07-09 | 苏州工业园区驿力机车科技有限公司 | Fan controller |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113535636A (en) * | 2021-06-30 | 2021-10-22 | 成都中微达信科技有限公司 | Computing device |
| WO2023092347A1 (en) * | 2021-11-24 | 2023-06-01 | 华为技术有限公司 | Brake system and apparatus |
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Application publication date: 20140423 |