DE3832856A1 - Printed circuit board having a thermally conductive element - Google Patents

Printed circuit board having a thermally conductive element

Info

Publication number
DE3832856A1
DE3832856A1 DE19883832856 DE3832856A DE3832856A1 DE 3832856 A1 DE3832856 A1 DE 3832856A1 DE 19883832856 DE19883832856 DE 19883832856 DE 3832856 A DE3832856 A DE 3832856A DE 3832856 A1 DE3832856 A1 DE 3832856A1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
metal core
heat
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19883832856
Other languages
German (de)
Inventor
Roman Dr Ing Zurowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Original Assignee
Standard Elektrik Lorenz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Elektrik Lorenz AG filed Critical Standard Elektrik Lorenz AG
Priority to DE19883832856 priority Critical patent/DE3832856A1/en
Publication of DE3832856A1 publication Critical patent/DE3832856A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

In order to dissipate heat losses which are produced in the components which are arranged on a printed circuit board, it is frequently necessary to provide a special cooling device. Metal contact coolers are known which must be mounted on the printed circuit board and pass the heat losses on to a heat sink which is arranged anywhere outside. The installation of such contact coolers is, however, very costly. The problem to be solved comprises implementation of the heat dissipation from components on printed circuit boards in an effective and simple manner. This problem is solved by the printed circuit board (1) being produced by injection moulding and by it having at least one cavity (2) which is used for accommodating a flat metal core (3). The connection between this metal core (3) and the printed circuit board (1) can be most easily implemented by cast-on snap-action hooks (5) which mount the metal core (3) in the printed circuit board (1) in a simple and effective manner. <IMAGE>

Description

Die Erfindung betrifft eine Leiterplatte mit einem wärmeleitenden Element, das die Verlustwärme, die in mindestens einem auf der Leiterplatte angeordneten Bauelement erzeugt wird, abführt.The invention relates to a circuit board with a thermally conductive element, which is the heat loss that in at least one arranged on the circuit board Component is generated, dissipates.

Die in Bauelementen auf Leiterplatten erzeugte Verlustwärme muß, insbesondere wegen der zunehmenden Integration der Bauelemente und der zunehmenden Packungsdichte auf Leiterplatten, wirksam abgeführt werden, um eine Zerstörung der Bauelemente zu vermeiden. Bei einer bekannten Leiterplatte (DE-OS 17 66 395) geschieht dies durch ein wärmeleitendes Element in Gestalt eines T-förmigen Kontaktkühlers, der einerseits mit einem Rippen-Kühlkörper gut wärmeleitend verschraubt und andererseits mit einem Bauelement gut wärmeleitend verbunden ist. Bei einer anderen bekannten Leiterplatte sind flache Zapfen eines Gehäusekühlkörpers durch Ausnehmungen in der Leiterplatte hindurchgeführt und mit den zu kühlenden Bauelementen wärmeleitend verbunden (DE-OS 34 16 348). In beiden Fällen ist der zum Abführen der Wärme erforderliche Aufwand, insbesondere auch der Montageaufwand, beträchtlich. Außerdem muß die Form der wärmeleitenden Elemente genau an die Lage der zu kühlenden Bauelemente angepaßt werden.The generated in components on printed circuit boards Heat loss must, especially because of the increasing Integration of components and the increasing Packing density on printed circuit boards, effectively dissipated to avoid destruction of the components. In a known printed circuit board (DE-OS 17 66 395) this is done by a thermally conductive element in Shape of a T-shaped contact cooler, on the one hand screwed with a heat sink with a good heat conduction and on the other hand with a component with good thermal conductivity connected is. In another known circuit board are flat pins of a case heat sink through Recesses made in the circuit board and with the components to be cooled are connected in a heat-conducting manner (DE-OS 34 16 348). In both cases, it is for removal  the heat required, especially the Assembly effort, considerable. In addition, the shape of the heat-conducting elements exactly to the location of the cooling components can be adapted.

Der Erfindung liegt die Aufgabe zugrunde, eine einfach herzustellende und mit einem wärmeleitenden Element zu versehende Leiterplatte zu schaffen.The invention has for its object a simple to be manufactured and with a heat-conducting element creating accidental circuit board.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die Leiterplatte im Spritzguß hergestellt ist und mindestens einen Hohlraum aufweist, der zur Aufnahme eines flachen Metallkerns dient.This object is achieved in that the printed circuit board is injection molded and has at least one cavity for receiving a flat metal core.

Besonders einfach wird das Einsetzen des als wärmeleitendes Element dienenden Metallkerns, wenn die Leiterplatte mit als Schnappverbindung ausgebildeten Befestigungselementen versehen ist. Andere vorteilhafte Weiterbildungen der Erfindung sind den weiteren Unteransprüchen zu entnehmen.It is particularly easy to insert the as heat-conducting element serving metal core, if the Printed circuit board with a snap connection Fasteners is provided. Other beneficial Further developments of the invention are the others See subclaims.

Ausführungsbeispiele der Erfindung werden im folgenden anhand der Zeichnung erläutert. Es zeigen:Embodiments of the invention are as follows explained using the drawing. Show it:

Fig. 1 eine erfindungsgemäße Leiterplatte in einer perspektivischen Gesamtansicht, Fig. 1 is a printed circuit board according to the invention in a perspective overall view,

Fig. 2 eine Detailansicht der Leiterplatte gemäß Fig. 1 in größerem Maßstab, Fig. 2 is a detailed view of the circuit board of FIG. 1 in a larger scale,

Fig. 3 ein zweites Ausführungsbeispiel der Erfindung in einer perspektivischen Gesamtansicht, und Fig. 3 shows a second embodiment of the invention in an overall perspective view, and

Fig. 4 eine vergrößerte Teilansicht der Leiterplatte gemäß Fig. 3 entsprechend der gestrichelten Schnittlinie 4-4. Fig. 4 is an enlarged partial view of the circuit board of FIG. 3 according to the dashed line 4-4.

Eine erfindungsgemäße Leiterplatte 1 weist zwei flache Hohlräume 2 auf, in denen jeweils ein Metallkern 3 aufgenommen ist. Die Metallkerne 3 sind als flache Metallstreifen, z.B. aus Aluminium-Blech hergestellt. Sie werden in der Leiterplatte durch eine Schnappverbindung gehalten, die durch mehrere elastische Schnapphaken 5 gebildet wird (Fig. 1 und 2). Zur Befestigung in der Leiterplatte 1 brauchen die Metallkerne 3 lediglich in den jeweiligen Hohlraum 2 hineingedrückt zu werden. Sie werden dann durch die Schnapphaken 5 einwandfrei in ihrer Lage gehalten.A circuit board 1 according to the invention has two flat cavities 2 , in each of which a metal core 3 is accommodated. The metal cores 3 are made as flat metal strips, for example from aluminum sheet. They are held in the circuit board by a snap connection, which is formed by a plurality of elastic snap hooks 5 ( FIGS. 1 and 2). For fastening in the printed circuit board 1 , the metal cores 3 only need to be pressed into the respective cavity 2 . You are then held in place by the snap hooks 5 perfectly.

An der in der Zeichnung vorn liegenden Stirnseite der Leiterplatte 1 weisen die Metallkerne 3 einen Rand 6 auf, der über die Leiterplatte hinausragt. Der Rand 6 ist hier um 90° umgebogen und bildet eine Frontplatte, er kann aber auch als Kühlrippe ausgebildet sein. In dem dargestellten Ausführungsbeispiel sind die beiden Metallkerne 3 und der Rand 6 aus einem Stück Aluminium-Blech ausgestanzt.On the front side of the printed circuit board 1 lying at the front in the drawing, the metal cores 3 have an edge 6 which projects beyond the printed circuit board. The edge 6 is bent through 90 ° here and forms a front plate, but it can also be designed as a cooling fin. In the illustrated embodiment, the two metal cores 3 and the edge 6 are punched out of a piece of aluminum sheet.

Auf einen der Metallkerne ist ein Bauelement 7, z.B. ein Halbleiter-Bauelement in einem DIP-Gehäuse, aufgesetzt. Das Bauelement 7 liegt mit seiner gesamten Grundfläche an dem Metallkern 3 plan an, so daß ein guter Wärmeübergang gegeben ist. Die in dem Bauelement 7 erzeugte Verlustwärme kann somit zum großen Teil über den Metallkern 3 abgeführt und über den Rand 6 an ein Kühlelement abgegeben werden. A component 7 , for example a semiconductor component in a DIP housing, is placed on one of the metal cores. The component 7 lies flat with its entire base on the metal core 3 , so that there is good heat transfer. The heat loss generated in the component 7 can thus largely be dissipated via the metal core 3 and released to a cooling element via the edge 6 .

Die Anschluß-Beinchen 8 des Bauelements 7 sind über Lötaugen 9 mit jeweils einer Leiterbahn auf der Leiterplatte 1 verlötet. Weitere Leiterbahnen 10 sind in der Zeichnung lediglich angedeutet.The connection pins 8 of the component 7 are soldered to each of a conductor track on the printed circuit board 1 via solder eyes 9 . Further conductor tracks 10 are only indicated in the drawing.

Die Leiterplatte 1 ist im Spritzguß hergestellt. In einem Arbeitsgang können dadurch die gesamte Leiterplatte einschließlich der Hohlräume 2, der Schnapphaken 5 und eines Randes 11, mit dem die Leiterplatte z.B. in einem Gestell geführt wird, hergestellt werden.The circuit board 1 is injection molded. As a result, the entire printed circuit board, including the cavities 2 , the snap hooks 5 and an edge 11 with which the printed circuit board is guided, for example, in a frame, can be produced in one operation.

Zum Herstellen der Schnapphaken 5 werden in der Spritzgußform Dorne verwendet, die einen Durchbruch 12 in der Leiterplatte 1 ergeben, der aus Fig. 2 ersichtlich ist.To produce the snap hooks 5 , mandrels are used in the injection mold, which result in an opening 12 in the printed circuit board 1 , which can be seen in FIG. 2.

Eine aus Fig. 3 ersichtliche Leiterplatte 13 weist einen Metallkern 14 auf, der mit zwei umgebogenen Rändern versehen ist, die von der Leiterplatte 13 nach oben herausragen. Sie wirken somit als Kühlfahnen, von denen Wärme an einen Kühlluftstrom abgegeben wird, sie können aber auch zur Befestigung von in der Zeichnung nicht dargestellten Schaltungsbestandteilen dienen. Ein weiterer Metallkern 16 weist keinen Rand auf. Er kann z.B. mit einer Kühleinrichtung an der Unterseite der Leiterplatte 13 verbunden sein.A circuit board 13 shown in FIG. 3 has a metal core 14 which is provided with two bent edges which protrude upward from the circuit board 13 . They thus act as cooling lugs, from which heat is given off to a cooling air flow, but they can also be used to fasten circuit components not shown in the drawing. Another metal core 16 has no edge. For example, it can be connected to a cooling device on the underside of the printed circuit board 13 .

In den Fig. 1 und 3 ist jeweils lediglich ein Bauelement zur Erläuterung dargestellt. In Wirklichkeit sind aber auf einer Leiterplatte normalerweise eine größere Anzahl Bauelemente befestigt. In Figs. 1 and 3 only, a device is shown for explaining respectively. In reality, however, a larger number of components are normally attached to a circuit board.

Die Metallkerne 3, 14 und 16 lassen sich durch die beschriebene Schnappverbindung äußerst einfach in die Leiterplatten 1 bzw. 13 einbauen. Außerdem bewirkt die geschilderte Anordnung der Metallkerne 3, 14 und 16, daß die Dicke der Leiterplatte unverändert beibehalten werden kann.The metal cores 3 , 14 and 16 can be extremely easily installed in the printed circuit boards 1 and 13 by the snap connection described. In addition, the arrangement of the metal cores 3 , 14 and 16 described has the effect that the thickness of the circuit board can be kept unchanged.

Claims (5)

1. Leiterplatte mit einem wärmeleitenden Element, das die Verlustwärme, die in mindestens einem auf der Leiterplatte angeordnete Bauelement erzeugt wird, abführt, dadurch gekennzeichnet, daß sie im Spritzguß hergestellt ist und mindestens einen Hohlraum (2) aufweist, der zur Aufnahme eines flachen Metallkerns (3) dient.1. Printed circuit board with a heat-conducting element which dissipates the heat loss which is generated in at least one component arranged on the printed circuit board, characterized in that it is produced by injection molding and has at least one cavity ( 2 ) which is used to hold a flat metal core ( 3 ) serves. 2. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, daß sie mit als angegossene Schnapphaken (5) ausgebildeten Befestigungselementen für den Metallkern (3) versehen ist.2. Printed circuit board according to claim 1, characterized in that it is provided with fastening elements for the metal core ( 3 ) designed as cast-on snap hooks ( 5 ). 3. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet, daß der Metallkern (3) einen Rand (6) aufweist, der über die Leiterplatte (1) hinausragt.3. Printed circuit board according to claim 1, characterized in that the metal core ( 3 ) has an edge ( 6 ) which projects beyond the printed circuit board ( 1 ). 4. Leiterplatte nach Anspruch 3, dadurch gekennzeichnet, daß der hinausragende Rand (15) des Metallkerns (14) als Kühlrippe ausgebildet ist. 4. Printed circuit board according to claim 3, characterized in that the protruding edge ( 15 ) of the metal core ( 14 ) is designed as a cooling fin. 5. Leiterplatte nach Anspruch 3, dadurch gekennzeichnet, daß der hinausragende Rand (6) des Metallkerns (3) als Frontplatte ausgebildet ist.5. Printed circuit board according to claim 3, characterized in that the protruding edge ( 6 ) of the metal core ( 3 ) is designed as a front plate.
DE19883832856 1988-09-28 1988-09-28 Printed circuit board having a thermally conductive element Withdrawn DE3832856A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19883832856 DE3832856A1 (en) 1988-09-28 1988-09-28 Printed circuit board having a thermally conductive element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19883832856 DE3832856A1 (en) 1988-09-28 1988-09-28 Printed circuit board having a thermally conductive element

Publications (1)

Publication Number Publication Date
DE3832856A1 true DE3832856A1 (en) 1990-03-29

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Family Applications (1)

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DE19883832856 Withdrawn DE3832856A1 (en) 1988-09-28 1988-09-28 Printed circuit board having a thermally conductive element

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222732B1 (en) 1991-09-21 2001-04-24 Robert Bosch Gmbh Electrical device, in particular a switching and control unit for motor vehicles
US6377462B1 (en) 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking
CN103747662A (en) * 2014-01-22 2014-04-23 苏州工业园区驿力机车科技有限公司 Fan controller
WO2014090987A1 (en) * 2012-12-14 2014-06-19 Valeo Systemes Thermiques Printed circuit comprising a heat-transport insert device for cooling
CN105792505A (en) * 2016-03-25 2016-07-20 龙南骏亚电子科技有限公司 Aluminum-based circuit board of high thermal conductivity
CN107787112A (en) * 2016-08-25 2018-03-09 三星电机株式会社 Printed circuit board (PCB) with electronic component, its manufacture method and electronic component modular

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222732B1 (en) 1991-09-21 2001-04-24 Robert Bosch Gmbh Electrical device, in particular a switching and control unit for motor vehicles
EP0558712B2 (en) † 1991-09-21 2010-04-07 Robert Bosch Gmbh Electrical device, especially switching and control device for motor vehicles
US6377462B1 (en) 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking
WO2014090987A1 (en) * 2012-12-14 2014-06-19 Valeo Systemes Thermiques Printed circuit comprising a heat-transport insert device for cooling
FR2999862A1 (en) * 2012-12-14 2014-06-20 Valeo Systemes Thermiques PRINTED CIRCUIT HAVING A COOLING INSERT COOLING DEVICE
CN103747662A (en) * 2014-01-22 2014-04-23 苏州工业园区驿力机车科技有限公司 Fan controller
CN105792505A (en) * 2016-03-25 2016-07-20 龙南骏亚电子科技有限公司 Aluminum-based circuit board of high thermal conductivity
CN107787112A (en) * 2016-08-25 2018-03-09 三星电机株式会社 Printed circuit board (PCB) with electronic component, its manufacture method and electronic component modular
US10595413B2 (en) 2016-08-25 2020-03-17 Samsung Electro-Mechanics Co., Ltd. Board having electronic element, method for manufacturing the same, and electronic element module including the same

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Owner name: ALCATEL SEL AKTIENGESELLSCHAFT, 7000 STUTTGART, DE

8139 Disposal/non-payment of the annual fee