WO2014090987A1 - Printed circuit comprising a heat-transport insert device for cooling - Google Patents

Printed circuit comprising a heat-transport insert device for cooling Download PDF

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Publication number
WO2014090987A1
WO2014090987A1 PCT/EP2013/076527 EP2013076527W WO2014090987A1 WO 2014090987 A1 WO2014090987 A1 WO 2014090987A1 EP 2013076527 W EP2013076527 W EP 2013076527W WO 2014090987 A1 WO2014090987 A1 WO 2014090987A1
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WO
WIPO (PCT)
Prior art keywords
printed circuit
insert
face
circuit according
projecting portion
Prior art date
Application number
PCT/EP2013/076527
Other languages
French (fr)
Inventor
Karen Chauvin
Original Assignee
Valeo Systemes Thermiques
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes Thermiques filed Critical Valeo Systemes Thermiques
Priority to EP13803059.8A priority Critical patent/EP2932805A1/en
Publication of WO2014090987A1 publication Critical patent/WO2014090987A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Definitions

  • the invention relates to printed circuits and more particularly to printed circuits having inserts.
  • the subject of the invention is a printed circuit comprising a heat transfer insert.
  • PCB printed circuit board for printed circuit
  • any printed circuit or any electronic card any printed circuit or any electronic card.
  • a thermal interface is essential between the radiator and the PCB to ensure good thermal conductivity between the two elements (surface roughness).
  • the thermal conductivity of this interface is much lower than that of copper. This interface degrades the transmission of calories between the insert and the radiator and thus reduces the efficiency of the heat dissipation system.
  • the invention aims to remedy all or part of the disadvantages of the state of the art identified above, and in particular to provide means for cooling a component by improving the dissipation of the calories it produces.
  • this dissipation is carried out via a copper insert which captures the calories under the component and leads them to a protruding portion of the insert to promote the dissipation of calories in the open air, or in a stream of air provoked.
  • one aspect of the invention relates to a printed circuit comprising a first face, a second face and at least one insert of a heat-transfer material, characterized in that:
  • the insert is permanent
  • a second part of the insert is protruding from the second face of the printed circuit to dissipate calories.
  • the method / device according to the invention may have one or more additional characteristics among the following, considered individually or according to the technically possible combinations.
  • a first part of the insert is plane and this first part and the first face of the main part of the printed circuit are coplanar
  • the heat transfer material is chosen from at least copper or aluminum,
  • the projecting portion of the insert extends parallel to the first face of the printed circuit
  • the projecting portion extends over a distance of the order of one centimeter.
  • the protruding part extends over a distance of between 0.5 centimeters and 30 centimeters.
  • the projecting portion of the insert comprises at least one fin.
  • the invention also relates to a cooling device comprising a printed circuit according to one of the preceding claims, characterized in that the projecting portion of the insert is adapted to be disposed in a coolant flow.
  • the invention also relates to the use of a printed circuit as described above for dissipating thermal energy, the projecting portion of the insert being disposed in a flow of refrigerant fluid.
  • the invention relates to a method for manufacturing a printed circuit as described above, characterized in that the pressing step comprises an insertion step at least partially on the second face of the plate and on the second face of the insert of an additional layer made of a material not completely polymerized.
  • the pressing step comprises a heating step so as to complete the complete polymerization of said additional layer.
  • FIG. 1 a variant of the invention comprising a rectilinear projecting part
  • FIG. 2 a variant of the invention comprising a bent protrusion
  • SUBSTITUTE SHEET (RULE 26) 3, a sectional representation of a variant of the invention comprising a projecting part comprising fins,
  • Figure 4 a top view of a variant of the invention having a projecting portion having fins.
  • Figure 1 shows a circuit 101 printed on which tracks will be printed and soldered electronic components to obtain a printed circuit.
  • the printed circuit 101 comprises a plate called the main part.
  • the plate 101 is generally made of epoxy resin. The description remains valid with other materials.
  • At least one of the faces of the printed circuit is intended to receive electronic components. These components are placed at predetermined locations. This face is a first face 102 of the printed circuit 101.
  • first face 102 of the main part of the printed circuit is now called the first face 102 of the printed circuit and the second face 103 of the main part of the printed circuit is called second face. printed circuit board.
  • Figure 1 shows that the printed circuit 101 comprises, for example at a location in the main part for receiving an electronic component, a heat transfer insert 104.
  • a heat transfer element designates a heat conducting element, that is to say a thermal conductor.
  • the insert 104 is made of copper.
  • An important feature of the insert is that it is permanent, that is to say it is embedded in the printed circuit at the time of manufacture of said printed circuit. It is impossible to remove the insert 104 without destroying the circuit. It is therefore an inlaid and inseparable component of the printed circuit. It is also said that it is inserted into the mass during the manufacture of the printed circuit.
  • Figure 1 shows that
  • the insert 04 comprises a first planar face 105 such that the surface of the first face 105 of the insert 104 and the first face 102 of the printed circuit 101 are coplanar.
  • the first face 105 of the insert 104 is a first portion 105 of the insert 104. This coplanarity is valid at manufacturing tolerances.
  • the fact that the first face 105 of the insert 104 and the first face 102 of the printed circuit 101 are coplanar means that the first face 105 of the insert 104 is visible and accessible when looking at the first face 102 of the insert 104. This makes it possible to place at this location an electronic component as if the printed circuit board 101 did not contain an insert.
  • the insert 104 may be made of any heat transfer material compatible with the printed circuit manufacturing process.
  • aluminum is mentioned in addition to copper.
  • FIG. 1 shows that the circuit 101 printed has a second face 103 adjacent to the first face 102 of the printed circuit 101.
  • This second face 103 of the circuit 01 is a lateral face of the printed circuit 101.
  • the first face 102 of the printed circuit 101 and the second face 103 of the printed circuit 101 are perpendicular.
  • Figure 1 shows that the insert 104 extends in the mass of the printed circuit 101 and projects at the second face 103 of the printed circuit 101.
  • the projecting portion 106 of the insert 104 is a second part 106 of the insert 104.
  • the protruding portion 106 of the insert 104 extends parallel to a plane in which is the first face 102 of the printed circuit 101.
  • the distance over which the projecting portion of the insert 104 extends is of the order of one centimeter.
  • the distance over which the projecting portion of the insert 104 extends is generally between 0.5 centimeters and 30 centimeters. This distance is a function of the amount of heat to be dissipated, the dissipation conditions and the maximum size allowed for the printed circuit 101. According to these constraints, the distance over which the projecting portion of the insert 104 extends is adapted. The more calories to be dissipated and the more space there is, the greater the projecting portion of the insert 104 is large.
  • the projecting portion 106 of the insert 104 is bent.
  • the direction in which the projecting portion 106 of the insert 104 extends is different from the plane in which the first face 102 of the printed circuit 101 extends.
  • FIRE I LLE OF REM PLACEM ENT (RULE 26) 2 shows that the protruding part 106 of the insert 104 is bent at 90 °, forming a bend 109, the direction in which the projecting portion 106 is orthogonal to the plane in which the first face 102 of the printed circuit extends. 01.
  • the elbow of the insert 104 is formed at the place where the insert 104 protrudes. In practice, this elbow 109 can be made at a distance from this place. This distance is for example of the order of one centimeter.
  • Bending or not the protruding part 106 of the insert 104 is guided by environmental considerations of the printed circuit 101. Bending the projecting portion 106 of the insert 104 can save space by reducing the overall area of the printed circuit 101. Bending the protruding portion 106 of the insert 04 may allow this portion 106 to be placed. protruding into a flow of air, natural or provoked, so as to improve the dissipation of calories.
  • FIG. 1 shows that the projecting portion 106 of the insert 104 is flat.
  • FIG. 4 shows a variant of FIG. 1 in which the protruding part 106 of the insert 104 has a fin 107 on its upper face 108. Arbitrarily the upper face of the projecting part is that seen when it is opposite the first face 105 of the insert 104.
  • Figure 4 shows that the fin 107 is a rectilinear protuberance.
  • Figure 4 also illustrates that the upper face 108 of the insert 104 has a plurality of parallel fins. This parallelism is checked to manufacturing tolerances. The presence of these fins increases the overall surface of the protruding portion 106 of the insert 104 and thus improve its ability to dissipate calories.
  • SUBSTITUTE SHEET (RULE 26) several faces of the projecting portion 106 comprise fins, another face of the protruding portion 106 that the upper face of the projecting portion 106 comprises fins.
  • the length of the fins is preferably of the order of the distance over which the protruding portion 106 of the insert 104 extends.
  • the width of the fins is of the order of one millimeter.
  • the height of the fins is of the order of a millimeter. A preferred height is 3 millimeters. In practice the heights are between 2 and 8 millimeters.
  • the method of manufacturing a printed circuit according to the invention comprises at least the following steps:
  • a step of drilling a plate comprising a first face and a second face, so as to dig in the second face of the plate a hole having a given shape
  • a step of introducing into said hole of a heat-transfer material insert having a shape adapted to penetrate into said hole and to project from the second face of the plate into a projecting portion of a second face of the insert, the first face of said main portion and the second face of said main portion being in intersecting planes.
  • Said plate comprising a first and a second face is preferably made of a material which is a mixture of glass fibers and resin and which has completely polymerized.
  • the pressing step comprises an insertion step on the first face 102 and / or on the face parallel to and opposite the first face 102 of an additional layer made of a material not completely polymerized.
  • the pressing step comprises a heating step so as to perform a complete polymerization of the additional layer.
  • the invention also relates to a cooling device comprising a printed circuit as described above, and characterized in that the projecting portion 106 of the insert 104 is adapted to be disposed in a coolant flow.
  • coolant is any thermal conductive fluid and compatible with the printed circuit 101. This is for example air.
  • the invention also relates to the use of a printed circuit as described above, for dissipating a thermal energy, the projecting portion (106) of the insert being disposed in a flow of refrigerant fluid.
  • the implementation of the invention allows simply having a printed circuit incorporating an effective cooling device. With the invention there is no loss of efficiency due to thermal interfaces between a coolant and a radiator. In the invention everything is integrated.

Abstract

The invention relates to a printed circuit device comprising a first surface, a second surface, and at least one insert of a heat-transport material, characterized in that: the insert is permanent, and a second surface of the insert projects from the second surface of the printed circuit in order to dissipate calories.

Description

Circuit imprimé comportant un dispositif de refroidissement insert  PCB having an insert cooler
caloporteur  heat
DOMAINE TECHNIQUE DE L'INVENTION  TECHNICAL FIELD OF THE INVENTION
[0001] L'invention se rapporte aux circuits imprimés et plus particulièrement aux circuits imprimés comportant des inserts. En particulier l'invention a pour objet un circuit imprimé comportant un insert caloporteur. The invention relates to printed circuits and more particularly to printed circuits having inserts. In particular, the subject of the invention is a printed circuit comprising a heat transfer insert.
[0002 ] On entendra par PCB (Printed Circuit Board pour circuit imprimé) dans le cadre de la présente description tout circuit imprimé ou toute carte électronique.  By PCB will be understood (printed circuit board for printed circuit) in the context of the present description any printed circuit or any electronic card.
ETAT DE LA TECHNIQUE ANTERIEURE STATE OF THE PRIOR ART
[0003] Dans l'état de la technique, on connaît des modes de refroidissement de circuits imprimés mettant en œuvre des via dans lesquels on insère des pions. De telles réalisations impliquent, pour le circuit imprimé, un stress mécanique au moment de l'insertion du pion. Cela fragilise in fine le circuit imprimé.  In the state of the art, there are known cooling modes of printed circuits implementing via in which pions are inserted. Such embodiments imply, for the printed circuit, a mechanical stress at the time of the insertion of the pin. This weakens in fine the circuit board.
[0004] Dans l'état de la technique, on connaît aussi des circuits imprimés comportant des inserts en cuivre. L'une des faces d'un tel insert de cuivre est généralement située sous un composant électronique d'une face d'un PCB. Une face opposée de l'insert et la face opposée du PCB sont coplanaires. Cela permet au PCB ainsi constitué de pouvoir être produit par pressage, ses faces étant uniformément planes, et la presse peut alors exercer une pression uniforme sur toute la surface du PCB.  In the state of the art, there are also known printed circuits comprising copper inserts. One of the faces of such a copper insert is generally located under an electronic component of a face of a PCB. An opposite face of the insert and the opposite face of the PCB are coplanar. This allows the PCB thus formed to be produced by pressing, its faces being uniformly flat, and the press can then exert a uniform pressure on the entire surface of the PCB.
[0005] Avec un tel PCB il est donc possible d'utiliser un radiateur pour favoriser la dissipation des calories produites par le composant situé au-dessus de la face de l'insert. La technique consiste à fixer un radiateur sur la face opposée de l'insert. Des calories sont alors conduites par l'insert et dissipées par le radiateur. Cette technique présente au moins deux inconvénients :  With such a PCB it is possible to use a radiator to promote the dissipation of calories produced by the component located above the face of the insert. The technique consists in fixing a radiator on the opposite face of the insert. Calories are then driven by the insert and dissipated by the radiator. This technique has at least two disadvantages:
Une interface thermique est indispensable entre le radiateur et le PCB pour assurer une bonne conductivité thermique entre les deux éléments (rugosité des surfaces). La conductivité thermique de cette interface est bien inférieure à celle du cuivre. Cette interface dégrade la transmission des calories entre l'insert et le radiateur et donc réduit l'efficacité du système de dissipation des calories.  A thermal interface is essential between the radiator and the PCB to ensure good thermal conductivity between the two elements (surface roughness). The thermal conductivity of this interface is much lower than that of copper. This interface degrades the transmission of calories between the insert and the radiator and thus reduces the efficiency of the heat dissipation system.
FEUILLE DE REMPLACEMENT (RÈGLE 26) Le recours à un radiateur impose un composant supplémentaire, le radiateur lui-même, et une étape de fixation dudit radiateur. Cela augmente la complexité d'un processus de production d'un circuit imprimé utilisant cette technique de dissipation de calorie. SUBSTITUTE SHEET (RULE 26) The use of a radiator imposes an additional component, the radiator itself, and a step of fixing said radiator. This increases the complexity of a PCB production process using this calorie dissipation technique.
EXPOSE DE L'INVENTION SUMMARY OF THE INVENTION
[0006] L'invention vise à remédier à tout ou partie des inconvénients de l'état de la technique identifiés ci-dessus, et notamment à proposer des moyens pour permettre de refroidir un composant en améliorant la dissipation des calories qu'il produit. Dans l'invention cette dissipation est réalisée via un insert de cuivre qui capte les calories sous le composant et les conduit vers une partie saillante de l'insert pour favoriser la dissipation des calories à l'air libre, ou dans un courant d'air provoqué. Cette solution en plus de résoudre les problèmes précédemment cités permet plus de flexibilités par rapport aux contraintes mécaniques de packaging et/ou d'intégration. Cette solution permet aussi plus de liberté au moment de la conception du circuit imprimé puisque le placement et la forme de l'insert sont libres.  The invention aims to remedy all or part of the disadvantages of the state of the art identified above, and in particular to provide means for cooling a component by improving the dissipation of the calories it produces. In the invention this dissipation is carried out via a copper insert which captures the calories under the component and leads them to a protruding portion of the insert to promote the dissipation of calories in the open air, or in a stream of air provoked. This solution in addition to solving the aforementioned problems allows more flexibility with respect to the mechanical constraints of packaging and / or integration. This solution also allows more freedom in the design of the printed circuit since the placement and shape of the insert are free.
[0007] A cet effet, un aspect de l'invention se rapporte à un circuit imprimé comportant une première face, une deuxième face et au moins un insert d'un matériau caloporteur caractérisé en ce que :  For this purpose, one aspect of the invention relates to a printed circuit comprising a first face, a second face and at least one insert of a heat-transfer material, characterized in that:
l'insert est permanent,  the insert is permanent,
une deuxième partie de l'insert est saillante de la deuxième face du circuit imprimé pour dissiper des calories.  a second part of the insert is protruding from the second face of the printed circuit to dissipate calories.
[0008] Outre les caractéristiques principales qui viennent d'être mentionnées dans le paragraphe précédent, le procédé/dispositif selon l'invention peut présenter une ou plusieurs caractéristiques complémentaires parmi les suivantes, considérées individuellement ou selon les combinaisons techniquement possibles In addition to the main features which have just been mentioned in the preceding paragraph, the method / device according to the invention may have one or more additional characteristics among the following, considered individually or according to the technically possible combinations.
- une première partie de l'insert est plane et cette première partie et la première face de la partie principale du circuit imprimé sont coplanaires, a first part of the insert is plane and this first part and the first face of the main part of the printed circuit are coplanar,
- le matériau caloporteur est choisi parmi au moins le cuivre ou l'aluminium,  the heat transfer material is chosen from at least copper or aluminum,
FEUILLE DE REMPLACEMENT (RÈGLE 26) - la première face de la partie principale du circuit imprimé étant considérée dans un plan horizontal, la deuxième face de la partie principale du circuit imprimé est un bord latéral du circuit imprimé, SUBSTITUTE SHEET (RULE 26) the first face of the main part of the printed circuit being considered in a horizontal plane, the second face of the main part of the printed circuit is a lateral edge of the printed circuit,
- la partie saillante de l'insert s'étend parallèlement à la première face du circuit imprimé,  the projecting portion of the insert extends parallel to the first face of the printed circuit,
- la partie saillante de l'insert est coudée,  the projecting part of the insert is bent,
- la partie saillante s'étend sur une distance de l'ordre du centimètre.  the projecting portion extends over a distance of the order of one centimeter.
- la partie saillante s'étend sur une distance comprise entre 0.5 centimètres et 30 centimètres.  the protruding part extends over a distance of between 0.5 centimeters and 30 centimeters.
- la partie saillante de l'insert comporte au moins une ailette.  - The projecting portion of the insert comprises at least one fin.
L'invention concerne également un dispositif de refroidissement comprenant un circuit imprimé selon l'une des revendications précédentes, caractérisé en ce que la partie saillante de l'insert est apte à être disposée dans un flux de fluide réfrigérant.  The invention also relates to a cooling device comprising a printed circuit according to one of the preceding claims, characterized in that the projecting portion of the insert is adapted to be disposed in a coolant flow.
L'invention concerne également l'utilisation d'un circuit imprimé comme décrit ci- dessus pour dissiper une énergie thermique, la partie saillante de l'insert étant disposée dans un flux de fluide réfrigérant. The invention also relates to the use of a printed circuit as described above for dissipating thermal energy, the projecting portion of the insert being disposed in a flow of refrigerant fluid.
L'invention concerne un procédé de fabrication d'un circuit imprimé comme décrit ci-dessus, caractérisé en ce que l'étape de pressage comprend une étape d'insertion au moins partiellement sur la deuxième face de la plaque et sur la deuxième face de l'insert d'une couche supplémentaire constituée en un matériau non complètement polymérisé.  The invention relates to a method for manufacturing a printed circuit as described above, characterized in that the pressing step comprises an insertion step at least partially on the second face of the plate and on the second face of the insert of an additional layer made of a material not completely polymerized.
De préférence, l'étape de pressage comprend une étape de chauffe de sorte à accomplir la polymérisation complète de ladite couche supplémentaire.  Preferably, the pressing step comprises a heating step so as to complete the complete polymerization of said additional layer.
BREVE DESCRIPTION DES FIGURES BRIEF DESCRIPTION OF THE FIGURES
[0009] D'autres caractéristiques et avantages de l'invention ressortiront à la lecture de la description qui suit, en référence aux figures annexées, qui illustrent :  Other features and advantages of the invention will emerge on reading the description which follows, with reference to the appended figures, which illustrate:
- Figure 1 , une variante de l'invention comportant une partie saillante rectiligne,  FIG. 1, a variant of the invention comprising a rectilinear projecting part,
Figure 2, une variante de l'invention comportant une partie saillante coudée,  FIG. 2, a variant of the invention comprising a bent protrusion,
FEUILLE DE REMPLACEMENT (RÈGLE 26) Figure 3, une représentation en coupe d'une variante de l'invention comportant une partie saillante comportant des ailettes, SUBSTITUTE SHEET (RULE 26) 3, a sectional representation of a variant of the invention comprising a projecting part comprising fins,
Figure 4, une représentation vue de dessus d'une variante de l'invention comportant une partie saillante comportant des ailettes.  Figure 4, a top view of a variant of the invention having a projecting portion having fins.
[0010] Pour plus de clarté, les éléments identiques ou similaires sont repérés par des signes de référence identiques sur l'ensemble des figures. For clarity, identical or similar elements are identified by identical reference signs throughout the figures.
[0011] L'invention sera mieux comprise à la lecture de la description qui suit et à l'examen des figures qui l'accompagnent. Celles-ci sont présentées à titre indicatif et nullement limitatif de l'invention.  The invention will be better understood on reading the description which follows and the examination of the figures that accompany it. These are presented as an indication and in no way limitative of the invention.
DESCRIPTION DETAILLEE D'UN MODE DE REALISATION DETAILED DESCRIPTION OF AN EMBODIMENT
[0012] La figure 1 montre un circuit 101 imprimé sur lequel des pistes vont être imprimées et des composants électroniques brasés pour obtenir un circuit imprimé. Le circuit imprimé 101 comprend une plaque appelée partie principale. La plaque 101 est en général en résine époxy. La description reste valable avec d'autres matériaux. Au moins l'une des faces du circuit imprimé est destinée à recevoir des composants électroniques. Ces composants sont placés à des emplacements prédéterminés. Cette face est une première face 102 du circuit imprimé 101.  Figure 1 shows a circuit 101 printed on which tracks will be printed and soldered electronic components to obtain a printed circuit. The printed circuit 101 comprises a plate called the main part. The plate 101 is generally made of epoxy resin. The description remains valid with other materials. At least one of the faces of the printed circuit is intended to receive electronic components. These components are placed at predetermined locations. This face is a first face 102 of the printed circuit 101.
[0013] Pour simplifier la lecture de la présente demande de brevet, la première face 102 de la partie principale du circuit imprimé est appelée dorénavant première face 102 du circuit imprimé et la deuxième face 103 de la partie principale du circuit imprimé est appelée deuxième face du circuit imprimé. To simplify the reading of the present patent application, the first face 102 of the main part of the printed circuit is now called the first face 102 of the printed circuit and the second face 103 of the main part of the printed circuit is called second face. printed circuit board.
[0014] La figure 1 montre que le circuit imprimé 101 comporte, par exemple à un emplacement dans la partie principale destiné à recevoir un composant électronique, un insert 104 caloporteur. Dans ce document, un élément caloporteur désigne un élément apte à conduire la chaleur, c'est-à-dire un conducteur thermique. Dans une variante l'insert 104 est réalisé en cuivre. Une caractéristique importante de l'insert est qu'il est permanent, c'est-à-dire qu'il est incrusté dans le circuit imprimé au moment de la fabrication dudit circuit imprimé. Il est impossible de retirer l'insert 104 sans détruire le circuit. Il s'agit donc d'un composant incrusté et indissociable du circuit imprimé. On dit aussi qu'il est inséré dans la masse pendant la fabrication du circuit imprimé. La figure 1 montre que Figure 1 shows that the printed circuit 101 comprises, for example at a location in the main part for receiving an electronic component, a heat transfer insert 104. In this document, a heat transfer element designates a heat conducting element, that is to say a thermal conductor. In a variant, the insert 104 is made of copper. An important feature of the insert is that it is permanent, that is to say it is embedded in the printed circuit at the time of manufacture of said printed circuit. It is impossible to remove the insert 104 without destroying the circuit. It is therefore an inlaid and inseparable component of the printed circuit. It is also said that it is inserted into the mass during the manufacture of the printed circuit. Figure 1 shows that
FEUILLE DE REMPLACEMENT (RÈGLE 26) l'insert 04 comporte une première face 105 plane telle que la surface de la première face 105 de l'insert 104 et la première face 102 du circuit imprimé 101 sont coplanaires. La première face 105 de l'insert 104 est une première partie 105 de l'insert 104. Cette coplanarité est valable aux tolérances de fabrication près. Le fait que la première face 105 de l'insert 104 et la première face 102 du circuit imprimé 101 soient coplanaires signifie que la première face 105 de l'insert 104 est visible et accessible lorsqu'on regarde la première face 102 de l'insert 104. Cela permet de placer à cet emplacement un composant électronique comme si le circuit imprimé 101 ne comportait pas d'insert. SUBSTITUTE SHEET (RULE 26) the insert 04 comprises a first planar face 105 such that the surface of the first face 105 of the insert 104 and the first face 102 of the printed circuit 101 are coplanar. The first face 105 of the insert 104 is a first portion 105 of the insert 104. This coplanarity is valid at manufacturing tolerances. The fact that the first face 105 of the insert 104 and the first face 102 of the printed circuit 101 are coplanar means that the first face 105 of the insert 104 is visible and accessible when looking at the first face 102 of the insert 104. This makes it possible to place at this location an electronic component as if the printed circuit board 101 did not contain an insert.
[0015] L'insert 104 peut être réalisé dans n'importe quel matériau caloporteur compatible avec les processus de fabrication des circuits imprimés. Pour l'exemple on cite, en plus du cuivre, l'aluminium. The insert 104 may be made of any heat transfer material compatible with the printed circuit manufacturing process. For the example, aluminum is mentioned in addition to copper.
[0016] La figure 1 montre que le circuit 101 imprimé comporte une deuxième face 103 adjacente à la première face 102 du circuit imprimé 101. Cette deuxième face 103 du circuit 01 est une face latérale du circuit imprimé 101. Aux tolérances de fabrication près, la première^ face 102 du circuit imprimé 101 et la deuxième face 103 du circuit imprimé 101 sont perpendiculaires.  FIG. 1 shows that the circuit 101 printed has a second face 103 adjacent to the first face 102 of the printed circuit 101. This second face 103 of the circuit 01 is a lateral face of the printed circuit 101. With manufacturing tolerances close, the first face 102 of the printed circuit 101 and the second face 103 of the printed circuit 101 are perpendicular.
[0017] La figure 1 montre que l'insert 104 s'étend dans la masse du circuit imprimé 101 et fait saillie au niveau de la deuxième face 103 du circuit imprimé 101. La partie saillante 106 de l'insert 104 est une deuxième partie 106 de l'insert 104. La partie 106 saillante de l'insert 104 s'étend parallèlement à un plan dans lequel se trouve la première face 102 du circuit imprimé 101.  Figure 1 shows that the insert 104 extends in the mass of the printed circuit 101 and projects at the second face 103 of the printed circuit 101. The projecting portion 106 of the insert 104 is a second part 106 of the insert 104. The protruding portion 106 of the insert 104 extends parallel to a plane in which is the first face 102 of the printed circuit 101.
[0018] La distance sur laquelle s'étend la partie saillante de l'insert 104 est de l'ordre du centimètre. La distance sur laquelle s'étend la partie saillante de l'insert 104 est en général comprise entre 0.5 centimètre et 30 centimètres. Cette distance est fonction de la quantité de chaleur à dissiper, des conditions de dissipation et de l'encombrement maximal autorisé pour le circuit imprimé 101. Selon ces contraintes la distance sur laquelle s'étend la partie saillante de l'insert 104 est adaptée. Plus il y a de calories à dissiper et plus il y a de place, plus la partie saillante de l'insert 104 est grande. The distance over which the projecting portion of the insert 104 extends is of the order of one centimeter. The distance over which the projecting portion of the insert 104 extends is generally between 0.5 centimeters and 30 centimeters. This distance is a function of the amount of heat to be dissipated, the dissipation conditions and the maximum size allowed for the printed circuit 101. According to these constraints, the distance over which the projecting portion of the insert 104 extends is adapted. The more calories to be dissipated and the more space there is, the greater the projecting portion of the insert 104 is large.
[0019] Sur la figure 2, la partie 106 saillante de l'insert 104 est coudée. La direction dans laquelle la partie 106 saillante de l'insert 104 s'étend est différente du plan dans lequel s'étend la première face 102 du circuit imprimé 101. La figure  In Figure 2, the projecting portion 106 of the insert 104 is bent. The direction in which the projecting portion 106 of the insert 104 extends is different from the plane in which the first face 102 of the printed circuit 101 extends.
FEU I LLE DE REM PLACEM ENT (RÈG LE 26) 2 montre que la partie 106 saillante de l'insert 104 est coudée à 90°, formant un coude 109, la direction dans laquelle s'étend la partie 106 saillante étant orthogonal au plan dans lequel s'étend la première face 102 du circuit imprimé 01. Sur la variante de la figure 2 le coude de l'insert 104 est réalisé à l'endroit où l'insert 104 fait saillie. Dans la pratique ce coude 109 peut être réalisé à distance de cet endroit. Cette distance est par exemple de l'ordre du centimètre. FIRE I LLE OF REM PLACEM ENT (RULE 26) 2 shows that the protruding part 106 of the insert 104 is bent at 90 °, forming a bend 109, the direction in which the projecting portion 106 is orthogonal to the plane in which the first face 102 of the printed circuit extends. 01. In the variant of Figure 2 the elbow of the insert 104 is formed at the place where the insert 104 protrudes. In practice, this elbow 109 can be made at a distance from this place. This distance is for example of the order of one centimeter.
[0020 ] Le fait de couder ou pas la partie 106 saillante de l'insert 104 est guidé par des considérations d'environnement du circuit 101 imprimé. Le fait de couder la partie 106 saillante de l'insert 104 peut permettre de gagner de la place en réduisant la surface globale du circuit imprimé 101. Le fait de couder la partie 106 saillante de l'insert 04 peut permettre de placer cette partie 106 saillante dans un flux d'air, naturel ou provoqué, de manière à améliorer la dissipation des calories. Bending or not the protruding part 106 of the insert 104 is guided by environmental considerations of the printed circuit 101. Bending the projecting portion 106 of the insert 104 can save space by reducing the overall area of the printed circuit 101. Bending the protruding portion 106 of the insert 04 may allow this portion 106 to be placed. protruding into a flow of air, natural or provoked, so as to improve the dissipation of calories.
[ 0021] La figure 1 montre que la partie 106 saillante de l'insert 104 est plane. La figure 4 montre une variante de la figure 1 dans laquelle la partie 106 saillante de l'insert 104 comporte une ailette 107 sur sa face supérieure 108. Arbitrairement la face supérieure de la partie saillante est celle vue lorsqu'on est en regard de la première face 105 de l'insert 104. Figure 1 shows that the projecting portion 106 of the insert 104 is flat. FIG. 4 shows a variant of FIG. 1 in which the protruding part 106 of the insert 104 has a fin 107 on its upper face 108. Arbitrarily the upper face of the projecting part is that seen when it is opposite the first face 105 of the insert 104.
[ 0022 ] La figure 4 montre que l'ailette 107 est une protubérance rectiligne. La figure 4 illustre aussi que la face 108 supérieure de l'insert 104 comporte plusieurs ailettes parallèles. Ce parallélisme est vérifié aux tolérances de fabrication près. La présence de ces ailettes permet d'augmenter la surface globale de la partie 106 saillante de l'insert 104 et donc d'améliorer sa capacité à dissiper des calories.  Figure 4 shows that the fin 107 is a rectilinear protuberance. Figure 4 also illustrates that the upper face 108 of the insert 104 has a plurality of parallel fins. This parallelism is checked to manufacturing tolerances. The presence of these fins increases the overall surface of the protruding portion 106 of the insert 104 and thus improve its ability to dissipate calories.
[0023] Ces ailettes peuvent être obtenues, par exemple :  These fins can be obtained, for example:
- Par emboutissage :  - By stamping:
Après la production du PCB, quand l'insert a déjà été inséré, Avant la production du PCB, quand l'insert n'a pas encore été inséré,  After the production of the PCB, when the insert has already been inserted, Before the production of the PCB, when the insert has not yet been inserted,
Par apport de matière :  By contribution of material:
- Après la production du PCB, quand l'insert a déjà été inséré, - After the production of the PCB, when the insert has already been inserted,
Avant la production du PCB, quand l'insert n'a pas encore été inséré. Before the production of the PCB, when the insert has not yet been inserted.
[0024 ] Dans des variantes non représentées :  In unrepresented variants:
FEUILLE DE REMPLACEMENT (RÈGLE 26) plusieurs faces de la partie saillante 106 comportent des ailettes, une autre face de la partie 106 saillante que la face supérieure de la partie 106 saillante comporte des ailettes. SUBSTITUTE SHEET (RULE 26) several faces of the projecting portion 106 comprise fins, another face of the protruding portion 106 that the upper face of the projecting portion 106 comprises fins.
[0025] La longueur des ailettes est, de manière préférée, de l'ordre de la distance sur laquelle s'étend la partie 106 saillante de l'insert 104. La largeur des ailettes est de l'ordre du millimètre. La hauteur des ailettes est de l'ordre du millimètre. Une hauteur préférée est de 3 millimètres. Dans la pratique les hauteurs sont comprises entre 2 et 8 millimètres.  The length of the fins is preferably of the order of the distance over which the protruding portion 106 of the insert 104 extends. The width of the fins is of the order of one millimeter. The height of the fins is of the order of a millimeter. A preferred height is 3 millimeters. In practice the heights are between 2 and 8 millimeters.
[0026] Le procédé de fabrication d'un circuit imprimé selon l'invention comporte au moins les étapes suivantes :  The method of manufacturing a printed circuit according to the invention comprises at least the following steps:
une étape de perçage d'une plaque comprenant une première face et une deuxième face, de sorte à creuser dans la deuxième face de la plaque un trou ayant une forme donnée,  a step of drilling a plate comprising a first face and a second face, so as to dig in the second face of the plate a hole having a given shape,
une étape d'introduction dans ledit trou d'un insert en matériau caloporteur ayant une forme adaptée à pénétrer dans ledit trou et à dépasser de la deuxième face de la plaque en une partie saillante d'une deuxième face de l'insert, la première face de ladite partie principale et la deuxième face de ladite partie principale étant dans des plans sécants.  a step of introducing into said hole of a heat-transfer material insert having a shape adapted to penetrate into said hole and to project from the second face of the plate into a projecting portion of a second face of the insert, the first face of said main portion and the second face of said main portion being in intersecting planes.
- une étape de pressage de ladite plaque munie de ledit insert.  a step of pressing said plate provided with said insert.
Ladite plaque comprenant une première et une deuxième faces est préférentiellement constituée dans un matériau qui est mélange de fibres de verre et de résine et qui a complètement polymérisé.  Said plate comprising a first and a second face is preferably made of a material which is a mixture of glass fibers and resin and which has completely polymerized.
[0027 ] De préférence, l'étape de pressage comprend une étape d'insertion au sur la première face 102 et/ou sur la face parallèle et opposée à la première face 102 d'une couche supplémentaire constituée en un matériau non complètement polymérisé.  Preferably, the pressing step comprises an insertion step on the first face 102 and / or on the face parallel to and opposite the first face 102 of an additional layer made of a material not completely polymerized.
[0028] Avantageusement, l'étape de pressage comprend une étape de chauffe de sorte à accomplir une polymérisation complète de la couche supplémentaire. Advantageously, the pressing step comprises a heating step so as to perform a complete polymerization of the additional layer.
[0029] A l'issue du procédé de fabrication, on obtient le circuit imprimé précédemment décrit et illustré sur les figures 1 à 4. At the end of the manufacturing process, the printed circuit previously described and illustrated in FIGS. 1 to 4 is obtained.
FEUILLE DE REMPLACEMENT (RÈGLE 26) [0030] On note que le fait que l'insert est introduit dans la plaque pendant la fabrication du circuit imprimé assure qu'il soit permanent au sens de la présente invention, comme déjà expliqué. SUBSTITUTE SHEET (RULE 26) Note that the fact that the insert is introduced into the plate during the manufacture of the printed circuit ensures that it is permanent within the meaning of the present invention, as already explained.
[0031] L'invention concerne également un dispositif de refroidissement comprenant un circuit imprimé tel que décrit précédemment, et caractérisé en ce que la partie saillante 106 de l'insert 104 est apte à être disposée dans un flux de fluide réfrigérant. Par fluide réfrigérant, on entend tout fluide conducteur thermique et compatible avec le circuit imprimé 101. Il s'agit par exemple d'air.  The invention also relates to a cooling device comprising a printed circuit as described above, and characterized in that the projecting portion 106 of the insert 104 is adapted to be disposed in a coolant flow. By coolant is any thermal conductive fluid and compatible with the printed circuit 101. This is for example air.
[0032 ] L'invention concerne également l'utilisation d'un circuit imprimé tel que précédemment décrit, pour dissiper une énergie thermique, la partie saillante (106) de l'insert étant disposée dans un flux de fluide réfrigérant. The invention also relates to the use of a printed circuit as described above, for dissipating a thermal energy, the projecting portion (106) of the insert being disposed in a flow of refrigerant fluid.
[0033] La mise en œuvre de l'invention permet d'avoir simplement un circuit imprimé intégrant un dispositif de refroidissement efficace. Avec l'invention il n'y a pas de perte d'efficacité due à des interfaces thermiques entre un caloporteur et un radiateur. Dans l'invention tout est intégré. The implementation of the invention allows simply having a printed circuit incorporating an effective cooling device. With the invention there is no loss of efficiency due to thermal interfaces between a coolant and a radiator. In the invention everything is integrated.
FEUILLE DE REMPLACEMENT (RÈGLE 26) SUBSTITUTE SHEET (RULE 26)

Claims

REVENDICATIONS
1. Circuit (101) imprimé comportant une partie principale comprenant une première face (102) et une deuxième face (103), ledit circuit imprimé comprenant au moins un insert (104) d'un matériau caloporteur caractérisé en ce que : A printed circuit (101) comprising a main portion comprising a first face (102) and a second face (103), said printed circuit comprising at least one insert (104) of a heat transfer material characterized in that:
l'insert est permanent,  the insert is permanent,
une deuxième partie (106) de l'insert (104) est saillante de la deuxième face de la partie principale pour dissiper des calories, la première face de ladite partie principale et la deuxième face de ladite partie principale étant dans des plans sécants.  a second portion (106) of the insert (104) protrudes from the second face of the main portion to dissipate calories, the first face of said main portion and the second face of said main portion being in intersecting planes.
2. Circuit imprimé selon la revendication 1 , caractérisé en ce qu'une première partie (105) de l'insert (104) est plane et cette première partie (105) et la première face (102) de la partie principale du circuit imprimé sont coplanaires.  2. printed circuit board according to claim 1, characterized in that a first portion (105) of the insert (104) is flat and this first portion (105) and the first face (102) of the main portion of the printed circuit are coplanar.
3. Circuit imprimé selon l'une des revendications précédentes, caractérisé en ce que le matériau caloporteur est choisi parmi au moins le cuivre ou l'aluminium. 3. Printed circuit according to one of the preceding claims, characterized in that the heat transfer material is selected from at least copper or aluminum.
4. Circuit imprimé selon l'une des revendications précédentes, caractérise en ce que la première face de la partie principale du circuit imprimé étant considérée dans un plan horizontal, la deuxième face de la partie principale du circuit imprimé est un bord latéral du circuit imprimé. 4. Printed circuit according to one of the preceding claims, characterized in that the first face of the main part of the printed circuit being considered in a horizontal plane, the second face of the main part of the printed circuit is a side edge of the printed circuit. .
5. Circuit imprimé selon l'une des revendications précédentes, caractérisé en ce que la partie saillante de l'insert s'étend parallèlement à la première face du circuit imprimé. 5. Printed circuit according to one of the preceding claims, characterized in that the projecting portion of the insert extends parallel to the first face of the printed circuit.
6. Circuit imprimé selon l'une des revendications î à 5, caractérisé en ce que la partie saillante de l'insert est coudée.  6. Printed circuit according to one of claims 1 to 5, characterized in that the projecting portion of the insert is bent.
7. Circuit imprimé selon l'une des revendications précédentes, caractérisé en ce que la partie saillante s'étend sur une distance de l'ordre du centimètre. 7. Printed circuit according to one of the preceding claims, characterized in that the projecting portion extends over a distance of about one centimeter.
8. Circuit imprimé selon l'une des revendications 1 à 7, caractérisé en ce que la partie saillante s'étend sur une distance comprise entre 0.5 centimètres et 30 centimètres. 8. printed circuit board according to one of claims 1 to 7, characterized in that the projecting portion extends over a distance of between 0.5 centimeters and 30 centimeters.
9. Circuit imprimé selon l'une des revendications précédentes, caractérisé en ce que la partie saillante de l'insert comporte au moins une ailette. 9. Printed circuit according to one of the preceding claims, characterized in that the projecting portion of the insert comprises at least one fin.
10. Circuit imprimé selon la revendication 9, caractérisé en ce que la hauteur des ailettes est de l'ordre du millimètre. 10. Printed circuit according to claim 9, characterized in that the height of the fins is of the order of one millimeter.
FEUILLE DE REMPLACEMENT (RÈGLE 26) SUBSTITUTE SHEET (RULE 26)
11. Dispositif de refroidissement comprenant un circuit imprimé selon l'une des revendications précédentes, caractérisé en ce que la partie saillante (106) de l'insert est apte à être disposée dans un flux de fluide réfrigérant. 11. Cooling device comprising a printed circuit according to one of the preceding claims, characterized in that the projecting portion (106) of the insert is adapted to be disposed in a coolant flow.
12. Utilisation d'un circuit imprimé selon l'une des revendications 1 à 10 pour dissiper une énergie thermique, la partie saillante (106) de l'insert étant disposée dans un flux de fluide réfrigérant, tel qu'un flux d'air.  12. Use of a printed circuit according to one of claims 1 to 10 for dissipating thermal energy, the protruding portion (106) of the insert being disposed in a flow of refrigerant, such as a flow of air .
13. Procédé de fabrication d'un circuit imprimé selon l'une des revendications 1 à 10, caractérisé en ce qu'il comporte une étape de pressage comprenant une étape d'insertion au moins partiellement d'une couche supplémentaire constituée en un matériau non complètement polymérisé.  13. A method of manufacturing a printed circuit according to one of claims 1 to 10, characterized in that it comprises a pressing step comprising a step of insertion at least partially of an additional layer made of a material not completely polymerized.
14. Procédé de fabrication d'un circuit imprimé selon la revendication précédente, caractérisé en ce que l'étape de pressage comprend une étape de chauffe de sorte à accomplir la polymérisation complète de ladite couche supplémentaire.  14. A method of manufacturing a printed circuit according to the preceding claim, characterized in that the pressing step comprises a heating step so as to complete the complete polymerization of said additional layer.
FEU I LLE DE REM PLACEM ENT (RÈG LE 26) FIRE I LLE OF REM PLACEM ENT (RULE 26)
PCT/EP2013/076527 2012-12-14 2013-12-13 Printed circuit comprising a heat-transport insert device for cooling WO2014090987A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP13803059.8A EP2932805A1 (en) 2012-12-14 2013-12-13 Printed circuit comprising a heat-transport insert device for cooling

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1262079A FR2999862A1 (en) 2012-12-14 2012-12-14 PRINTED CIRCUIT HAVING A COOLING INSERT COOLING DEVICE
FR1262079 2012-12-14

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WO2014090987A1 true WO2014090987A1 (en) 2014-06-19

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3832856A1 (en) * 1988-09-28 1990-03-29 Standard Elektrik Lorenz Ag Printed circuit board having a thermally conductive element
US5099395A (en) * 1987-10-11 1992-03-24 Ibiden Co. Ltd. Circuit board for mounting electronic components
US5311407A (en) * 1992-04-30 1994-05-10 Siemens Components, Inc. Printed circuit based for mounted semiconductors and other electronic components

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5099395A (en) * 1987-10-11 1992-03-24 Ibiden Co. Ltd. Circuit board for mounting electronic components
DE3832856A1 (en) * 1988-09-28 1990-03-29 Standard Elektrik Lorenz Ag Printed circuit board having a thermally conductive element
US5311407A (en) * 1992-04-30 1994-05-10 Siemens Components, Inc. Printed circuit based for mounted semiconductors and other electronic components

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EP2932805A1 (en) 2015-10-21

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