M426Q62 五、新型說明： 【新型所屬之技術領域】 . 本創作係關於一種導熱元件，特別是指一種用來裝設 熱管，經過壓鉚後，表面形成共平面的散熱底板結構。 【先前技術】 由於熱管具備高的熱傳導力，重量輕且結構簡 單，再加上不消耗電力且價格低廉，目前被廣泛的應用 於電子產品當中。其係應用相變化熱傳導原理，將容易 產生高熱的電子元件（如：處理器或晶片組等）的熱能轉 • 移，避免產生熱聚集造成系統溫度拉昇，致系統效能降 低。 置入請參照圖1A為筆記型電腦散熱模組無焊接 新技術，一熱管2置入一底板1中。所述的底板1具有 一凹槽10，以埋入熱管2。在筆記型電腦中，為了盡量 縮小散熱模組體積，所使用的熱管2管斷面一般係呈扁 平管狀，熱管2由上而下放置或由底板側插於凹槽10 中，再以機械鉚平加工方式，藉由材料變形，將熱管2 φ 固定於底板1的凹槽10中，並使熱管2頂面20與底 板表面形成同一平面13，如圖1B。 由於熱管2的寬度通常會略小於凹槽10的寬度， 因此鉚平後，易在熱管頂面20與凹槽10上沿之間產 生一缝隙100，造成熱管2與底板1相互間之密合、緊 結性不足，當然也直接影響其熱傳效率，此外，也容易 使熱管2自底板1的凹槽10中掉出。 因此，之後針對底板1的結構做了一些改良，請 參照圖2A。凹槽10的兩侧壁垂直延伸二凸肋11，凸 3 M426Q62 出底板表面13—預定高度。當熱管2置入凹槽1◦，並 進行平整化製程後，凸肋11會壓合到熱管頂面20，並 填補凹槽10與熱管2之寬度差，避免間隙產生，同時 使熱管2與底板1結合更牢固。但是，卻產生另外一個 問題，在平整化製程中，由於凸肋11是由凹槽10的兩 侧壁101向上垂直延伸，因此受鉚壓時，並非所有的凸 肋材料都會往凹槽開口方向變形，仍會有相當比率材料 會在底板表面13堆積形成凸起的平台14，如圖2Β。 任何平台的存在都會影響與熱源之緊密接觸，進而降低 熱傳導效果。 若要將凸出於底板表面13的凸肋11壓平並消除 平台高度，需要施加極大的壓力，不只影響加工性，還 會使底板1因受壓而變成孤形，影響底板和熱源之貼 合0 有鑑於此，創作人基於多年經驗，針對用於埋入 熱管的底板結構改良，以解決上述問題。 【新型内容】 有鑑於上述目的，本創作提供一種散熱底板結構， 用以埋入一熱管，所述熱管可以是一直線或一彎曲熱 管，在熱管埋入散熱底板結構，且以機械鉚平加工法鉚 合後，散熱底板結構表面仍保有平面特徵，包括：一容 置凹槽，形成於散熱底板結構中，用以提供熱管埋入容 置凹槽；二凸肋，分別緊鄰形成於容置凹槽兩側，二凸 肋高於散熱底板結構表面；及二逃料槽，形成於散熱底 板結構中，分別緊鄰且位於些凸肋外側，藉此，在埋入 該熱管，進行機械鉚平加工法時，該些凸肋鉚合熱管， 4 M426062 而該些逃料槽得以容置二凸肋於機械鉚平加工法後，多 餘的金屬，而使散熱底板結構表面得以保持平面特徵。 本創作更提供一種熱管與散熱底板之結合結構，包 括：一散熱底板，具有一容置凹槽及二逃料槽形成於 • 散熱底板表面，其中，二逃料槽，分別位於容置凹槽兩 側；一熱管，置於容置凹槽中，成扁平管狀，具有一頂 面；及二固定部，分別自容置凹槽左右兩側延伸以將該 熱管固定於該容置凹槽中，其中，散熱底板表面、熱管 頂面及固定部表面大致上形成一共平面。 • 關於本創作之優點與精神，可藉由以下的創作說明 及所附圖式得到進一步的了解，然而所附圖式僅供參考 與說明，非以對本創作加以限制。 【實施方式】 為使本創作之上述目的、特徵和優點能更明顯易 懂，下文依本創作所提供的散熱底板結構，特舉較佳 實施例，並配合所附相關圖式，作詳細說明如下。 ^ 請參照圖3A，為本創作之散熱底板結構及熱管之 剖面示意圖。散熱底板結構是用以埋入一熱管，可以 是一直線熱管或一彎曲熱管。熱管的管斷面可以是圓 管狀或扁平管狀，但不論使用何種熱管，在置入散熱 底板後，皆需再以機械鉚平加工法鉚合，並使散熱底 板表面和熱管表面具有一共平面。 底板結構3包括一容置凹槽30、二凸肋31及二逃 料槽32。所述的容置凹槽30，形成於底板結構3中， 以放置熱管4。容置凹槽30之二側壁301在本創作實施 5 例中係呈弧形’且容置凹槽30之剖面略呈橢圓形。當 熱管4平置於容置凹槽30中時，部份熱管4凸出於容置 凹槽30，而南於底板表面33。因此，本實施例中容置 凹槽30需預留熱管4經沖壓變形後的空間。 在一較佳實施例中，容置凹槽30的兩側壁3〇1及 底部302具有一導熱介質34，如：導熱膏等。以在熱 管4被擠壓變形時’填補容置凹槽30與熱管4之間無法 完全密合的間隙’以增加熱管4與容置凹槽3〇之接觸， 提供更好的熱傳效果。 為了在進行沖壓製程使熱管表面4〇與底板表面 33形成共平面時，熱管4可以被緊密固定，本創作實施 例的底板結構3更包括在容置凹槽3〇開口兩侧分別設 置二凸肋31。 所述的凸肋31分別緊鄰於容置凹槽3〇兩側，且高 於底板表面33。在本發明實施例中凸肋31係分別由容 置凹槽30的左右侧壁向上垂直延伸，不論是直線熱管 或彎曲熱管，皆能由上往下放置於容置凹槽3〇中， 除此之外，為了吸收凸肋31可能堆疊在底板表面 33上多餘的材料，在二凸肋31外侧各具有—逃料槽 32，形成於散熱底板結構3中，分別位於該些凸肋底 部外側，在一較佳實施例中，逃料槽32緊鄰凸肋31 底部外侧。但往往實際應用時，逃料槽32是否一定緊 鄰凸肋31，還需考慮到中央處理晶片寬度，但是，距 離最遠不會超過5mm。 藉此，在埋入熱管4，進行機械鉚平加工法時，該 些凸肋31扣住熱管4，可填補熱管4與容置凹槽^ M426062 之間的寬度差’以消除間隙，該些逃料槽32則用以容 置二凸肋31於機械鉚平加工法後，多餘的金屬，而使 底板表面33得以保持一平面特徵。 在本創作實施例中，逃料槽32係為—v型或一 u 型逃料槽。在一實施例中，逃料槽32最佳係v塑， 可以在鉚平製程中，使得凸肋3彳順著逃料槽32的斜 面逐漸堆積至逃料槽32中，較不會形成缝隙，而影響 熱傳導的效果。 其中，若以底板表面33為基準面，逃料槽32的 深度需依據凸肋31垂直高度及寬度而決定，以免在壓 平後，逃料槽32太淺無法容納凸肋31多餘的金屬， 以致於仍在底板表面33形成凸起的平台，但可以想 見’逃料槽32也不能夠過深或過寬，以免最後在底板 表面形成過深的溝槽，反而影響熱傳導效果。 在另一較佳實施例中，凸肋31向容置凹槽傾斜， 如圖4A所示。但在此情況下，由於左右兩凸肋3彳形成 的開口小於熱管4的寬度，無法由上往下直接放入容置 凹槽30中。因此，此種設計較適用於直線熱管，且熱 管須側向放入所述容置凹槽30中。 若要使用於彎曲熱管時，則需採用前一實施例的 散熱底板，並在熱管由上往下置入後，多一道工序， 將原本垂直延伸的凸肋31向容置凹槽3〇彎折，形成本 實施例之結構。 壓平熱管4凸出於容置凹槽30的部份後之剖面示 思圖’如圖4B所示。斜向設置的凸肋31可以確保在受 到沖壓時’大部份凸肋31材料能夠往容置凹槽3〇開口 7 M426062 方向傾倒而被壓平，以緊密扣合熱管4，同時避免多餘 材料向底板表面33堆積。 其中，圖4A之凸肋31被沖壓變形後，形成用來 扣合熱官4的固定部31 ’。而逃料槽32則吸收在沖壓 過程中，凸肋31被壓平後多餘材料。 睛參照圖5A及5B，本創作實施例之散熱底板結 構也可以適用管斷面為圓形之熱管。 佳若逃枓槽32能剛好被凸肋31多餘的材料填平最 ’但在一般情況下，逃料槽32不一定能被完全填 底;而仍存在於底板表面33，如圖4B。即便如此， 升士面33、熱管4的表面及固定部31，表面大致上 因杯:共平面，有效降低熱阻，未完全填平之逃料槽 ^極淺，故不致於對導熱效果產生不良的影響， 吏不衫響本創作之精神。 2作之用來埋人熱管之底板結構具有以下優點： 埶管頂I:凸肋填補熱管與容置四槽寬度差，且避免 與容置凹槽之間產生間隙同時，本創作之逃 多餘因此，不w大的壓力即 p千凸肋，且不會造成底板變形。 管==制3受變形之方向，以更緊密固定熱 凸肋向容置凹槽開口傾斜，c時，由於 然而然向熱管方向擠壓，少力變形時’便自 (3)逃料槽可以吸收在沖麗：二積在底板平台。 多餘的全屬妊祖，+過狡中，凸肋被壓平後 提升材:二;在底板表面形成凸起的平台， V/、電子兀件之間的貼合度及緊密度。 8 本創作雖以較佳實例闡明如上，然其並非用以限 定本創作精神與發明實體僅止於上述實施例。凡熟悉 此項技術者，當可輕易了解並利用其它元件或方式來 產生相同的功效。是以，在不脫離本創作之精神與範 疇内所作之修改，均應包含在下述之申請專利範圍内。 【圖式簡單說明】 圖1A及1B扁平熱管放置於習知底板進行平整化製程 前後之剖面示意圖； 圖2A及2B扁平熱管放置於習知底板進行平整化製程 前後之剖面示意圖； 圖3A及3B扁平熱管放置於本創作實施例底板中進行 平整化製程前後之剖面示意； 圖4A及4B扁平熱管放置於本創作另一實施例底板 中，進行平整化製程前後之剖面示意圖；及 圖5A及5B圓形熱管放置於本創作另一實施例底板 中，進行平整化製程前後之剖面示意圖。 M4260.62 t 【主要元件符號說明】 1 :習知的底板 2、‘ 10 :凹槽 101 100 :缝隙 11 ' 13、33 :底板表面 14 ： 3:底板結構 30 ： 301 :容置凹槽側壁 302 32 :逃料槽 320 34 :導熱介質 31, 20、40 :熱管表面 :熱管 :凹槽側壁 31 :凸肋 平台 容置凹槽 :容置凹槽底部 :逃料槽側壁 :固定部M426Q62 V. New description: [New technical field] The present invention relates to a heat-conducting element, in particular to a heat-dissipating bottom plate structure for mounting a heat pipe and forming a coplanar surface after being riveted. [Prior Art] Since the heat pipe has high heat conductivity, light weight and simple structure, and it is not power-consuming and inexpensive, it is widely used in electronic products. It applies the principle of phase change heat conduction, which transfers the heat energy of electronic components (such as processors or chipsets) that are prone to high heat, avoiding the accumulation of heat and causing the system temperature to rise, resulting in reduced system performance. Please refer to Figure 1A for the new technology of the notebook computer cooling module without soldering. A heat pipe 2 is placed in a bottom plate 1. The bottom plate 1 has a recess 10 for embedding the heat pipe 2. In the notebook computer, in order to minimize the volume of the heat dissipation module, the heat pipe 2 pipe section generally has a flat tube shape, and the heat pipe 2 is placed from the top to the bottom or the bottom plate side is inserted into the groove 10, and then mechanically riveted. In the flat processing mode, the heat pipe 2 φ is fixed in the groove 10 of the bottom plate 1 by material deformation, and the top surface 20 of the heat pipe 2 forms the same plane 13 with the surface of the bottom plate, as shown in FIG. 1B. Since the width of the heat pipe 2 is generally slightly smaller than the width of the groove 10, after the riveting, a gap 100 is easily formed between the top surface 20 of the heat pipe and the upper edge of the groove 10, so that the heat pipe 2 and the bottom plate 1 are in close contact with each other. Insufficient tightness, of course, also directly affects its heat transfer efficiency. In addition, it is easy to cause the heat pipe 2 to fall out of the recess 10 of the bottom plate 1. Therefore, some improvements have been made to the structure of the base plate 1, see Fig. 2A. The two side walls of the recess 10 extend perpendicularly to the two ribs 11, and the protrusion 3 M426Q62 exits the bottom surface 13 by a predetermined height. After the heat pipe 2 is placed in the groove 1◦ and the flattening process is performed, the rib 11 is pressed against the top surface 20 of the heat pipe, and the width difference between the groove 10 and the heat pipe 2 is filled to avoid the gap generation, and the heat pipe 2 is The bottom plate 1 is more firmly bonded. However, another problem arises. In the flattening process, since the ribs 11 are vertically extended by the two side walls 101 of the recess 10, not all of the rib materials are directed toward the opening of the recess when being riveted. Deformation, there will still be a considerable ratio of material that will build up on the bottom surface 13 to form a raised platform 14, as shown in Figure 2A. The presence of any platform can affect the close contact with the heat source, which in turn reduces heat transfer. To flatten the rib 11 protruding from the bottom surface 13 and eliminate the height of the platform, it is necessary to apply a great pressure, which not only affects the workability, but also causes the bottom plate 1 to become orphaned due to the pressure, affecting the adhesion of the bottom plate and the heat source. In view of this, the creator has improved the floor structure for embedding the heat pipe based on years of experience to solve the above problems. [New content] In view of the above objects, the present invention provides a heat dissipation floor structure for embedding a heat pipe, which may be a straight line or a curved heat pipe, embedded in a heat pipe bottom plate structure, and mechanically riveted. After riveting, the surface of the heat dissipation base plate still retains a planar feature, including: a receiving groove formed in the heat dissipation base plate structure for providing a heat pipe buried in the receiving groove; and two convex ribs respectively formed adjacent to the receiving concave On both sides of the slot, the two convex ribs are higher than the surface of the heat dissipation bottom plate structure; and the two escape grooves are formed in the heat dissipation bottom plate structure, respectively adjacent to and located outside the convex ribs, thereby embedding the heat pipe for mechanical riveting processing In the method, the ribs are riveted with the heat pipe, 4 M426062, and the escape grooves can accommodate the two ribs after the mechanical riveting process, and the excess metal can maintain the planar surface of the heat dissipation floor structure. The present invention further provides a combination structure of a heat pipe and a heat dissipation base plate, comprising: a heat dissipation bottom plate having a receiving groove and two escape grooves formed on the surface of the heat dissipation base plate, wherein the two escape grooves are respectively located in the receiving groove a heat pipe disposed in the accommodating recess and having a flattened tubular shape having a top surface; and two fixing portions extending from the left and right sides of the accommodating recess to fix the heat pipe in the accommodating recess The surface of the heat dissipation substrate, the top surface of the heat pipe, and the surface of the fixing portion form a common plane. • The advantages and spirit of this creation can be further understood by the following creative descriptions and drawings. However, the drawings are for reference and explanation only and are not intended to limit the creation. [Embodiment] In order to make the above objects, features and advantages of the present invention more obvious and easy to understand, the following is a detailed description of the heat dissipation base plate structure provided by the present invention, and with the accompanying drawings, as follows. ^ Please refer to FIG. 3A, which is a schematic cross-sectional view of the heat dissipation substrate structure and the heat pipe of the present invention. The heat sink structure is used to embed a heat pipe, which may be a straight heat pipe or a curved heat pipe. The cross section of the heat pipe can be round or flat, but no matter which heat pipe is used, after the heat sink is placed, it needs to be riveted by mechanical riveting method, and the surface of the heat sink and the surface of the heat pipe have a common plane. . The bottom plate structure 3 includes a receiving recess 30, two ribs 31 and two escape slots 32. The accommodating recess 30 is formed in the bottom plate structure 3 to place the heat pipe 4. The two side walls 301 of the receiving recess 30 are curved in the example of the present invention, and the cross section of the receiving recess 30 is slightly elliptical. When the heat pipe 4 is placed flat in the accommodating recess 30, part of the heat pipe 4 protrudes from the accommodating recess 30 and is souther than the bottom surface 33. Therefore, in the embodiment, the recess 30 is required to reserve the space after the heat pipe 4 is stamped and deformed. In a preferred embodiment, the two side walls 3〇1 and the bottom portion 302 of the receiving recess 30 have a heat conducting medium 34, such as a thermal paste or the like. In order to increase the contact between the heat pipe 4 and the accommodating groove 3 when the heat pipe 4 is pressed and deformed, the gap between the accommodating groove 30 and the heat pipe 4 is not completely closed to provide a better heat transfer effect. In order to form a coplanar surface of the heat pipe surface 4 and the bottom surface 33, the heat pipe 4 can be tightly fixed. The bottom plate structure 3 of the present embodiment further includes two convex portions respectively disposed on the two sides of the opening of the receiving groove 3〇. Rib 31. The ribs 31 are respectively adjacent to both sides of the accommodating recess 3 and higher than the bottom surface 33. In the embodiment of the present invention, the ribs 31 are vertically extended upward from the left and right side walls of the accommodating recess 30, and the linear heat pipe or the curved heat pipe can be placed from the top to the bottom in the accommodating recess 3, except In addition, in order to absorb the excess material on the bottom surface 33 of the rib 31, the outer ribs 31 have a fluffing groove 32 formed in the heat dissipating bottom structure 3, respectively located outside the bottom of the ribs. In a preferred embodiment, the escape chute 32 is adjacent to the outside of the bottom of the rib 31. However, in practice, the escaping groove 32 must be adjacent to the rib 31, and the width of the central processing wafer should be considered, but the distance from the farthest distance does not exceed 5 mm. Therefore, when the heat pipe 4 is buried and the mechanical riveting processing method is performed, the ribs 31 are fastened to the heat pipe 4, and the width difference between the heat pipe 4 and the receiving groove ^ M426062 can be filled to eliminate the gap. The escape groove 32 is used to accommodate the excess metal after the two ribs 31 are mechanically riveted, so that the bottom surface 33 can maintain a planar feature. In the present embodiment, the escape chute 32 is a -v type or a u-type escape chute. In an embodiment, the escape groove 32 is preferably v-shaped, and the rib 3 can be gradually accumulated in the escape groove 32 along the inclined surface of the escape groove 32 in the riveting process, and no gap is formed. And affect the effect of heat conduction. Wherein, if the bottom surface 33 is used as the reference surface, the depth of the escape groove 32 is determined according to the vertical height and width of the rib 31, so as to prevent the escape groove 32 from being too shallow to accommodate the excess metal of the rib 31 after the flattening, Therefore, a raised platform is still formed on the bottom surface 33, but it is conceivable that the escape groove 32 cannot be too deep or too wide to avoid forming a deep groove on the surface of the bottom plate, which adversely affects the heat conduction effect. In another preferred embodiment, the rib 31 is inclined toward the receiving groove as shown in Fig. 4A. However, in this case, since the openings formed by the left and right ribs 3 are smaller than the width of the heat pipe 4, they cannot be directly placed into the accommodating recess 30 from the top to the bottom. Therefore, this design is more suitable for a linear heat pipe, and the heat pipe must be placed laterally into the accommodating recess 30. In order to use the curved heat pipe, the heat dissipating bottom plate of the previous embodiment is used, and after the heat pipe is placed from the top to the bottom, a plurality of steps are performed to bend the originally vertically extending rib 31 toward the receiving groove 3. Folded to form the structure of this embodiment. A cross-sectional view of the flattening heat pipe 4 protruding from the portion accommodating the recess 30 is shown in Fig. 4B. The obliquely disposed ribs 31 ensure that the material of most of the ribs 31 can be flattened in the direction of the receiving recess 3 〇 opening 7 M426062 when pressed, to tightly fasten the heat pipe 4 while avoiding excess material. It is deposited on the bottom surface 33. Here, the rib 31 of Fig. 4A is stamped and deformed to form a fixing portion 31' for engaging the heat member 4. The escape chute 32 is absorbed in the stamping process, and the ribs 31 are flattened and the excess material is flattened. Referring to Figures 5A and 5B, the heat dissipation base structure of the present embodiment can also be applied to a heat pipe having a circular cross section. The escaping slot 32 can be filled with the excess material of the rib 31. However, in general, the escaping groove 32 may not be completely filled; it is still present on the floor surface 33, as shown in Fig. 4B. Even so, the surface of the riser 33, the surface of the heat pipe 4 and the fixing portion 31 are substantially due to the cup: coplanar, which effectively reduces the thermal resistance, and the escape groove which is not completely filled is extremely shallow, so that the heat conduction effect is not generated. Bad influence, not the spirit of this creation. 2 The base plate structure used for burying the heat pipe has the following advantages: 埶 Pipe top I: The rib fills the difference between the heat pipe and the accommodating four groove width, and avoids the gap between the accommodating groove and the escape of the creation. Therefore, the pressure that is not large is p pleats, and the bottom plate is not deformed. Tube == system 3 is deformed in the direction to tightly fix the hot rib to the accommodating groove opening. When c, however, it is squeezed toward the heat pipe, and when it is less deformed, it will be self-propelled (3). Can be absorbed in the Chong Li: two accumulation in the floor platform. The excess is all pregnant ancestors, + over the squat, the ribs are flattened and raised: 2; a raised platform on the surface of the bottom plate, V/, the fit and tightness between the electronic components. 8 Although the present invention is exemplified by the preferred examples, it is not intended to limit the spirit of the creation and the inventive entity only to the above embodiments. Anyone familiar with the technology can easily understand and utilize other components or methods to produce the same effect. Therefore, modifications made without departing from the spirit and scope of this creation should be included in the scope of the patent application below. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A and FIG. 1B are schematic cross-sectional views of a flat heat pipe placed before and after a flattening process; FIG. 2A and FIG. 2B are schematic cross-sectional views of a flat heat pipe placed before and after a flattening process; FIG. 3A and FIG. The flat heat pipe is placed in the bottom plate of the present embodiment before and after the flattening process; FIG. 4A and FIG. 4B are flat cross-sectional views of the flat heat pipe placed in the bottom plate of the present embodiment, before and after the flattening process; and FIGS. 5A and 5B The circular heat pipe is placed in the bottom plate of another embodiment of the present invention, and a schematic cross-sectional view before and after the flattening process is performed. M4260.62 t [Main component symbol description] 1 : Conventional base plate 2, '10: groove 101 100: slit 11' 13, 33: bottom plate surface 14: 3: bottom plate structure 30: 301: accommodating groove side wall 302 32 : escape trough 320 34 : heat transfer medium 31, 20, 40 : heat pipe surface: heat pipe: groove side wall 31 : rib platform receiving groove: accommodating groove bottom: escape groove side wall: fixed part