TW201634895A - Combination heat sink and heat pipe assembly - Google Patents
Combination heat sink and heat pipe assembly Download PDFInfo
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- TW201634895A TW201634895A TW105119871A TW105119871A TW201634895A TW 201634895 A TW201634895 A TW 201634895A TW 105119871 A TW105119871 A TW 105119871A TW 105119871 A TW105119871 A TW 105119871A TW 201634895 A TW201634895 A TW 201634895A
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- heat sink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/14—Fastening; Joining by using form fitting connection, e.g. with tongue and groove
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明係關於一種散熱器的基座與熱導管組合,尤指基座係以上、下基板嵌插結構並通過沖壓而與熱導管完成快速穩固的緊迫結合,以提供中央處理器(CPU)或其他發熱電子元件進行散熱使用。The invention relates to a base of a heat sink combined with a heat pipe, in particular to a base system above and a lower substrate insert structure and a quick and stable combination with a heat pipe by punching to provide a central processing unit (CPU) or Other heat-generating electronic components are used for heat dissipation.
習用附有熱導管的散熱器,通常是將熱導管的吸熱端嵌設(或貫穿或包覆)結合於一散熱基座,熱導管的散熱端則可連結到一散熱鰭片模組,散熱基座係貼觸於中央處理器或其他發熱電子元件,而將熱溫導引到散熱鰭片模組進行散熱;早期技術,主要是採用銲結以完成熱導管與基座的結合,近期則是利用嵌合技術,將熱導管直接嵌入結合於散熱基座的預設溝槽內,並使熱導管可露出於基座表面;另有第M280631號新型專利所揭技術,其係將複數熱導管夾置在底座與覆板之間,於底座與覆板對應蓋合後,使底座兩端凸部因受外力擠壓而產生向內彎曲變形,進而壓置夾置覆板及熱導管,達到底座與熱導管的固定結合;然查,上述M280631專利,因底座的兩端凸部於瞬間受到巨大的擠壓外力時,極容易導致上方覆板的中央部份發生隆起狀的彎曲變形,甚至,底座本身亦可能產生彎曲變形,而不論是覆板或底座發生變形,必然都無法穩固夾持所述的複數熱導管,所以熱導管在底座與覆板之間將難免會存在間隙,不僅其固定效果不佳,且導熱效果亦更不理想。A heat sink with a heat pipe is usually used to embed (or penetrate or cover) the heat-absorbing end of the heat pipe into a heat-dissipating base, and the heat-dissipating end of the heat pipe can be connected to a heat-dissipating fin module to dissipate heat. The pedestal is attached to the central processing unit or other heat-generating electronic components, and the thermal temperature is guided to the heat-dissipating fin module for heat dissipation; the early technology mainly uses the solder joint to complete the combination of the heat pipe and the pedestal, and more recently The use of a chiseling technique, the heat pipe is directly embedded in a predetermined groove of the heat sink base, and the heat pipe can be exposed on the surface of the base; and the technology disclosed in the new patent No. M280631, which is a plurality of heats The conduit is sandwiched between the base and the cover plate, and after the base and the cover plate are correspondingly closed, the convex portions at both ends of the base are bent and deformed inward by being pressed by an external force, and then the sandwiched cover plate and the heat pipe are pressed. The fixed combination of the base and the heat pipe is achieved; however, the above-mentioned M280631 patent, because the convex portions at both ends of the base are subjected to a large pressing external force in an instant, it is easy to cause a convex deformation of the central portion of the upper cladding plate. Even the base The body may also have bending deformation, and no matter whether the superposed plate or the base is deformed, the plurality of heat pipes may not be stably clamped, so the heat pipe will inevitably have a gap between the base and the cover plate, and the fixing effect is not only fixed. Poor, and the thermal conductivity is also less than ideal.
本發明之主要目的,係提供一種散熱器的基座與熱導管組合,該基座係包括一上、下基板,特別是在該上、下基板相對面的兩側分別設有一組以上可對應嵌固的嵌槽與嵌塊,而在上、下基板的相對面兩側之間,並設有一個以上的可合併容置熱導管的凹槽,因此可將一個以上的熱導管分別對應置入上、下基板的凹槽,再通過沖壓使兩側的嵌塊緊迫進入嵌槽,因此使熱導管與上、下基板可呈非常緊密的咬合嵌固,不但能簡化並快速完成基座與熱導管的穩固結合,且足以確保熱導管在上、下基板之間不會存在間隙,故具有更佳的導熱及散熱效果。The main object of the present invention is to provide a base of a heat sink and a heat pipe. The base includes an upper and a lower substrate, and particularly one or more of the opposite sides of the upper and lower substrates are respectively provided. The embedded recessed groove and the insert block, and between the opposite sides of the upper and lower substrates, and more than one groove for accommodating the heat pipe, so that more than one heat pipe can be respectively arranged The grooves of the upper and lower substrates are pressed, and the inserts on both sides are pressed into the groove by pressing, so that the heat pipe and the upper and lower substrates can be tightly engaged and integrated, which not only simplifies and quickly completes the base and the base. The solid combination of the heat pipes is sufficient to ensure that there is no gap between the upper and lower substrates of the heat pipes, so that the heat conduction and heat dissipation effects are better.
本發明之次要目的,係提供一種散熱器的基座與熱導管組合,其中,該上、下基板並在各容置凹槽的相鄰間隔處,分別設有可對應嵌固的插槽與插柱,因此於上、下基板沖壓結合時,使所述插槽與插柱可同步對應而嵌固結合,故於各容置凹槽的相鄰間隔處也產生咬合嵌固,使上、下基板與熱導管相互結合的作用力可更為均勻,能確保該上、下基板不會變形。A secondary object of the present invention is to provide a base of a heat sink and a heat pipe, wherein the upper and lower substrates are respectively provided with corresponding slots at adjacent intervals of the receiving grooves. Therefore, when the upper and lower substrates are press-bonded, the slot and the post can be synchronously coupled and integrated, so that the adjacent gaps of the accommodating recesses also form a occlusal engagement. The force of the lower substrate and the heat pipe combined with each other can be more uniform, and the upper and lower substrates can be prevented from being deformed.
本發明之又一目的,係提供一種散熱器的基座與熱導管組合,其中,該上、下基板所設的嵌槽與嵌塊,或設於各凹槽相鄰間隔處的插槽與插柱,所述嵌槽與插槽係具有選定的傾斜角度,而所述嵌塊與插柱係可為垂直柱,因此於沖壓時,所述嵌塊與插柱即可沿著具有傾斜角度的嵌槽與插槽引導插入,產生變形咬合的迫緊嵌固。Another object of the present invention is to provide a base of a heat sink and a heat pipe, wherein the upper and lower substrates are provided with a groove and a block, or a slot disposed at an interval between each groove and Inserting the post, the slot and the slot have a selected angle of inclination, and the insert and the post can be a vertical post, so that the insert and the post can be inclined at an angle when punching The slot and the slot guide the insertion, resulting in a tight engagement of the deformed bite.
本發明之另一目的,係提供一種散熱器的基座與熱導管組合,其中,該上、下基板於兩側所設的嵌槽與嵌塊,所述嵌塊係可實施為單凸或雙凸的垂直柱,嵌槽係可實施為相對應單凹或雙凹的傾斜槽,因此通過沖壓時,單凸或雙凸垂直柱的嵌塊即可沿著單凹或雙凹的傾斜槽,使嵌塊可對準引導插入嵌槽,而呈變形的迫緊結合,進一步加強基座與熱導管的穩固結合。Another object of the present invention is to provide a base of a heat sink and a heat pipe, wherein the upper and lower substrates are provided with grooves and inserts on both sides, and the block can be implemented as a single convex or The double convex vertical column, the groove system can be implemented as a corresponding single concave or double concave inclined groove, so when punching, the single convex or double convex vertical column can be inclined along the single concave or double concave inclined groove. The insert can be aligned with the guide insertion slot, and the deformation is tightly coupled to further strengthen the solid combination of the base and the heat pipe.
本發明之再一目的,係提供一種散熱器的基座與熱導管組合,其中,該上、下基板於各凹槽相鄰間隔處所設的插槽與插柱,該插槽亦可為一傾斜槽,因此可供插柱對準引導插入,而呈變形的迫緊結合,以進加強基座與熱導管的穩固結合。A further object of the present invention is to provide a base of a heat sink and a heat pipe, wherein the upper and lower substrates are provided with slots and posts at adjacent intervals of the grooves, and the slot can also be a slot. The groove is inclined so that the insertion post can be aligned with the guide insertion, and the deformation is tightly coupled to secure the solid base and the heat pipe.
茲依附圖實施例將本發明手段特徵及其他作用、目的詳細說明如下:The features of the present invention and other functions and purposes are described in detail below with reference to the accompanying drawings:
如圖1至圖3所示,本發明所為「散熱器的基座與熱導管組合」,該基座係包括一上、下基板1、2,特別是在該上、下基板1、2相對面的兩側分別設有一組以上可對應嵌固的嵌槽11與嵌塊21,而在上、下基板1、2的相對面兩側之間,並設有一個以上的可供合併容置熱導管3的凹槽12、22,因此可將一個以上的熱導管3分別對應置入上、下基板1、2的凹槽12、22,再通過沖壓,使兩側的嵌塊21可緊迫進入嵌槽11,進而產生咬合嵌固效果(如圖3),因此能簡化並快速完成基座與熱導管3的結合。As shown in FIG. 1 to FIG. 3, the present invention is a combination of a base of a heat sink and a heat pipe, and the base includes an upper and lower substrates 1, 2, in particular, the upper and lower substrates 1 and 2 are opposite. The two sides of the surface are respectively provided with a plurality of corresponding recesses 11 and inserts 21, and between the opposite sides of the upper and lower substrates 1, 2, and more than one for merging The grooves 12 and 22 of the heat pipe 3 can be placed correspondingly into the grooves 12 and 22 of the upper and lower substrates 1 and 2, respectively, and then punched, so that the inserts 21 on both sides can be pressed. Entering the slot 11 and producing a snap-in effect (Fig. 3), the combination of the base and the heat pipe 3 can be simplified and quickly completed.
如上述本發明所為「散熱器的基座與熱導管組合」,該上、下基板1、2兩側係利用一組以上對應嵌固的嵌槽11與嵌塊21,形成沖壓咬合嵌固,故上、下基板1、2並不會有其他外力擠壓,所以能確保上、下基板1、2與熱導管3產生密合良好的結合。As described above, the "base of the heat sink and the heat pipe are combined", the two sides of the upper and lower substrates 1 and 2 are formed by a plurality of correspondingly embedded recesses 11 and inserts 21 to form a press-fit engagement. Therefore, the upper and lower substrates 1 and 2 are not pressed by other external forces, so that it is possible to ensure a good adhesion between the upper and lower substrates 1 and 2 and the heat pipe 3.
上述上、下基板1、2所設可供容置熱導管3的凹槽12、22,其係在各凹槽12、22的相鄰間隔處,分別設有可呈對應嵌固的插槽13(23)與插柱14(24),即如圖2所示,各插槽13(23)與插柱14(24)係可呈上下交錯設置,因此於熱導管3置入上、下基板1、2的凹槽12、22並通過沖壓時,即可使對應的插槽13(23)與插柱14(24)亦同步對應嵌固結合,因此於各容置凹槽12、22的相鄰間隔處也能同時產生咬合嵌固(如圖3),使基座與熱導管3的組合可更為穩定牢固。The upper and lower substrates 1 and 2 are provided with grooves 12 and 22 for accommodating the heat pipes 3, which are respectively arranged at adjacent intervals of the grooves 12 and 22, and are respectively provided with correspondingly inserted slots. 13(23) and the insertion post 14 (24), that is, as shown in FIG. 2, each of the slots 13 (23) and the insertion post 14 (24) can be arranged in an up-and-down manner, so that the heat pipe 3 is placed above and below. When the grooves 12 and 22 of the substrate 1 and 2 are punched, the corresponding slot 13 (23) and the insertion post 14 (24) can be simultaneously engaged and integrated, so that the recesses 12 and 22 are accommodated. At the same interval, the occlusion can be simultaneously produced (Fig. 3), so that the combination of the pedestal and the heat pipe 3 can be more stable and firm.
上述上、下基板1、2,於各凹槽12、22的相鄰間隔處,因係利用插槽13(23)與插柱14(24),形成對應嵌固結合,是以,上、下基板1、2與熱導管3相互結合的作用力可更為均勻,上、下基板1、2絕不會發生彎曲變形,故能將熱導管3穩固結合於上、下基板1、2之間。The upper and lower substrates 1 and 2 are formed at the adjacent intervals of the respective grooves 12 and 22 by using the socket 13 (23) and the insertion post 14 (24) to form a corresponding embedded joint. The force of bonding the lower substrate 1, 2 and the heat pipe 3 to each other can be more uniform, and the upper and lower substrates 1 and 2 are never bent and deformed, so that the heat pipe 3 can be firmly bonded to the upper and lower substrates 1, 2 between.
如圖4所示,上述上、下基板1、2於兩側所設的嵌槽11與嵌塊21,所述嵌塊21係可實施為雙凸的垂直柱211,嵌槽11係可實施為相對應雙凹的傾斜槽111,所述雙凹的傾斜槽111各具有相對的傾斜角度θ1,因此於通過沖壓時,所述具有雙凸垂直柱211的嵌塊21即可沿著具有雙凹傾斜槽111的嵌槽11,使嵌塊21可對準引導插入嵌槽11,而呈變形的迫緊結合(如圖5所示),用以進一步加強該基座與熱導管3的穩固結合。As shown in FIG. 4, the upper and lower substrates 1 and 2 are provided with the recesses 11 and the inserts 21 on both sides, and the inserts 21 can be implemented as bi-convex vertical columns 211, and the recesses 11 can be implemented. The inclined grooves 111 corresponding to the double concaves each have a relative inclination angle θ1, so that when the punching is performed, the insert 21 having the double convex vertical column 211 can have a double The recessed groove 11 of the inclined groove 111 allows the insert 21 to be aligned with the guide insertion slot 11 and is deformed and tightly coupled (as shown in FIG. 5) to further strengthen the stability of the base and the heat pipe 3. Combine.
同理可知,如圖6、圖7所示另一替代實施例,所述的嵌槽11a與嵌塊21a,其亦可分別實施為一單凹的傾斜槽及一單凸的垂直柱,利用具有單凹傾斜槽的嵌槽11a與具有單凸垂直柱的嵌塊21a,於沖壓時使嵌塊21a可沿著嵌槽11a引導插入,而產生變形咬合的迫緊嵌固。Similarly, as shown in FIG. 6 and FIG. 7 , the recess 11 a and the insert 21 a can also be implemented as a single concave inclined groove and a single convex vertical column, respectively. The recess 11a having a single concave inclined groove and the insert 21a having a single convex vertical column allow the insert 21a to be guided and inserted along the insert 11a at the time of punching, thereby causing a tight fitting of the deformed bite.
如圖8、圖9所示,上述各凹槽12、22於相鄰間隔處所設的插槽13(23)與插柱14(24),該插槽13(23)係可實施為一具有傾斜角度θ2的傾斜槽,因此可將插柱14(24)引導插入插槽13(23),用以產生更佳的咬合嵌固,使基座與熱導管3的組合更為穩定牢固。As shown in FIG. 8 and FIG. 9, each of the grooves 12 and 22 is disposed at an adjacent interval between the slot 13 (23) and the insertion post 14 (24). The slot 13 (23) can be implemented as one having The inclined groove is inclined at an angle θ2, so that the insertion post 14 (24) can be guided into the slot 13 (23) for better engagement and engagement, so that the combination of the base and the heat pipe 3 is more stable and firm.
如上述上、下基板1、2所設的凹槽12、22,該上下的凹槽12、22,於合併後係形成一可供熱導管3適配容納的圓孔槽,且該合併後的圓孔槽係可微小於(或等於)熱導管3的直徑,因此可供形成更適配的緊迫結合效果。The grooves 12 and 22 provided on the upper and lower substrates 1 and 2, the upper and lower grooves 12 and 22 are combined to form a circular hole groove which can be accommodated by the heat pipe 3, and after the combination The circular channeling system can be smaller than (or equal to) the diameter of the heat pipe 3, thus providing a more suitable tight bonding effect.
如圖10至圖13所示,係將本發明應用於散熱器的具體實施例,其係將一個以上的熱導管3對應置入上、下基板1、2的凹槽12、22,以供進行沖壓結合,使熱導管3的吸熱端被穩固嵌入基座的上、下基板1、2之間,而複數熱導管3的散熱端則呈併排延伸,而可供連結到一散熱鰭片模組4,該熱導管3與散熱鰭片模組4的連結結構因屬習知,且其連結的結構亦無特定限制必要,故不另贅述。As shown in FIG. 10 to FIG. 13 , a specific embodiment of the present invention is applied to a heat sink, in which one or more heat pipes 3 are correspondingly placed in the grooves 12 and 22 of the upper and lower substrates 1 and 2 for Pressing and bonding is performed so that the heat absorbing end of the heat pipe 3 is firmly embedded between the upper and lower substrates 1 and 2 of the susceptor, and the heat radiating ends of the plurality of heat pipes 3 are extended side by side, and are connected to a heat sink fin mold. In the group 4, the connection structure of the heat pipe 3 and the heat dissipation fin module 4 is conventional, and the structure of the connection is not particularly limited, and therefore will not be further described.
綜上所述,本發明所為散熱器的基座與熱導管組合,其結構特徵與組合形態均明顯不同於習知,故手段運用誠屬新穎首創,且能快速完成基座與熱導管組合,產生極佳的咬合嵌固效果,故已具進步性無訛,敬祈 依法審查賜准專利,實感德便。In summary, the pedestal of the heat sink of the present invention is combined with the heat pipe, and its structural features and combined forms are obviously different from the conventional ones. Therefore, the method is innovative and can quickly complete the combination of the pedestal and the heat pipe. It has excellent occlusion and embedding effect, so it has been progressive and innocent, and it is prudent to examine and grant patents according to law.
1‧‧‧上基板
2‧‧‧下基板
11‧‧‧嵌槽
21‧‧‧嵌塊
3‧‧‧熱導管
12、22‧‧‧凹槽
13、23‧‧‧插槽
14、24‧‧‧插柱
211‧‧‧垂直柱
111‧‧‧傾斜槽
θ1、θ2‧‧‧傾斜角度
11a‧‧‧嵌槽
21a‧‧‧嵌塊
4‧‧‧散熱鰭片模組1‧‧‧Upper substrate
2‧‧‧lower substrate
11‧‧‧Inlay
21‧‧‧Block
3‧‧‧heat pipe
12. 22‧‧‧ Groove
13, 23‧‧‧ slots
14, 24‧‧ ‧Plug
211‧‧‧ vertical column
111‧‧‧inclination groove θ1, θ2‧‧‧ tilt angle
11a‧‧‧Inlay
21a‧‧‧Block
4‧‧‧Solid fin module
圖1為本發明的分解立體圖。 圖2為本發明的分解示意圖。 圖3為本發明的組合示意圖。 圖4為本發明於上、下基板實施雙凹傾斜嵌槽與雙凸垂直嵌塊在迫緊結合前的狀態示意圖。 圖5為圖4在迫緊結合後的組合示意圖。 圖6為本發明於上、下基板實施單凹傾斜嵌槽與單凸垂直嵌塊在迫緊結合前的狀態示意圖。 圖7為圖6在迫緊結合後的組合示意圖。 圖8為本發明在上、下基板各凹槽相鄰間隔處所設插槽與插柱於迫緊嵌合前的狀態示意圖。 圖9為圖8在迫緊嵌合後的組合示意圖。 圖10為本發明應用於散熱器的實施例組合立體圖。 圖11為圖10的上視示意圖。 圖12為圖10的左側視圖。 圖13為圖10的前視圖。Figure 1 is an exploded perspective view of the present invention. Figure 2 is an exploded perspective view of the present invention. Figure 3 is a schematic view of the combination of the present invention. FIG. 4 is a schematic view showing a state in which a double concave inclined groove and a double convex vertical insert are applied to the upper and lower substrates before being tightly coupled. Fig. 5 is a schematic view showing the combination of Fig. 4 after being tightly coupled. FIG. 6 is a schematic view showing a state in which a single concave inclined recess and a single convex vertical insert are applied to the upper and lower substrates before being tightly coupled. Fig. 7 is a schematic view showing the combination of Fig. 6 after being tightly combined. FIG. 8 is a schematic view showing a state in which a slot and a post provided at adjacent intervals of the grooves of the upper and lower substrates are tightly fitted before being tightly fitted. Fig. 9 is a schematic view showing the combination of Fig. 8 after being tightly fitted. Figure 10 is a perspective view of an embodiment of the present invention applied to a heat sink. Figure 11 is a top plan view of Figure 10. Figure 12 is a left side view of Figure 10. Figure 13 is a front elevational view of Figure 10.
1‧‧‧上基板 1‧‧‧Upper substrate
2‧‧‧下基板 2‧‧‧lower substrate
11‧‧‧嵌槽 11‧‧‧Inlay
21‧‧‧嵌塊 21‧‧‧Block
3‧‧‧熱導管 3‧‧‧heat pipe
12、22‧‧‧凹槽 12. 22‧‧‧ Groove
13、23‧‧‧插槽 13, 23‧‧‧ slots
14、24‧‧‧插柱 14, 24‧‧ ‧Plug
Claims (10)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610268776.0A CN105873415A (en) | 2016-04-26 | 2016-04-26 | Base and heat pipe combination of radiator |
Publications (1)
Publication Number | Publication Date |
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TW201634895A true TW201634895A (en) | 2016-10-01 |
Family
ID=56629298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105119871A TW201634895A (en) | 2016-04-26 | 2016-06-24 | Combination heat sink and heat pipe assembly |
Country Status (5)
Country | Link |
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US (1) | US20170307299A1 (en) |
JP (1) | JP2017198435A (en) |
CN (1) | CN105873415A (en) |
DE (1) | DE102016113713A1 (en) |
TW (1) | TW201634895A (en) |
Families Citing this family (10)
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CN108966587B (en) * | 2017-10-13 | 2019-06-21 | 邹昊雄 | A kind of radiator |
JP6582114B1 (en) * | 2018-11-30 | 2019-09-25 | 古河電気工業株式会社 | heatsink |
US10677535B1 (en) | 2018-11-30 | 2020-06-09 | Furukawa Electric Co., Ltd. | Heat sink |
JP1643634S (en) * | 2018-12-28 | 2020-10-12 | ||
CN111381645A (en) * | 2018-12-29 | 2020-07-07 | 北京图森智途科技有限公司 | Heat dissipation system for vehicle-mounted server, vehicle-mounted server and automatic driving automobile |
JP6640401B1 (en) * | 2019-04-18 | 2020-02-05 | 古河電気工業株式会社 | heatsink |
JP1662414S (en) * | 2019-09-12 | 2020-06-29 | ||
CN213841858U (en) * | 2020-11-05 | 2021-07-30 | 亚浩电子五金塑胶(惠州)有限公司 | Heat pipe and heat radiation structure with same |
AT524886B1 (en) | 2021-03-22 | 2023-05-15 | Kaelte Und Systemtechnik Gmbh | Device for storing and releasing sensible and latent energy for cooling fluids |
USD1026838S1 (en) * | 2022-04-26 | 2024-05-14 | Taiwan Microloops Corp. | Heat dissipation module |
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US5931226A (en) * | 1993-03-26 | 1999-08-03 | Showa Aluminum Corporation | Refrigerant tubes for heat exchangers |
JPH07142653A (en) * | 1993-06-25 | 1995-06-02 | Mitsubishi Cable Ind Ltd | Heat pipe type cooler |
JP3198284B2 (en) * | 1996-04-08 | 2001-08-13 | 有限会社刀水企画 | Extruded material joining method and liquid-cooled heat sink |
US7316263B2 (en) * | 2003-11-19 | 2008-01-08 | Intel Corporation | Cold plate |
US7327576B2 (en) * | 2005-06-24 | 2008-02-05 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
TWM280631U (en) * | 2005-07-21 | 2005-11-11 | Shr-Ming Chen | Tight-fitting structure of heat dissipater base and heat pipe |
US7455102B2 (en) * | 2005-12-22 | 2008-11-25 | Golden Sun News Techniques Co., Ltd. | Method for manufacturing heat pipe cooling device |
JP4698413B2 (en) * | 2005-12-27 | 2011-06-08 | 住友軽金属工業株式会社 | Liquid-cooled heat sink |
US20080055857A1 (en) * | 2006-09-05 | 2008-03-06 | Shyh-Ming Chen | Method for connecting heat pipes and a heat sink |
US7441592B2 (en) * | 2006-11-26 | 2008-10-28 | Tsung-Hsien Huang | Cooler module |
CN101090097A (en) * | 2007-05-30 | 2007-12-19 | 秦彪 | Heat pipe type CPU radiator and manufacturing technology |
TWM327123U (en) * | 2007-06-04 | 2008-02-11 | Acbel Polytech Inc | Heat dissipation device of power supply |
JP5082610B2 (en) * | 2007-06-12 | 2012-11-28 | 日本軽金属株式会社 | Heat exchanger manufacturing method and heat exchanger |
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CN102218487B (en) * | 2011-03-04 | 2016-01-13 | 东莞汉旭五金塑胶科技有限公司 | Heat-conducting seat supplies compound formulation and the structure thereof of the closely sealed arrangement of many heat pipes |
DE202012005681U1 (en) * | 2012-06-07 | 2012-07-13 | Asia Vital Components Co., Ltd. | cooling module |
CN204069608U (en) * | 2014-08-18 | 2014-12-31 | 翔达精密工业有限公司 | Radiator close-fitting fixed structure |
-
2016
- 2016-04-26 CN CN201610268776.0A patent/CN105873415A/en active Pending
- 2016-06-24 TW TW105119871A patent/TW201634895A/en unknown
- 2016-07-04 US US15/201,573 patent/US20170307299A1/en not_active Abandoned
- 2016-07-26 DE DE102016113713.8A patent/DE102016113713A1/en not_active Withdrawn
- 2016-08-10 JP JP2016157530A patent/JP2017198435A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2017198435A (en) | 2017-11-02 |
US20170307299A1 (en) | 2017-10-26 |
CN105873415A (en) | 2016-08-17 |
DE102016113713A1 (en) | 2017-10-26 |
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