201005250 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種導熱模組’尤指一種堆疊式導熱 模組。 【先前技術】 一般散熱裝置通常係包含一導熱塊、複數熱管以及一 散熱鰭片組，貼設於一電子發熱元件上的導熱塊上係開設 ®有複數通孔以供此等熱管穿設。 而熱管的製造以及通孔的加工上都必須相當講究真圓 度，而導熱塊上所開設的通孔，通常係呈封閉圓形以對應 圓形的熱管，一般係利用銑削的方式將黨熱塊上的通孔加 工出來；然而，若是利用此種方式來在導熱塊上開設通 孔’其加工的公差必須拿捏的相當精準，因為熱管穿設於 通孔内時，通孔必須留一微小的空隙，使銲料可以流入通 ❷孔之中，使熱管與導熱塊緊密接觸；若是銑削出的通孔尺 寸太小，則熱管無法穿入導熱塊，而必須重複加工；若是 銑削出的通孔尺寸太大，則熱管穿入導熱塊後，熱管與導 熱塊之間的空隙還是太大，即使利用銲料亦無法使熱管與 導=塊緊密接觸，如此便會降低導熱塊與熱管之間的導熱 效率，使熱量積存於貼接於發熱電子元件的導熱塊上，甚 至還會造成電子元件的過熱燒毀。 因此如何克服前述先前技術之缺點，實為目前所亟 待解決之課題。 5 201005250 【發明内容】 本發明之一目的係提供一種一種堆疊式導熱模組，藉 由導熱座、堆疊塊以及蓋板以相互壓抵的方式將熱管裝設 於第一穿孔及第二穿孔内，可達到組裝方便以及節省製造 成本之效用。 為了達成上述之目的’本發明係提供一種堆疊式導熱 模組，包括一導熱座、一堆疊塊、一蓋板以及複數熱管， 其中，該堆疊塊對應疊接於該導熱座，該蓋板對應疊接於 該堆疊塊，其中在該導熱座與該堆疊塊之接合處開設有至 少一第一穿孔，在該堆疊塊與該蓋板之接合處開設有至少 一第一穿孔，該等熱管分別穿設於該第一穿孔以及該第二 穿孔。 【實施方式】 參 有關本發明之詳細說明及技術内容，配合圖式說明如 下，然而所附圖式僅提供參考與說明用，並非用來對本發 明加以限制者。 請參閱第一圖，係為本發明之立體分解示意圖，本發 明係提供一種堆疊式導熱模組，包括一導熱座丨〇、一堆叠 塊20、一蓋板30以及複數熱管40，其中： 導熱座10係呈一矩形，導熱座1〇之端面係開設有複數 固接孔11 ’固接孔11係位於導熱座10之邊緣，而導熱座1〇 之外側面還延伸成型有複數銲料擋牆12，本實施例_，辉 6 201005250 料擋牆12之個數係為二，但不以此為限；另外，導熱座1〇 之頂面還成型有間隔排列的複數凹槽b。 堆疊塊20亦呈一矩形並疊接於導熱座1〇，堆疊塊2〇開 設有對應固接孔11的複數容置孔23 ;另外，堆疊塊2〇還開 設有複數第二通孔24 ;另外’堆疊塊2〇係包含一第一堆疊 板21以及疊接於第一堆疊板21的一第二堆疊板22，第一堆 疊板21及第二堆疊板22之接合處成型有複數第三穿孔e ; 第一堆疊板21與第二堆疊板22之接觸面分別開設有相互對 馨應的複數凹槽b，第三穿孔e係由該等對互對應的凹槽b 合組而成。 蓋板30也呈一矩形，蓋板3〇係對應疊接於堆疊塊2〇， 蓋板30開設有對應容置孔23的複數開孔31，開孔31、容置 孔23以及固接孔11係供一固定元件5〇穿設固接以將導熱座 、堆疊塊20以及蓋板30固接；固定元件50係可為一螺 絲；而蓋板30之底面則開設有複數凹槽b，蓋板3〇之頂面 ❹則開設有一凹坑32，凹坑32之底面開設有複數第一通孔 33 ’該等第一通孔33係位於凹槽b内。 導熱座10與堆疊塊20之接合處開設有複數第一穿孔 c，堆疊塊20與蓋板30之接合處開設有複數第二穿孔d ; 導熱座10與堆疊塊20之接觸面分別開設有相互對應的複數 凹槽b，第一穿孔c係由該等凹槽b合組而成；蓋板3〇與 堆疊塊20之接觸面分別開設有相互對應的至少一凹槽匕， 該第二穿孔係由該等凹槽合組而成；熱管4〇則分別穿設於 第一穿孔c、第二穿孔d以及第三穿孔e。 7 201005250 請參照二至四圖所示’係分別為第一圖沿剖面線2—2 之剖視圖、第二圖A部份之放大圖以及第二圖沿剖面線 4-4之剖視圖’組裝時可先將熱管4〇置於導熱座1〇的凹槽 b内’再將堆疊塊2〇與導熱座1〇抵接，重複同樣動作即可 將熱管40依序擺入所有的第一穿孔c、第二穿孔（1以及第 二穿孔e内，再利用固定元件5〇將導熱座1〇、堆疊塊2〇以 及蓋板30鎖固即可將熱管6〇緊密壓抵住。 蓋板30頂面的凹坑32，係供銲料（圖未示）倒入，而 與凹坑32連通的第一通孔33、第二通孔24、第一穿孔c、 第二穿孔d以及第三穿孔e係組成一流道（詳見第三圖） 以供銲料流經，而熱管4〇穿設於第一穿孔c、第二穿孔d 以及第三穿孔e内時，其與此等穿孔之内壁將會形成一空 隙d，空隙d係可供銲料流經並填滿空隙d，使熱管4〇更 加緊密貼合於導熱座1〇、堆疊塊2〇以及蓋板3〇，提高導熱 效率，另外，該第一穿孔c、第二穿孔d以及第三穿孔e 0之方向係可呈不同方向，即第一穿孔c、第二穿孔4以及 第二穿孔e可設置成相互平行或相互垂直走向，亦即熱管 40在一層的走向可以與另一層的熱管4〇走向相互交叉垂直 (圖未詳示）。 3月再詳見第四圖’銲料從凹坑32向下流時，流至各個 第一穿孔c、第二穿孔d以及第三穿孔6時，銲料會向兩 側流，若是銲料倒入的的量太多時，其會流出第一穿孔 c、第二穿孔d以及第三穿孔e，並沿著堆疊塊2〇的外緣 向下流，當銲料流至導熱座1〇時，銲料擂牆12可防止銲料 8 201005250 ，因為導熱座ι〇底下可能貼設有電 π)’若銲料直接流至電子零件上，可能會 造成紐路而使其失去效用。 請參照第五圖’係為本發明第二實施例之示意圖，凹 係為可對應熱管4g之外型’本實施例中，熱管4〇 大熱&，而銲料擋踏12還開設有一凹陷槽⑵，凹 係、向導熱座10的側壁向内凹陷，以使過多的銲料 答置。 請參照第六圖，係為本發明第三實 發明組裝完成後，會具有三個平面，即底面以及兩:面本 而可=實際使用需求來決定是哪一面來貼接發熱源60。 凊參照第七圖，係為本發明第四實施例之示意圖，凹 槽b之壁面上還可再開設一容料槽宮，此種結構適用於細 長狀的固態銲料，使用時係先將鮮料穿設於容料槽运内， 再加熱使銲料呈熔融狀態，而銲料則會填滿空隙d ;另 Φ外，銲料擋牆12還開設有供多餘的銲料容置的一凹陷槽 121。 θ 請參照第八圖，係為本發明使用狀態示意圖，使用本 發明之導熱模組1時，係將導熱模組1貼接於發熱源60 上’再將複數熱管40之兩端分別穿設於導熱模組1以及散 熱歸片組70，如此’可將發熱源發出之熱量藉由導熱模 組1以及熱管40快速傳導至散熱鰭片組7〇處進行散熱。 因此本發明之堆疊式導熱模組具有下列之優點： 1.藉由導熱模組1係以壓抵的方式將熱管40固定，可 9 201005250 使熱管40被緊密壓抵於導熱模組1中，提高導熱效〃 2.藉由凹槽b係為開放槽，在加工上較為^率。々 省加工成本，可降低導熱模組1整體製造成本。且較節 3.藉由堆疊塊2〇可依實際使用需求增加或減少 導熱模組1的適用性以及實用性。 ，增加 4·導熱模組1内銲料澆道的設計使用容易，解決習知 導熱結構中熱管與導熱塊鮮接的不便之處，可提高製程的 效率。201005250 IX. Description of the Invention: [Technical Field] The present invention relates to a heat conducting module ‘in particular to a stacked heat conducting module. [Prior Art] A heat dissipating device generally includes a heat conducting block, a plurality of heat pipes, and a heat dissipating fin set. The heat conducting block attached to an electronic heating element is provided with a plurality of through holes for the heat pipes to pass through. The manufacture of heat pipes and the processing of through-holes must be quite rounded, and the through-holes on the heat-conducting blocks are usually closed circular to correspond to circular heat pipes. Generally, the party heat is used by milling. The through hole on the block is machined; however, if the through hole is opened in the heat conducting block by this method, the tolerance of the processing must be quite accurate, because the through hole must be left small when the heat pipe is inserted in the through hole. The gap allows the solder to flow into the through hole, so that the heat pipe is in close contact with the heat conducting block; if the size of the through hole is too small, the heat pipe cannot penetrate the heat conducting block, and must be repeatedly processed; if it is a through hole that is milled If the size is too large, the gap between the heat pipe and the heat conducting block is too large after the heat pipe is inserted into the heat conducting block. Even if the heat pipe is in close contact with the conductive block by the solder, the heat conduction between the heat conducting block and the heat pipe is reduced. The efficiency is such that heat is accumulated on the heat conducting block attached to the heat-generating electronic component, and even the overheating of the electronic component is caused. Therefore, how to overcome the shortcomings of the prior art described above is a problem that is currently to be solved. 5 201005250 SUMMARY OF THE INVENTION An object of the present invention is to provide a stacked heat conduction module in which a heat pipe is mounted in a first through hole and a second through hole by means of a heat conducting seat, a stacking block and a cover plate. It can achieve the convenience of assembly and save the cost of manufacturing. In order to achieve the above object, the present invention provides a stacked heat conducting module, comprising a heat conducting seat, a stacking block, a cover plate and a plurality of heat pipes, wherein the stacking block is correspondingly overlapped with the heat conducting seat, and the cover plate corresponds to And affixed to the stacking block, wherein at least one first through hole is formed at a joint of the heat conducting seat and the stacking block, and at least one first through hole is opened at a joint of the stacked block and the cover plate, and the heat pipes are respectively The first through hole and the second through hole are worn. The detailed description and technical contents of the present invention are set forth below with reference to the accompanying drawings. Please refer to the first figure, which is a perspective exploded view of the present invention. The present invention provides a stacked heat conduction module comprising a heat conducting seat, a stacking block 20, a cover plate 30 and a plurality of heat pipes 40, wherein: The base 10 has a rectangular shape, and the end surface of the heat conducting seat 1 is provided with a plurality of fixing holes 11'. The fixing hole 11 is located at the edge of the heat conducting seat 10, and the outer side of the heat conducting seat 1 is further formed with a plurality of solder retaining walls. 12, this embodiment _, Hui 6 201005250 The number of the material retaining wall 12 is two, but not limited thereto; in addition, the top surface of the heat conducting seat 1 还 is also formed with a plurality of grooves b arranged at intervals. The stacking block 20 is also formed in a rectangular shape and is stacked on the heat conducting seat 1〇. The stacking block 2 is provided with a plurality of receiving holes 23 corresponding to the fixing holes 11; in addition, the stacking block 2 is further provided with a plurality of second through holes 24; In addition, the 'stacking block 2' includes a first stacking plate 21 and a second stacking plate 22 laminated to the first stacking plate 21, and the joint between the first stacking plate 21 and the second stacking plate 22 is formed with a plurality of third portions. The perforation e; the contact faces of the first stacking plate 21 and the second stacking plate 22 are respectively provided with a plurality of mutually opposite grooves b, and the third perforations e are formed by combining the pair of mutually corresponding grooves b. The cover plate 30 also has a rectangular shape, and the cover plate 3 is correspondingly overlapped with the stacking block 2, and the cover plate 30 is provided with a plurality of openings 31 corresponding to the receiving holes 23, the opening 31, the receiving hole 23 and the fixing hole. The fixing member 50 is fixedly connected to fix the heat conducting seat, the stacking block 20 and the cover plate 30; the fixing member 50 can be a screw; and the bottom surface of the cover plate 30 is provided with a plurality of grooves b, A top surface of the cover plate 3 defines a recess 32. The bottom surface of the recess 32 defines a plurality of first through holes 33. The first through holes 33 are located in the recess b. A plurality of first through holes c are formed in the joint between the heat conducting base 10 and the stacking block 20, and a plurality of second through holes d are formed at the joint between the stacking block 20 and the cover plate 30. The contact faces of the heat conducting base 10 and the stacking block 20 are respectively opened to each other. Corresponding plurality of grooves b, the first perforations c are formed by the grooves b; the contact faces of the cover plate 3 and the stacking block 20 are respectively provided with at least one groove 相互 corresponding to each other, the second perforation The heat sinks 4 are respectively disposed through the first through holes c, the second through holes d, and the third through holes e. 7 201005250 Please refer to the figures in Figures 2 to 4 for the first section along the section line 2-2, the second section A and the second section along section line 4-4. The heat pipe 4〇 can be first placed in the groove b of the heat conducting seat 1〇, and then the stacking block 2〇 is abutted against the heat conducting seat 1〇, and the same action can be repeated to sequentially transfer the heat pipe 40 into all the first through holes c. The second through hole (1 and the second through hole e), and then the fixing member 5〇 is used to lock the heat conducting seat 1〇, the stacking block 2〇 and the cover plate 30 to press the heat pipe 6〇 tightly against the cover plate 30. The face recess 32 is a first through hole 33, a second through hole 24, a first through hole c, a second through hole d, and a third through hole e which are poured into the solder 32 (not shown), and communicate with the recess 32. The main channel (see the third figure) for the solder to flow through, and the heat pipe 4 is disposed in the first perforation c, the second perforation d and the third perforation e, and the inner wall of the perforation Forming a gap d, the gap d is for the solder to flow through and fill the gap d, so that the heat pipe 4〇 is more closely attached to the heat conducting seat 1〇, the stacking block 2〇, and the cover 3 In addition, the direction of the first through hole c, the second through hole d, and the third through hole e 0 may be different directions, that is, the first through hole c, the second through hole 4, and the second through hole e may be disposed to each other Parallel or perpendicular to each other, that is, the direction of the heat pipe 40 in one layer can be perpendicular to the other side of the heat pipe 4 ( (not shown in detail). See the fourth figure in March, when the solder flows down from the pit 32. When flowing to each of the first through holes c, the second through holes d and the third through holes 6, the solder flows to both sides, and if the amount of solder poured in too much, it flows out of the first through holes c, the second through holes d, and The third through hole e flows downward along the outer edge of the stacking block 2〇. When the solder flows to the heat conducting seat 1〇, the soldering wall 12 can prevent the solder 8 201005250 because the thermal conductive seat may be electrically π under the thermal conductive seat 〇 ) 'If the solder flows directly onto the electronic parts, it may cause the link to lose its effectiveness. Please refer to the fifth figure, which is a schematic view of a second embodiment of the present invention. The concave system is adapted to correspond to the heat pipe 4g. In the present embodiment, the heat pipe 4 is hot & The groove (2), the recessed, and the side walls of the guide hot seat 10 are recessed inwardly to allow excess solder to be placed. Referring to the sixth figure, after the assembly of the third invention of the present invention, there are three planes, that is, the bottom surface and the two surfaces: the actual use requirement to determine which side is to be attached to the heat source 60. Referring to the seventh figure, which is a schematic view of a fourth embodiment of the present invention, a container groove can be further formed on the wall surface of the groove b. The structure is suitable for a slender solid solder, and is used first. The material is placed in the container, and then heated to melt the solder, and the solder fills the gap d. In addition, the solder retaining wall 12 is further provided with a recess 121 for the excess solder to be received. θ Please refer to the eighth figure, which is a schematic diagram of the state of use of the present invention. When the heat conducting module 1 of the present invention is used, the heat conducting module 1 is attached to the heat generating source 60, and then the two ends of the plurality of heat pipes 40 are respectively disposed. In the heat-conducting module 1 and the heat-dissipating group 70, the heat generated by the heat source can be quickly conducted to the heat-dissipating fin group 7 by the heat-conducting module 1 and the heat pipe 40 for heat dissipation. Therefore, the stacked heat conduction module of the present invention has the following advantages: 1. The heat pipe 40 is fixed by pressing the heat conduction module 1 , and the heat pipe 40 is pressed tightly against the heat conduction module 1 by the 201005250 Improve the thermal conductivity 〃 2. By the groove b is an open groove, it is more suitable in processing.加工 Processing cost can reduce the overall manufacturing cost of the thermal module 1. And the section 3. By stacking blocks 2, the applicability and practicability of the heat conducting module 1 can be increased or decreased according to actual use requirements. 4) The design of the solder runner in the heat conduction module 1 is easy to use, and the inconvenience of the heat pipe and the heat conduction block in the conventional heat conduction structure can be solved, and the efficiency of the process can be improved.
综上所述，當知本發明之堆疊式導熱模組已具有產業 利用,、新寵與進步性，又本發明之構造亦未曾見於同 類產品及公開使用’完全符合發明專利申請要件，妥依專 利法提出申請。 【圖式簡單說明】 第圖係為本發明之立體分解示意圖。 瘳第=圖係為第一圖沿剖面線2-2之剖視圖。 第一圖係為第二圖Α部份之放大圖。 ^四圖係為第二圖沿剖面線4_4之剖視圖。 =圖係為本發明第二實施例之示意圖。 "圖係為本發明第三實施例之示意圖。 七圖係為本發明第四實施例之示意圖。 Y圖係為本發明使用狀態示意圖。 【主要元件符號說明】 201005250In summary, it is known that the stacked thermal module of the present invention has industrial utilization, new favor and progressiveness, and the structure of the present invention has not been seen in similar products and publicly used. The law makes an application. BRIEF DESCRIPTION OF THE DRAWINGS The drawings are schematic exploded views of the present invention.瘳第图图 is a cross-sectional view of the first figure along section line 2-2. The first figure is an enlarged view of the second figure. ^四图 is a cross-sectional view of the second figure along section line 4_4. = Figure is a schematic view of a second embodiment of the invention. "The diagram is a schematic diagram of a third embodiment of the invention. Seven figures are schematic views of a fourth embodiment of the present invention. The Y diagram is a schematic diagram of the state of use of the present invention. [Main component symbol description] 201005250
1 導熱模組 10 導熱座 11 固接孔 12 銲料擋牆 121 凹陷槽 20 堆疊塊 21 第一堆疊板 22 第二堆疊板 23 容置孔 24 第二通孔 30 蓋板 31 開孔 32 凹坑 33 第一通孔 40 熱管 50 固定元件 60 發熱源 70 散熱鰭片組 b 凹槽 c 第一穿孔 d 第二穿孔 e 第三穿孔 f 空隙 g 容料槽1 Heat conduction module 10 Thermal conduction seat 11 Fixing hole 12 Solder retaining wall 121 Depression groove 20 Stacking block 21 First stacking plate 22 Second stacking plate 23 accommodating hole 24 Second through hole 30 Cover plate 31 Opening hole 32 Pit 33 First through hole 40 heat pipe 50 fixing member 60 heat source 70 heat sink fin group b groove c first hole d second hole e third hole f gap g container groove