1309761 九、發明說明： 【發明所屬之技術領域】 模組本《歸及—種散熱她，尤指—翻於電子树等散熱之散熱 【先前技術】 執旦目m處理料電子元件紅常運行過程中都將產生大量之 c 出其產生之熱量’將會導致熱量累積引起溫度升 i 電子元件之正常運行。故，業界通常在電子元件上安 衣一散熱器進行輔助散熱。 物勒ϋ型之散熱裝置如中國大陸專利公告第〇3223425.2號所揭露， 3二3括—散熱器及與該散熱器接觸之熱f。其中，該散熱器 ㈣子元件如巾央處理之基座越直設置於基 紐糾。該熱管紐與餘1之基座接觸之蒸發段，及從 Ξ 觀伸㈣並錄^上遠絲狀部分賴之冷凝 = 時’令央處理器產生之熱量首先被基座吸收，再傳導至散熱 *㈣發到周圍環境中以達到冷卻中央處理器之目的。熱管具有 導性’故可將熱量從基座直接快速傳遞到散熱片上之較遠處 二:ί散發。^提高散錄置之散熱能力，通常將散熱器設計成較 -積具有較大之散熱面積以提升整體之性能。然，在實際應用中 文到空間等條件之限制，散熱ϋ之體積不能過大。例如，其他電子元 如電谷等<置在中央處理器附近’且該電容高於中央處理器時，電 ^易與散熱|§發生干涉。為避免此麟況…般通過減小散熱器體積 ^避免與其他元件發生干涉。然，減小散熱碰積將使散絲置之整 體散熱效果降低，滿足不了散熱需求。 【發明内容】 有雲，此，有必要提供一種具有較佳散熱性能之散熱模組。 二種散熱模組，包括一傳熱板、設於傳熱板上之散熱器以及至少 一熱官，該散熱器包括與傳熱板接觸之基座，該傳熱板與散熱器基座 相，觸之一側上設有至少一溝槽，該散熱器基座之底部具有一凹槽， 且凹槽與傳熱板上之溝槽對應組合成—通道以容納熱管，該熱管包 1309761 =傳ΐί 散熱段及遠轉熱㈣與散熱器接 中，管之第-傳熱段包括-具有圓形截面: 4二“埶5|其’二ί t熱官之第—傳熱段之圓弧段容納於傳熱板之 ϋ Ϊ座底部之凹槽形成之通勒，其扁平段伸出該通道之 ϋΓΪ器基座底部之凹槽内，該爲平段具有—扁平之底面與 政熱益基座之底部表面處於同一平面内。 相較于習知技術，該散熱模纽中之傳熱板可增加散熱器到電子元 之距離’可以避免餘器與其他元件發生干涉，使散熱器具有 相對較大之體積；_，將歸之第__段之—部分㈣，可以避 免熱管與其他元件發生干涉。 【實施方式】 本發明政熱模組用來辅助電子元件如巾央處理器等進行散敎。 麻f—同參閱第—圖至第五圖，本發明散熱模組之—實施例[括- 、设於傳熱板10(3上之—散熱器及同時與傳熱板_和散 熱态200接觸之兩個熱管3〇〇。 傳熱板100係由導熱性能良好之金屬材料如銅、銘等製成，其盘 設，電路板5〇〇上之電子元件如中央處理器4〇時接觸並吸收中央^ 理声400產生之熱$。傳熱板丨⑻之上部設有—對相互平行之溝槽⑽ 用以容置熱管300，並將吸收之熱量傳遞給熱管3〇〇。 與上述傳熱板1〇〇之頂部接觸之散熱器2〇〇包括一基座21〇、與該 基座210間隔平行設置之—頂板220，及設於基座2峨頂板220之間之 散熱片組230。 其中，基座210係由導熱性能良好之金屬材料如銅、鋁等製成， 且其面積要大於賴板_之®積。基座21G包括與傳熱板通接觸之 底部2104，及與散熱片組230底部23〇4接觸之頂部21〇2。在基座21〇之 底部2104具有-對平行之凹槽2106，該等凹槽21〇6分別與傳熱板腦 上之對應溝槽110組合成二通道用以容納熱管3〇〇。 頂板220之底側具有一對相互平行之凹槽2202。 政熱片組230直立設於基座210上，其相對之頂部摺邊2302、底部 摺邊2304分別與頂板220、基座210連接。在散熱片組23〇之頂部摺邊 2302設有一對平行之溝槽2306，且該溝槽23〇6與頂板21〇上之凹槽 1309761 2106對應組合成一對通孔以容置熱管30〇。 每一熱管300呈U型’其内設有毛細結構並盛裝有適量之工作介質 如水、乙醇等。每一熱管300包括相互間隔且大體平行設置之第一傳 熱#又310及苐一傳熱段320 ’以及將第一傳熱段31〇和第二傳熱段32〇連 接成一體之第三傳熱段330，且熱管300之第一傳熱段31〇及第二傳熱 段320分別容納於基座210、頂板220上之凹槽2106、2202内。其中， 熱管300之第一傳熱段310可以劃分成三個部分，即具有圓形截面之中 部圓弧段3104及設於該中部圓弧段31〇4兩端之二扁平段31〇2。每一扁 平段3102具有一扁平之底面及外凸之頂面，即每一扁平段3102具有半 圓形之截面，且扁平段3102之底面與基座21〇之底面處於同一平面 内。而每一熱管300之第一傳熱段31〇之中部圓弧段31〇4位於傳熱板 100與基座210所形成之通道内，即第一傳熱段之圓娘段31〇4夾設 於傳熱板100與散熱器200之間。故，傳熱板100所吸收之熱量，可同 時傳遞給散熱器200之基座210及熱管3〇〇之第一傳熱段31〇，再通過熱 官3〇0之弟一傳熱段32〇將熱量傳遞給散熱片組23〇之頂部摺邊23〇2及 頂板220 ’敢後散發到周圍環境中而達到冷卻中央處理器之目的。 此外，可調整熱管300之二第二傳熱段mo間之距離以便使熱量更加均 勻地分佈在散熱片組230之頂部摺邊2302。 如上所述’熱管300之第一傳熱段310與傳熱板1〇〇接觸並吸收傳 熱板100上之熱量，為熱管300之蒸發段；熱管3〇〇之第二傳熱段32〇將 第一傳熱段310吸收之熱量傳給與其接觸之頂板22〇及散熱片組23〇之 頂部，為熱管300之冷凝段。 明顯看出’傳熱板獅位於散熱器2〇〇下方，墊高了散熱器2〇〇， 從而可使散熱器2〇〇之基座21〇之底面與中央處理器4〇〇周圍之電容 600之上表面間保持一定距離以免發生干涉；而熱管3〇〇之第一傳熱段 310上位於傳熱板1GG外部之部分亦被打平形成扁平段3iQ2，故也可以 避免與一些元件發生干涉。故，本發明散熱模組中之散熱器2⑻之體 積可以相對較大，具有較大之散熱面積以提升整體之性能。 在上述貫施例中’熱管300之第一傳熱段31〇之扁平段31〇2可通過 壓圓形熱官獅#方法製成。我們知道，通過衝壓^法將熱管3〇〇之 第-傳，段310之端部打平時’熱管3〇〇内之毛細結構將會受到損壞而 P奢低熱官3GG之性能。如第六騎示，為降低補對熱管3湖毛細結 8 1309761 t二， °上之㈣21°6之_設置《過渡缺口 夺可在熱管細上之對應廣置形成複數過渡段 错= 2軸，從而可__職㈣納毛細結 構之損壞。 上述各相互連接之元件之間，如熱管與基座細之間、熱管· &頂板220之間以及熱管30績散熱片助〇之間可通過焊接等方法連 综上所述’本發明符合發明專利要件，爰依法提出專利申請。惟， =上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在 $依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利 範圍内。 【圖式簡單說明】 第一圖係本發明散熱模組一實施例之立體圖。 第二圖係沿第一圖中ΙΙ-ΙΙ線之剖面圖。 第三圖係第一圖之分解圖。 第四圖係第一圖令之散熱模組之底部朝上時之立體圖。 第五圖係第四圖之分解圖。 第六圖與第四圖相近，係第一圖中之散熱模組之底部朝上時之放大 圖。 【主要元件符號說明】 傳熱板 100 溝槽 110 散熱器 200 基座 210 頂部 2102 底部 2104 凹槽 2106、2202 過渡缺口 2108 頂板 220 散熱片組 230 頂部摺邊 2302 底部摺邊 2304 溝槽 2306 熱管 300 第一傳熱段 310 扁平段 3102 圓弧段 3104 適渡段 3106 1309761 第二傳熱段 中央處理器 320 第三傳熱段 330 400 電路板 500 101309761 IX. Description of the invention: [Technical field to which the invention belongs] The module "returns to - heats her, especially - heats up the heat dissipation of the electronic tree [previous technique] The electronic component of the processing material is always running. In the process, a large amount of heat will be generated, which will cause the heat to accumulate and cause the temperature to rise. Therefore, the industry usually installs a heat sink on the electronic components to assist in heat dissipation. The heat sink of the object type is disclosed in Chinese Patent Publication No. 3223425.2, and the heat sink and the heat f in contact with the heat sink are disclosed. Wherein, the heat sink (4) sub-element, such as the base of the towel processing, is disposed directly on the base correction. The heat pipe is in contact with the evaporation section of the base of the remaining 1 and the heat from the 丝 伸 四 四 四 上 上 上 上 = = = = 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令Cooling* (4) is sent to the surrounding environment to cool the central processor. The heat pipe is conductive' so that heat can be transferred from the susceptor directly to the far side of the heat sink. ^ Improve the heat dissipation capability of the scatterer. Usually, the heat sink is designed to have a larger heat dissipation area to improve the overall performance. However, in practical applications, the space is limited by the conditions, and the volume of heat dissipation cannot be too large. For example, when other electronic components such as electricity valleys and the like are placed near the central processing unit and the capacitance is higher than the central processing unit, the electric power interferes with the heat dissipation|§. In order to avoid this situation, by reducing the volume of the heat sink ^ avoid interference with other components. However, reducing the heat sinking will reduce the overall heat dissipation of the filaments and will not meet the heat dissipation requirements. SUMMARY OF THE INVENTION There is a cloud, and it is necessary to provide a heat dissipation module having better heat dissipation performance. The two heat dissipation modules include a heat transfer plate, a heat sink disposed on the heat transfer plate, and at least one heat official, the heat sink includes a base in contact with the heat transfer plate, the heat transfer plate and the heat sink base At least one groove is disposed on one side of the contact, the bottom of the heat sink base has a groove, and the groove is correspondingly combined with the groove on the heat transfer plate to form a channel for accommodating the heat pipe, the heat pipe package 1309761 = ΐ The heat dissipation section and the heat transfer (4) are connected to the heat sink. The first heat transfer section of the tube includes - has a circular cross section: 4 2 "埶5| Its '2' The arc segment is accommodated in the groove of the bottom of the heat transfer plate, and the flat portion extends out of the groove at the bottom of the base of the channel of the channel. The flat section has a flat bottom and a political heat. The bottom surface of the susceptor base is in the same plane. Compared with the prior art, the heat transfer plate in the heat dissipation mold can increase the distance from the heat sink to the electron element to avoid interference between the residual device and other components, so that the heat sink Has a relatively large volume; _, will be returned to the __ segment - part (four), can avoid heat pipe and The components of the present invention are used to assist the electronic components such as the towel processor to perform the divergence. The same as the first to fifth figures, the heat dissipation module of the present invention - The embodiment [includes - is provided on the heat transfer plate 10 (the heat sink and the two heat pipes 3 in contact with the heat transfer plate _ and the heat dissipation state 200 at the same time. The heat transfer plate 100 is made of a metal having good thermal conductivity) The material is made of copper, Ming, etc., and the electronic components on the circuit board 5 such as the central processing unit 4 contact and absorb the heat generated by the central control sound 400. The upper part of the heat transfer plate 8 (8) There are - pairs of parallel grooves (10) for accommodating the heat pipe 300, and transferring the absorbed heat to the heat pipe 3. The heat sink 2 接触 contacting the top of the heat transfer plate 1〇〇 includes a base 21 The top plate 220 is disposed in parallel with the base 210, and the heat sink group 230 is disposed between the top plate 220 of the base 2. The base 210 is made of a metal material having good thermal conductivity such as copper, aluminum, or the like. Made up, and its area is larger than the product of the board. The base 21G includes a contact with the heat transfer plate. a portion 2104, and a top portion 21〇2 in contact with the bottom portion 23〇4 of the fin group 230. The bottom portion 2104 of the base 21 has a pair of parallel grooves 2106, which are respectively associated with the heat transfer plate brain The upper corresponding grooves 110 are combined into two channels for accommodating the heat pipes 3. The bottom side of the top plate 220 has a pair of mutually parallel grooves 2202. The political heat sheet set 230 is erected on the base 210, opposite to the top. The flange 2302 and the bottom flange 2304 are respectively connected to the top plate 220 and the base 210. The top flange 2302 of the heat sink group 23 is provided with a pair of parallel grooves 2306, and the groove 23〇6 and the top plate 21 are placed on the top plate 21 The grooves 1309761 2106 are correspondingly combined into a pair of through holes to accommodate the heat pipes 30A. Each of the heat pipes 300 is U-shaped and has a capillary structure therein and contains an appropriate amount of working medium such as water, ethanol or the like. Each heat pipe 300 includes a first heat transfer #430 and a heat transfer portion 320' which are spaced apart from each other and are substantially parallel, and a third unit which connects the first heat transfer portion 31A and the second heat transfer portion 32A The heat transfer section 330, and the first heat transfer section 31 and the second heat transfer section 320 of the heat pipe 300 are respectively accommodated in the recesses 2106, 2202 of the base 210 and the top plate 220. The first heat transfer section 310 of the heat pipe 300 can be divided into three parts, that is, a circular arc section 3104 having a circular cross section and two flat sections 31〇2 disposed at both ends of the middle arc section 31〇4. Each flat section 3102 has a flat bottom surface and a convex top surface, i.e., each flat section 3102 has a semi-circular cross section, and the bottom surface of the flat section 3102 is in the same plane as the bottom surface of the base 21〇. The first arc portion 31〇4 of the first heat transfer section 31 of each heat pipe 300 is located in the channel formed by the heat transfer plate 100 and the base 210, that is, the first heat transfer section of the round mother section 31〇4 clip It is disposed between the heat transfer plate 100 and the heat sink 200. Therefore, the heat absorbed by the heat transfer plate 100 can be simultaneously transmitted to the base 210 of the heat sink 200 and the first heat transfer section 31 of the heat pipe 3, and then passed through the heat transfer section 32 of the heat officer 3〇0. 〇 Transfer heat to the top flange 23〇2 and the top plate 220 of the heat sink group 23's to dissipate into the surrounding environment to cool the central processor. In addition, the distance between the second heat transfer sections mo of the heat pipe 300 can be adjusted to distribute the heat more evenly over the top flange 2302 of the heat sink set 230. As described above, the first heat transfer section 310 of the heat pipe 300 contacts the heat transfer plate 1 and absorbs heat on the heat transfer plate 100, which is the evaporation section of the heat pipe 300; the second heat transfer section 32 of the heat pipe 3〇〇 The heat absorbed by the first heat transfer section 310 is transferred to the top of the top plate 22 and the heat sink group 23, which are in contact with it, and is the condensation section of the heat pipe 300. It is obvious that the 'heat transfer plate lion is located under the radiator 2 ,, and the heat sink 2 垫 is raised, so that the bottom surface of the base plate 21 of the heat sink 2 与 and the capacitance around the central processor 4 〇〇 The surface above 600 is kept at a certain distance to avoid interference; and the portion of the first heat transfer section 310 of the heat pipe 3 located outside the heat transfer plate 1GG is also flattened to form the flat section 3iQ2, so that it can be avoided from occurring with some components. put one's oar in. Therefore, the heat sink 2 (8) in the heat dissipation module of the present invention can have a relatively large volume and a large heat dissipation area to improve the overall performance. In the above embodiment, the flat section 31〇2 of the first heat transfer section 31 of the heat pipe 300 can be formed by the method of pressing the circular heat lion #. We know that by the stamping method, the heat pipe 3 is transferred to the first pass, and the end of the segment 310 is flattened. The capillary structure in the heat pipe 3〇〇 will be damaged and the performance of the P luxury low heat official 3GG. For example, the sixth riding shows that in order to reduce the heat pipe 3, the lake hair is fine, the thickness of the lake is 8 1309761 t, and the temperature of the (4) 21 ° 6 is set. The transition gap can be formed on the heat pipe to form a complex transition. Therefore, the damage of the capillary structure can be __ (4). Between the above-mentioned interconnected components, such as between the heat pipe and the pedestal, between the heat pipe and the top plate 220, and between the heat pipe 30 and the heat sink, the invention can be combined by welding or the like. Invent the patent requirements, and file a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a perspective view of an embodiment of a heat dissipation module of the present invention. The second figure is a cross-sectional view along the ΙΙ-ΙΙ line in the first figure. The third figure is an exploded view of the first figure. The fourth figure is a perspective view of the first embodiment of the heat dissipation module with the bottom facing upward. The fifth figure is an exploded view of the fourth figure. The sixth figure is similar to the fourth figure, which is an enlarged view of the bottom of the heat dissipation module in the first figure. [Main component symbol description] Heat transfer plate 100 Groove 110 Heat sink 200 Base 210 Top 2102 Bottom 2104 Groove 2106, 2202 Transition notch 2108 Top plate 220 Heat sink set 230 Top flange 2302 Bottom flange 2304 Groove 2306 Heat pipe 300 First heat transfer section 310 flat section 3102 arc section 3104 transition section 3106 1309761 second heat transfer section central processor 320 third heat transfer section 330 400 circuit board 500 10