USD1026838S1 - Heat dissipation module - Google Patents
Heat dissipation module Download PDFInfo
- Publication number
- USD1026838S1 USD1026838S1 US29/836,398 US202229836398F USD1026838S US D1026838 S1 USD1026838 S1 US D1026838S1 US 202229836398 F US202229836398 F US 202229836398F US D1026838 S USD1026838 S US D1026838S
- Authority
- US
- United States
- Prior art keywords
- heat dissipation
- dissipation module
- view
- module
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 5
- 150000002500 ions Chemical class 0.000 description 1
Images
Description
The broken lines in the drawings illustrate pod ions of the heat dissipation module that form no part of the claimed design.
Claims (1)
- The ornamental design for a heat dissipation module, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/836,398 USD1026838S1 (en) | 2022-04-26 | 2022-04-26 | Heat dissipation module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/836,398 USD1026838S1 (en) | 2022-04-26 | 2022-04-26 | Heat dissipation module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1026838S1 true USD1026838S1 (en) | 2024-05-14 |
Family
ID=90972285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/836,398 Active USD1026838S1 (en) | 2022-04-26 | 2022-04-26 | Heat dissipation module |
Country Status (1)
Country | Link |
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US (1) | USD1026838S1 (en) |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD567771S1 (en) * | 2006-12-23 | 2008-04-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
USD722574S1 (en) * | 2013-11-26 | 2015-02-17 | Heatscape, Inc. | Power heat sink with hybrid vapor chamber—heat pipe module |
US20160219756A1 (en) * | 2015-01-28 | 2016-07-28 | Cooler Master Co., Ltd. | Heat sink structure with heat exchange mechanism |
US20170307299A1 (en) * | 2016-04-26 | 2017-10-26 | Tsung-Hsien Huang | Combination heat sink and heat pipe assembly |
US20190128617A1 (en) * | 2017-10-31 | 2019-05-02 | Heatscape.Com, Inc. | Method of forming a combined vapor chamber and heat pipe assembly |
US20190170446A1 (en) * | 2017-12-06 | 2019-06-06 | Forcecon Technology Co., Ltd. | Multi-tube parallel heat spreader |
US20200393201A1 (en) * | 2019-04-17 | 2020-12-17 | Furukawa Electric Co., Ltd. | Heatsink |
US20210018272A1 (en) * | 2018-12-28 | 2021-01-21 | Furukawa Electric Co., Ltd. | Heat sink |
USD954005S1 (en) * | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
USD971862S1 (en) * | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
CN218244170U (en) * | 2022-04-25 | 2023-01-06 | 惠州惠立勤电子科技有限公司 | Heat radiation module |
US20230213288A1 (en) * | 2022-01-06 | 2023-07-06 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Three-dimensional heat transfer device |
US20230337398A1 (en) * | 2022-04-15 | 2023-10-19 | Taiwan Microloops Corp. | Heat dissipation module |
CN116952033A (en) * | 2022-04-15 | 2023-10-27 | 惠州惠立勤电子科技有限公司 | Heat dissipation module and manufacturing method thereof |
US20230354552A1 (en) * | 2022-04-28 | 2023-11-02 | Taiwan Microloops Corp. | Assembly structure of vapor chamber and heat pipe |
US20230349644A1 (en) * | 2022-04-28 | 2023-11-02 | Taiwan Microloops Corp. | Combination structure of vapor chamber and heat pipe |
CN116997131A (en) * | 2022-04-25 | 2023-11-03 | 惠州惠立勤电子科技有限公司 | Heat radiation module |
US20230358482A1 (en) * | 2020-11-24 | 2023-11-09 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Three-dimensional heat exchanger |
-
2022
- 2022-04-26 US US29/836,398 patent/USD1026838S1/en active Active
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD567771S1 (en) * | 2006-12-23 | 2008-04-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
USD722574S1 (en) * | 2013-11-26 | 2015-02-17 | Heatscape, Inc. | Power heat sink with hybrid vapor chamber—heat pipe module |
US20160219756A1 (en) * | 2015-01-28 | 2016-07-28 | Cooler Master Co., Ltd. | Heat sink structure with heat exchange mechanism |
US20170307299A1 (en) * | 2016-04-26 | 2017-10-26 | Tsung-Hsien Huang | Combination heat sink and heat pipe assembly |
US20190128617A1 (en) * | 2017-10-31 | 2019-05-02 | Heatscape.Com, Inc. | Method of forming a combined vapor chamber and heat pipe assembly |
US20190170446A1 (en) * | 2017-12-06 | 2019-06-06 | Forcecon Technology Co., Ltd. | Multi-tube parallel heat spreader |
US20210018272A1 (en) * | 2018-12-28 | 2021-01-21 | Furukawa Electric Co., Ltd. | Heat sink |
USD971862S1 (en) * | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
US20200393201A1 (en) * | 2019-04-17 | 2020-12-17 | Furukawa Electric Co., Ltd. | Heatsink |
USD954005S1 (en) * | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
US20230358482A1 (en) * | 2020-11-24 | 2023-11-09 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Three-dimensional heat exchanger |
US20230213288A1 (en) * | 2022-01-06 | 2023-07-06 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Three-dimensional heat transfer device |
US20230337398A1 (en) * | 2022-04-15 | 2023-10-19 | Taiwan Microloops Corp. | Heat dissipation module |
CN116952033A (en) * | 2022-04-15 | 2023-10-27 | 惠州惠立勤电子科技有限公司 | Heat dissipation module and manufacturing method thereof |
CN218244170U (en) * | 2022-04-25 | 2023-01-06 | 惠州惠立勤电子科技有限公司 | Heat radiation module |
CN116997131A (en) * | 2022-04-25 | 2023-11-03 | 惠州惠立勤电子科技有限公司 | Heat radiation module |
US20230354552A1 (en) * | 2022-04-28 | 2023-11-02 | Taiwan Microloops Corp. | Assembly structure of vapor chamber and heat pipe |
US20230349644A1 (en) * | 2022-04-28 | 2023-11-02 | Taiwan Microloops Corp. | Combination structure of vapor chamber and heat pipe |
Non-Patent Citations (1)
Title |
---|
Intechopen, "Heat Pipe and Phase Change Heat Transfer Technologies for Electronics Cooling", Fig. 16, Published Jun. 15, 2016. (https://www.intechopen.com/chapters/50699) (Year: 2016). * |
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