USD1026838S1 - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
USD1026838S1
USD1026838S1 US29/836,398 US202229836398F USD1026838S US D1026838 S1 USD1026838 S1 US D1026838S1 US 202229836398 F US202229836398 F US 202229836398F US D1026838 S USD1026838 S US D1026838S
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United States
Prior art keywords
heat dissipation
dissipation module
view
module
ornamental design
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US29/836,398
Inventor
Chun-Hung Lin
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Taiwan Microloops Corp
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Taiwan Microloops Corp
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Priority to US29/836,398 priority Critical patent/USD1026838S1/en
Assigned to TAIWAN MICROLOOPS CORP. reassignment TAIWAN MICROLOOPS CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, CHUN-HUNG
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FIG. 1 is a perspective view of a heat dissipation module showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a reference view showing the heat dissipation module.
The broken lines in the drawings illustrate pod ions of the heat dissipation module that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heat dissipation module, as shown and described.
US29/836,398 2022-04-26 2022-04-26 Heat dissipation module Active USD1026838S1 (en)

Priority Applications (1)

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US29/836,398 USD1026838S1 (en) 2022-04-26 2022-04-26 Heat dissipation module

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US29/836,398 USD1026838S1 (en) 2022-04-26 2022-04-26 Heat dissipation module

Publications (1)

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USD1026838S1 true USD1026838S1 (en) 2024-05-14

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US29/836,398 Active USD1026838S1 (en) 2022-04-26 2022-04-26 Heat dissipation module

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Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD567771S1 (en) * 2006-12-23 2008-04-29 Foxconn Technology Co., Ltd. Heat dissipation device
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
USD722574S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. Power heat sink with hybrid vapor chamber—heat pipe module
US20160219756A1 (en) * 2015-01-28 2016-07-28 Cooler Master Co., Ltd. Heat sink structure with heat exchange mechanism
US20170307299A1 (en) * 2016-04-26 2017-10-26 Tsung-Hsien Huang Combination heat sink and heat pipe assembly
US20190128617A1 (en) * 2017-10-31 2019-05-02 Heatscape.Com, Inc. Method of forming a combined vapor chamber and heat pipe assembly
US20190170446A1 (en) * 2017-12-06 2019-06-06 Forcecon Technology Co., Ltd. Multi-tube parallel heat spreader
US20200393201A1 (en) * 2019-04-17 2020-12-17 Furukawa Electric Co., Ltd. Heatsink
US20210018272A1 (en) * 2018-12-28 2021-01-21 Furukawa Electric Co., Ltd. Heat sink
USD954005S1 (en) * 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
CN218244170U (en) * 2022-04-25 2023-01-06 惠州惠立勤电子科技有限公司 Heat radiation module
US20230213288A1 (en) * 2022-01-06 2023-07-06 Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. Three-dimensional heat transfer device
US20230337398A1 (en) * 2022-04-15 2023-10-19 Taiwan Microloops Corp. Heat dissipation module
CN116952033A (en) * 2022-04-15 2023-10-27 惠州惠立勤电子科技有限公司 Heat dissipation module and manufacturing method thereof
US20230354552A1 (en) * 2022-04-28 2023-11-02 Taiwan Microloops Corp. Assembly structure of vapor chamber and heat pipe
US20230349644A1 (en) * 2022-04-28 2023-11-02 Taiwan Microloops Corp. Combination structure of vapor chamber and heat pipe
CN116997131A (en) * 2022-04-25 2023-11-03 惠州惠立勤电子科技有限公司 Heat radiation module
US20230358482A1 (en) * 2020-11-24 2023-11-09 Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. Three-dimensional heat exchanger

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD567771S1 (en) * 2006-12-23 2008-04-29 Foxconn Technology Co., Ltd. Heat dissipation device
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
USD722574S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. Power heat sink with hybrid vapor chamber—heat pipe module
US20160219756A1 (en) * 2015-01-28 2016-07-28 Cooler Master Co., Ltd. Heat sink structure with heat exchange mechanism
US20170307299A1 (en) * 2016-04-26 2017-10-26 Tsung-Hsien Huang Combination heat sink and heat pipe assembly
US20190128617A1 (en) * 2017-10-31 2019-05-02 Heatscape.Com, Inc. Method of forming a combined vapor chamber and heat pipe assembly
US20190170446A1 (en) * 2017-12-06 2019-06-06 Forcecon Technology Co., Ltd. Multi-tube parallel heat spreader
US20210018272A1 (en) * 2018-12-28 2021-01-21 Furukawa Electric Co., Ltd. Heat sink
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
US20200393201A1 (en) * 2019-04-17 2020-12-17 Furukawa Electric Co., Ltd. Heatsink
USD954005S1 (en) * 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
US20230358482A1 (en) * 2020-11-24 2023-11-09 Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. Three-dimensional heat exchanger
US20230213288A1 (en) * 2022-01-06 2023-07-06 Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. Three-dimensional heat transfer device
US20230337398A1 (en) * 2022-04-15 2023-10-19 Taiwan Microloops Corp. Heat dissipation module
CN116952033A (en) * 2022-04-15 2023-10-27 惠州惠立勤电子科技有限公司 Heat dissipation module and manufacturing method thereof
CN218244170U (en) * 2022-04-25 2023-01-06 惠州惠立勤电子科技有限公司 Heat radiation module
CN116997131A (en) * 2022-04-25 2023-11-03 惠州惠立勤电子科技有限公司 Heat radiation module
US20230354552A1 (en) * 2022-04-28 2023-11-02 Taiwan Microloops Corp. Assembly structure of vapor chamber and heat pipe
US20230349644A1 (en) * 2022-04-28 2023-11-02 Taiwan Microloops Corp. Combination structure of vapor chamber and heat pipe

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Intechopen, "Heat Pipe and Phase Change Heat Transfer Technologies for Electronics Cooling", Fig. 16, Published Jun. 15, 2016. (https://www.intechopen.com/chapters/50699) (Year: 2016). *

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