USD950507S1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
USD950507S1
USD950507S1 US29/732,857 US202029732857F USD950507S US D950507 S1 USD950507 S1 US D950507S1 US 202029732857 F US202029732857 F US 202029732857F US D950507 S USD950507 S US D950507S
Authority
US
United States
Prior art keywords
heat sink
view
perspective
ornamental design
showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/732,857
Inventor
Yen-Chih Chen
Chi-Yuan Hsiao
Hsih-Ting You
Yu-Hsiang Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AIC Inc
Original Assignee
AIC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AIC Inc filed Critical AIC Inc
Priority to US29/732,857 priority Critical patent/USD950507S1/en
Assigned to AIC INC. reassignment AIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, YEN-CHIH, HSIAO, CHI-YUAN, LIN, YU-HSIANG, YOU, HSIH-TING
Application granted granted Critical
Publication of USD950507S1 publication Critical patent/USD950507S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a heat sink showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is second perspective view thereof;
FIG. 9 is third perspective view thereof; and,
FIG. 10 is a perspective view showing the heat sink in use.
The broken lines in the drawings illustrate portions of the heat sink that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink, as shown and described.
US29/732,857 2020-04-28 2020-04-28 Heat sink Active USD950507S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/732,857 USD950507S1 (en) 2020-04-28 2020-04-28 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/732,857 USD950507S1 (en) 2020-04-28 2020-04-28 Heat sink

Publications (1)

Publication Number Publication Date
USD950507S1 true USD950507S1 (en) 2022-05-03

Family

ID=81329132

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/732,857 Active USD950507S1 (en) 2020-04-28 2020-04-28 Heat sink

Country Status (1)

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US (1) USD950507S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230171917A1 (en) * 2021-11-30 2023-06-01 Delta Electronics, Inc. Heat dissipation assembly
USD1024985S1 (en) * 2019-01-17 2024-04-30 Telefonaktiebolaget Lm Ericsson (Publ) Heat sink

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6921328B1 (en) * 1998-05-26 2005-07-26 Kabushiki Kaisha Yaskawa Denki Cooling device for electric equipment
USD510325S1 (en) * 2003-10-15 2005-10-04 Asustek Computer Inc. Thermal module
USD510324S1 (en) * 2003-10-15 2005-10-04 Asustek Computer Inc. Thermal module
US20070091566A1 (en) * 2005-10-24 2007-04-26 Hon Hai Precision Industry Co., Ltd. Fan duct and heat dissipation module comprising the same
US20070151706A1 (en) * 2006-01-05 2007-07-05 International Business Machines Corporation Heat sink for dissipating a thermal load
US20070254584A1 (en) * 2005-10-14 2007-11-01 Cooler Master Co., Ltd. Heat-dissipation structure
US7359192B2 (en) * 2005-04-01 2008-04-15 Foxconn Technology Co., Ltd. Cooling device for heat-generating electronic component
US20080101018A1 (en) * 2006-10-27 2008-05-01 Foxconn Technology Co., Ltd. Heat dissipation device
USD604705S1 (en) * 2008-09-15 2009-11-24 Foxconn Technology Co., Ltd. Heat dissipation device
US7729119B2 (en) * 2007-11-28 2010-06-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
USD634278S1 (en) * 2009-10-15 2011-03-15 Sapa Ab Heat sink
US8081458B2 (en) * 2009-12-10 2011-12-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus for electronic device
US8300405B2 (en) * 2010-05-28 2012-10-30 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Airflow duct
US8305752B2 (en) * 2010-07-27 2012-11-06 Hon Hai Precision Industry Co., Ltd. Air duct and electronic device incorporating the same
US8335082B2 (en) * 2010-09-21 2012-12-18 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating apparatus
US20170083058A1 (en) * 2015-09-23 2017-03-23 Chris Janak Modular thermal solution for high-performance processors
US10281220B1 (en) * 2016-08-19 2019-05-07 ZT Group Int'l, Inc. Heat sink with vapor chamber
US11096312B1 (en) * 2020-06-04 2021-08-17 Aic Inc. Heat dissipation apparatus with fan

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6921328B1 (en) * 1998-05-26 2005-07-26 Kabushiki Kaisha Yaskawa Denki Cooling device for electric equipment
USD510325S1 (en) * 2003-10-15 2005-10-04 Asustek Computer Inc. Thermal module
USD510324S1 (en) * 2003-10-15 2005-10-04 Asustek Computer Inc. Thermal module
US7359192B2 (en) * 2005-04-01 2008-04-15 Foxconn Technology Co., Ltd. Cooling device for heat-generating electronic component
US20070254584A1 (en) * 2005-10-14 2007-11-01 Cooler Master Co., Ltd. Heat-dissipation structure
US20070091566A1 (en) * 2005-10-24 2007-04-26 Hon Hai Precision Industry Co., Ltd. Fan duct and heat dissipation module comprising the same
US20070151706A1 (en) * 2006-01-05 2007-07-05 International Business Machines Corporation Heat sink for dissipating a thermal load
US20080101018A1 (en) * 2006-10-27 2008-05-01 Foxconn Technology Co., Ltd. Heat dissipation device
US7729119B2 (en) * 2007-11-28 2010-06-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
USD604705S1 (en) * 2008-09-15 2009-11-24 Foxconn Technology Co., Ltd. Heat dissipation device
USD634278S1 (en) * 2009-10-15 2011-03-15 Sapa Ab Heat sink
US8081458B2 (en) * 2009-12-10 2011-12-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus for electronic device
US8300405B2 (en) * 2010-05-28 2012-10-30 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Airflow duct
US8305752B2 (en) * 2010-07-27 2012-11-06 Hon Hai Precision Industry Co., Ltd. Air duct and electronic device incorporating the same
US8335082B2 (en) * 2010-09-21 2012-12-18 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipating apparatus
US20170083058A1 (en) * 2015-09-23 2017-03-23 Chris Janak Modular thermal solution for high-performance processors
US10281220B1 (en) * 2016-08-19 2019-05-07 ZT Group Int'l, Inc. Heat sink with vapor chamber
US11096312B1 (en) * 2020-06-04 2021-08-17 Aic Inc. Heat dissipation apparatus with fan

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1024985S1 (en) * 2019-01-17 2024-04-30 Telefonaktiebolaget Lm Ericsson (Publ) Heat sink
US20230171917A1 (en) * 2021-11-30 2023-06-01 Delta Electronics, Inc. Heat dissipation assembly

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