USD722574S1 - Power heat sink with hybrid vapor chamber—heat pipe module - Google Patents

Power heat sink with hybrid vapor chamber—heat pipe module Download PDF

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Publication number
USD722574S1
USD722574S1 US29/473,927 US201329473927F USD722574S US D722574 S1 USD722574 S1 US D722574S1 US 201329473927 F US201329473927 F US 201329473927F US D722574 S USD722574 S US D722574S
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United States
Prior art keywords
vapor chamber
pipe module
heat sink
heat pipe
hybrid vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/473,927
Inventor
Ali Mira
Yashar Mira
Michael Mira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heatscape Inc
Original Assignee
Heatscape Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heatscape Inc filed Critical Heatscape Inc
Priority to US29/473,927 priority Critical patent/USD722574S1/en
Assigned to HEATSCAPE, INC. reassignment HEATSCAPE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIRA, ALI, MIRA, MICHAEL, MIRA, YASHAR
Application granted granted Critical
Publication of USD722574S1 publication Critical patent/USD722574S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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FIG. 1 is a top perspective view of a power heat sink with hybrid vapor chamber—heat pipe module showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is an additional perspective view thereof; and,
FIG. 8 is a disassembled view corresponding to FIG. 7.
The broken line showing on the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power heat sink with hybrid vapor chamber—heat pipe module, as shown and described.
US29/473,927 2013-11-26 2013-11-26 Power heat sink with hybrid vapor chamber—heat pipe module Active USD722574S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/473,927 USD722574S1 (en) 2013-11-26 2013-11-26 Power heat sink with hybrid vapor chamber—heat pipe module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/473,927 USD722574S1 (en) 2013-11-26 2013-11-26 Power heat sink with hybrid vapor chamber—heat pipe module

Publications (1)

Publication Number Publication Date
USD722574S1 true USD722574S1 (en) 2015-02-17

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD802543S1 (en) * 2010-11-03 2017-11-14 Enermax Technology Corporation Cooling fin
USD805043S1 (en) * 2016-02-22 2017-12-12 Heatscape.Com, Inc. Heatsink for optical modules
USD814627S1 (en) * 2016-04-25 2018-04-03 Neograf Solutions, Llc Heat spreader
USD814625S1 (en) * 2016-04-25 2018-04-03 Neograf Solutions, Llc Heat spreader
USD814626S1 (en) * 2016-04-25 2018-04-03 Neograf Solutions, Llc Heat spreader
US9980410B1 (en) 2017-03-31 2018-05-22 International Business Machines Corporation Heat pipe and vapor chamber heat dissipation
USD822625S1 (en) * 2016-04-26 2018-07-10 Showa Denko K.K. Fin for heat exchanger
USD827588S1 (en) * 2016-12-27 2018-09-04 Sony Corporation Chip connector
USD1026838S1 (en) * 2022-04-26 2024-05-14 Taiwan Microloops Corp. Heat dissipation module

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD802543S1 (en) * 2010-11-03 2017-11-14 Enermax Technology Corporation Cooling fin
USD805043S1 (en) * 2016-02-22 2017-12-12 Heatscape.Com, Inc. Heatsink for optical modules
USD814627S1 (en) * 2016-04-25 2018-04-03 Neograf Solutions, Llc Heat spreader
USD814625S1 (en) * 2016-04-25 2018-04-03 Neograf Solutions, Llc Heat spreader
USD814626S1 (en) * 2016-04-25 2018-04-03 Neograf Solutions, Llc Heat spreader
USD822625S1 (en) * 2016-04-26 2018-07-10 Showa Denko K.K. Fin for heat exchanger
USD827588S1 (en) * 2016-12-27 2018-09-04 Sony Corporation Chip connector
US9980410B1 (en) 2017-03-31 2018-05-22 International Business Machines Corporation Heat pipe and vapor chamber heat dissipation
US10045464B1 (en) 2017-03-31 2018-08-07 International Business Machines Corporation Heat pipe and vapor chamber heat dissipation
US10575440B2 (en) 2017-03-31 2020-02-25 International Business Machines Corporation Heat pipe and vapor chamber heat dissipation
US10966351B2 (en) 2017-03-31 2021-03-30 Elpis Technologies Inc. Heat pipe and vapor chamber heat dissipation
USD1026838S1 (en) * 2022-04-26 2024-05-14 Taiwan Microloops Corp. Heat dissipation module

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