USD722574S1 - Power heat sink with hybrid vapor chamber—heat pipe module - Google Patents
Power heat sink with hybrid vapor chamber—heat pipe module Download PDFInfo
- Publication number
- USD722574S1 USD722574S1 US29/473,927 US201329473927F USD722574S US D722574 S1 USD722574 S1 US D722574S1 US 201329473927 F US201329473927 F US 201329473927F US D722574 S USD722574 S US D722574S
- Authority
- US
- United States
- Prior art keywords
- vapor chamber
- pipe module
- heat sink
- heat pipe
- hybrid vapor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken line showing on the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.
Claims (1)
- The ornamental design for a power heat sink with hybrid vapor chamber—heat pipe module, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/473,927 USD722574S1 (en) | 2013-11-26 | 2013-11-26 | Power heat sink with hybrid vapor chamber—heat pipe module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/473,927 USD722574S1 (en) | 2013-11-26 | 2013-11-26 | Power heat sink with hybrid vapor chamber—heat pipe module |
Publications (1)
Publication Number | Publication Date |
---|---|
USD722574S1 true USD722574S1 (en) | 2015-02-17 |
Family
ID=52463904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/473,927 Active USD722574S1 (en) | 2013-11-26 | 2013-11-26 | Power heat sink with hybrid vapor chamber—heat pipe module |
Country Status (1)
Country | Link |
---|---|
US (1) | USD722574S1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD802543S1 (en) * | 2010-11-03 | 2017-11-14 | Enermax Technology Corporation | Cooling fin |
USD805043S1 (en) * | 2016-02-22 | 2017-12-12 | Heatscape.Com, Inc. | Heatsink for optical modules |
USD814627S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
USD814625S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
USD814626S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
US9980410B1 (en) | 2017-03-31 | 2018-05-22 | International Business Machines Corporation | Heat pipe and vapor chamber heat dissipation |
USD822625S1 (en) * | 2016-04-26 | 2018-07-10 | Showa Denko K.K. | Fin for heat exchanger |
USD827588S1 (en) * | 2016-12-27 | 2018-09-04 | Sony Corporation | Chip connector |
USD1026838S1 (en) * | 2022-04-26 | 2024-05-14 | Taiwan Microloops Corp. | Heat dissipation module |
-
2013
- 2013-11-26 US US29/473,927 patent/USD722574S1/en active Active
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD802543S1 (en) * | 2010-11-03 | 2017-11-14 | Enermax Technology Corporation | Cooling fin |
USD805043S1 (en) * | 2016-02-22 | 2017-12-12 | Heatscape.Com, Inc. | Heatsink for optical modules |
USD814627S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
USD814625S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
USD814626S1 (en) * | 2016-04-25 | 2018-04-03 | Neograf Solutions, Llc | Heat spreader |
USD822625S1 (en) * | 2016-04-26 | 2018-07-10 | Showa Denko K.K. | Fin for heat exchanger |
USD827588S1 (en) * | 2016-12-27 | 2018-09-04 | Sony Corporation | Chip connector |
US9980410B1 (en) | 2017-03-31 | 2018-05-22 | International Business Machines Corporation | Heat pipe and vapor chamber heat dissipation |
US10045464B1 (en) | 2017-03-31 | 2018-08-07 | International Business Machines Corporation | Heat pipe and vapor chamber heat dissipation |
US10575440B2 (en) | 2017-03-31 | 2020-02-25 | International Business Machines Corporation | Heat pipe and vapor chamber heat dissipation |
US10966351B2 (en) | 2017-03-31 | 2021-03-30 | Elpis Technologies Inc. | Heat pipe and vapor chamber heat dissipation |
USD1026838S1 (en) * | 2022-04-26 | 2024-05-14 | Taiwan Microloops Corp. | Heat dissipation module |
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