USD971862S1 - Heatsink - Google Patents
Heatsink Download PDFInfo
- Publication number
- USD971862S1 USD971862S1 US29/696,679 US201929696679F USD971862S US D971862 S1 USD971862 S1 US D971862S1 US 201929696679 F US201929696679 F US 201929696679F US D971862 S USD971862 S US D971862S
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- US
- United States
- Prior art keywords
- heatsink
- shows
- view
- design
- broken lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The even broken lines illustrate environment and form no part of the claimed design. The dot-dash broken lines represent boundary lines and form no part of the claimed design.
Claims (1)
- We claim the ornamental design for a heatsink, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-28918 | 2018-12-28 | ||
JPD2018-28918F JP1643634S (en) | 2018-12-28 | 2018-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD971862S1 true USD971862S1 (en) | 2022-12-06 |
Family
ID=68234413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/696,679 Active USD971862S1 (en) | 2018-12-28 | 2019-06-28 | Heatsink |
Country Status (3)
Country | Link |
---|---|
US (1) | USD971862S1 (en) |
JP (1) | JP1643634S (en) |
TW (1) | TWD211372S (en) |
Citations (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6634800B2 (en) | 2000-04-27 | 2003-10-21 | Furukawa Electric Co., Ltd. | Ferrule for optical connector |
USD541232S1 (en) | 2005-12-19 | 2007-04-24 | Zalman Tech Co., Ltd. | Radiator for electronic parts |
USD561710S1 (en) | 2007-01-03 | 2008-02-12 | Thermaltake Technology Co., Ltd. | Heat sink |
USD561711S1 (en) * | 2006-12-08 | 2008-02-12 | Thermaltake Technology Co., Ltd. | Heat sink |
USD582359S1 (en) * | 2008-01-07 | 2008-12-09 | Cooler Master Co., Ltd. | Heat dissipator |
USD587217S1 (en) * | 2007-12-30 | 2009-02-24 | Zalman Tech Co., Ltd. | Radiator for a graphics card chipset |
US20100002380A1 (en) | 2008-07-03 | 2010-01-07 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat sink apparatus |
US20100206521A1 (en) | 2009-02-17 | 2010-08-19 | Aacotek Company Limited | Heat dissipating fin and heat sink |
US20100270007A1 (en) * | 2009-04-23 | 2010-10-28 | Wen-Te Lin | Heat sink |
US20110192026A1 (en) * | 2010-02-11 | 2011-08-11 | Shyh-Ming Chen | Press fitting method for heat pipe and heat sink |
USD660256S1 (en) * | 2011-02-25 | 2012-05-22 | Zalman Tech Co., Ltd. | Radiator for an electronic device |
US20120145356A1 (en) * | 2010-12-10 | 2012-06-14 | Palo Alto Research Center Incorporated | Hybrid Pin-Fin Micro Heat Pipe Heat Sink and Method of Fabrication |
US20130044433A1 (en) * | 2010-05-24 | 2013-02-21 | Icepipe Corporation | Heat-dissipating device for electronic apparatus |
USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
US20150043869A1 (en) | 2013-08-08 | 2015-02-12 | Hon Hai Precision Industry Co., Ltd. | Optical fiber connector having detachable first body and second body |
USD722573S1 (en) * | 2013-11-26 | 2015-02-17 | Heatscape, Inc. | U-shaped condenser heat sink for low profile modules |
USD742337S1 (en) * | 2013-08-06 | 2015-11-03 | Fujitsu Limited | Radiator for electronic device |
JP1537917S (en) | 2014-12-19 | 2015-11-16 | ||
US20160298909A1 (en) * | 2015-04-13 | 2016-10-13 | Tai-Sol Electronics Co., Ltd. | Heat Dissipation Structure with Heat Pipes Arranged in Two Spaced and Partially Overlapped Layers |
US20160313067A1 (en) * | 2015-04-27 | 2016-10-27 | Cooler Master Co., Ltd. | Heat dissipating device and heat dissipating fin |
USD795821S1 (en) | 2016-02-22 | 2017-08-29 | Heatscape.Com, Inc. | Liquid cooling cold plate with diamond cut pin fins |
US20170307299A1 (en) * | 2016-04-26 | 2017-10-26 | Tsung-Hsien Huang | Combination heat sink and heat pipe assembly |
USD803169S1 (en) | 2016-02-22 | 2017-11-21 | Heatscape.Com, Inc. | Combined liquid cooling cold plate and vapor chamber |
USD805042S1 (en) * | 2015-10-27 | 2017-12-12 | Tsung-Hsien Huang | Combined heat exchanger base and embedded heat pipes |
US20180128552A1 (en) * | 2015-07-14 | 2018-05-10 | Furukawa Electric Co., Ltd. | Cooling device |
US20180284356A1 (en) | 2015-10-12 | 2018-10-04 | 3M Innovative Properties Company | Optical waveguide positioning feature in a multiple waveguides connector |
USD833988S1 (en) * | 2016-07-22 | 2018-11-20 | Tsung-Hsien Huang | Heat sink |
US20190170446A1 (en) * | 2017-12-06 | 2019-06-06 | Forcecon Technology Co., Ltd. | Multi-tube parallel heat spreader |
US20190269035A1 (en) * | 2018-02-27 | 2019-08-29 | Ciena Corporation | Asymmetric heat pipe coupled to a heat sink |
US20200326131A1 (en) * | 2017-12-28 | 2020-10-15 | Furukawa Electric Co., Ltd. | Heat sink |
US20200355443A1 (en) * | 2018-01-31 | 2020-11-12 | Furukawa Electric Co., Ltd. | Heat sink |
USD905647S1 (en) * | 2018-07-20 | 2020-12-22 | Heatscape.Com, Inc. | Combination heat pipe and heat sink |
US20210018272A1 (en) * | 2018-12-28 | 2021-01-21 | Furukawa Electric Co., Ltd. | Heat sink |
US20210208385A1 (en) * | 2019-06-03 | 2021-07-08 | Karl Storz Se & Co. Kg | Device for heat dissipation from an endoscopic illumination apparatus |
US20210318072A1 (en) * | 2015-07-14 | 2021-10-14 | Furukawa Electric Co., Ltd. | Cooling device with superimposed fin groups |
-
2018
- 2018-12-28 JP JPD2018-28918F patent/JP1643634S/ja active Active
-
2019
- 2019-06-27 TW TW108303814F patent/TWD211372S/en unknown
- 2019-06-28 US US29/696,679 patent/USD971862S1/en active Active
Patent Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6634800B2 (en) | 2000-04-27 | 2003-10-21 | Furukawa Electric Co., Ltd. | Ferrule for optical connector |
USD541232S1 (en) | 2005-12-19 | 2007-04-24 | Zalman Tech Co., Ltd. | Radiator for electronic parts |
USD561711S1 (en) * | 2006-12-08 | 2008-02-12 | Thermaltake Technology Co., Ltd. | Heat sink |
USD561710S1 (en) | 2007-01-03 | 2008-02-12 | Thermaltake Technology Co., Ltd. | Heat sink |
USD587217S1 (en) * | 2007-12-30 | 2009-02-24 | Zalman Tech Co., Ltd. | Radiator for a graphics card chipset |
USD582359S1 (en) * | 2008-01-07 | 2008-12-09 | Cooler Master Co., Ltd. | Heat dissipator |
US20100002380A1 (en) | 2008-07-03 | 2010-01-07 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat sink apparatus |
US20100206521A1 (en) | 2009-02-17 | 2010-08-19 | Aacotek Company Limited | Heat dissipating fin and heat sink |
US20100270007A1 (en) * | 2009-04-23 | 2010-10-28 | Wen-Te Lin | Heat sink |
US20110192026A1 (en) * | 2010-02-11 | 2011-08-11 | Shyh-Ming Chen | Press fitting method for heat pipe and heat sink |
US20130044433A1 (en) * | 2010-05-24 | 2013-02-21 | Icepipe Corporation | Heat-dissipating device for electronic apparatus |
US20120145356A1 (en) * | 2010-12-10 | 2012-06-14 | Palo Alto Research Center Incorporated | Hybrid Pin-Fin Micro Heat Pipe Heat Sink and Method of Fabrication |
USD660256S1 (en) * | 2011-02-25 | 2012-05-22 | Zalman Tech Co., Ltd. | Radiator for an electronic device |
USD742337S1 (en) * | 2013-08-06 | 2015-11-03 | Fujitsu Limited | Radiator for electronic device |
US20150043869A1 (en) | 2013-08-08 | 2015-02-12 | Hon Hai Precision Industry Co., Ltd. | Optical fiber connector having detachable first body and second body |
USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
USD722573S1 (en) * | 2013-11-26 | 2015-02-17 | Heatscape, Inc. | U-shaped condenser heat sink for low profile modules |
JP1537917S (en) | 2014-12-19 | 2015-11-16 | ||
US20160298909A1 (en) * | 2015-04-13 | 2016-10-13 | Tai-Sol Electronics Co., Ltd. | Heat Dissipation Structure with Heat Pipes Arranged in Two Spaced and Partially Overlapped Layers |
US20160313067A1 (en) * | 2015-04-27 | 2016-10-27 | Cooler Master Co., Ltd. | Heat dissipating device and heat dissipating fin |
US20200191494A1 (en) * | 2015-07-14 | 2020-06-18 | Furukawa Electric Co., Ltd. | Cooling device with superimposed fin groups |
US20180128552A1 (en) * | 2015-07-14 | 2018-05-10 | Furukawa Electric Co., Ltd. | Cooling device |
US11150028B2 (en) * | 2015-07-14 | 2021-10-19 | Furukawa Electric Co., Ltd. | Cooling device with superimposed fin groups and parallel heatpipes |
US20210318072A1 (en) * | 2015-07-14 | 2021-10-14 | Furukawa Electric Co., Ltd. | Cooling device with superimposed fin groups |
US20180284356A1 (en) | 2015-10-12 | 2018-10-04 | 3M Innovative Properties Company | Optical waveguide positioning feature in a multiple waveguides connector |
USD805042S1 (en) * | 2015-10-27 | 2017-12-12 | Tsung-Hsien Huang | Combined heat exchanger base and embedded heat pipes |
USD795821S1 (en) | 2016-02-22 | 2017-08-29 | Heatscape.Com, Inc. | Liquid cooling cold plate with diamond cut pin fins |
USD803169S1 (en) | 2016-02-22 | 2017-11-21 | Heatscape.Com, Inc. | Combined liquid cooling cold plate and vapor chamber |
USD829673S1 (en) | 2016-02-22 | 2018-10-02 | Heatscape.Com, Inc. | Combined liquid cooling cold plate and vapor chamber |
US20170307299A1 (en) * | 2016-04-26 | 2017-10-26 | Tsung-Hsien Huang | Combination heat sink and heat pipe assembly |
USD833988S1 (en) * | 2016-07-22 | 2018-11-20 | Tsung-Hsien Huang | Heat sink |
US20190170446A1 (en) * | 2017-12-06 | 2019-06-06 | Forcecon Technology Co., Ltd. | Multi-tube parallel heat spreader |
US20200326131A1 (en) * | 2017-12-28 | 2020-10-15 | Furukawa Electric Co., Ltd. | Heat sink |
US20200355443A1 (en) * | 2018-01-31 | 2020-11-12 | Furukawa Electric Co., Ltd. | Heat sink |
US20190269035A1 (en) * | 2018-02-27 | 2019-08-29 | Ciena Corporation | Asymmetric heat pipe coupled to a heat sink |
USD905647S1 (en) * | 2018-07-20 | 2020-12-22 | Heatscape.Com, Inc. | Combination heat pipe and heat sink |
US20210018272A1 (en) * | 2018-12-28 | 2021-01-21 | Furukawa Electric Co., Ltd. | Heat sink |
US20210208385A1 (en) * | 2019-06-03 | 2021-07-08 | Karl Storz Se & Co. Kg | Device for heat dissipation from an endoscopic illumination apparatus |
Non-Patent Citations (6)
Title |
---|
ETeknix, "Cooler Master TPC 800 Vapour Chamber CPU Cooler Review", Published "9 Years ago", at latest Nov. 8, 2012 as indicated by comment replies. (https://www.eteknix.com/cooler-master-tpc-800-vapour-chamber-cpu-cooler-review/all/1/) (Year: 2012). * |
ETeknix, "Noctua NH-D9L Dual-Tower CPU Cooler Review", Published "6 Years ago", at latest Jan. 20, 2016 as indicated by comment replies. (https://www.eteknix.com/noctua-nh-d9l-dual-tower-cpu-cooler-review/2/) (Year: 2016). * |
Noctua, "Industrial Applications", Cached from web.archive.og on Nov. 19, 2017. (https://noctua.at/en/industrial-applications)(https://web.archive.org/web/20171119165910/https://noctua.at/en/industrial-applications) (Year: 2017). * |
U.S. Appl. No. 29/727,570 titled "Heat Sink" filed Mar. 11, 2020. |
U.S. Appl. No. 29/727,572 titled "Heat Sink" filed Mar. 11, 2020. |
U.S. Appl. No. 29/727,573 titled "Heat Sink" filed Mar. 11, 2020. |
Also Published As
Publication number | Publication date |
---|---|
TWD211372S (en) | 2021-05-11 |
JP1643634S (en) | 2020-10-12 |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |