USD971862S1 - Heatsink - Google Patents

Heatsink Download PDF

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Publication number
USD971862S1
USD971862S1 US29/696,679 US201929696679F USD971862S US D971862 S1 USD971862 S1 US D971862S1 US 201929696679 F US201929696679 F US 201929696679F US D971862 S USD971862 S US D971862S
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United States
Prior art keywords
heatsink
shows
view
design
broken lines
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US29/696,679
Inventor
Yoshikatsu INAGAKI
Shuta HIKICHI
Hiroshi Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Assigned to FURUKAWA ELECTRIC CO., LTD. reassignment FURUKAWA ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIROSHI, SAKAI, SHUTA, HIKICHI, YOSHIKATSU, INAGAKI
Assigned to FURUKAWA ELECTRIC CO., LTD. reassignment FURUKAWA ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIKICHI, SHUTA, INAGAKI, Yoshikatsu, SAKAI, HIROSHI
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FIG. 1 shows a top isometric view of a heatsink in accordance with the present design.
FIG. 2 shows a bottom isometric view of the heatsink in FIG. 1 .
FIG. 3 shows a top view of the heatsink in FIG. 1 .
FIG. 4 shows a bottom view of the heatsink in FIG. 1 .
FIG. 5 shows a right side view of the heatsink in FIG. 1 .
FIG. 6 shows a left side view of the heatsink in FIG. 1 .
FIG. 7 shows a front view of the heatsink in FIG. 1 ; and,
FIG. 8 shows a rear view of the heatsink in FIG. 1 .
The even broken lines illustrate environment and form no part of the claimed design. The dot-dash broken lines represent boundary lines and form no part of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a heatsink, as shown and described.
US29/696,679 2018-12-28 2019-06-28 Heatsink Active USD971862S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-28918 2018-12-28
JPD2018-28918F JP1643634S (en) 2018-12-28 2018-12-28

Publications (1)

Publication Number Publication Date
USD971862S1 true USD971862S1 (en) 2022-12-06

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US29/696,679 Active USD971862S1 (en) 2018-12-28 2019-06-28 Heatsink

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US (1) USD971862S1 (en)
JP (1) JP1643634S (en)
TW (1) TWD211372S (en)

Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6634800B2 (en) 2000-04-27 2003-10-21 Furukawa Electric Co., Ltd. Ferrule for optical connector
USD541232S1 (en) 2005-12-19 2007-04-24 Zalman Tech Co., Ltd. Radiator for electronic parts
USD561710S1 (en) 2007-01-03 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD582359S1 (en) * 2008-01-07 2008-12-09 Cooler Master Co., Ltd. Heat dissipator
USD587217S1 (en) * 2007-12-30 2009-02-24 Zalman Tech Co., Ltd. Radiator for a graphics card chipset
US20100002380A1 (en) 2008-07-03 2010-01-07 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink apparatus
US20100206521A1 (en) 2009-02-17 2010-08-19 Aacotek Company Limited Heat dissipating fin and heat sink
US20100270007A1 (en) * 2009-04-23 2010-10-28 Wen-Te Lin Heat sink
US20110192026A1 (en) * 2010-02-11 2011-08-11 Shyh-Ming Chen Press fitting method for heat pipe and heat sink
USD660256S1 (en) * 2011-02-25 2012-05-22 Zalman Tech Co., Ltd. Radiator for an electronic device
US20120145356A1 (en) * 2010-12-10 2012-06-14 Palo Alto Research Center Incorporated Hybrid Pin-Fin Micro Heat Pipe Heat Sink and Method of Fabrication
US20130044433A1 (en) * 2010-05-24 2013-02-21 Icepipe Corporation Heat-dissipating device for electronic apparatus
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
US20150043869A1 (en) 2013-08-08 2015-02-12 Hon Hai Precision Industry Co., Ltd. Optical fiber connector having detachable first body and second body
USD722573S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. U-shaped condenser heat sink for low profile modules
USD742337S1 (en) * 2013-08-06 2015-11-03 Fujitsu Limited Radiator for electronic device
JP1537917S (en) 2014-12-19 2015-11-16
US20160298909A1 (en) * 2015-04-13 2016-10-13 Tai-Sol Electronics Co., Ltd. Heat Dissipation Structure with Heat Pipes Arranged in Two Spaced and Partially Overlapped Layers
US20160313067A1 (en) * 2015-04-27 2016-10-27 Cooler Master Co., Ltd. Heat dissipating device and heat dissipating fin
USD795821S1 (en) 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
US20170307299A1 (en) * 2016-04-26 2017-10-26 Tsung-Hsien Huang Combination heat sink and heat pipe assembly
USD803169S1 (en) 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
US20180128552A1 (en) * 2015-07-14 2018-05-10 Furukawa Electric Co., Ltd. Cooling device
US20180284356A1 (en) 2015-10-12 2018-10-04 3M Innovative Properties Company Optical waveguide positioning feature in a multiple waveguides connector
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
US20190170446A1 (en) * 2017-12-06 2019-06-06 Forcecon Technology Co., Ltd. Multi-tube parallel heat spreader
US20190269035A1 (en) * 2018-02-27 2019-08-29 Ciena Corporation Asymmetric heat pipe coupled to a heat sink
US20200326131A1 (en) * 2017-12-28 2020-10-15 Furukawa Electric Co., Ltd. Heat sink
US20200355443A1 (en) * 2018-01-31 2020-11-12 Furukawa Electric Co., Ltd. Heat sink
USD905647S1 (en) * 2018-07-20 2020-12-22 Heatscape.Com, Inc. Combination heat pipe and heat sink
US20210018272A1 (en) * 2018-12-28 2021-01-21 Furukawa Electric Co., Ltd. Heat sink
US20210208385A1 (en) * 2019-06-03 2021-07-08 Karl Storz Se & Co. Kg Device for heat dissipation from an endoscopic illumination apparatus
US20210318072A1 (en) * 2015-07-14 2021-10-14 Furukawa Electric Co., Ltd. Cooling device with superimposed fin groups

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6634800B2 (en) 2000-04-27 2003-10-21 Furukawa Electric Co., Ltd. Ferrule for optical connector
USD541232S1 (en) 2005-12-19 2007-04-24 Zalman Tech Co., Ltd. Radiator for electronic parts
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD561710S1 (en) 2007-01-03 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD587217S1 (en) * 2007-12-30 2009-02-24 Zalman Tech Co., Ltd. Radiator for a graphics card chipset
USD582359S1 (en) * 2008-01-07 2008-12-09 Cooler Master Co., Ltd. Heat dissipator
US20100002380A1 (en) 2008-07-03 2010-01-07 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink apparatus
US20100206521A1 (en) 2009-02-17 2010-08-19 Aacotek Company Limited Heat dissipating fin and heat sink
US20100270007A1 (en) * 2009-04-23 2010-10-28 Wen-Te Lin Heat sink
US20110192026A1 (en) * 2010-02-11 2011-08-11 Shyh-Ming Chen Press fitting method for heat pipe and heat sink
US20130044433A1 (en) * 2010-05-24 2013-02-21 Icepipe Corporation Heat-dissipating device for electronic apparatus
US20120145356A1 (en) * 2010-12-10 2012-06-14 Palo Alto Research Center Incorporated Hybrid Pin-Fin Micro Heat Pipe Heat Sink and Method of Fabrication
USD660256S1 (en) * 2011-02-25 2012-05-22 Zalman Tech Co., Ltd. Radiator for an electronic device
USD742337S1 (en) * 2013-08-06 2015-11-03 Fujitsu Limited Radiator for electronic device
US20150043869A1 (en) 2013-08-08 2015-02-12 Hon Hai Precision Industry Co., Ltd. Optical fiber connector having detachable first body and second body
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
USD722573S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. U-shaped condenser heat sink for low profile modules
JP1537917S (en) 2014-12-19 2015-11-16
US20160298909A1 (en) * 2015-04-13 2016-10-13 Tai-Sol Electronics Co., Ltd. Heat Dissipation Structure with Heat Pipes Arranged in Two Spaced and Partially Overlapped Layers
US20160313067A1 (en) * 2015-04-27 2016-10-27 Cooler Master Co., Ltd. Heat dissipating device and heat dissipating fin
US20200191494A1 (en) * 2015-07-14 2020-06-18 Furukawa Electric Co., Ltd. Cooling device with superimposed fin groups
US20180128552A1 (en) * 2015-07-14 2018-05-10 Furukawa Electric Co., Ltd. Cooling device
US11150028B2 (en) * 2015-07-14 2021-10-19 Furukawa Electric Co., Ltd. Cooling device with superimposed fin groups and parallel heatpipes
US20210318072A1 (en) * 2015-07-14 2021-10-14 Furukawa Electric Co., Ltd. Cooling device with superimposed fin groups
US20180284356A1 (en) 2015-10-12 2018-10-04 3M Innovative Properties Company Optical waveguide positioning feature in a multiple waveguides connector
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
USD795821S1 (en) 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD803169S1 (en) 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD829673S1 (en) 2016-02-22 2018-10-02 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
US20170307299A1 (en) * 2016-04-26 2017-10-26 Tsung-Hsien Huang Combination heat sink and heat pipe assembly
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
US20190170446A1 (en) * 2017-12-06 2019-06-06 Forcecon Technology Co., Ltd. Multi-tube parallel heat spreader
US20200326131A1 (en) * 2017-12-28 2020-10-15 Furukawa Electric Co., Ltd. Heat sink
US20200355443A1 (en) * 2018-01-31 2020-11-12 Furukawa Electric Co., Ltd. Heat sink
US20190269035A1 (en) * 2018-02-27 2019-08-29 Ciena Corporation Asymmetric heat pipe coupled to a heat sink
USD905647S1 (en) * 2018-07-20 2020-12-22 Heatscape.Com, Inc. Combination heat pipe and heat sink
US20210018272A1 (en) * 2018-12-28 2021-01-21 Furukawa Electric Co., Ltd. Heat sink
US20210208385A1 (en) * 2019-06-03 2021-07-08 Karl Storz Se & Co. Kg Device for heat dissipation from an endoscopic illumination apparatus

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
ETeknix, "Cooler Master TPC 800 Vapour Chamber CPU Cooler Review", Published "9 Years ago", at latest Nov. 8, 2012 as indicated by comment replies. (https://www.eteknix.com/cooler-master-tpc-800-vapour-chamber-cpu-cooler-review/all/1/) (Year: 2012). *
ETeknix, "Noctua NH-D9L Dual-Tower CPU Cooler Review", Published "6 Years ago", at latest Jan. 20, 2016 as indicated by comment replies. (https://www.eteknix.com/noctua-nh-d9l-dual-tower-cpu-cooler-review/2/) (Year: 2016). *
Noctua, "Industrial Applications", Cached from web.archive.og on Nov. 19, 2017. (https://noctua.at/en/industrial-applications)(https://web.archive.org/web/20171119165910/https://noctua.at/en/industrial-applications) (Year: 2017). *
U.S. Appl. No. 29/727,570 titled "Heat Sink" filed Mar. 11, 2020.
U.S. Appl. No. 29/727,572 titled "Heat Sink" filed Mar. 11, 2020.
U.S. Appl. No. 29/727,573 titled "Heat Sink" filed Mar. 11, 2020.

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TWD211372S (en) 2021-05-11
JP1643634S (en) 2020-10-12

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