USD561711S1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
USD561711S1
USD561711S1 US29/275,687 US27568707F USD561711S US D561711 S1 USD561711 S1 US D561711S1 US 27568707 F US27568707 F US 27568707F US D561711 S USD561711 S US D561711S
Authority
US
United States
Prior art keywords
heat sink
ornamental design
sink
heat
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/275,687
Inventor
Pei-Hsi Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermaltake Technology Co Ltd
Original Assignee
Thermaltake Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermaltake Technology Co Ltd filed Critical Thermaltake Technology Co Ltd
Assigned to THERMALTAKE TECHNOLOGY CO., LTD. reassignment THERMALTAKE TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, PEI-HSI
Application granted granted Critical
Publication of USD561711S1 publication Critical patent/USD561711S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of a heat sink;
FIG. 2 is a front elevation thereof;
FIG. 3 is a rear elevation thereof;
FIG. 4 is a left side elevation thereof;
FIG. 5 is a right side elevation thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

  1. The ornamental design for a heat sink, as shown and described.
US29/275,687 2006-12-08 2007-01-04 Heat sink Expired - Lifetime USD561711S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95306823 2006-12-08

Publications (1)

Publication Number Publication Date
USD561711S1 true USD561711S1 (en) 2008-02-12

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ID=39031844

Family Applications (1)

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US29/275,687 Expired - Lifetime USD561711S1 (en) 2006-12-08 2007-01-04 Heat sink

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US (1) USD561711S1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080202729A1 (en) * 2007-02-27 2008-08-28 Fujikura Ltd. Heat sink
US20080251239A1 (en) * 2007-04-10 2008-10-16 Fujikura Ltd. Heat sink
US20080310105A1 (en) * 2007-06-14 2008-12-18 Chia-Chun Cheng Heat dissipating apparatus and water cooling system having the same
US20090323284A1 (en) * 2008-06-25 2009-12-31 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having a fan received therein
US20100051231A1 (en) * 2008-08-26 2010-03-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having a heat pipe inserted therein
US20100155023A1 (en) * 2008-12-22 2010-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having heat pipes inserted therein
US20100230074A1 (en) * 2009-03-13 2010-09-16 Hong Fu Jin Precision Industry (Shenzhen) Co. Ltd. Heat dissipation apparatus
US20110083830A1 (en) * 2009-10-12 2011-04-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
US9867315B2 (en) 2012-06-29 2018-01-09 Asetek Danmark A/S Server memory cooling apparatus
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
USD954005S1 (en) * 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080202729A1 (en) * 2007-02-27 2008-08-28 Fujikura Ltd. Heat sink
US7942194B2 (en) 2007-04-10 2011-05-17 Fujikura Ltd. Heat sink
US20080251239A1 (en) * 2007-04-10 2008-10-16 Fujikura Ltd. Heat sink
US20080310105A1 (en) * 2007-06-14 2008-12-18 Chia-Chun Cheng Heat dissipating apparatus and water cooling system having the same
US7796387B2 (en) * 2008-05-25 2010-09-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having a fan received therein
US20090323284A1 (en) * 2008-06-25 2009-12-31 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having a fan received therein
US20100051231A1 (en) * 2008-08-26 2010-03-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having a heat pipe inserted therein
US20100155023A1 (en) * 2008-12-22 2010-06-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus having heat pipes inserted therein
US20100230074A1 (en) * 2009-03-13 2010-09-16 Hong Fu Jin Precision Industry (Shenzhen) Co. Ltd. Heat dissipation apparatus
US8430153B2 (en) * 2009-10-12 2013-04-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having heat sink enclosing conductive member therein
US20110083830A1 (en) * 2009-10-12 2011-04-14 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US9867315B2 (en) 2012-06-29 2018-01-09 Asetek Danmark A/S Server memory cooling apparatus
USD795821S1 (en) * 2016-02-22 2017-08-29 Heatscape.Com, Inc. Liquid cooling cold plate with diamond cut pin fins
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD829673S1 (en) * 2016-02-22 2018-10-02 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
USD800674S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Cooling plate row for in-line memory
USD800675S1 (en) * 2016-05-24 2017-10-24 Asetek Danmark A/S Set of cooling plate rows for in-line memory
US10021811B2 (en) 2016-05-24 2018-07-10 Asetek Danmark A/S Single ended cooling module rows and assemblies for thermal management of in-line memory modules
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
USD954005S1 (en) * 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
US11924996B2 (en) 2020-09-30 2024-03-05 Coolit Systems, Inc. Liquid-cooling devices, and systems, to cool multi-chip modules

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