US20080202729A1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- US20080202729A1 US20080202729A1 US11/840,969 US84096907A US2008202729A1 US 20080202729 A1 US20080202729 A1 US 20080202729A1 US 84096907 A US84096907 A US 84096907A US 2008202729 A1 US2008202729 A1 US 2008202729A1
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- US
- United States
- Prior art keywords
- heat
- fins
- receiving base
- heat sink
- heat receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
To improve a heat exchange efficiency of a heat sink without enlarging the heat sink. The heat sink of the invention comprises a heat receiving base receiving heat from an exothermic element, a plurality of fins radiating heat arranged radially around the heat receiving base at predetermined intervals, and one or more heat pipe(s) comprising a curved portion. One of end portions of the curved portion is individually connected to a predetermined portion of the heat receiving base, and a predetermined region of the curved portion is contacted with the fins in a heat transferable manner.
Description
- This application claims priority from Provisional Application Ser. No. 60/891,889, filed Feb. 27, 2007, pending, incorporated herein by reference.
- 1. Field of the Invention
- The present invention deals with a heat sink for cooling an exothermic element using a heat pipe for transporting heat in the form of latent heat of a condensable working fluid encapsulated therein.
- 2. Discussion of the Related Art
- A heat pipe is a generally known heat transfer device for transporting heat in the form of latent heat of a condensable working fluid. A non-condensable gas such as an air is evacuated from a container of the heat pipe, and a condensable fluid such as water or hydrocarbon is encapsulated therein. The container is sealed air-tightly. Therefore, if a part of the heat pipe is heated from outside when another part of the heat pipe is being cooled, the working fluid is vaporized by the heat, and the vapor flows toward a cooled part where a temperature and a pressure are low. The vapor releases the latent heat outside of the container and then liquefies. The resultant liquid phase working fluid flows toward a heated portion where the heat is transmitted from outside.
- As explained above, the vaporized working fluid is transmitted to a heat radiating side by a pressure difference in the container arising from the heating and radiation. Meanwhile, a pressure for refluxing the working fluid to the heated portion is required. For this purpose, common heat pipes are adapted to create a capillary pumping. Specifically, thin slits, porous materials or meshes functioning as a wick are arranged in the container. When the working fluid infiltrating in the wick is evaporated, a meniscus of the working fluid infilling pores in the wick comes down. Consequently, a capillary pumping arises from a surface tension. The condensed working fluid infiltrating into the wick is aspirated to be flown back to the heated portion side where evaporation takes place, by the capillary pumping thus created at the heated portion.
- The heat pipe of this kind is capable of cooling the exothermic element by a vapor flow and a reflux of the working fluid in the container. Therefore, in these days, the heat pipes are utilized in e.g., artificial satellites and spacecrafts, and widely used for cooling exothermic electron devices such as a central processing unit of an electronic device.
- As an example of a conventional heat sink using a heat pipe for cooling an electron devices such as a central processing unit, Japanese Patent Laid-Open No. 2004-111966 (corresponding to U.S. Pat. No. 6,894,900) discloses a heat sink comprising a heat pipe erected vertically on a heat-absorbing base with a bend, and a plurality of horizontal fins arranged at a regular intervals along the vertically erected part of the heat pipe.
- As an another example of a conventional heat sink, there has been developed a heat sink comprising a plurality of vertical fins erected on an upper face of a heat-absorbing base at regular intervals, and a plurality of heat pipes extending from a side wall of the base to communicate with the vertical fins.
- However, in case of elongating the erected part of the heat pipe lengthwise for the purpose of enhancing heat exchange (or radiating) efficiency of the conventional heat sink disclosed in U.S. Pat. No. 6,894,900, a quantity of the fins has to be increased. Consequently, the size of the heat sink of this kind has to be larger.
- On the other hand, according to another example of the conventional heat sink, a plurality of heat pipes penetrates the vertical fins, and the heat pipes are contacted with the vertical fins. Therefore, thermal exchanges (i.e., heat radiation) between the individual heat pipes and the individual vertical fins take place simultaneously. In this case, if the vertical fins are arranged close together, temperatures of the air existing between the vertical fins are raised. As a result, thermal resistance of the vertical fins is increased and this degrades thermal exchange efficiency. Especially, the thermal exchange efficiency is degraded significantly in the direction to radiate the heat laterally from the heat pipes. For this reason, the vertical fins have to be enlarged to enhance the thermal exchange efficiency. That is, the heat sink of this kind also has to be larger as the case of the conventional heat sink of U.S. Pat. No. 6,894,900.
- The present invention has been conceived in view of the aforementioned technical problems, and it is an object of the present invention to improve thermal exchange efficiency, i.e., heat radiation of a heat sink without enlarging the size of the heat sink itself.
- In order to achieve the aforementioned objective, a heat sink of the present invention comprises a heat receiving base for receiving heat from an exothermic element, a plurality of fins for radiating heat arranged radially around the heat receiving base at predetermined intervals in a circumferential direction, and one or more heat pipe(s) comprising a curved portion. One of end portions of the curved portion is individually connected to a predetermined portion of the heat receiving base, and a predetermined region of the curved portion is contacted with the fins in a heat transferable manner.
- The curved portion of the heat pipe is bent into arcuate and situated inward of an outermost portion of the fins.
- According to another aspect of the invention, a heat sink comprises a heat receiving base for receiving heat from an exothermic element, a plurality of fins for radiating heat arranged to enclose the heat receiving base at predetermined interval in a radial direction of the heat receiving base, and a plurality of heat pipes. One of end portions of the heat pipe is individually connected to a predetermined portion of the heat receiving base, and those heat pipes are arranged to extend radially in different directions and to be contacted sequentially with the fins in a heat transferable manner.
- The fins enclosing the heat receiving base are divided evenly according to the number of the heat pipes extending radially, and a predetermined clearance exists between abutting sets of the fins belonging individually to one heat pipe.
- According to the heat sink of the invention, the heat receiving base is structured as a heat pipe comprising a porous structured wick disposed on an interior bottom face, and porous structured projections formed integrally on an upper face of the wick.
- Also, according to the heat sink of the invention, the heat pipe penetrates the fins while contacting sequentially with the fins.
- Further, according to the heat sink of invention, the aforementioned heat pipes are arranged not to be overlapped with each other.
- According to the present invention, the heat pipe is bent into arcuate and such a curved portion is contacted sequentially with the plurality of fins, and one of the end portions of the heat pipe is connected to the heat receiving base. This structure allows the heat pipe to be contacted with the fins over a long range. For this reason, heat exchange or radiating efficiency of the heat pipe within a limited space can be improved significantly. Meanwhile, the fins mounted on the heat pipe are not shared by another heat pipe. Therefore, heat exchange can be carried out efficiently without enlarging the fins. In other words, this is advantageous to downsize the heat pipe. Thus, the heat pipe of the invention can also comply with a demand of reduction in size and weight of an electronic control unit of various types of equipments. Further, according to the present invention, the heat receiving base as a core of the heat sink is structured as a heat pipe, and one of the end portions of the heat pipes bent into arcuate are connected thereto. This structure also improves heat transfer efficiency and heat exchange efficiency of the heat sink as a whole. Specifically, according to the invention, a porous structured wick is formed on an interior bottom face of the heat receiving base, and porous structured protrusions are formed thereon. Therefore, heat transporting capacity of the heat sink is further enhanced, and heat exchange efficiency between the heat sink and the exothermic element is thereby improved.
- These and other features, aspects, and advantages of the present invention will become better understood with reference to the following description and accompanying drawings, which should not be read to limit the invention in any way, in which:
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FIG. 1 is a top view showing a first embodiment of a heat sink according to the invention. -
FIG. 2 is a perspective view showing an arrangement of an installation base and a heat receiving base according to the first embodiment. -
FIG. 3 is a partially omitted cross-sectional view showing a structure of the heat receiving base according to the first embodiment. -
FIG. 4 is a perspective view showing an arrangement of the installation base, the heat receiving base and a heat pipe according to the first embodiment. -
FIG. 5 is a perspective view showing an arrangement of the installation base, the heat receiving base, the heat pipe and fins according to the first embodiment. -
FIG. 6 is a side view showing one of configurations of the fin according to the first embodiment. -
FIG. 7 is a perspective view showing an arrangement of the installation base, the heat receiving base, the heat pipe, and two kinds of the fins according to the first embodiment. -
FIG. 8 is a side view showing another configuration of the fin according to the first embodiment. -
FIG. 9 is an explanatory drawing showing how to join the fins according to the first embodiment. -
FIG. 10 is a perspective view showing an arrangement of the installation base, the heat receiving base, the heat pipe, the two kinds of fins, and a bracket according to the first embodiment. -
FIG. 11 is a perspective view showing an arrangement of the installation base, the heat receiving base, the heat pipe, the two kinds of fins, the bracket, and an axial fan mounting frame according to the first embodiment. -
FIG. 12 is a top view showing a second embodiment of a heat sink according to the invention. -
FIG. 13 is a partially omitted perspective view showing an arrangement of an installation base, the heat receiving base, a heat pipe, and fins according to the second embodiment. -
FIG. 14 is a perspective view showing an exterior appearance of a main part of the heat sink according to the second embodiment. -
FIG. 15 is a top view showing a third embodiment of a heat sink according to the invention. -
FIG. 16 is a partially omitted perspective view showing an arrangement of an installation base, a heat receiving base, heat pipes, and fins according to the third embodiment. -
FIG. 17 is a perspective view showing an exterior appearance of a main part of the heat sink according to the third embodiment. - Here will be described a first exemplary embodiment of the invention.
FIG. 1 is a top view showing a first embodiment of a heat sink according to the invention. Theheat sink 1 illustrated inFIG. 1 comprises aninstallation base 5. As illustrated inFIGS. 2 to 4 , aheat receiving base 3 is mounted on a center of theinstallation base 5, and a bottom face of theheat receiving base 3 is aligned to be contacted with at least an upper face of a not-shown electron device as an exothermic element, e.g., a central processing unit. - As illustrated in
FIG. 2 , theinstallation base 5 comprises abase plate 7, a circular reinforcement frame 9, linear reinforcement frames 11 and clips 13. The circular reinforcement frame 9 is formed on thebase plate 7 at a predetermined height, and theheat receiving base 3 is mounted thereon. The linear reinforcement frames 11 extend from the circular reinforcement frame 9 radially to four corners of thebase plate 7, and the end portion thereof is bent downwardly. At the leading end of thelinear reinforcement frame 11, there is formed aclip 13. - The
heat receiving base 3 is positioned by forming an inner flange along an inner circumference of the circular reinforcement frame 9 on which theheat receiving base 3 is to be placed, or by forming a flange around a lower end of an outer circumference of theheat receiving base 3 by which theheat receiving base 3 is fixed within the circular reinforcement frame 9 at the predetermined height. Alternatively, in case of positioning theheat receiving base 3 without a flange, theheat receiving base 3 may be placed directly on an exothermic element by allowing a vertical movement of theheat receiving base 3 within the inner circumference of the circular reinforcement frame 9, or theheat receiving base 3 may also be positioned by placing a lower end of below-mentionedfins heat receiving base 3 on the circular reinforcement frame 9. In any case, a lower circumference of theheat receiving base 3 is preferable to be soldered with the circular reinforcement frame 9 using a copper or the like having an excellent endothermic characteristics so as to enhance a structural strength. - An illustrated structure of the
installation base 5 is an example to carry out the invention and a structure of theinstallation base 5 should therefore not be limited to the illustrated structure. Another appropriate structure of theinstallation base 5 may also be applied to the invention. - The
heat receiving base 3 is structured as a heat pipe. Specifically, theheat receiving base 3 comprises a column-shapedhollow container 15. Non-condensable gas such as an air is evacuated from thecontainer 15, and thecontainer 15 is filled with a condensable working fluid such as water. An area of an upper face of thecontainer 15 is slightly smaller than that of a bottom face so that a peripheral wall of thecontainer 15 is tapered. Additionally, anozzle 16 is formed on an upper face thecontainer 15. The condensable working fluid is infused through thenozzle 16 and thenozzle 16 is then closed. - As illustrated in
FIG. 3 , awick 17 made of porous material is disposed on an interior bottom face of thecontainer 15, and a plurality of porousstructured projections 19 are formed integrally on an upper face of thewick 17. Thewick 17 is formed into a flat sheet by bindingparticles 21. Theparticle 21 is a material which has an excellent hydrophilicity with the working fluid, and which does not react with the working fluid. For example, a copper particle of several hundred micrometers (e.g., around 200 μm) diameter can be used as theparticle 21. Thoseparticles 21 are consolidated by sintering or the like so as to form thewick 17. - According to an exemplary aspect of the present invention, the thickness of the
wick 17 is not constant and the upper face thereof is rugged. Specifically, a substantially flat base layer is formed by consolidating the above-mentionedparticles 21 into one or more layers. A base layer is attached to the inner bottom face of thecontainer 15. At predetermined portions of the base layer, theparticles 21 are heaped up and consolidated integrally with the base layer by a sintering etc. Accordingly, the thickness of thewick 17 is thicker at those portions. The portions where theparticles 21 are heaped up correspond toporous projections 19 of the present invention. Those portions may be described as “stacks” or “cones”. Theprojections 19 may be shaped into an arbitrary shape like a cylinder, cone, or pyramid as would be understood by one of skill in the art. In case of a conical shape, for example, the height of eachprojection 19 may be around 1.8 mm. Additionally, theprojections 19 may be arranged at either regular or irregular intervals. Besides, inFIG. 3 , thewick 17 and theprojections 19 are illustrated in larger scale than the actual proportion, and the number of the illustratedprojections 19 is smaller than the actual number for the convenience of illustration, however, an actual size of theprojections 19 is considerably small and the actual number of theprojections 19 is significantly large. - A wick may also be formed on an inner circumferential face of the
container 15. For example, a plurality of thin slits may be formed as a wick on the inner circumferential face of thecontainer 15 in a vertical direction. Alternatively, a net material formed of extremely thin strings may also be arranged as a wick on the inner circumferential face of thecontainer 15. In this case, meshes of the net material are preferably formed into rhombic wherein an inner angle of vertexes is within the range of 5 to 85 degree for the purpose of reducing a flow resistance. - A bottom face of the
heat receiving base 3 is basically formed into a shape congruent with a shape of an upper face of an electron device. However, in order to enhance an endothermic efficiency, the bottom face of theheat receiving base 3 may also be formed into a shape to be contacted partially with side faces of the electron device, or a deformable heat absorbing material may be interposed between the bottom face of theheat receiving base 3 and the upper face of the electron device. - As illustrated in
FIG. 1 , 4 and 5, eachheat pipe 27 comprises alinear portion 31 which is to be inserted into theheat receiving base 3, and an arcuatecurved portion 33 which is to be situated concentrically with and outside of theheat receiving base 3. A radial distance from an inner circumference of thecurved portion 31 to the outer face of the peripheral wall of the heat receiving base 3 (or the container 15) is substantially constant everywhere in thecurved portion 31. A condensable working fluid, whose boiling point is lower than that of the water encapsulated in thecontainer 15, e.g., hydrocarbon or the like, is encapsulated in theheat pipe 27. Specifically, thelinear portion 31 inserted into theheat receiving base 3 functions as an evaporating portion (i.e., a heat receiving portion), and thecurved portion 33 enclosing theheat receiving base 3 halfway functions as a condensing portion (i.e., a heat radiating portion). - As illustrated in
FIG. 2 , a plurality ofholes 25 into which thelinear portion 31 of theheat pipes 27 are to be inserted tightly are formed on the peripheral wall of the heat receiving base 3 (i.e., the container 15). In order to enhance a thermal conductivity, a contour of theholes 25 is preferably congruent with a cross-sectional shape of theheat pipe 27. Thelinear portion 31 of theheat pipe 27 is inserted into theheat receiving base 3 from one of theholes 25 formed on relatively upper side of the peripheral wall. For the purpose of enhancing a structural strength, theheat pipe 27 is preferably soldered with thehole 25 using an alloy having an excellent thermal conductivity such as a copper. Meanwhile, a leading end of thelinear portion 31 is housed in thehole 25 which is situated on a relatively lower portion of the peripheral wall of theheat receiving base 3, in a side diametrically opposite to thehole 25 where theheat pipe 27 is soldered with. Thus, as illustrated inFIGS. 1 and 5 , theheat pipes 27 are arranged not to be contacted or overlapped with each other in theheat sink 1. - As illustrated in
FIGS. 1 and 5 , a plurality offins 35 for radiating heat is mounted on thecurved portion 33 of theheat pipe 27. Specifically, as illustrated inFIG. 6 , acircular opening 37 whose diameter is identical to that of theheat pipe 27 is formed in thefin 35. Thefins 35 are mounted on theheat pipe 27 by inserting theheat pipe 27 into theopening 37 of thefins 35. Thefins 35 are arranged on theheat pipe 27 at regular intervals. A distance from an innermost portion of theopening 37 to an innermost side of thefin 35 is identical to the radial distance from the inner circumference of thecurved portion 33 to the peripheral wall of theheat receiving base 3. For this reason, the innermost sides of thefins 35 are contacted with the peripheral wall of theheat receiving base 3 when thefins 35 are mounted on theheat pipe 27. As a result, thefins 35 are arranged radially around the peripheral wall of theheat receiving base 3. In order to enhance a structural strength, contact portions between the innermost side of thefins 35 and the peripheral wall of theheat receiving base 3, and contact portions between theopenings 37 and theheat pipe 27 are preferably soldered or brazed using an alloy having an excellent thermal conductivity such as a copper. Here, areference numeral 36 inFIG. 5 represents soldered portions. - As can be seen from
FIG. 5 and 7 , the leading end portion of thecurved portion 33 is situated near thelinear portion 31 of theother heat pipe 27. Therefore, as illustrated in FIGS. 7 and 8,fins 41 comprising anopening 37 as well as acutout 39 for housing alinear portion 31 of theother heat pipe 27 are used in the leading end area of thecurved portion 33. As the case offins 35, contact portions between an innermost side of thefins 41 and the peripheral wall of theheat receiving base 3, and contact portions between theopenings 37 and theheat pipe 27 are preferably soldered using a copper or the like so as to enhance a structural strength. - Here, in
FIGS. 5 and 7 , although thefins heat pipe 27 for the convenience of illustration, thefins other heat pipe 27. - As explained above, and as evidenced by the structure of the
fins circular opening 37 is formed therein, theheat pipes 27 are not contacted with each other in theheat sink 1. For this reason, the thermal exchange efficiency of theheat pipes 27 is improved and this eliminates a necessity to enlarge thefins - Further, the
fins FIG. 9 . Specifically, ajoint portion 43 is formed by bending an outermost portion of thefins joint portion 43 comprises acutout 45 and a projectingportion 47 on both upper and lower end of thefins FIGS. 6 and 8 . Thefins heat pipe 27 by inserting theheat pipe 27 into thehole 37 of thefins portions 47. As a result, the projectingportions 47 are fitted with theadjacent cutouts 45, and thefins joint portion 43. Theheat pipe 27 and thefins 35 as well as 41 are thereby assembled at a high intensity. - After the
fins heat pipe 27, abracket 49 is mounted on theheat receiving base 3 for the purpose of an installation of an axial fan, as illustrated in FIG. 10. Thebracket 49 is mounted on theheat receiving base 3 by fitting thenozzle 16 into acentral opening 51 of thebracket 49 for example. Alternatively, thebracket 49 can also be bonded with theheat receiving base 3. The method for fixing thebracket 49 should not be limited to those methods but thebracket 49 may be fixed on theheat receiving base 3 by other appropriate methods. - The
bracket 49 comprises two pairs offoundations 53 on which an after mentionedinstallation frame 57 for the axial fan is to be mounted, and afitting portions 55 which is bent generally at a right angle downwardly so as to be fitted with theinstallation frame 57. - In order to secure a space for the
bracket 49, thefins heat receiving base 3, in other words, in the vicinity of thelinear portion 31 of theheat pipe 27. - However, the configuration of the
bracket 49 should not be limited to the illustrated configuration but thebracket 49 may be modified appropriately according to need. For example, in case of arranging thefins heat receiving base 3, thebracket 49 may be modified to meet this requirement. - As illustrated in
FIGS. 1 and 11 , the axialfan installation frame 57 comprises aring portion 59 to be mounted on the outer end of thefins foundations 53. In thering portion 59, fixingportions 61 extending downwardly are formed on diametrically opposite two portions. Theinstallation frame 57 is fixed with theheat sink 1 by fitting the fixingportion 61 with thefitting portion 55 of thebracket 49. Theinstallation frame 57 further comprises acable management portion 60. - On the
ring portion 59, fourcolumns 63 are erected at regular intervals. From the upper end of thecolumn 63, asupport 65 is formed to connect thecolumn 63 and a mountingplate 67 for anaxial fan 69 driven by a not shown motor. The supports 65 are situated at a predetermined angle with respect to the mountingplate 67 so as to establish a reaction force against a revolution of theaxial fan 69. InFIG. 11 , theaxial fan 69 is mounted on an upper face of the mountingplate 67 as depicted by a broken line. However, theaxial fan 69 may also be mounted on a bottom face of the mountingplate 67 within an inner circumference of thering 59 in a rotatable condition. - In addition to above, the structure of the axial
fan installation frame 57 should not be limited to the illustrated structure but may be modified arbitrarily according to need. -
Clips 13 of theinstallation base 5 are adapted to fix theheat sink 1 with an electronic substrate, a chassis of an electric device or the like by inserting a bolt, screw and etc. into anopening 13 a shown inFIG. 1 . Alternatively, theclip 13 may also be fixed by soldering or brazing. - According to this embodiment, the
heat pipe 27 connected to theheat receiving base 3 is bent into arcuate, and the plurality offins curved portion 33 of theheat pipe 27 by inserting theheat pipe 27 into thehole 37. This configuration allows arranging a large number offins heat pipe 27. For this reason, the heat radiation efficiency of theheat pipe 27 can be improved significantly within a limited space. - For the purpose of facilitating the heat radiation from the
heat pipe 27, ambient air is blown into the clearances between the fins by operating theaxial fan 69. Therefore, the heat radiation efficiency of theheat pipe 27 can be further improved within a limited space. - Additionally, the
fins heat pipe 27 are not shared by another heat pipe. This eliminates a necessity to enlarge the heat radiating area of thefins heat sink 1 of the invention can fulfill the requirement of downsizing of personal computers, laptop computers, a central processing unit of electronic devices and so on. - Furthermore, according to this embodiment, the
heat receiving base 3 as a core of theheat sink 1 is also structured as a heat pipe. Specifically, awick 17 made of porous material is disposed on the interior bottom face of theheat receiving base 3, and a plurality of porousstructured projections 19 projecting upwardly are formed integrally on thewick 17. In addition, thelinear portion 31, i.e., the heat receiving portion of theheat pipes 27 is connected to theheat receiving base 3 structured as a heat pipe. Therefore, the heat transporting capacity and the heat transporting efficiency of theheat sink 1 are further improved. As a result, the thermal exchange efficiency between theheat sink 1 and an exothermic element is further improved. - Next, a
heat sink 71 as a second embodiment of the present invention will be explained with reference toFIGS. 12 to 14 .FIG. 12 is a top view showing theheat sink 71. - Differences between the
heat sink 71 of the second embodiment and theheat sink 1 of the first embodiment are configurations of aheat receiving base 73,heat radiation fins 81 andheat pipes 85. The remaining elements of theheat sink 71 illustrated inFIGS. 12 to 14 are similar to those of theheat sink 1, so further description will be omitted by allotting common reference numerals. - The
heat receiving base 73 is made of a material whose heat conductivity is excellent such as a copper. As illustrated inFIG. 13 , theheat receiving base 73 comprises a column shapedheat receiving body 75, and a cylindricalheat exhausting portion 77 which is formed integrally on a circumference of theheat receiving body 75. Inheat receiving body 75, there are formed twovertical holes 79 into which an evaporating side of the after mentionedheat pipes 85 are buried tightly. - A plurality of
heat radiating fins 81 are arranged around theheat receiving base 73. Thefins 81 are preferably fixed to a peripheral wall of theheat receiving base 73 by a soldering or blazing using a copper or the like having an excellent heat conductivity. According to the second embodiment illustrated inFIGS. 12 to 14 , all of thefins 81 are formed in the same configuration. Specifically, thefin 81 comprises a cutout 83 in which theheat pipe 85 is housed. The cutout 83 has acontact portion 83 a to which theheat pipe 85 is contacted. A curvature of thecontact portion 83 a is congruent with a sectional curvature of the curved portion (i.e., a heat radiating portion) 89 of theheat pipe 85. Likewise thefins fins 81 also comprise a snap structure as shown inFIG. 9 . Therefore, thefins 81 can be integrated easily at regular intervals. - As illustrated in
FIGS. 12 to 14 , an end portion of the evaporating side of the heat pipes 58 is inserted into thevertical hole 79 tightly. Theheat pipe 85 comprises abent portion 87 which is bent at the portion above an upper face of theheat receiving body 75 at generally right angle outwardly of theheat exhausting portion 77, and acurved portion 89 which extends half around theheat receiving base 73 from thebent portion 87 clockwise. As the first embodiment, theheat pipes 85 are arranged not to be contacted or overlapped with each other. - The configuration of the
fin 81 should not be limited to the above-explained configuration. That is, configuration of the cutout may be modified according to the configuration of the heat pipe. - In addition, an axial fan may also be mounted on the
heat sink 71 of the second embodiment. In order to mounting the axial fan on theheat sink 71, for example, an installation frame can be mounted on an appropriate portion in theinstallation base 5 such as alinear reinforcement frame 11, aclip 13 etc. However, the measure for mounting the axial fan should not be limited to the aforementioned example but detailed explanation about installation of the axial fan is omitted. - According to the second embodiment, the heat radiating portion (i.e., the condensing portion) of the
heat pipe 85 connected to theheat receiving base 73 is bent into arcuate, and contacted sequentially with thefins 81 through thecontact portion 83 a of the cutouts 83. This configuration allows theheat pipe 85 contacting with a large number offins 81 along almost entire length of the heat radiating portion of oneheat pipe 85. For this reason, the heat radiation efficiency of theheat pipe 85 can be improved significantly within a limited space. - In addition to above, since the
fins 81 are designed to be contacted with theheat pipe 85 through the cutout 83, thefins 81 can be manufactured easily, and also, thefins 81 can be attached easily to theheat receiving base 73. For this reason, an assembly of theheat sink 71 can be simplified significantly. This is also advantageous for a volume production of theheat sink 71. - Furthermore, the evaporation sides of the
heat pipe 85 are inserted tightly, i.e., buried tightly into thevertical holes 79 of theheat receiving base 73. For this reason, the heat generated by the exothermic element can be transmitted efficiently to the evaporation side of theheat pipe 85, and a structural strength of theheat sink 71 is also improved. - Next, a
heat sink 91 as a third embodiment of the present invention will be explained with reference toFIGS. 15 to 17 .FIG. 15 is a top view showing the heat sink 99 of the third embodiment. - Differences between the
heat sink 91 of the third embodiment and theheat sink heat receiving base 93,heat radiation fins 99a to 99n andheat pipes 97. The remaining elements of theheat sink 91 illustrated inFIGS. 15 to 17 are similar to those of theheat sinks - The
heat receiving base 93 is made of a material whose heat conductivity is excellent such as a copper. As illustrated inFIG. 16 , theheat receiving base 93 also has a column-shaped main body, and comprisesvertical holes 93 into which an evaporation side of the after mentionedheat pipes 97 are buried tightly. Theheat receiving base 93 further comprises a plurality ofprotrusions 93 b, which are formed around outer circumference at regular intervals, and to whichheat radiating fins 99 a are contacted. - As illustrated in
FIGS. 15 and 16 , theheat pipes 97 in which the evaporation side is inserted into theholes 95 are arranged radially at regular intervals. Specifically, an angle between twoheat pipes 97 is 72 degrees. On the condensing side of theheat pipes 97, one set offins 99 a to 99 n is mounted, and widths of thefins 99 a to 99 n in the circumferential direction are within a range of approximately 70 degrees. Additionally, a predetermined clearance exists in the radial direction between each two sets of thefins 99 a to 99 n. Infins 99 a to 99 n, there is formed a not shown opening into which the condensing side of theheat pipe 97 is inserted. Theinnermost fin 99 a is contacted withprotrusions 93 b of theheat receiving base 93. - The set of
fins 99 a to 99 n are preferably soldered to theheat pipe 97 using a copper or the like so as to enhance the structural strength. - As illustrated in
FIG. 17 , clips 13 of theinstallation base 5 are adapted to fix theheat sink 91 with an electronic substrate or the like by inserting aclip fastener 101 into an opening of theclip 13. - According to the third embodiment, the
heat pipes 97 buried tightly into thevertical holes 95 of theheat receiving base 93 are arranged radially, and the condensing portion of theheat pipes 97 are contacted sequentially with the set offins 99 a to 99 n. This configuration allows theheat pipe 97 contacting with a large number of fins such asfins 99 a to 99 n along almost entire length of the heat radiating portion of oneheat pipe 97. For this reason, the heat radiation efficiency of theheat pipe 97 can be improved significantly within a limited space.
Claims (13)
1. A heat sink, comprising:
a heat receiving base for receiving heat from an exothermic element;
a plurality of fins for radiating heat arranged radially around the heat receiving base at predetermined intervals, and
a heat pipe comprising a curved portion, in which one of an end portion thereof is connected with a predetermined portion of the heat receiving base, and in which at least a predetermined region of the curved portion is contacted with the fins in a heat transferable manner.
2. The heat sink according to claim 1 , wherein:
the curved portion of the heat pipe is bent into arcuate and situated inward of an outermost portion of the fins.
3. The heat sink according to claim 1 , wherein:
the heat receiving base is structured as a heat pipe, which comprises
a porous structured wick, which is disposed on an interior bottom face, and
porous structured projections, which are formed integrally on an upper face of the wick.
4. The heat sink according to claim 1 , wherein:
the heat receiving base has a column-shaped configuration.
5. The heat sink according to claim 1 , wherein:
the heat pipe is connected with the heat receiving base by burying the end portion of an evaporating side tightly into a predetermined portion of the heat receiving base.
6. The heat sink according to claim 1 , wherein:
the plurality of fins are arranged radially around the heat receiving base.
7. The heat sink according to claim 1 , wherein:
the heat pipe penetrates the fins while contacting sequentially with the fins.
8. A heat sink, comprising:
an heat receiving base for receiving heat from an exothermic element,
a plurality of fins for radiating heat arranged to enclose the heat receiving base at predetermined interval, and
a plurality of heat pipes, in which one of end portions thereof are individually connected to a predetermined portion of the heat receiving base, which are arranged radially to extend in different directions, and contacted with the fins in a heat transferable manner.
9. The heat sink according to claim 8 , wherein:
the fins are divided evenly according to the number of the heat pipes extending radially, and
a predetermined clearance exists between abutting sets of the fins belonging individually to one heat pipe.
10. The heat sink according to claim 8 , wherein:
the heat receiving base is structured as a heat pipe, which comprises
a porous structured wick, which is disposed on an interior bottom face, and
porous structured projections, which are formed integrally on an upper face of the wick.
11. The heat sink according to claim 8 , wherein:
the heat receiving base has a column-shaped configuration.
12. The heat sink according to claim 8 , wherein:
the heat pipe is connected with the heat receiving base by burying the end portion of an evaporating side tightly into a predetermined portion of the heat receiving base.
13. The heat sink according to claim 8 , wherein:
the heat pipe penetrates the fins while contacting sequentially with the fins.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/840,969 US20080202729A1 (en) | 2007-02-27 | 2007-08-19 | Heat sink |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US89188907P | 2007-02-27 | 2007-02-27 | |
US11/840,969 US20080202729A1 (en) | 2007-02-27 | 2007-08-19 | Heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080202729A1 true US20080202729A1 (en) | 2008-08-28 |
Family
ID=39714564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/840,969 Abandoned US20080202729A1 (en) | 2007-02-27 | 2007-08-19 | Heat sink |
Country Status (2)
Country | Link |
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US (1) | US20080202729A1 (en) |
CN (1) | CN101257779A (en) |
Cited By (14)
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US20090161315A1 (en) * | 2007-12-19 | 2009-06-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipating apparatus with heat pipe |
US20090236077A1 (en) * | 2008-03-24 | 2009-09-24 | Hong Fu Jin Precision Industry (Shenzhen) Co.,Ltd. | Heat dissipation device |
US20090242176A1 (en) * | 2008-03-27 | 2009-10-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipe |
US20090314466A1 (en) * | 2008-06-18 | 2009-12-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus having heat pipes inserted therein |
US20100051231A1 (en) * | 2008-08-26 | 2010-03-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus having a heat pipe inserted therein |
US20100051232A1 (en) * | 2008-08-27 | 2010-03-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus incorporating a fan |
US20100097762A1 (en) * | 2008-10-16 | 2010-04-22 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus |
US20100122796A1 (en) * | 2008-11-14 | 2010-05-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus |
US20100230074A1 (en) * | 2009-03-13 | 2010-09-16 | Hong Fu Jin Precision Industry (Shenzhen) Co. Ltd. | Heat dissipation apparatus |
US20110024090A1 (en) * | 2009-08-03 | 2011-02-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
CN102045988A (en) * | 2009-10-12 | 2011-05-04 | 富准精密工业(深圳)有限公司 | Radiating device |
US20140185240A1 (en) * | 2012-12-28 | 2014-07-03 | Mark MacDonald | Heat exchanger assembly for electronic device |
US20170125866A1 (en) * | 2015-11-03 | 2017-05-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Novel thermal management solution for battery pack |
WO2024033356A1 (en) * | 2022-08-08 | 2024-02-15 | City, University of London | Heat transfer system |
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CN102130075A (en) * | 2010-12-24 | 2011-07-20 | 东莞汉旭五金塑胶科技有限公司 | Radial heat radiator |
CN107388067A (en) * | 2017-08-28 | 2017-11-24 | 德清明裕照明电器有限公司 | Energy-saving bulb is used in car and boat |
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US20170125866A1 (en) * | 2015-11-03 | 2017-05-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Novel thermal management solution for battery pack |
US10516194B2 (en) * | 2015-11-03 | 2019-12-24 | Toyota Motor Engineering & Manufacturing North America, Inc. | Thermal management solution for battery pack |
WO2024033356A1 (en) * | 2022-08-08 | 2024-02-15 | City, University of London | Heat transfer system |
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