US20100122796A1 - Heat dissipation apparatus - Google Patents
Heat dissipation apparatus Download PDFInfo
- Publication number
- US20100122796A1 US20100122796A1 US12/430,843 US43084309A US2010122796A1 US 20100122796 A1 US20100122796 A1 US 20100122796A1 US 43084309 A US43084309 A US 43084309A US 2010122796 A1 US2010122796 A1 US 2010122796A1
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- US
- United States
- Prior art keywords
- heat
- conductive core
- dissipation apparatus
- heat dissipation
- arcuate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure generally relates to heat dissipation apparatuses, and particularly to a heat dissipation apparatus for dissipating heat generated by electronic components with a high heat dissipating efficiency.
- a heat dissipation apparatus is attached to an electronic component for removing heat generated by the electronic component.
- the heat dissipating apparatus includes a heat absorbing plate thermally contacted with the electronic component and a plurality of fins extending upwardly from the heat absorbing plate. Heat generated by the electronic component is transferred to the fins through the heat absorbing plate and dissipated to the ambient environment by the fins.
- the above-mentioned heat dissipation apparatus which transfers heat via heat conduction means, is no longer capable of satisfying the heat dissipating requirement of the advanced electronic components.
- FIG. 1 is an assembled, isometric view of a heat dissipation apparatus in accordance with an exemplary embodiment of the disclosure.
- FIG. 2 is an exploded, isometric view of the heat dissipation apparatus of FIG. 1 .
- a heat dissipation apparatus in accordance with an exemplary embodiment includes a heat absorbing base 10 , a heat conductive core 20 , two fin assemblies 30 , two heat pipes 40 , a securing member 50 and a retention frame 60 .
- the heat dissipation apparatus is positioned on an electronic component 70 , such as a CPU, which is mounted on a printed circuit board 80 , for dissipating heat generated by the electronic component 70 .
- the securing member 50 is used to secure the heat dissipation apparatus to the electronic component 70 .
- the heat absorbing base 10 is a rectangular metal plate, and has an excellent heat conductivity.
- the heat absorbing base 10 is made of copper or aluminum.
- the heat absorbing base 10 has a planar bottom surface 11 thermally connecting with the electronic component 70 and a top surface 12 opposite to the bottom surface 11 .
- a layer of thermally interface material is filled between the electronic component 70 and the bottom surface 11 of the heat absorbing base 10 to reduce the thermal resistance therebetween.
- Two parallel mounting grooves 13 are defined in the top surface 12 of the heat absorbing base 10 for accommodating the heat pipes 40 .
- the heat conductive core 20 is made of material with excellent heat conductivity such as copper or aluminum.
- a bottom surface of the heat conductive core 20 is attached on the top surface 12 of the heat absorbing base 10 .
- Heat generated by the electronic component 70 is transferred vertically and upwardly to the heat conductive core 20 via the heat absorbing base 10 .
- the heat conductive core 20 includes a body 202 and a plurality of fins 221 .
- the body 202 has a configuration of a substantially elliptic cylinder, and includes a top surface, a bottom surface, and a side surface between the top and bottom surface.
- the top and bottom surfaces are parallel to each other, and are elliptical.
- the side surface includes two opposite first arcuate sections 21 and two opposite second arcuate sections 22 .
- the two first arcuate sections 21 are located at two opposite sides of a major axis of the body 202
- the two second arcuate sections 22 are located at two opposite sides of a minor axis of the body 202 .
- the second arcuate section 22 has a curvature larger than that of the first arcuate section 21 .
- the fins 221 of the heat conductive core 20 extend radially and outwardly from the second arcuate sections 22 .
- the top surface of the body 202 defines a pair of elongated locating grooves 25 along the major axis thereof for receiving the securing member 50 therein.
- Each of the two fin assemblies 30 is substantially sectorial, and includes a plurality of stacked fins 31 .
- An air passage 311 is defined between every two adjacent fins 31 .
- Each fin 31 is made of material with excellent heat conductivity such as copper or aluminum, and includes a rectangular main body 312 and an extension arm 313 extending upwardly from an outer portion of a top side of the main body 312 .
- Each fin 31 defines a receiving hole 314 therein near a joint of the main body 312 and the extension arm 313 . All of the receiving holes 314 of the fins 31 of the fin assembly 30 cooperatively form an arcuate channel for receiving a section of the heat pipe 40 therein.
- Inner sides of the main bodies 312 of the fins 31 of the fin assembly 30 together form an arcuate surface corresponding to the first arcuate section 21 of the heat conductive core 20 .
- the two fin assemblies 30 are respectively attached to the two first arcuate sections 21 of the heat conductive core 20 by soldering or heat conducting adhesive.
- the heat pipes 40 are used for transferring heat from the heat absorbing base 10 to the fin assemblies 30 by phase change.
- Each heat pipe 40 includes a sealed hollow pipe body receiving working fluid therein and a wick structure disposed on an inner wall of the pipe body.
- the heat pipe 40 is bent to have an evaporation section 41 , a condensation section 43 , and an adiabatic section 42 interconnecting the evaporation section 41 and the condensation section 43 .
- the evaporation section 41 of each heat pipe 40 is straight and flat, and is mounted in a corresponding groove 11 of the heat absorbing base 10 .
- the evaporation section 41 of each heat pipe 40 and the heat absorbing base 10 are combined together by soldering or heat conducting adhesive.
- the bottom surface of the heat conductive core 20 can contact with the heat absorbing base 10 and the evaporation section 41 of each heat pipe 40 at the same time.
- a top surface of the evaporation section 41 of each heat pipe 40 is substantially coplanar with the top surface 12 of the heat absorbing base 10 .
- the adiabatic section 42 extends upwardly and slantwise from one end of the evaporation section 41 .
- the adiabatic sections 42 of the two heat pipes 40 are located at two opposite sides of the minor axis of the heat absorbing base 10 , respectively.
- the condensation section 43 is substantially arcuate, and extends from a free end of the adiabatic section 42 clockwise.
- the condensation sections 43 of the two heat pipes 40 are respectively located at two opposite sides of the major axis of the heat conductive core 20 , and respectively received in the arcuate channels of the fin assemblies 30 .
- the condensation section 43 of the heat pipe 40 and the first arcuate section 21 of the heat conductive core 20 are homocentric.
- a distance between the condensation section 43 and the corresponding first arcuate section 21 of the heat conductive core 20 is invariable, which makes the combination of fin assembly 30 and the heat pipe 40 feasible and convenient.
- the electronic component 70 is surrounded by the retention frame 60 which is securely mounted on the printed circuit board 80 .
- the retention frame 60 is substantially rectangular shaped.
- a pair of catches 61 , 62 i.e., first catch 61 and second catch 62 extend outwardly from two opposite sides of the retention frame, respectively.
- the securing member 50 includes an elongated pressing portion 51 extending along the major axis of the heat conductive core 20 , a first locking leg 53 integrally formed with and bent perpendicularly from a rear end of the pressing portion 51 , and a moveable second locking leg 52 movably coupled with a front end of the pressing portion 51 .
- the pressing portion 51 includes a pair of elongated resilient arms received in the locating grooves 25 of the heat conductive core 20 .
- the heat dissipation apparatus is placed on the electronic component 70 .
- the first and second locking legs 53 , 52 of the securing member 50 are coupled to the first and second catches 61 , 62 of the retention frame 60 , respectively.
- heat absorbed by the heat absorbing base 10 can be transferred to the fin assemblies 30 not only via the heat conductive core 20 , but also via the heat pipes 40 .
- the heat dissipating efficiency of the heat dissipation apparatuses is greatly improved for heat absorbed by liquid having a phase change (i.e. from liquid to vapor) is hundred times more than that of the liquid without phase change, and a heat transfer efficiency by phase change of liquid is much better than heat conduction or heat convection without phase change.
- the elliptical, cylindrical surface of the heat conductive core 20 provides a larger heat contacting area to contact with the fin assemblies 30 , which further improves the heat dissipating efficiency of the heat dissipation apparatuses.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- 1. Technical Field
- The disclosure generally relates to heat dissipation apparatuses, and particularly to a heat dissipation apparatus for dissipating heat generated by electronic components with a high heat dissipating efficiency.
- 2. Description of Related Art
- It is well-known that heat is generated by electronic components such as central processing units (CPUs) of computers. If the generated heat is not rapidly and efficiently removed, the electronic component may overheat and the performance thereof may be significantly degraded.
- Conventionally, a heat dissipation apparatus is attached to an electronic component for removing heat generated by the electronic component. The heat dissipating apparatus includes a heat absorbing plate thermally contacted with the electronic component and a plurality of fins extending upwardly from the heat absorbing plate. Heat generated by the electronic component is transferred to the fins through the heat absorbing plate and dissipated to the ambient environment by the fins. However, the above-mentioned heat dissipation apparatus, which transfers heat via heat conduction means, is no longer capable of satisfying the heat dissipating requirement of the advanced electronic components.
- What is needed, therefore, is a heat dissipation apparatus with a high heat dissipating efficiency, which overcomes the described limitations.
- Many aspects of the present heat dissipation apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosed heat dissipation apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled, isometric view of a heat dissipation apparatus in accordance with an exemplary embodiment of the disclosure. -
FIG. 2 is an exploded, isometric view of the heat dissipation apparatus ofFIG. 1 . - Referring to
FIGS. 1 and 2 , a heat dissipation apparatus in accordance with an exemplary embodiment includes aheat absorbing base 10, a heatconductive core 20, twofin assemblies 30, twoheat pipes 40, a securingmember 50 and aretention frame 60. The heat dissipation apparatus is positioned on anelectronic component 70, such as a CPU, which is mounted on a printedcircuit board 80, for dissipating heat generated by theelectronic component 70. The securingmember 50 is used to secure the heat dissipation apparatus to theelectronic component 70. - The
heat absorbing base 10 is a rectangular metal plate, and has an excellent heat conductivity. Preferably, theheat absorbing base 10 is made of copper or aluminum. Theheat absorbing base 10 has aplanar bottom surface 11 thermally connecting with theelectronic component 70 and atop surface 12 opposite to thebottom surface 11. Generally, a layer of thermally interface material is filled between theelectronic component 70 and thebottom surface 11 of theheat absorbing base 10 to reduce the thermal resistance therebetween. Twoparallel mounting grooves 13 are defined in thetop surface 12 of theheat absorbing base 10 for accommodating theheat pipes 40. - The heat
conductive core 20 is made of material with excellent heat conductivity such as copper or aluminum. A bottom surface of the heatconductive core 20 is attached on thetop surface 12 of theheat absorbing base 10. Heat generated by theelectronic component 70 is transferred vertically and upwardly to the heatconductive core 20 via theheat absorbing base 10. The heatconductive core 20 includes abody 202 and a plurality offins 221. Thebody 202 has a configuration of a substantially elliptic cylinder, and includes a top surface, a bottom surface, and a side surface between the top and bottom surface. The top and bottom surfaces are parallel to each other, and are elliptical. The side surface includes two opposite firstarcuate sections 21 and two opposite secondarcuate sections 22. The two firstarcuate sections 21 are located at two opposite sides of a major axis of thebody 202, and the two secondarcuate sections 22 are located at two opposite sides of a minor axis of thebody 202. The secondarcuate section 22 has a curvature larger than that of the firstarcuate section 21. Thefins 221 of the heatconductive core 20 extend radially and outwardly from the secondarcuate sections 22. The top surface of thebody 202 defines a pair of elongated locatinggrooves 25 along the major axis thereof for receiving the securingmember 50 therein. - Each of the two
fin assemblies 30 is substantially sectorial, and includes a plurality of stackedfins 31. Anair passage 311 is defined between every twoadjacent fins 31. Eachfin 31 is made of material with excellent heat conductivity such as copper or aluminum, and includes a rectangularmain body 312 and anextension arm 313 extending upwardly from an outer portion of a top side of themain body 312. Eachfin 31 defines areceiving hole 314 therein near a joint of themain body 312 and theextension arm 313. All of the receivingholes 314 of thefins 31 of thefin assembly 30 cooperatively form an arcuate channel for receiving a section of theheat pipe 40 therein. Inner sides of themain bodies 312 of thefins 31 of thefin assembly 30 together form an arcuate surface corresponding to the firstarcuate section 21 of the heatconductive core 20. The twofin assemblies 30 are respectively attached to the two firstarcuate sections 21 of the heatconductive core 20 by soldering or heat conducting adhesive. - The
heat pipes 40 are used for transferring heat from theheat absorbing base 10 to thefin assemblies 30 by phase change. Eachheat pipe 40 includes a sealed hollow pipe body receiving working fluid therein and a wick structure disposed on an inner wall of the pipe body. Theheat pipe 40 is bent to have anevaporation section 41, acondensation section 43, and anadiabatic section 42 interconnecting theevaporation section 41 and thecondensation section 43. Theevaporation section 41 of eachheat pipe 40 is straight and flat, and is mounted in acorresponding groove 11 of theheat absorbing base 10. Theevaporation section 41 of eachheat pipe 40 and theheat absorbing base 10 are combined together by soldering or heat conducting adhesive. Thus, the bottom surface of the heatconductive core 20 can contact with theheat absorbing base 10 and theevaporation section 41 of eachheat pipe 40 at the same time. A top surface of theevaporation section 41 of eachheat pipe 40 is substantially coplanar with thetop surface 12 of theheat absorbing base 10. Theadiabatic section 42 extends upwardly and slantwise from one end of theevaporation section 41. Theadiabatic sections 42 of the twoheat pipes 40 are located at two opposite sides of the minor axis of theheat absorbing base 10, respectively. Thecondensation section 43 is substantially arcuate, and extends from a free end of theadiabatic section 42 clockwise. Thecondensation sections 43 of the twoheat pipes 40 are respectively located at two opposite sides of the major axis of the heatconductive core 20, and respectively received in the arcuate channels of thefin assemblies 30. In this embodiment, thecondensation section 43 of theheat pipe 40 and the firstarcuate section 21 of the heatconductive core 20 are homocentric. Thus, a distance between thecondensation section 43 and the corresponding firstarcuate section 21 of the heatconductive core 20 is invariable, which makes the combination offin assembly 30 and theheat pipe 40 feasible and convenient. - The
electronic component 70 is surrounded by theretention frame 60 which is securely mounted on the printedcircuit board 80. Theretention frame 60 is substantially rectangular shaped. A pair ofcatches first catch 61 andsecond catch 62 extend outwardly from two opposite sides of the retention frame, respectively. - The
securing member 50 includes an elongatedpressing portion 51 extending along the major axis of the heatconductive core 20, afirst locking leg 53 integrally formed with and bent perpendicularly from a rear end of thepressing portion 51, and a moveablesecond locking leg 52 movably coupled with a front end of thepressing portion 51. Thepressing portion 51 includes a pair of elongated resilient arms received in the locatinggrooves 25 of the heatconductive core 20. In assembly, the heat dissipation apparatus is placed on theelectronic component 70. The first and second lockinglegs member 50 are coupled to the first andsecond catches retention frame 60, respectively. - In the heat dissipation apparatus, due to the presence of the
heat pipes 40 and the heatconductive core 20, heat absorbed by theheat absorbing base 10 can be transferred to thefin assemblies 30 not only via the heatconductive core 20, but also via theheat pipes 40. The heat dissipating efficiency of the heat dissipation apparatuses is greatly improved for heat absorbed by liquid having a phase change (i.e. from liquid to vapor) is hundred times more than that of the liquid without phase change, and a heat transfer efficiency by phase change of liquid is much better than heat conduction or heat convection without phase change. In addition, the elliptical, cylindrical surface of the heatconductive core 20 provides a larger heat contacting area to contact with thefin assemblies 30, which further improves the heat dissipating efficiency of the heat dissipation apparatuses. - It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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CN200810305562.1 | 2008-11-14 | ||
CN200810305562 | 2008-11-14 | ||
CN2008103055621A CN101742890B (en) | 2008-11-14 | 2008-11-14 | Radiation device |
Publications (2)
Publication Number | Publication Date |
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US20100122796A1 true US20100122796A1 (en) | 2010-05-20 |
US7969737B2 US7969737B2 (en) | 2011-06-28 |
Family
ID=42171068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/430,843 Expired - Fee Related US7969737B2 (en) | 2008-11-14 | 2009-04-27 | Heat dissipation apparatus |
Country Status (2)
Country | Link |
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US (1) | US7969737B2 (en) |
CN (1) | CN101742890B (en) |
Cited By (4)
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---|---|---|---|---|
US20110094723A1 (en) * | 2009-10-26 | 2011-04-28 | Meyer Iv George Anthony | Combination of fastener and thermal-conducting member |
US20170105316A1 (en) * | 2015-10-13 | 2017-04-13 | Asia Vital Components Co., Ltd. | Thermal module assembling structure |
CN109168304A (en) * | 2018-10-25 | 2019-01-08 | 海鹰企业集团有限责任公司 | A kind of underwater tubular electronic compartment radiator |
WO2024019371A1 (en) * | 2022-07-18 | 2024-01-25 | 삼성전자 주식회사 | Heat radiation structure and electronic device comprising same |
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CN201438459U (en) * | 2009-03-13 | 2010-04-14 | 鸿富锦精密工业(深圳)有限公司 | Heat dissipating device assembly |
CN101990388A (en) * | 2009-08-03 | 2011-03-23 | 富准精密工业(深圳)有限公司 | Heat-dissipating device |
US20110290450A1 (en) * | 2010-05-31 | 2011-12-01 | Asia Vital Components Co., Ltd. | Heat Dissipation Module |
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US20070044942A1 (en) * | 2005-08-24 | 2007-03-01 | Xingwen Mou | Bottom plate of a radiator for a CPU |
US7532472B2 (en) * | 2006-04-14 | 2009-05-12 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
US7576987B2 (en) * | 2006-08-04 | 2009-08-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Clip for heat dissipation device |
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US7796387B2 (en) * | 2008-05-25 | 2010-09-14 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation apparatus having a fan received therein |
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Cited By (5)
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US20110094723A1 (en) * | 2009-10-26 | 2011-04-28 | Meyer Iv George Anthony | Combination of fastener and thermal-conducting member |
US20170105316A1 (en) * | 2015-10-13 | 2017-04-13 | Asia Vital Components Co., Ltd. | Thermal module assembling structure |
US10021813B2 (en) * | 2015-10-13 | 2018-07-10 | Asia Vital Components Co., Ltd. | Thermal module assembling structure |
CN109168304A (en) * | 2018-10-25 | 2019-01-08 | 海鹰企业集团有限责任公司 | A kind of underwater tubular electronic compartment radiator |
WO2024019371A1 (en) * | 2022-07-18 | 2024-01-25 | 삼성전자 주식회사 | Heat radiation structure and electronic device comprising same |
Also Published As
Publication number | Publication date |
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US7969737B2 (en) | 2011-06-28 |
CN101742890B (en) | 2013-06-05 |
CN101742890A (en) | 2010-06-16 |
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