USD586763S1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
USD586763S1
USD586763S1 US29/298,474 US29847407F USD586763S US D586763 S1 USD586763 S1 US D586763S1 US 29847407 F US29847407 F US 29847407F US D586763 S USD586763 S US D586763S
Authority
US
United States
Prior art keywords
heat dissipation
dissipation device
view
elevational view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/298,474
Inventor
Yi-Tao Hua
Wu-Yung Chen
Chung-yuan Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN200730200913.9F external-priority patent/CN300868409S/en
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, WU-YUNG, HUA, YI-TAO, CHEN, CHUNG-YUAN
Application granted granted Critical
Publication of USD586763S1 publication Critical patent/USD586763S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top, front and right side perspective view of a heat dissipation device showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a heat dissipation device, as shown and described.
US29/298,474 2007-08-23 2007-12-05 Heat dissipation device Expired - Lifetime USD586763S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200730200913.9F CN300868409S (en) 2007-08-23 Thermal pad

Publications (1)

Publication Number Publication Date
USD586763S1 true USD586763S1 (en) 2009-02-17

Family

ID=40349730

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/298,474 Expired - Lifetime USD586763S1 (en) 2007-08-23 2007-12-05 Heat dissipation device

Country Status (1)

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US (1) USD586763S1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD757662S1 (en) * 2014-02-06 2016-05-31 Kobe Steel, Ltd. Plate for heat exchanger
USD763804S1 (en) * 2014-02-06 2016-08-16 Kobe Steel, Ltd. Plate for heat exchanger
USD793351S1 (en) * 2016-03-01 2017-08-01 Bitspower International Co., Ltd. Heat dissipation board
USD798830S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798829S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798831S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD810034S1 (en) * 2016-02-22 2018-02-13 Heatscape.Com, Inc. Flexible folded fin heatsink with straight and radial fin patterns
USD908101S1 (en) * 2018-11-26 2021-01-19 Ptt Global Chemical Public Company Limited Microchannel heat exchanger
USD908100S1 (en) * 2018-11-26 2021-01-19 Ptt Global Chemical Public Company Limited Microchannel heat exchanger
USD908644S1 (en) * 2018-11-26 2021-01-26 Ptt Global Chemical Public Company Limited Microchannel heat exchanger

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD757662S1 (en) * 2014-02-06 2016-05-31 Kobe Steel, Ltd. Plate for heat exchanger
USD763804S1 (en) * 2014-02-06 2016-08-16 Kobe Steel, Ltd. Plate for heat exchanger
USD798830S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798829S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798831S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD810034S1 (en) * 2016-02-22 2018-02-13 Heatscape.Com, Inc. Flexible folded fin heatsink with straight and radial fin patterns
USD842822S1 (en) * 2016-02-22 2019-03-12 Heatscape.Com, Inc. Flexible folded fin heatsink with straight and radial fin patterns
USD793351S1 (en) * 2016-03-01 2017-08-01 Bitspower International Co., Ltd. Heat dissipation board
USD908101S1 (en) * 2018-11-26 2021-01-19 Ptt Global Chemical Public Company Limited Microchannel heat exchanger
USD908100S1 (en) * 2018-11-26 2021-01-19 Ptt Global Chemical Public Company Limited Microchannel heat exchanger
USD908644S1 (en) * 2018-11-26 2021-01-26 Ptt Global Chemical Public Company Limited Microchannel heat exchanger

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