USD905647S1 - Combination heat pipe and heat sink - Google Patents
Combination heat pipe and heat sink Download PDFInfo
- Publication number
- USD905647S1 USD905647S1 US29/657,394 US201829657394F USD905647S US D905647 S1 USD905647 S1 US D905647S1 US 201829657394 F US201829657394 F US 201829657394F US D905647 S USD905647 S US D905647S
- Authority
- US
- United States
- Prior art keywords
- combination
- heat
- heat sink
- heat pipe
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines depict portions of the combination heat pipe and heat sink that form no part of the claimed design.
Claims (1)
- The ornamental design for a combination heat pipe and heat sink, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/657,394 USD905647S1 (en) | 2018-07-20 | 2018-07-20 | Combination heat pipe and heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/657,394 USD905647S1 (en) | 2018-07-20 | 2018-07-20 | Combination heat pipe and heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
USD905647S1 true USD905647S1 (en) | 2020-12-22 |
Family
ID=73823835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/657,394 Active USD905647S1 (en) | 2018-07-20 | 2018-07-20 | Combination heat pipe and heat sink |
Country Status (1)
Country | Link |
---|---|
US (1) | USD905647S1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD953280S1 (en) * | 2020-01-17 | 2022-05-31 | Furukawa Electric Co., Ltd | Heat sink |
USD954005S1 (en) | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
USD971862S1 (en) * | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0129297B2 (en) * | 1982-09-09 | 1989-06-09 | Matsushita Electronics Corp | |
USD427159S (en) * | 1997-06-27 | 2000-06-27 | Sony Corporation | Semiconductor element |
US20060181856A1 (en) * | 2005-02-11 | 2006-08-17 | Inventec Corporation | Heatsink device of video graphics array and chipset |
US20090194260A1 (en) * | 2008-02-04 | 2009-08-06 | Chih-Peng Liao | Cooling apparatus for graphic cards |
US20110186269A1 (en) * | 2010-02-04 | 2011-08-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module |
US20140022724A1 (en) * | 2012-07-20 | 2014-01-23 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation apparatus |
US20140182817A1 (en) * | 2013-01-03 | 2014-07-03 | Adlink Technology Inc. | Low thermal resistance cooler module for embedded system |
USD722573S1 (en) * | 2013-11-26 | 2015-02-17 | Heatscape, Inc. | U-shaped condenser heat sink for low profile modules |
USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
US20170199554A1 (en) * | 2016-01-13 | 2017-07-13 | Msi Computer (Shenzhen) Co.,Ltd. | Heat dissipation system |
USD807824S1 (en) * | 2016-07-18 | 2018-01-16 | General Electric Company | Heat spreader |
US20180062347A1 (en) * | 2016-08-31 | 2018-03-01 | Nlight, Inc. | Laser cooling system |
USD819578S1 (en) * | 2016-07-14 | 2018-06-05 | Enermax Technology Corporation | Heat dissipating fin |
JP6429297B1 (en) * | 2017-08-04 | 2018-11-28 | 泰碩電子股▲分▼有限公司 | Vapor chamber complex |
-
2018
- 2018-07-20 US US29/657,394 patent/USD905647S1/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0129297B2 (en) * | 1982-09-09 | 1989-06-09 | Matsushita Electronics Corp | |
USD427159S (en) * | 1997-06-27 | 2000-06-27 | Sony Corporation | Semiconductor element |
US20060181856A1 (en) * | 2005-02-11 | 2006-08-17 | Inventec Corporation | Heatsink device of video graphics array and chipset |
US20090194260A1 (en) * | 2008-02-04 | 2009-08-06 | Chih-Peng Liao | Cooling apparatus for graphic cards |
US20110186269A1 (en) * | 2010-02-04 | 2011-08-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module |
US20140022724A1 (en) * | 2012-07-20 | 2014-01-23 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation apparatus |
US20140182817A1 (en) * | 2013-01-03 | 2014-07-03 | Adlink Technology Inc. | Low thermal resistance cooler module for embedded system |
USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
USD722573S1 (en) * | 2013-11-26 | 2015-02-17 | Heatscape, Inc. | U-shaped condenser heat sink for low profile modules |
US20170199554A1 (en) * | 2016-01-13 | 2017-07-13 | Msi Computer (Shenzhen) Co.,Ltd. | Heat dissipation system |
USD819578S1 (en) * | 2016-07-14 | 2018-06-05 | Enermax Technology Corporation | Heat dissipating fin |
USD807824S1 (en) * | 2016-07-18 | 2018-01-16 | General Electric Company | Heat spreader |
US20180062347A1 (en) * | 2016-08-31 | 2018-03-01 | Nlight, Inc. | Laser cooling system |
JP6429297B1 (en) * | 2017-08-04 | 2018-11-28 | 泰碩電子股▲分▼有限公司 | Vapor chamber complex |
Non-Patent Citations (4)
Title |
---|
"Dell Heatpipe Heatsink". Found online Mar. 12, 2020 at newegg.com. Reference dated Mar. 30, 2019. Retrieved from https://www.newegg.com/p/2RM-000M-00776?Description=heatpipe%20heatsink&cm_re=heatpipe_heatsink-_-9SIAH9B9331370-_-Product. (Year: 2019). * |
"Double heatpipe heatsink". Found online Apr. 13, 2020 at aliexpress.com. Reference dated Dec. 2, 2016. Retrieved from https://www.aliexpress.com/i/2045174681.html. (Year: 2016). * |
"Heat Pipe Overview". Found online Apr. 13, 2020 at youtube.com. Reference dated Jul. 9, 2015. Retrieved from https://www.youtube.com/watch?v=WoJnnHTQfuw. (Year: 2015). * |
"Microcool General Liquid Cooling". Found online Mar. 12, 2020 at slideshare.net. Reference dated Sep. 23, 2016. Retrieved from https://www.slideshare.net/ScottHolland13/microcool-general-liquid-cooling-presentation-10215. (Year: 2016). * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD971862S1 (en) * | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
USD954005S1 (en) | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
USD953280S1 (en) * | 2020-01-17 | 2022-05-31 | Furukawa Electric Co., Ltd | Heat sink |
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Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
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FEPP | Fee payment procedure |
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