US20210018272A1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- US20210018272A1 US20210018272A1 US17/039,658 US202017039658A US2021018272A1 US 20210018272 A1 US20210018272 A1 US 20210018272A1 US 202017039658 A US202017039658 A US 202017039658A US 2021018272 A1 US2021018272 A1 US 2021018272A1
- Authority
- US
- United States
- Prior art keywords
- heat
- end portion
- heat sink
- heat pipe
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 70
- 230000017525 heat dissipation Effects 0.000 claims abstract description 64
- 238000001704 evaporation Methods 0.000 claims abstract description 35
- 230000008020 evaporation Effects 0.000 claims abstract description 35
- 230000005494 condensation Effects 0.000 claims description 13
- 238000009833 condensation Methods 0.000 claims description 13
- 238000001816 cooling Methods 0.000 abstract description 13
- 239000012530 fluid Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
Definitions
- the present disclosure is related to a heat sink configured to cool a heating element set as a cooling target by transferring heat of the heating element to a heat dissipation section by using a heat transfer function of a heat pipe.
- a large number of parts including a heating element such as an electronic part have been mounted inside the electronic device at a higher density than ever.
- an amount of heat generated by the heating element such as the electronic part has increased more than ever.
- a heat sink is used in some cases.
- a heat sink where a plurality of heat pipes are thermally connected to the heating element is used in some cases.
- the heat sink of Japanese Patent Laid-Open No. 2003-110072 is a heat sink formed in a manner that heat of the heating element is transferred to the heat dissipation fins by the plurality of tubular heat pipes, and the heat is to be dissipated from the heat dissipation fins.
- a heat sink where the heat of the heating element is transferred from a heat reception section to the heat dissipation fins by the plurality of heat pipes such as the heat sink of Japanese Patent Laid-Open No. 2003-110072, to exhibit a cooling property for even a heating element generating a high amount of heat, it is necessary to form a heat pipe group where a large number of heat pipes are arranged in parallel, and thermally connect the heat pipe group to the heating element.
- thermally connect the heat pipe group formed by the large number of heat pipes to the heating element it is necessary to secure a large space for housing the heat pipe group inside the electronic device.
- the heating element since a large number of parts are mounted inside the electronic device at the higher density than ever, the heating element may also be mounted into an even narrowed space in some cases.
- the number of installed heat pipes forming the heat pipe group may be restricted in some cases.
- the cooling property for the heating element generating a high amount of heat may not be sufficiently applied to the heat sink in some cases.
- the present disclosure is related to providing a heat sink that can exhibit an excellent cooling property for even a heating element generating a high amount of heat and being mounted into a narrowed space.
- a gist of the configuration of the present disclosure is as follows.
- a heat sink including a plurality of heat pipes to be thermally connected to a heating element, and a heat dissipation section thermally connected to the plurality of heat pipes, in which in the plurality of heat pipes, at least evaporation sections to be thermally connected to the heating element have flattened portions whose cross sectional shape in a direction orthogonal to a heat transfer direction of the plurality of heat pipes is flattened, and surfaces in the flattened portions in a thickness direction are arranged facing the heating element.
- the heat sink as described in any one of [1] to [6], in which the heat pipe includes a first wick structure corresponding to fine grooves formed on an inner surface of a container, and a second wick structure having protrusion portions protruding from the inner surface of the container in flat segments forming a main surface of the flattened portion.
- an increased number of heat pipes can be thermally connected to the heating element set as the cooling target without increasing an installment space of the heat reception section of the heat sink.
- an increased number of heat pipes can be thermally connected to the heat dissipation section of the heat sink.
- a heat dissipation efficiency of the heat dissipation section improves, and the excellent cooling property can be exhibited for the heating element even having the high heat value mounted into the narrowed space.
- the plurality of heat pipes can be reliably and also easily thermally connected to the heating element.
- the heat reception plate since the one end portion or central portion of the heat pipe is thermally connected to the heat reception plate, a thermal connectivity between the heat pipe and the heating element improves.
- the heat reception plate also has an action as a heat equalizing plate configured to equalize thermal loads to the respective heat pipes arranged in parallel, and can more reliably exhibit heat transfer properties of the respective heat pipes.
- the heat pipe since the heat pipe includes the first wick structure corresponding to the fine grooves formed on the inner surface of the container and the second wick structure having the protrusion portions protruding from the inner surface of the container in the flat segments forming the main surface of the flattened portion, a liquid working fluid can be smoothly recirculated to the flattened portion. Thus, even the heat pipe having the flattened portion in the evaporation section can exhibit the excellent heat transfer property.
- the heat pipe further includes the third wick structure disposed in the layered manner on the inner surface of the flattened section in the thickness direction, the liquid working fluid can be more smoothly recirculated to the flattened portion.
- the heat pipe having the flattened portion in the evaporation section can exhibit the more excellent heat transfer property.
- FIG. 1 is a perspective view of a heat sink according to a first embodiment of the present disclosure.
- FIG. 2 is a plan view of the heat sink according to the first embodiment of the present disclosure.
- FIG. 3 is a side view of one end portion of the heat sink according to the first embodiment of the present disclosure.
- FIG. 4 is a plan view of a heat sink according to a second embodiment of the present disclosure.
- FIG. 5 is a side view of the heat sink according to the second embodiment of the present disclosure.
- FIG. 6 is an explanatory view of a cross section A-A in FIG. 4 of the heat sink according to the second embodiment of the present disclosure.
- FIG. 7 is an explanatory view of a wick structure disposed in heat pipes provided to the heat sink according to the present disclosure.
- FIG. 1 is a perspective view of the heat sink according to the first embodiment of the present disclosure.
- FIG. 2 is a plan view of the heat sink according to the first embodiment of the present disclosure.
- FIG. 3 is a side view of one end portion of the heat sink according to the first embodiment of the present disclosure.
- FIG. 4 is a plan view of a heat sink according to a second embodiment of the present disclosure.
- FIG. 5 is a side view of the heat sink according to the second embodiment of the present disclosure.
- FIG. 6 is an explanatory view of a cross section A-A in FIG. 4 of the heat sink according to the second embodiment of the present disclosure.
- FIG. 7 is an explanatory view of a wick structure disposed in heat pipes provided to the heat sink according to the present disclosure.
- a heat sink 1 includes a plurality of heat pipes 11 thermally connected to a heating element 101 set as a cooling target of the heat sink 1 , and a heat dissipation section 40 .
- the plurality of heat pipes 11 are commonly thermally connected to the heat dissipation section 40 .
- the heat dissipation section 40 has a plurality of heat dissipation fins 41 .
- the heat pipe 11 is a heat transfer member having an internal space sealed and subjected to decompression treatment. A working fluid (not illustrated) is sealed in the internal space of the heat pipe 11 .
- each of the plurality of heat pipes 11 one end portion 12 is thermally connected to the heating element 101 , and another end portion 13 is thermally connected to the heat dissipation section 40 . Therefore, in each of the plurality of heat pipes 11 , the one end portion 12 functions as an evaporation section, and the other end portion 13 functions as a condensation section.
- a longitudinal direction linking the one end portion 12 to the other end portion 13 corresponds to a heat transfer direction.
- a heat pipe group is formed in the plurality (four, in FIGS. 1 to 3 ) of heat pipes 11 .
- the respective heat pipes 11 are arranged in parallel in a side view.
- the respective heat pipes 11 are arranged in parallel on a line in a side view.
- the evaporation sections of the plurality of heat pipes 11 are arranged in parallel along an extending direction of the heating element 101 .
- a cross sectional shape of the heat pipe 11 in a short direction that is, a cross sectional shape in a direction orthogonal to the heat transfer direction of the heat pipe 11 is a flattened shape obtained by subjecting a circular shape to flattening process. That is, the heat pipe 11 has a flattened portion 60 whose cross sectional shape in the direction orthogonal to the heat transfer direction is flattened.
- the flattened portion 60 extends from the evaporation section corresponding to the one end portion 12 to the condensation section corresponding to the other end portion 13 .
- the flattened portion 60 includes mutually facing flat segments 61 forming a main surface, and mutually facing surfaces 62 linking the facing flat segments 61 in a thickness direction.
- the mutually facing flat segments 61 form a longitudinal direction of the flattened portion 60
- the mutually facing surfaces 62 in the thickness direction form the short direction of the flattened portion 60 .
- one of the surfaces 62 in the thickness direction is arranged on a side of the heating element 101 .
- the facing flat segments 61 adopt a mode of being erected. That is, the flattened portion 60 in the longitudinal direction adopts the mode of being erected. From the aforementioned description, the surfaces 62 in the thickness direction form a width direction of the heat pipe group.
- an increased number of the heat pipes 11 can be thermally connected to the heating element 101 without increasing an installment space of a heat reception section of the heat sink 1 as compared with a heat pipe where a shape of the heat pipe in the short direction is circular.
- the one end portion 12 is thermally connected to a first surface 31 of a heat reception plate 30 .
- the plurality of heat pipes 11 are all installed on the same surface of the heat reception plate 30 .
- the heating element 101 is thermally connected to a second surface 32 corresponding to a surface on the opposite side of the first surface 31 of the heat reception plate 30 . Therefore, each of the plurality of heat pipes 11 is thermally connected to the heating element 101 via the heat reception plate 30 .
- a cover member 110 is attached to cover the heat reception plate 30 and an upper surface of the one end portion 12 of the heat pipe 11 .
- a wick structure 51 configured to cause the liquid working fluid (not illustrated) to recirculate from the other end portion 13 to the one end portion 12 is disposed inside a container 50 of each of the heat pipes 11 .
- the wick structure 51 is a structure having capillarity. A type and a shape of the wick structure 51 are not particularly limited.
- the wick structure 51 includes a first wick structure 52 corresponding to a plurality of fine grooves, a second wick structure 53 having a protrusion portion protruding from the inner surface of the container 50 in the flat segments 61 forming the main surface of the flattened portion 60 on an inner surface of the heat pipe 11 , and a third wick structure 54 disposed in a layered manner on the surfaces 62 of the flattened portion 60 in the thickness direction on an inner surface of the container 50 of the heat pipe 11 .
- the first wick structure 52 is the plurality of fine grooves extending in the heat transfer direction on the inner surface of the container 50 .
- the first wick structure 52 is formed in the entirety of the container 50 in a circumference direction. From the aforementioned description, the first wick structure 52 is formed in the entirety of the inner surface of the container 50 .
- the second wick structure 53 includes two protrusion portions protruding in a convex manner from the inner surface of the container 50 .
- the second wick structure 53 is disposed on the first wick structure 52 .
- the second wick structure 53 also protrudes relative to the third wick structure 54 disposed in a layered manner. That is, the second wick structure 53 has a wall thickness larger than that of the third wick structure 54 .
- the two protrusion portions described above are arranged facing each other.
- the second wick structure 53 having the protrusion portions is excellent in recirculation property of the liquid working fluid as compared with the wick structures having no protrusion portions (the first wick structure 52 and the third wick structure 54 in the heat pipe 11 ).
- An area where the second wick structure 53 is disposed is not particularly limited, and can be selected depending on a use condition or the like of the heat sink 1 , but in the heat sink 1 , the second wick structure 53 extends from the one end portion 12 to the other end portion 13 of the heat pipe 11 .
- a type of the second wick structure 53 is a sintered body of metallic powder, a mesh formed of a metallic line, a metallic braided body, or the like, and is not particular limited, but in the heat pipe 11 , a sintered body of metallic powder such as copper or a copper alloy is used.
- the third wick structure 54 is formed at a substantially uniform thickness in a layered manner along the surfaces 62 of the flattened portion 60 in the thickness direction.
- the third wick structure 54 is formed to be continuous to the second wick structure 53 in a cross section in the direction orthogonal to the heat transfer direction of the heat pipe 11 .
- the third wick structure 54 is disposed on the first wick structure 52 .
- An area where the third wick structure 54 is disposed is not particularly limited, and can be selected depending on the use condition or the like of the heat sink 1 , but in the heat sink 1 , the third wick structure 54 extends from the one end portion 12 to the other end portion 13 of the heat pipe 11 .
- a type of the third wick structure 54 is a sintered body of metallic powder, a mesh formed of a metallic line, a metallic braided body, or the like, and is not particularly limited, but in the heat pipe 11 , a sintered body of metallic powder such as copper or a copper alloy is used.
- the one end portions 12 of the heat pipes 11 are arranged in parallel along the extending direction of the heating element 101 .
- the one end portions 12 of the plurality of heat pipes 11 are arranged in parallel substantially on the same plane.
- a shape of the one end portion 12 of each of the plurality of heat pipes 11 in a plan view is substantially linear, and a shape of a central portion 14 located between the one end portion 12 and the other end portion 13 in a plan view is also substantially linear. Therefore, in the plurality of heat pipes 11 , substantially linear parts in a plan view are arranged side by side from the one end portion 12 to the central portion 14 .
- each of the plurality of heat pipes 11 is substantially L-shaped in a plan view.
- the bent portion 15 of the heat pipe 11 located on a right side is bent in a right direction
- the bent portion 15 of the heat pipe 11 on a left side is bent in a left direction.
- bending directions of the bent portions 15 are opposite to each other with regard to the heat pipe 11 located on the left side and the heat pipe 11 located on the right side.
- Each of the plurality of heat pipes 11 adopts a mode where the other end portion 13 extends in a substantially parallel direction to the longitudinal direction of the heat dissipation section 40 by the bent portion 15 .
- the plurality of heat dissipation fins 41 are arranged in parallel such that a main surface (planar portion) of the heat dissipation fins 41 is arranged in a substantially parallel direction to the extending direction of the one end portion 12 of the heat pipe 11 .
- the heat dissipation fins 41 are a thin flat plate-like member.
- the other end portion 13 of the heat pipe 11 extending in the parallel direction to the longitudinal direction of the heat dissipation section 40 reaches an end portion of the heat dissipation section 40 in the longitudinal direction.
- an external shape of the heat dissipation section 40 is substantially cuboid.
- the heat dissipation section 40 adopts a structure where a first heat dissipation fin group 42 whose external shape is substantially cuboid, and a second heat dissipation fin group 43 whose external shape is substantially cuboid while being adjacent to the first heat dissipation fin group 42 are laminated.
- Both the first heat dissipation fin group 42 and the second heat dissipation fin group 43 adopt a structure where the plurality of heat dissipation fins 41 attached on a flat plate-like supporting body 45 are arranged in parallel in the substantially parallel direction to the longitudinal direction of the heat dissipation section 40 .
- the other end portion 13 of the heat pipe 11 is inserted between the first heat dissipation fin group 42 and the second heat dissipation fin group 43 .
- the heat dissipation section 40 is thermally connected to the heat pipe 11 .
- a material of the container 50 used in the heat pipe 11 is not particularly limited, and for example, copper, a copper alloy, aluminum, an aluminum alloy, stainless steel, and the like can be exemplified.
- the working fluid to be sealed in the container 50 can be appropriately selected according to compatibility with the material of the container 50 , and for example, water, fluorocarbons, cyclopentane, ethylene glycol, a mixture of these, and the like can be exemplified.
- a material of the heat dissipation fins 41 is not particularly limited, and for example, a metal such as copper and a copper alloy can be exemplified.
- the heat pipe group of the heat sink 1 is installed such that the plurality of heat pipes 11 are arranged immediately above and in the vicinity of the heating element 101 on a plane on a side of the heat reception plate 30 of the heating element 101 .
- the heat radiated from the heating element 101 is transmitted to the heat reception plate 30 .
- the heat transmitted to the heat reception plate 30 is transmitted from the heat reception plate 30 to the one end portion 12 of the heat pipe 11 .
- the heat transmitted to the one end portion 12 of the heat pipe 11 is transferred from the one end portion 12 of the heat pipe 11 to the other end portion 13 of the heat pipe 11 by a heat transfer action of the heat pipe 11 .
- the heat transferred to the other end portion 13 of the heat pipe 11 is transmitted to the heat dissipation section 40 having the plurality of heat dissipation fins 41 .
- the heat transmitted to the heat dissipation section 40 is dissipated from the heat dissipation section 40 to an external environment, it is possible to cool the heating element 101 .
- the heat pipe 11 includes the flattened portion 60 whose cross sectional shape in the orthogonal direction to the heat transfer direction of the heat pipe 11 is flattened, and the surfaces 62 of the flattened portion 60 in the thickness direction are arranged facing the heating element 101 , so that an increased number of the heat pipes 11 can be thermally connected to the heating element 101 set as the cooling target without increasing the installment space of the heat reception section of the heat sink 1 .
- the heat sink 1 in response to a state where an increased number of the heat pipes 11 can be thermally connected to the heating element 101 , an increased number of the heat pipes 11 can be thermally connected to the heat dissipation section 40 of the heat sink 1 , and a heat dissipation efficiency of the heat dissipation section 40 improves. Therefore, the heat sink 1 can exhibit the excellent cooling property for a heating element 101 even having a high heat value and being mounted to the narrowed space.
- the heat sink 1 since the evaporation sections of the plurality of heat pipes 11 (in the heat sink 1 , the one end portions 12 ) are arranged in parallel along the extending direction of the heating element 101 , it is possible to reliably and also easily thermally connect the plurality of heat pipes 11 to the heating element 101 .
- the heat sink 1 since the evaporation section of the heat pipe 11 (in the heat sink 1 , the one end portion 12 ) is thermally connected to the heat reception plate 30 , the thermal connectivity between the heat pipe 11 and the heating element 101 improves.
- the heat reception plate 30 also has an action as a heat equalizing plate configured to equalize thermal loads to the heat pipes 11 arranged in parallel, it is possible to more reliably exhibit the heat transfer property of the heat pipe 11 .
- the one end portion 12 of the first heat pipe 11 is thermally connected to the heat reception plate 30 , but instead of this, as illustrated in FIGS. 4 and 5 , the heat sink 2 according to the second embodiment adopts a mode where the heat pipe 11 from the one end portion 12 to the other end portion 13 extends from one end 33 to another end 34 of the heat reception plate 30 .
- the heat pipe 11 is thermally connected to the first surface 31 of the heat reception plate 30 .
- the heat dissipation fins 41 are elected on the first surface 31 of the heat reception plate 30 .
- the heat dissipation fins 41 are elected on the first surface 31 of the heat reception plate 30 in a vertical direction. Edge portions of the heat dissipation fins 41 are attached on the first surface 31 of the heat reception plate 30 .
- the plurality of heat dissipation fins 41 are arranged in parallel at a predetermined interval from the one end 33 to the other end 34 of the heat reception plate 30 .
- the heating element 101 is to be thermally connected to a central portion 35 of the heat reception plate 30 (that is, parts other than the one end 33 and the other end 34 of the heat reception plate 30 ). Therefore, the central portion 14 of the heat pipe 11 (that is, parts other than the one end portion 12 and the other end portion 13 ) is thermally connected to the heating element 101 to function as the evaporation section. In addition, both end portions (the one end portion 12 and the other end portion 13 ) of the heat pipe 11 are thermally connected to the heat dissipation section 40 to function as the condensation section.
- the heat pipe 11 includes the flattened portion 60 whose cross sectional shape in the orthogonal direction to the heat transfer direction of the heat pipe 11 is flattened, and the surfaces 62 of the flattened portion 60 in the thickness direction are arranged facing the heating element 101 .
- an increased number of the heat pipes 11 can be thermally connected to the heating element 101 without increasing the installment space of the heat reception section of the heat sink 2 .
- the heat sink 2 in response to a state where an increased number of the heat pipes 11 can be thermally connected to the heating element 101 , an increased number of the heat pipes 11 can be thermally connected to the heat dissipation section 40 of the heat sink 2 , and the heat dissipation efficiency of the heat dissipation section 40 improves. Therefore, the heat sink 2 can also exhibit the excellent cooling property for the heating element 101 even having the high heat value and being mounted in the narrowed space.
- the bent portion is formed in the other end portion of the heat pipe, and the heat pipe is substantially L-shaped in a plan view, but the shape of the heat pipe in a plan view is not particularly limited, and may be substantially linear, for example.
- the heat dissipation fins may be arranged in parallel such that the main surface (planar portion) of the heat dissipation fins is arranged in substantially orthogonal direction to the extending direction of one end portion of the heat pipe group.
- the heat reception plate is disposed in the heat sink according to the first and second embodiments described above, but a configuration may be adopted where the heat reception plate is not disposed depending on a use situation of the heat sink.
- the heat dissipation section is formed of the plurality of heat dissipation fins, but the mode of the heat dissipation section serving as a heat exchange unit is not particularly limited, and for example, a water cooling jacket and the like may also be used.
- the heat sink of the present disclosure can be used in an extensive field, but for example, can be used in a field where a high performance electronic part is used such as a server used in a data center or the like since an excellent cooling performance can be exhibited for the heating element even having the high heat value and being mounted into the narrowed space.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- The present application is a continuation application of International Patent Application No. PCT/JP2019/048615 filed on Dec. 12, 2019, which claims the benefit of Japanese Patent Application No. 2018-247479, filed on Dec. 28, 2018. The contents of these applications are incorporated herein by reference in their entirety.
- The present disclosure is related to a heat sink configured to cool a heating element set as a cooling target by transferring heat of the heating element to a heat dissipation section by using a heat transfer function of a heat pipe.
- Along with an enhancement of functions of an electronic device in recent years, a large number of parts including a heating element such as an electronic part have been mounted inside the electronic device at a higher density than ever. In addition, along with the enhancement of the functions of the electronic device, an amount of heat generated by the heating element such as the electronic part has increased more than ever. As a unit configured to cool the heating element such as the electronic part, a heat sink is used in some cases. To reliably and also efficiently cool even a heating element generating a high amount of heat, a heat sink where a plurality of heat pipes are thermally connected to the heating element is used in some cases.
- As the heat sink where the plurality of heat pipes are thermally connected to the heating element, for example, a heat sink exists where a large number of flat plate-like heat dissipation fins protruding to outer peripheral surfaces of a plurality of tubular heat pipes are disposed (Japanese Patent Laid-Open No. 2003-110072). The heat sink of Japanese Patent Laid-Open No. 2003-110072 is a heat sink formed in a manner that heat of the heating element is transferred to the heat dissipation fins by the plurality of tubular heat pipes, and the heat is to be dissipated from the heat dissipation fins.
- In a heat sink where the heat of the heating element is transferred from a heat reception section to the heat dissipation fins by the plurality of heat pipes such as the heat sink of Japanese Patent Laid-Open No. 2003-110072, to exhibit a cooling property for even a heating element generating a high amount of heat, it is necessary to form a heat pipe group where a large number of heat pipes are arranged in parallel, and thermally connect the heat pipe group to the heating element. On the other hand, to thermally connect the heat pipe group formed by the large number of heat pipes to the heating element, it is necessary to secure a large space for housing the heat pipe group inside the electronic device. However, since a large number of parts are mounted inside the electronic device at the higher density than ever, the heating element may also be mounted into an even narrowed space in some cases.
- Because of a constraint of the space inside the electronic device as described above, the number of installed heat pipes forming the heat pipe group may be restricted in some cases. When the number of installed heat pipes is restricted, the cooling property for the heating element generating a high amount of heat may not be sufficiently applied to the heat sink in some cases.
- The present disclosure is related to providing a heat sink that can exhibit an excellent cooling property for even a heating element generating a high amount of heat and being mounted into a narrowed space.
- A gist of the configuration of the present disclosure is as follows.
- [1] A heat sink including a plurality of heat pipes to be thermally connected to a heating element, and a heat dissipation section thermally connected to the plurality of heat pipes, in which in the plurality of heat pipes, at least evaporation sections to be thermally connected to the heating element have flattened portions whose cross sectional shape in a direction orthogonal to a heat transfer direction of the plurality of heat pipes is flattened, and surfaces in the flattened portions in a thickness direction are arranged facing the heating element.
- [2] The heat sink as described in [1], in which the evaporation section of the heat pipe is located in one end portion of the heat pipe, and a condensation section of the heat pipe to be thermally connected to the heat dissipation section is located in another end portion of the heat pipe.
- [3] The heat sink as described in [1], in which the evaporation section of the heat pipe is located in a central portion of the heat pipe, and the condensation section of the heat pipe to be thermally connected to the heat dissipation section is located in both end portions of the heat pipe.
- [4] The heat sink as described in any one of [1] to [3], in which the evaporation sections of the plurality of heat pipes are arranged in parallel along an extending direction of the heating element.
- [5] The heat sink as described in any one of [1] to [4], in which the evaporation section of the heat pipe is thermally connected to a heat reception plate, and the heat reception plate is to be thermally connected to the heating element.
- [6] The heat sink as described in any one of [1] to [5], in which the flattened portion extends from the evaporation section to the condensation section.
- [7] The heat sink as described in any one of [1] to [6], in which the heat pipe includes a first wick structure corresponding to fine grooves formed on an inner surface of a container, and a second wick structure having protrusion portions protruding from the inner surface of the container in flat segments forming a main surface of the flattened portion.
- [8] The heat sink as described in [7], in which the heat pipe further includes a third wick structure disposed in a layered manner on an inner surface of the flattened portion in the thickness direction.
- In accordance with a mode of the heat sink of the present disclosure, since at least the evaporation section in the heat pipe has the flattened portion whose cross sectional shape in the direction orthogonal to the heat transfer direction of the heat pipe is flattened and the surface in the flattened portion in a thickness direction is arranged facing the heating element, an increased number of heat pipes can be thermally connected to the heating element set as the cooling target without increasing an installment space of the heat reception section of the heat sink. In addition, in accordance with a mode of the heat sink of the present disclosure, an increased number of heat pipes can be thermally connected to the heat dissipation section of the heat sink. Therefore, in accordance with a mode of the heat sink of the present disclosure, a heat dissipation efficiency of the heat dissipation section improves, and the excellent cooling property can be exhibited for the heating element even having the high heat value mounted into the narrowed space.
- In accordance with a mode of the heat sink of the present disclosure, since the one end portions or central portions of the plurality of heat pipes are arranged in parallel along the extending direction of the heating element, the plurality of heat pipes can be reliably and also easily thermally connected to the heating element.
- In accordance with a mode of the heat sink of the present disclosure, since the one end portion or central portion of the heat pipe is thermally connected to the heat reception plate, a thermal connectivity between the heat pipe and the heating element improves. In addition, the heat reception plate also has an action as a heat equalizing plate configured to equalize thermal loads to the respective heat pipes arranged in parallel, and can more reliably exhibit heat transfer properties of the respective heat pipes.
- In accordance with a mode of the heat sink of the present disclosure, since the heat pipe includes the first wick structure corresponding to the fine grooves formed on the inner surface of the container and the second wick structure having the protrusion portions protruding from the inner surface of the container in the flat segments forming the main surface of the flattened portion, a liquid working fluid can be smoothly recirculated to the flattened portion. Thus, even the heat pipe having the flattened portion in the evaporation section can exhibit the excellent heat transfer property.
- In accordance with a mode of the heat sink of the present disclosure, since the heat pipe further includes the third wick structure disposed in the layered manner on the inner surface of the flattened section in the thickness direction, the liquid working fluid can be more smoothly recirculated to the flattened portion. Thus, even the heat pipe having the flattened portion in the evaporation section can exhibit the more excellent heat transfer property.
-
FIG. 1 is a perspective view of a heat sink according to a first embodiment of the present disclosure. -
FIG. 2 is a plan view of the heat sink according to the first embodiment of the present disclosure. -
FIG. 3 is a side view of one end portion of the heat sink according to the first embodiment of the present disclosure. -
FIG. 4 is a plan view of a heat sink according to a second embodiment of the present disclosure. -
FIG. 5 is a side view of the heat sink according to the second embodiment of the present disclosure. -
FIG. 6 is an explanatory view of a cross section A-A inFIG. 4 of the heat sink according to the second embodiment of the present disclosure. -
FIG. 7 is an explanatory view of a wick structure disposed in heat pipes provided to the heat sink according to the present disclosure. - Hereafter, a heat sink according to a first embodiment of the present disclosure will be described with reference to the drawings.
FIG. 1 is a perspective view of the heat sink according to the first embodiment of the present disclosure.FIG. 2 is a plan view of the heat sink according to the first embodiment of the present disclosure.FIG. 3 is a side view of one end portion of the heat sink according to the first embodiment of the present disclosure.FIG. 4 is a plan view of a heat sink according to a second embodiment of the present disclosure.FIG. 5 is a side view of the heat sink according to the second embodiment of the present disclosure.FIG. 6 is an explanatory view of a cross section A-A inFIG. 4 of the heat sink according to the second embodiment of the present disclosure.FIG. 7 is an explanatory view of a wick structure disposed in heat pipes provided to the heat sink according to the present disclosure. - As illustrated in
FIGS. 1 to 3 , aheat sink 1 according to the first embodiment includes a plurality ofheat pipes 11 thermally connected to aheating element 101 set as a cooling target of theheat sink 1, and aheat dissipation section 40. The plurality ofheat pipes 11 are commonly thermally connected to theheat dissipation section 40. Theheat dissipation section 40 has a plurality of heat dissipation fins 41. Theheat pipe 11 is a heat transfer member having an internal space sealed and subjected to decompression treatment. A working fluid (not illustrated) is sealed in the internal space of theheat pipe 11. - In each of the plurality of
heat pipes 11, oneend portion 12 is thermally connected to theheating element 101, and anotherend portion 13 is thermally connected to theheat dissipation section 40. Therefore, in each of the plurality ofheat pipes 11, the oneend portion 12 functions as an evaporation section, and theother end portion 13 functions as a condensation section. In each of the plurality ofheat pipes 11, a longitudinal direction linking the oneend portion 12 to theother end portion 13 corresponds to a heat transfer direction. In theheat sink 1, a heat pipe group is formed in the plurality (four, inFIGS. 1 to 3 ) ofheat pipes 11. In the heat pipe group, therespective heat pipes 11 are arranged in parallel in a side view. In theheat sink 1, therespective heat pipes 11 are arranged in parallel on a line in a side view. In addition, the evaporation sections of the plurality ofheat pipes 11 are arranged in parallel along an extending direction of theheating element 101. - In each of the plurality of
heat pipes 11, a cross sectional shape of theheat pipe 11 in a short direction, that is, a cross sectional shape in a direction orthogonal to the heat transfer direction of theheat pipe 11 is a flattened shape obtained by subjecting a circular shape to flattening process. That is, theheat pipe 11 has a flattenedportion 60 whose cross sectional shape in the direction orthogonal to the heat transfer direction is flattened. In the heat sink of the present disclosure, in terms of space saving in a thermal connection portion with the heating element, it is sufficient when at least a part of the evaporation section in the heat pipe has the flattened portion, but in theheat pipe 11, the flattenedportion 60 extends from the evaporation section corresponding to the oneend portion 12 to the condensation section corresponding to theother end portion 13. - The flattened
portion 60 includes mutually facingflat segments 61 forming a main surface, and mutually facingsurfaces 62 linking the facingflat segments 61 in a thickness direction. The mutually facingflat segments 61 form a longitudinal direction of the flattenedportion 60, and the mutually facingsurfaces 62 in the thickness direction form the short direction of the flattenedportion 60. In the flattenedportion 60, one of thesurfaces 62 in the thickness direction is arranged on a side of theheating element 101. In addition, the facingflat segments 61 adopt a mode of being erected. That is, the flattenedportion 60 in the longitudinal direction adopts the mode of being erected. From the aforementioned description, thesurfaces 62 in the thickness direction form a width direction of the heat pipe group. - Therefore, in the
heat sink 1, an increased number of theheat pipes 11 can be thermally connected to theheating element 101 without increasing an installment space of a heat reception section of theheat sink 1 as compared with a heat pipe where a shape of the heat pipe in the short direction is circular. - As illustrated in
FIG. 3 , in theheat pipe 11, the oneend portion 12 is thermally connected to afirst surface 31 of aheat reception plate 30. The plurality ofheat pipes 11 are all installed on the same surface of theheat reception plate 30. Theheating element 101 is thermally connected to asecond surface 32 corresponding to a surface on the opposite side of thefirst surface 31 of theheat reception plate 30. Therefore, each of the plurality ofheat pipes 11 is thermally connected to theheating element 101 via theheat reception plate 30. It is noted that in theheat sink 1, acover member 110 is attached to cover theheat reception plate 30 and an upper surface of the oneend portion 12 of theheat pipe 11. - As illustrated in
FIG. 7 , awick structure 51 configured to cause the liquid working fluid (not illustrated) to recirculate from theother end portion 13 to the oneend portion 12 is disposed inside acontainer 50 of each of theheat pipes 11. Thewick structure 51 is a structure having capillarity. A type and a shape of thewick structure 51 are not particularly limited. In theheat pipe 11, thewick structure 51 includes afirst wick structure 52 corresponding to a plurality of fine grooves, a second wick structure 53 having a protrusion portion protruding from the inner surface of thecontainer 50 in theflat segments 61 forming the main surface of the flattenedportion 60 on an inner surface of theheat pipe 11, and athird wick structure 54 disposed in a layered manner on thesurfaces 62 of the flattenedportion 60 in the thickness direction on an inner surface of thecontainer 50 of theheat pipe 11. - The
first wick structure 52 is the plurality of fine grooves extending in the heat transfer direction on the inner surface of thecontainer 50. In addition, thefirst wick structure 52 is formed in the entirety of thecontainer 50 in a circumference direction. From the aforementioned description, thefirst wick structure 52 is formed in the entirety of the inner surface of thecontainer 50. - The second wick structure 53 includes two protrusion portions protruding in a convex manner from the inner surface of the
container 50. The second wick structure 53 is disposed on thefirst wick structure 52. In addition, the second wick structure 53 also protrudes relative to thethird wick structure 54 disposed in a layered manner. That is, the second wick structure 53 has a wall thickness larger than that of thethird wick structure 54. In addition, the two protrusion portions described above are arranged facing each other. The second wick structure 53 having the protrusion portions is excellent in recirculation property of the liquid working fluid as compared with the wick structures having no protrusion portions (thefirst wick structure 52 and thethird wick structure 54 in the heat pipe 11). Therefore, since the liquid working fluid can be smoothly recirculated to the evaporation section corresponding to the flattenedportion 60, even theheat pipe 11 having the flattenedportion 60 in the evaporation section can exhibit the excellent heat transfer property. An area where the second wick structure 53 is disposed is not particularly limited, and can be selected depending on a use condition or the like of theheat sink 1, but in theheat sink 1, the second wick structure 53 extends from the oneend portion 12 to theother end portion 13 of theheat pipe 11. - A type of the second wick structure 53 is a sintered body of metallic powder, a mesh formed of a metallic line, a metallic braided body, or the like, and is not particular limited, but in the
heat pipe 11, a sintered body of metallic powder such as copper or a copper alloy is used. - The
third wick structure 54 is formed at a substantially uniform thickness in a layered manner along thesurfaces 62 of the flattenedportion 60 in the thickness direction. In addition, thethird wick structure 54 is formed to be continuous to the second wick structure 53 in a cross section in the direction orthogonal to the heat transfer direction of theheat pipe 11. Thethird wick structure 54 is disposed on thefirst wick structure 52. An area where thethird wick structure 54 is disposed is not particularly limited, and can be selected depending on the use condition or the like of theheat sink 1, but in theheat sink 1, thethird wick structure 54 extends from the oneend portion 12 to theother end portion 13 of theheat pipe 11. It is noted that on thesurfaces 62 of the flattenedportion 60 in the thickness direction, since the capillarity of thefirst wick structure 52 contributes to the recirculation of the liquid working fluid to the evaporation section, a configuration may also be adopted where thethird wick structure 54 is not disposed depending on the use condition or the like of theheat sink 1. - A type of the
third wick structure 54 is a sintered body of metallic powder, a mesh formed of a metallic line, a metallic braided body, or the like, and is not particularly limited, but in theheat pipe 11, a sintered body of metallic powder such as copper or a copper alloy is used. - As illustrated in
FIGS. 1 to 3 , the oneend portions 12 of theheat pipes 11 are arranged in parallel along the extending direction of theheating element 101. In addition, the oneend portions 12 of the plurality ofheat pipes 11 are arranged in parallel substantially on the same plane. - As illustrated in
FIG. 2 , a shape of the oneend portion 12 of each of the plurality ofheat pipes 11 in a plan view is substantially linear, and a shape of acentral portion 14 located between the oneend portion 12 and theother end portion 13 in a plan view is also substantially linear. Therefore, in the plurality ofheat pipes 11, substantially linear parts in a plan view are arranged side by side from the oneend portion 12 to thecentral portion 14. - In the
heat sink 1, with regard to theheat pipe 11, abent portion 15 is formed in theother end portion 13 thermally connected to theheat dissipation section 40. Therefore, each of the plurality ofheat pipes 11 is substantially L-shaped in a plan view. In addition, thebent portion 15 of theheat pipe 11 located on a right side is bent in a right direction, and thebent portion 15 of theheat pipe 11 on a left side is bent in a left direction. In other words, bending directions of thebent portions 15 are opposite to each other with regard to theheat pipe 11 located on the left side and theheat pipe 11 located on the right side. - Each of the plurality of
heat pipes 11 adopts a mode where theother end portion 13 extends in a substantially parallel direction to the longitudinal direction of theheat dissipation section 40 by thebent portion 15. In theheat dissipation section 40, the plurality ofheat dissipation fins 41 are arranged in parallel such that a main surface (planar portion) of theheat dissipation fins 41 is arranged in a substantially parallel direction to the extending direction of the oneend portion 12 of theheat pipe 11. Theheat dissipation fins 41 are a thin flat plate-like member. In theheat sink 1, theother end portion 13 of theheat pipe 11 extending in the parallel direction to the longitudinal direction of theheat dissipation section 40 reaches an end portion of theheat dissipation section 40 in the longitudinal direction. - As illustrated in
FIG. 1 , an external shape of theheat dissipation section 40 is substantially cuboid. Theheat dissipation section 40 adopts a structure where a first heatdissipation fin group 42 whose external shape is substantially cuboid, and a second heatdissipation fin group 43 whose external shape is substantially cuboid while being adjacent to the first heatdissipation fin group 42 are laminated. Both the first heatdissipation fin group 42 and the second heatdissipation fin group 43 adopt a structure where the plurality ofheat dissipation fins 41 attached on a flat plate-like supportingbody 45 are arranged in parallel in the substantially parallel direction to the longitudinal direction of theheat dissipation section 40. - The
other end portion 13 of theheat pipe 11 is inserted between the first heatdissipation fin group 42 and the second heatdissipation fin group 43. When theother end portion 13 is arranged between the first heatdissipation fin group 42 and the second heatdissipation fin group 43, theheat dissipation section 40 is thermally connected to theheat pipe 11. - A material of the
container 50 used in theheat pipe 11 is not particularly limited, and for example, copper, a copper alloy, aluminum, an aluminum alloy, stainless steel, and the like can be exemplified. In addition, the working fluid to be sealed in thecontainer 50 can be appropriately selected according to compatibility with the material of thecontainer 50, and for example, water, fluorocarbons, cyclopentane, ethylene glycol, a mixture of these, and the like can be exemplified. In addition, a material of theheat dissipation fins 41 is not particularly limited, and for example, a metal such as copper and a copper alloy can be exemplified. - Next, a use method example of the
heat sink 1 according to the first embodiment will be described. As illustrated inFIG. 3 , the heat pipe group of theheat sink 1 is installed such that the plurality ofheat pipes 11 are arranged immediately above and in the vicinity of theheating element 101 on a plane on a side of theheat reception plate 30 of theheating element 101. The heat radiated from theheating element 101 is transmitted to theheat reception plate 30. The heat transmitted to theheat reception plate 30 is transmitted from theheat reception plate 30 to the oneend portion 12 of theheat pipe 11. The heat transmitted to the oneend portion 12 of theheat pipe 11 is transferred from the oneend portion 12 of theheat pipe 11 to theother end portion 13 of theheat pipe 11 by a heat transfer action of theheat pipe 11. The heat transferred to theother end portion 13 of theheat pipe 11 is transmitted to theheat dissipation section 40 having the plurality ofheat dissipation fins 41. When the heat transmitted to theheat dissipation section 40 is dissipated from theheat dissipation section 40 to an external environment, it is possible to cool theheating element 101. - At this time, the
heat pipe 11 includes the flattenedportion 60 whose cross sectional shape in the orthogonal direction to the heat transfer direction of theheat pipe 11 is flattened, and thesurfaces 62 of the flattenedportion 60 in the thickness direction are arranged facing theheating element 101, so that an increased number of theheat pipes 11 can be thermally connected to theheating element 101 set as the cooling target without increasing the installment space of the heat reception section of theheat sink 1. In addition, in theheat sink 1, in response to a state where an increased number of theheat pipes 11 can be thermally connected to theheating element 101, an increased number of theheat pipes 11 can be thermally connected to theheat dissipation section 40 of theheat sink 1, and a heat dissipation efficiency of theheat dissipation section 40 improves. Therefore, theheat sink 1 can exhibit the excellent cooling property for aheating element 101 even having a high heat value and being mounted to the narrowed space. - In addition, in the
heat sink 1, since the evaporation sections of the plurality of heat pipes 11 (in theheat sink 1, the one end portions 12) are arranged in parallel along the extending direction of theheating element 101, it is possible to reliably and also easily thermally connect the plurality ofheat pipes 11 to theheating element 101. - In addition, in the
heat sink 1, since the evaporation section of the heat pipe 11 (in theheat sink 1, the one end portion 12) is thermally connected to theheat reception plate 30, the thermal connectivity between theheat pipe 11 and theheating element 101 improves. In addition, since theheat reception plate 30 also has an action as a heat equalizing plate configured to equalize thermal loads to theheat pipes 11 arranged in parallel, it is possible to more reliably exhibit the heat transfer property of theheat pipe 11. - Next, a heat sink according to a second embodiment of the present disclosure will be described with reference to the drawings. It is noted that with regard to the heat sink according to the second embodiment, since a main configuration is the same as that of the heat sink according to the first embodiment, the same components as those of the heat sink according to the first embodiment will be described by using the same reference signs.
- In the
heat sink 1 according to the first embodiment, the oneend portion 12 of thefirst heat pipe 11 is thermally connected to theheat reception plate 30, but instead of this, as illustrated inFIGS. 4 and 5 , the heat sink 2 according to the second embodiment adopts a mode where theheat pipe 11 from the oneend portion 12 to theother end portion 13 extends from oneend 33 to anotherend 34 of theheat reception plate 30. In addition, as illustrated inFIGS. 5 and 6 , theheat pipe 11 is thermally connected to thefirst surface 31 of theheat reception plate 30. - The
heat dissipation fins 41 are elected on thefirst surface 31 of theheat reception plate 30. In a heat sink 2, theheat dissipation fins 41 are elected on thefirst surface 31 of theheat reception plate 30 in a vertical direction. Edge portions of theheat dissipation fins 41 are attached on thefirst surface 31 of theheat reception plate 30. In addition, as theheat dissipation section 40, the plurality ofheat dissipation fins 41 are arranged in parallel at a predetermined interval from the oneend 33 to theother end 34 of theheat reception plate 30. - The
heating element 101 is to be thermally connected to acentral portion 35 of the heat reception plate 30 (that is, parts other than the oneend 33 and theother end 34 of the heat reception plate 30). Therefore, thecentral portion 14 of the heat pipe 11 (that is, parts other than the oneend portion 12 and the other end portion 13) is thermally connected to theheating element 101 to function as the evaporation section. In addition, both end portions (the oneend portion 12 and the other end portion 13) of theheat pipe 11 are thermally connected to theheat dissipation section 40 to function as the condensation section. - It is noted that with regard to the heat sink 2, slight bending is formed in the
heat pipe 11 such that theheat pipe 11 approaches the central portion in the orthogonal direction to the longitudinal direction of theheat pipe 11 in thecentral portion 35 of theheat reception plate 30. According to the mode described above, it is possible to improve the thermal connectivity between the heat pipe group and theheating element 101. - Also in the heat sink 2 where the
heating element 101 is thermally connected to thecentral portion 14 of theheat pipe 11, theheat pipe 11 includes the flattenedportion 60 whose cross sectional shape in the orthogonal direction to the heat transfer direction of theheat pipe 11 is flattened, and thesurfaces 62 of the flattenedportion 60 in the thickness direction are arranged facing theheating element 101. Thus, an increased number of theheat pipes 11 can be thermally connected to theheating element 101 without increasing the installment space of the heat reception section of the heat sink 2. In addition, also in the heat sink 2, in response to a state where an increased number of theheat pipes 11 can be thermally connected to theheating element 101, an increased number of theheat pipes 11 can be thermally connected to theheat dissipation section 40 of the heat sink 2, and the heat dissipation efficiency of theheat dissipation section 40 improves. Therefore, the heat sink 2 can also exhibit the excellent cooling property for theheating element 101 even having the high heat value and being mounted in the narrowed space. - Next, other embodiments of the present disclosure will be described. In the heat sink according to the first embodiment described above, the bent portion is formed in the other end portion of the heat pipe, and the heat pipe is substantially L-shaped in a plan view, but the shape of the heat pipe in a plan view is not particularly limited, and may be substantially linear, for example. In this case, the heat dissipation fins may be arranged in parallel such that the main surface (planar portion) of the heat dissipation fins is arranged in substantially orthogonal direction to the extending direction of one end portion of the heat pipe group.
- The heat reception plate is disposed in the heat sink according to the first and second embodiments described above, but a configuration may be adopted where the heat reception plate is not disposed depending on a use situation of the heat sink. In addition, in the heat sink according to the first and second embodiments described above, the heat dissipation section is formed of the plurality of heat dissipation fins, but the mode of the heat dissipation section serving as a heat exchange unit is not particularly limited, and for example, a water cooling jacket and the like may also be used.
- The heat sink of the present disclosure can be used in an extensive field, but for example, can be used in a field where a high performance electronic part is used such as a server used in a data center or the like since an excellent cooling performance can be exhibited for the heating element even having the high heat value and being mounted into the narrowed space.
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018247479A JP6606267B1 (en) | 2018-12-28 | 2018-12-28 | heatsink |
JP2018-247479 | 2018-12-28 | ||
PCT/JP2019/048615 WO2020137569A1 (en) | 2018-12-28 | 2019-12-12 | Heatsink |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/048615 Continuation WO2020137569A1 (en) | 2018-12-28 | 2019-12-12 | Heatsink |
Publications (1)
Publication Number | Publication Date |
---|---|
US20210018272A1 true US20210018272A1 (en) | 2021-01-21 |
Family
ID=68532280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/039,658 Pending US20210018272A1 (en) | 2018-12-28 | 2020-09-30 | Heat sink |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210018272A1 (en) |
JP (1) | JP6606267B1 (en) |
CN (1) | CN213042908U (en) |
TW (1) | TWI722736B (en) |
WO (1) | WO2020137569A1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220136778A1 (en) * | 2020-11-05 | 2022-05-05 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Heat pipe and heat dissipation structure |
US20220146206A1 (en) * | 2019-04-29 | 2022-05-12 | Sunon Electronics (Kunshan) Co., Ltd. | Cooling module |
USD954005S1 (en) | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
US20220299273A1 (en) * | 2021-03-16 | 2022-09-22 | Fujitsu Limited | Cooling device |
USD971862S1 (en) * | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
US20230013442A1 (en) * | 2021-07-16 | 2023-01-19 | Asia Vital Components Co., Ltd. | Thermal module |
US20230102571A1 (en) * | 2020-03-27 | 2023-03-30 | Sony Interactive Entertainment Inc. | Heat radiating device and electronic apparatus |
US20230247799A1 (en) * | 2022-02-01 | 2023-08-03 | Cisco Technology, Inc. | Heat pipe with localized heatsink |
US20240102741A1 (en) * | 2022-09-22 | 2024-03-28 | Amulaire Thermal Technology, Inc. | Heat dissipation structure having heat pipe |
USD1026838S1 (en) * | 2022-04-26 | 2024-05-14 | Taiwan Microloops Corp. | Heat dissipation module |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022181344A1 (en) * | 2021-02-25 | 2022-09-01 | 日本電産株式会社 | Cooling device |
WO2022181343A1 (en) * | 2021-02-25 | 2022-09-01 | 日本電産株式会社 | Cooling device |
TW202239587A (en) | 2021-03-04 | 2022-10-16 | 宸寰科技有限公司 | Thin encapsulating attachment structure |
JP7235922B1 (en) | 2022-07-26 | 2023-03-08 | 古河電気工業株式会社 | heat sink |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100270007A1 (en) * | 2009-04-23 | 2010-10-28 | Wen-Te Lin | Heat sink |
CN102449423A (en) * | 2009-07-21 | 2012-05-09 | 古河电气工业株式会社 | Flattened heat pipe, and method for manufacturing the heat pipe |
EP2328172B1 (en) * | 2009-10-02 | 2019-06-26 | Abb Research Ltd. | A power-electronic arrangement |
US20120048517A1 (en) * | 2010-08-31 | 2012-03-01 | Kunshan Jue-Chung Electronics Co., | Heat pipe with composite wick structure |
JP3164517U (en) * | 2010-09-22 | 2010-12-02 | 超▲しゅう▼科技股▲ふん▼有限公司 | Heat pipe composite wick structure |
US20120312508A1 (en) * | 2011-06-08 | 2012-12-13 | Shen Chih-Yeh | Gapless heat pipe combination structure and combination method thereof |
JP5902404B2 (en) * | 2011-06-10 | 2016-04-13 | 株式会社フジクラ | Flat heat pipe and method of manufacturing the same |
US20130037242A1 (en) * | 2011-08-09 | 2013-02-14 | Cooler Master Co., Ltd. | Thin-type heat pipe structure |
US20130213612A1 (en) * | 2012-02-22 | 2013-08-22 | Chun-Ming Wu | Heat pipe heat dissipation structure |
JP2013195001A (en) * | 2012-03-21 | 2013-09-30 | Furukawa Electric Co Ltd:The | Heat pipe and heat radiation apparatus incorporating the same |
JP5567059B2 (en) * | 2012-04-05 | 2014-08-06 | 古河電気工業株式会社 | Thin heat pipe |
TWM449938U (en) * | 2012-11-01 | 2013-04-01 | yu-xuan Chen | Heat-receiving terminal contact structure for thin type heat pipe |
CN103868386A (en) * | 2012-12-17 | 2014-06-18 | 富瑞精密组件(昆山)有限公司 | Flat plate heat pipe and manufacturing method thereof |
CN106767071A (en) * | 2017-01-23 | 2017-05-31 | 中车大连机车研究所有限公司 | A kind of fine and soft shape wing fiber composite plough groove type abnormity heat pipe and preparation method thereof |
TWI661171B (en) * | 2017-06-23 | 2019-06-01 | 日商古河電氣工業股份有限公司 | Heat pipe |
-
2018
- 2018-12-28 JP JP2018247479A patent/JP6606267B1/en active Active
-
2019
- 2019-12-12 CN CN201990000594.2U patent/CN213042908U/en active Active
- 2019-12-12 WO PCT/JP2019/048615 patent/WO2020137569A1/en active Application Filing
- 2019-12-25 TW TW108147553A patent/TWI722736B/en active
-
2020
- 2020-09-30 US US17/039,658 patent/US20210018272A1/en active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD971862S1 (en) * | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
US20220146206A1 (en) * | 2019-04-29 | 2022-05-12 | Sunon Electronics (Kunshan) Co., Ltd. | Cooling module |
USD954005S1 (en) | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
US20230102571A1 (en) * | 2020-03-27 | 2023-03-30 | Sony Interactive Entertainment Inc. | Heat radiating device and electronic apparatus |
US20220136778A1 (en) * | 2020-11-05 | 2022-05-05 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Heat pipe and heat dissipation structure |
US11774180B2 (en) * | 2020-11-05 | 2023-10-03 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Heat pipe and heat dissipation structure |
US20220299273A1 (en) * | 2021-03-16 | 2022-09-22 | Fujitsu Limited | Cooling device |
US11892246B2 (en) * | 2021-03-16 | 2024-02-06 | Fujitsu Limited | Cooling device |
US20240125561A1 (en) * | 2021-03-16 | 2024-04-18 | Fujitsu Limited | Cooling device |
US20230013442A1 (en) * | 2021-07-16 | 2023-01-19 | Asia Vital Components Co., Ltd. | Thermal module |
US20230247799A1 (en) * | 2022-02-01 | 2023-08-03 | Cisco Technology, Inc. | Heat pipe with localized heatsink |
USD1026838S1 (en) * | 2022-04-26 | 2024-05-14 | Taiwan Microloops Corp. | Heat dissipation module |
US20240102741A1 (en) * | 2022-09-22 | 2024-03-28 | Amulaire Thermal Technology, Inc. | Heat dissipation structure having heat pipe |
Also Published As
Publication number | Publication date |
---|---|
JP6606267B1 (en) | 2019-11-13 |
CN213042908U (en) | 2021-04-23 |
TWI722736B (en) | 2021-03-21 |
TW202026583A (en) | 2020-07-16 |
WO2020137569A1 (en) | 2020-07-02 |
JP2020106245A (en) | 2020-07-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20210018272A1 (en) | Heat sink | |
US11150028B2 (en) | Cooling device with superimposed fin groups and parallel heatpipes | |
CN212673920U (en) | Heat radiator | |
CN212991086U (en) | Heat radiator | |
KR100612810B1 (en) | Electronic appliance | |
KR20180061271A (en) | Multi-level oscillating heat pipe implementation in electronic circuit card module | |
US11112186B2 (en) | Heat pipe heatsink with internal structural support plate | |
US10004159B2 (en) | Water-cooling radiator unit and device thereof | |
WO2017061408A1 (en) | Heat sink | |
US9772143B2 (en) | Thermal module | |
US10378836B2 (en) | Water-cooling radiator assembly | |
US11039549B2 (en) | Heat transferring module | |
JP5546280B2 (en) | Connection part of heat pipe heat receiving part and connection method of heat pipe heat receiving part | |
JP2012129379A (en) | Radiation fin | |
US10352625B2 (en) | Thermal module | |
CN211575950U (en) | Heat radiator | |
JP5117303B2 (en) | heatsink | |
US20190137187A1 (en) | Heat sink structure | |
US20240183628A1 (en) | Heat sink | |
WO2024024712A1 (en) | Heat sink | |
CN219919561U (en) | Heat radiation structure and heat radiation device | |
CN217985855U (en) | Phase change heat sink and electronic device having the same | |
JP2004186366A (en) | Heat-transfer fin and heat sink | |
KR101765153B1 (en) | Radiator for air cooling type | |
KR20190094041A (en) | Heat spreader and electronic device comprising the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FURUKAWA ELECTRIC CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:INAGAKI, YOSHIKATSU;UCHIMURA, YASUHIRO;HIKICHI, SHUTA;AND OTHERS;SIGNING DATES FROM 20200528 TO 20200605;REEL/FRAME:053939/0499 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: APPLICATION DISPATCHED FROM PREEXAM, NOT YET DOCKETED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |