CN103868386A - Flat plate heat pipe and manufacturing method thereof - Google Patents
Flat plate heat pipe and manufacturing method thereof Download PDFInfo
- Publication number
- CN103868386A CN103868386A CN201210547166.6A CN201210547166A CN103868386A CN 103868386 A CN103868386 A CN 103868386A CN 201210547166 A CN201210547166 A CN 201210547166A CN 103868386 A CN103868386 A CN 103868386A
- Authority
- CN
- China
- Prior art keywords
- capillary structure
- capillary
- heat pipe
- flat
- plate heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Abstract
A flat plate heat pipe is provided with an evaporation section, a heat transfer section and a condensation section which are connected in sequence. The flat plate heat pipe comprises a casing and a capillary structure adhering to the casing. The capillary structure comprises a first capillary structure located on the evaporation section, a second capillary structure and a third capillary structure, wherein the second capillary structure is connected with the first capillary structure and extending from the heat transfer section to the condensation section; and the third capillary structure is connected with the first capillary structure and the second capillary structure and penetrates the evaporation section, the heat transfer section and the condensation section. Capillary force of the first capillary structure is larger than that of the third capillary structure. When the flat plate heat pipe is in use, due to the fact that the capillary force of the first capillary structure is larger than that of the third capillary structure, working fluid accommodated in the third capillary structure can rapidly flow back to the first capillary structure from the third capillary structure under the traction of the capillary force so as to avoid dry burning of the first capillary structure, and working performance of the flat plate heat pipe is guaranteed. The invention further relates to a method for preparation of the flat plate heat pipe.
Description
Technical field
The present invention relates to a kind of heat pipe, particularly a kind of flat-plate heat pipe.
Background technology
The operation principle of flat-plate heat pipe is identical with conventional heat pipe, because it has the heat transfer area larger than conventional heat pipe, and meets the high practical value of " light, thin, short, little ", and is widely applied on the electronic product with larger radiating surface.
Traditional flat-plate heat pipe comprises a metal shell and is attached at a metal shell inner surface continuous capillary structure everywhere.Capillary structure encloses a steam channel in the inner.Described flat-plate heat pipe is gone up along its length and can be divided into successively the condensation segment that the evaporator section that contacts with thermal source and spontaneous evaporation section are extended.Described capillary structure comprises the first capillary structure that is positioned at evaporating section and the second capillary structure that is positioned at condensation segment place.Described the first capillary structure, the second capillary structure shape and thickness are identical.When flat-plate heat pipe work, the hydraulic fluid in the first capillary structure attracts to be back to the first capillary structure place from the second capillary structure through capillary force because entered after steam channel arrives condensation segment heat release cooling liquid by thermal evaporation.Prevent the first capillary structure dry combustion method in order to make the hydraulic fluid at the second capillary structure place be back to fast the first capillary structure place, must guarantee that the first capillary structure has high capillary force, the second capillary structure has low capillary power.But, because shape and the thickness of the first capillary structure and the second capillary structure are identical, therefore, capillary force is everywhere identical, cannot meet the heat pipe different requirements to the first capillary structure and the second capillary structure performance everywhere simultaneously, thereby cause the heat transfer property of flat-plate heat pipe not good.
Summary of the invention
In view of this, be necessary to provide a kind of manufacture method of flat plate heat tube and the described flat-plate heat pipe with good heat transfer capacity.
A kind of flat-plate heat pipe, there is the evaporator section, heat transfer segment and the condensation segment that are linked in sequence, described flat-plate heat pipe comprises housing and is attached at the capillary structure on housing, described capillary structure comprises and is positioned at the first capillary structure of evaporator section, is connected and extends to the second capillary structure of condensation segment and be connected and run through the 3rd capillary structure of evaporator section, heat transfer segment and condensation segment with the first capillary structure and the second capillary structure from heat transfer segment with the first capillary structure, and the capillary force of described the first capillary structure is greater than the capillary force of the 3rd capillary structure.
A manufacture method with the flat-plate heat pipe of the evaporator section, heat transfer segment and the condensation segment that are linked in sequence, comprises the following steps:
Provide one end to there is the flat housing of opening;
Provide a tool fluted mould, described mould is positioned in described housing and makes the heat transfer segment of the corresponding heat pipe of inner surface of described housing and condensation segment place be formed with in a longitudinal direction the second capillary structure of channel form;
Provide some metal-powders, described powder sintering and form the first capillary structure of the evaporating section that is positioned at heat pipe;
Some tinsels are provided, and these tinsels are wound around mutually and form described the 3rd capillary structure, described the 3rd capillary structure runs through evaporator section, heat transfer segment and condensation segment, and one end of described the 3rd capillary structure is formed on the first capillary structure, the other end is formed on the second capillary structure relatively;
Then housing vacuumized and inject hydraulic fluid and sealing, wherein, the capillary force of described the first capillary structure is greater than the capillary force of the 3rd capillary structure.
Compared with prior art, flat-plate heat pipe in use, the capillary force of cause the first capillary structure is greater than the capillary force of the 3rd capillary structure, be housed in hydraulic fluid in the 3rd capillary structure under the traction of capillary force, thereby can be back to the first capillary structure from the 3rd capillary structure fast and avoid the first capillary structure dry combustion method, ensure the service behaviour of flat-plate heat pipe.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Accompanying drawing explanation
Fig. 1 is the longitudinal sectional view of the flat-plate heat pipe of first embodiment of the invention.
Fig. 2 is that the evaporator section of flat-plate heat pipe shown in Fig. 1 is along the transverse sectional view of II-II line.
Fig. 3 is that the condensation segment of flat-plate heat pipe shown in Fig. 1 is along the transverse sectional view of III-III line.
Fig. 4 is the longitudinal sectional view of the flat-plate heat pipe of second embodiment of the invention.
Fig. 5 is that the evaporator section of flat-plate heat pipe shown in Fig. 4 is along the transverse sectional view of V-V line.
Main element symbol description
| Flat- |
1、 |
| Evaporator section | |
| 11、11a | |
| |
13 |
| |
15 |
| |
50 |
| The first |
51、51a |
| The second |
53、53a |
| The 3rd |
55 |
| |
531 |
| |
533 |
The following specific embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
The specific embodiment
As shown in Figure 1 to Figure 3, be the flat-plate heat pipe 1 of first embodiment of the invention.The body that described flat-plate heat pipe 1 is lengthwise, is followed successively by the evaporator section 11, a heat transfer segment 13 and the condensation segment 15 that are linked in sequence along its length.Described flat-plate heat pipe 1 comprises a housing 30, is attached at the capillary structure 50 of housing 30 inner surfaces and is contained in the hydraulic fluid (not shown) in capillary structure 50.Described housing 30 is the flat body of interior sky and lengthwise, its deep equality everywhere and opposite end sealing.The cross section of described housing 30 is track type.
Described capillary structure 50 comprises and is positioned at first capillary structure 51 at evaporator section 11 places, is connected and extends to one second capillary structure 53 of condensation segment 15 and be connected and run through one the 3rd capillary structure 55 of evaporator section 11, heat transfer segment 13 and condensation segment 15 with the first capillary structure 51 and the second capillary structure 53 from heat transfer segment 13 with the first capillary structure 51.The capillary force of described the second capillary structure 53 is less than the capillary force of the first capillary structure 51 and is greater than the capillary force of the 3rd capillary structure 55.The porosity of described the second capillary structure 53 is greater than the porosity of the first capillary structure 51 and is less than the porosity of the 3rd capillary structure 55.
The track type circulus of described the first capillary structure 51 for being formed by metal-powder sintering, its intimate is sticked and is covered with the inner surface of corresponding evaporator section 11 place's housings 30.Described the second capillary structure 53 is for being formed at the channel form capillary structure of the corresponding heat transfer segment 13 of housing 30 and condensation segment 15 place's inner surfaces, and its one end that approaches evaporator section 11 is connected with the first capillary structure 51.Described the second capillary structure 53 is greater than the first capillary structure 51 along the longitudinal length of housing 30 along the longitudinal length of housing 30.Described the second capillary structure 53 comprises some double wedges 531 and is positioned at the conduit 533 between double wedge 531, and the width of each double wedge 531 is less than the width of conduit 533.
Described the 3rd capillary structure 55 is formed at housing 30 middle parts, mutually be wound by tinsel, its cross section is flat elliptic, one end of one side surface be sticked the inner surface of the first capillary structure 51, the relative other end be sticked the second capillary structure 53 inner surfaces and and the second capillary structure 53 between form micro-pore, and remainder and the first capillary structure 51 and second capillary structure 53 intervals arrange.Described the first capillary structure 51 and the second capillary structure 53 equal the 3rd capillary structure 55 along the longitudinal length of housing 30 along the longitudinal length sum of housing 30.
So, flat-plate heat pipe 1 in use, the porosity of cause the 3rd capillary structure 55 is greater than the porosity of the first capillary structure 51, hydraulic fluid cooling after condensation segment 15 places heat release can penetrate into the 3rd capillary structure 55 fast, be greater than again the capillary force of the 3rd capillary structure 55 because of the capillary force of the first capillary structure 51, be housed in hydraulic fluid in the 3rd capillary structure 55 under the traction of capillary force, thereby can be back to the first capillary structure 51 from the 3rd capillary structure 55 fast and avoid the first capillary structure 51 dry combustion methods, ensure the service behaviour of flat-plate heat pipe 1.
Understandable, the first capillary structure 51, the second capillary structure 53 and the 3rd capillary structure 55 are not limited to by the material described in the present embodiment to be made, as long as can meet that the capillary force of the second capillary structure 53 is less than the capillary force of the first capillary structure 51 and the capillary force that is greater than the 3rd capillary structure 55, the porosity of the second capillary structure 53 is greater than the porosity of the first capillary structure 51 and is less than the porosity of the 3rd capillary structure 55.
Fig. 4 and Figure 5 shows that the flat-plate heat pipe 1a of second embodiment of the invention, the structural similarity of described flat-plate heat pipe 1a and the first embodiment middle plateform heat pipe 1, its difference is: described the second capillary structure 53a is the capillary structure that is formed at housing 30 inner surfaces, and described the second capillary structure 53a is along the inner surface that is covered with whole housing 30 on the length direction of housing 30, the outer surface of described the first capillary structure 51a be sticked at the second capillary structure 53a on the inner surface of evaporator section 11a and and the second capillary structure 53a between form micro-pore.
A method of manufacturing the flat-plate heat pipe 1 as described in embodiment mono-, comprises the following steps:
Described housing 30 is provided, and makes an end opening of described housing 30;
Provide a tool fluted mould, described mould is positioned in described housing 30 and makes the heat transfer segment 13 of the corresponding heat pipe of inner surface of described housing 30 and condensation segment 15 places be formed with in a longitudinal direction the second capillary structure 53 of channel form;
Some metal-powders are provided, and described powder sintering and forming is sticked and first capillary structure 51 at evaporator section 11 places of the corresponding heat pipe of inner surface of housing 30, and the particle diameter of described each metal-powder is greater than the width of described second capillary structure 53 each conduit 533;
Some tinsels are provided, and these tinsels are wound around mutually and form described the 3rd capillary structure 55, and described the 3rd capillary structure 55 is placed on to the middle part of housing 30, and make that one end sintering of one side surface is formed on the inner surface of the first capillary structure 51, other end sintering is formed on the inner surface of the second capillary structure 53 relatively;
Then housing 30 vacuumized and inject hydraulic fluid and sealing.
So, the flat-plate heat pipe 1 in the first embodiment has been manufactured.
The method of manufacturing the flat-plate heat pipe 1a in embodiment bis-is similar to the method for manufacturing the flat-plate heat pipe 1 in the first embodiment, its difference is: the second capillary structure 53a is covered with the inner surface of whole housing 30 on the longitudinal direction of housing 30, and described the first capillary structure 51a sintering is formed at the inner surface at the corresponding flat-plate heat pipe of described the second capillary structure 53a 1 evaporator section 11a place.
Claims (10)
1. a flat-plate heat pipe, there is the evaporator section being linked in sequence, heat transfer segment and condensation segment, described flat-plate heat pipe comprises housing and is attached at the capillary structure on housing, it is characterized in that: described capillary structure comprises the first capillary structure that is positioned at evaporator section, be located at the second capillary structure of condensation segment, and be connected and run through evaporator section with the first capillary structure and the second capillary structure, the 3rd capillary structure of heat transfer segment and condensation segment, the capillary force of described the first capillary structure is greater than the capillary force of the 3rd capillary structure, the porosity of described the first capillary structure is less than the porosity of the 3rd capillary structure.
2. flat-plate heat pipe as claimed in claim 1, it is characterized in that: the capillary force of described the second capillary structure is less than the capillary force of the first capillary structure and is greater than the capillary force of the 3rd capillary structure, the porosity of described the second capillary structure is greater than the porosity of the first capillary structure and is less than the porosity of the 3rd capillary structure.
3. flat-plate heat pipe as claimed in claim 1, it is characterized in that: described the second capillary structure is connected and extends to condensation segment from heat transfer segment with the first capillary structure, and be located on the inner surface of the corresponding heat transfer segment of described housing and condensation segment, one end of described the 3rd capillary structure is sticked on the first capillary structure, and the relative other end is sticked on described the second capillary structure.
4. flat-plate heat pipe as claimed in claim 3, is characterized in that: described the first capillary structure is attached on the inner surface of the corresponding evaporator section of described housing, and described the second capillary structure extends near one end of heat transfer segment from described the first capillary structure.
5. flat-plate heat pipe as claimed in claim 1, it is characterized in that: described the second capillary structure is connected with the first capillary structure and spontaneous evaporation section extends to condensation segment, and on the longitudinal direction of housing, be covered with the inner surface of whole housing, one end of described the 3rd capillary structure is sticked on the first capillary structure, and the relative other end is sticked on described the second capillary structure.
6. flat-plate heat pipe as claimed in claim 5, is characterized in that: described the first capillary structure is formed on the inner surface at the corresponding flat-plate heat pipe evaporator section of described the second capillary structure place.
7. the flat-plate heat pipe as described in claim 3 to 6 any one, is characterized in that: all in the form of a ring, described the 3rd capillary structure is flat elliptic and is positioned at the middle part of described housing the cross section of described the first capillary structure and the second capillary structure.
8. a manufacture method with the flat-plate heat pipe of the evaporator section, heat transfer segment and the condensation segment that are linked in sequence, comprises the following steps:
Provide one end to there is the housing of opening;
Provide a tool fluted mould, described mould is positioned in described housing and makes heat transfer segment and the condensation segment place of the corresponding heat pipe of inner surface of described housing form in a longitudinal direction the second capillary structure;
Some metal-powders are provided, described powder sintering and form the first capillary structure of the evaporating section that is positioned at heat pipe, wherein, the capillary force of described the first capillary structure is greater than the capillary force of the 3rd capillary structure, and the porosity of described the first capillary structure is less than the porosity of the 3rd capillary structure;
Some tinsels are provided, and these tinsels are wound around mutually and form described the 3rd capillary structure, described the 3rd capillary structure runs through evaporator section, heat transfer segment and condensation segment, and one end of described the 3rd capillary structure is formed on the first capillary structure, the other end is formed on the second capillary structure relatively;
Then housing vacuumized and inject hydraulic fluid and sealing.
9. the manufacture method of flat-plate heat pipe as claimed in claim 8, is characterized in that: described the second capillary structure is channel form capillary structure, comprises some double wedges and is positioned at the conduit between double wedge, and the width of each double wedge is less than the width of conduit.
10. the manufacture method of flat-plate heat pipe as claimed in claim 9, is characterized in that: the particle diameter of described each metal-powder is greater than the width of described second each conduit of capillary structure.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210547166.6A CN103868386A (en) | 2012-12-17 | 2012-12-17 | Flat plate heat pipe and manufacturing method thereof |
| TW101148581A TWI589830B (en) | 2012-12-17 | 2012-12-20 | Flat heat pipe and method for manufacturing the same |
| US13/850,268 US20140166244A1 (en) | 2012-12-17 | 2013-03-25 | Flat heat pipe and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210547166.6A CN103868386A (en) | 2012-12-17 | 2012-12-17 | Flat plate heat pipe and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103868386A true CN103868386A (en) | 2014-06-18 |
Family
ID=50907179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210547166.6A Pending CN103868386A (en) | 2012-12-17 | 2012-12-17 | Flat plate heat pipe and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20140166244A1 (en) |
| CN (1) | CN103868386A (en) |
| TW (1) | TWI589830B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105444597A (en) * | 2014-08-13 | 2016-03-30 | 奇鋐科技股份有限公司 | Hot pipe with composite capillary structure |
| CN105841531A (en) * | 2015-01-12 | 2016-08-10 | 奇鋐科技股份有限公司 | Flat heat pipe structure |
| CN109041540A (en) * | 2018-09-03 | 2018-12-18 | 北京空间机电研究所 | A kind of cross connector of rectangular shell |
| CN110220404A (en) * | 2014-11-28 | 2019-09-10 | 台达电子工业股份有限公司 | Heat pipe |
| CN113141756A (en) * | 2021-03-22 | 2021-07-20 | 联想(北京)有限公司 | Heat conduction structure, electronic equipment and manufacturing method of heat conduction structure |
| CN113507817A (en) * | 2021-06-04 | 2021-10-15 | 北京国科环宇科技股份有限公司 | Heat dissipation plate, module and case |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5750188B1 (en) * | 2014-07-15 | 2015-07-15 | 株式会社フジクラ | heat pipe |
| US20160069616A1 (en) * | 2014-09-05 | 2016-03-10 | Asia Vital Components Co., Ltd. | Heat pipe with complex capillary structure |
| US9370090B2 (en) | 2014-09-29 | 2016-06-14 | General Electric Company | Circuit card assembly and method of manufacturing thereof |
| JP5759606B1 (en) * | 2014-09-30 | 2015-08-05 | 株式会社フジクラ | heat pipe |
| US11454456B2 (en) | 2014-11-28 | 2022-09-27 | Delta Electronics, Inc. | Heat pipe with capillary structure |
| US20170122673A1 (en) * | 2015-11-02 | 2017-05-04 | Acmecools Tech. Ltd. | Micro heat pipe and method of manufacturing micro heat pipe |
| TWM521170U (en) * | 2015-12-04 | 2016-05-01 | Tai Sol Electronics Co Ltd | Heat pipe with fiber capillary structure |
| WO2018198372A1 (en) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | Vapor chamber |
| TWI661171B (en) * | 2017-06-23 | 2019-06-01 | 日商古河電氣工業股份有限公司 | Heat pipe |
| EP3421917B1 (en) * | 2017-06-30 | 2021-06-02 | Nokia Solutions and Networks Oy | Wick structures and heat pipe networks |
| WO2019065864A1 (en) * | 2017-09-29 | 2019-04-04 | 株式会社村田製作所 | Vapor chamber |
| JP6560425B1 (en) * | 2018-11-09 | 2019-08-14 | 古河電気工業株式会社 | heat pipe |
| JP6606267B1 (en) * | 2018-12-28 | 2019-11-13 | 古河電気工業株式会社 | heatsink |
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| US4883116A (en) * | 1989-01-31 | 1989-11-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ceramic heat pipe wick |
| GB2312734B (en) * | 1996-05-03 | 2000-05-03 | Matra Marconi Space | Capillary evaporator |
| US6460612B1 (en) * | 2002-02-12 | 2002-10-08 | Motorola, Inc. | Heat transfer device with a self adjusting wick and method of manufacturing same |
| US20040011509A1 (en) * | 2002-05-15 | 2004-01-22 | Wing Ming Siu | Vapor augmented heatsink with multi-wick structure |
| US20050126761A1 (en) * | 2003-12-10 | 2005-06-16 | Je-Young Chang | Heat pipe including enhanced nucleate boiling surface |
| US20060162906A1 (en) * | 2005-01-21 | 2006-07-27 | Chu-Wan Hong | Heat pipe with screen mesh wick structure |
| TWI289651B (en) * | 2005-03-25 | 2007-11-11 | Foxconn Tech Co Ltd | Method for making wick structure of heat pipe |
| TWI260387B (en) * | 2005-04-01 | 2006-08-21 | Foxconn Tech Co Ltd | Sintered heat pipe and manufacturing method thereof |
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| CN101055158A (en) * | 2006-04-14 | 2007-10-17 | 富准精密工业(深圳)有限公司 | Heat pipe |
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| CN101349519A (en) * | 2007-07-18 | 2009-01-21 | 富准精密工业(深圳)有限公司 | Hot pipe |
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-
2012
- 2012-12-17 CN CN201210547166.6A patent/CN103868386A/en active Pending
- 2012-12-20 TW TW101148581A patent/TWI589830B/en not_active IP Right Cessation
-
2013
- 2013-03-25 US US13/850,268 patent/US20140166244A1/en not_active Abandoned
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105444597A (en) * | 2014-08-13 | 2016-03-30 | 奇鋐科技股份有限公司 | Hot pipe with composite capillary structure |
| CN110220404A (en) * | 2014-11-28 | 2019-09-10 | 台达电子工业股份有限公司 | Heat pipe |
| CN105841531A (en) * | 2015-01-12 | 2016-08-10 | 奇鋐科技股份有限公司 | Flat heat pipe structure |
| CN109041540A (en) * | 2018-09-03 | 2018-12-18 | 北京空间机电研究所 | A kind of cross connector of rectangular shell |
| CN109041540B (en) * | 2018-09-03 | 2020-05-12 | 北京空间机电研究所 | Square tube shell cross joint |
| CN113141756A (en) * | 2021-03-22 | 2021-07-20 | 联想(北京)有限公司 | Heat conduction structure, electronic equipment and manufacturing method of heat conduction structure |
| CN113507817A (en) * | 2021-06-04 | 2021-10-15 | 北京国科环宇科技股份有限公司 | Heat dissipation plate, module and case |
| CN113507817B (en) * | 2021-06-04 | 2022-12-13 | 北京国科环宇科技股份有限公司 | Heat dissipation plate, module and case |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140166244A1 (en) | 2014-06-19 |
| TW201428225A (en) | 2014-07-16 |
| TWI589830B (en) | 2017-07-01 |
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