US20130037242A1

US20130037242A1 - Thin-type heat pipe structure

Info

Publication number: US20130037242A1
Application number: US13/206,383
Authority: US
Inventors: Chang-Yin Chen; Lei-Lei LIU
Original assignee: Cooler Master Co Ltd
Current assignee: Cooler Master Development Corp
Priority date: 2011-08-09
Filing date: 2011-08-09
Publication date: 2013-02-14

Abstract

A thin-type heat pipe structure includes a flat pipe, a second capillary structure, a third capillary structure, and a working fluid. The flat pipe has two boards and a containing chamber. A first capillary structure is set on the inner surface of the boards. The second capillary structure is contained in the containing chamber and covers a part of the first capillary structure. The third capillary structure is a stripe, contained in the containing chamber and clipped between the second capillary structure and another part of the first capillary structure. The working fluid is filled in the containing chamber. The overall design speeds up inner air's outflow and inner liquid's backflow.

Description

BACKGROUND

1. Technical Field
The present invention generally relates to a heat pipe, and more particularly, to a thin-type heat pipe structure that is used to guide heat generated by an electronic heat source.
2. Related Art
The exacerbating problems caused by electronic heat sources can be resolved by using heat pipes to conduct or dissipate heat generated by electronic products. Replacing cooling structures formed by cooling fins with heat pipes seems to be the future development trend. However, because electronic products generally have to be light, thin, short, and small, only a small space can be provided to heat pipes. As a result, the industry desires to have new heat pipe designs to resolve the problem.
A conventional heat pipe generally includes a round pipe, a capillary structure, and a working fluid. Inside the round pipe there is a containing chamber. The capillary structure is set inside the containing chamber and stuck to the inner surface of the pipe. The working fluid is filled in the containing chamber and accumulated in the capillary structure. As a whole, these parts form a conventional heat pipe structure.
However, conventional heat pipes are round and hence are not suitable for electronic products that should be as thin as possible. Furthermore, the capillary structure is a single-configuration structure. If the density of the capillary structure is high, the inner air will flow out swiftly when receiving heat, causing the heat receiving area to dry out quickly. If the density of the capillary structure is low, the heat pipe will be inefficient in conducting heat, and resulting in some problems that must be resolved.

BRIEF SUMMARY

The present invention provides a thin-type heat pipe structure. By staking and arranging several capillary structures, the present invention speeds up inner air's outflow and inner liquid's backflow.
In one aspect, the thin-type heat pipe structure of the present invention comprises a flat pipe, having two boards corresponding to each other and a containing chamber surrounded by the two boards, a first capillary structure being set up on the inner surface of the boards; a second capillary structure, contained inside the containing chamber and covering a part of the first capillary structure; a third capillary structure, being a stripe, contained inside the containing chamber and clipped in between the second capillary structure and another part of the first capillary structure; and a working fluid, filled in the containing chamber.
In another aspect, the thin-type heat pipe structure of the present invention comprises a flat pipe, having two boards corresponding to each other and a containing chamber formed between the two boards, the height of the two boards and the containing chamber being below 1.5 millimeters, a first capillary structure being set on the inner surface of the boards; a second capillary structure, contained inside the containing chamber and covering a part of the first capillary structure; a third capillary structure, being a stripe, contained inside the containing chamber and clipped in between the second capillary structure and another part of the first capillary structure; and a working fluid, filled in the containing chamber.
The present invention stakes capillary structures of different densities and segments some air passages. A first capillary structure has a low density and hence allows evaporated air to flow out quickly. A second capillary structure has a medium density and hence can accumulate inner liquid and prevent dry out. The third capillary structure has a high density and hence can facilitate inner air's flow. The third capillary structure further accumulates much liquid to supply for the second capillary structure's need. The staking of the capillary structures enhances the overall capillary absorption force.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a thin-type heat pipe of the present invention in a three-dimensional diagram;

FIG. 2 illustrates the thin-type heat pipe of the present invention in a breakdown diagram;

FIG. 3 illustrates the thin-type heat pipe of the present invention in combination; and

FIG. 4 illustrates the thin-type heat pipe of the present invention in combination in a sectional diagram.

DETAILED DESCRIPTION

Please refer to FIG. 1 to FIG. 4. The present invention provides a thin-type heat pipe structure. The thin-type heat pipe 1 mainly includes a flat pipe 10, a second capillary structure 20, a third capillary structure 30, and a working fluid 40.
The flat pipe 10 is made up of materials with good heat conductivity and good ductility, such as copper or copper alloy. It is formed by pressing a round pipe and hence has a flat shape. In this embodiment, the pipe 10 is a stripe formed by an upper board 11 and a lower board 12 that correspond to each other. Each of the upper and lower boards 11 and 12 is formed by a lateral flat section and a longitudinal curved section that extends from the lateral flat section. As shown in FIG. 2, the lateral flat section and the longitudinal curved section form a shape that is similar to the letter ‘J,’ and are sealed up on an end of the pipe 10 through soldering. A hollow containing chamber 13 exists in between the upper and lower boards 11 and 12. The overall height H1 between the outer surface of the upper and lower boards 11 and 12 is less than 1.5 millimeters. On the inner surface of the upper and lower boards 11 and 12 there is a first capillary structure 14 that is circular in shape. In this embodiment the first capillary structure 14 includes a plurality of furrows 141. These furrows 141 can speed up air's outflow and liquid's backflow. Furthermore, the first capillary structure 14 can also be made up of a plurality of smooth surfaces, or a combination of a plurality of furrows and a plurality of smooth surfaces, formed on the upper and lower boards 11 and 12.
The second capillary structure 20 is a mesh structure formed by a plurality of metal lines. This mesh structure has single or multiple layers. The directions of the metal lines can be parallel and perpendicular to the direction of the third capillary structure 30, or be diagonal. This feature is not shown in the figures. The mesh-shaped second capillary structure 20 is contained in the containing chamber 13, and a face of the second capillary structure 20 covers the underneath first capillary structure 14. The second capillary structure 20 provides internal liquid accumulation to avoid the dry out situation. Furthermore, the interior of the second capillary structure 20 has a plurality of holes. The interval between these holes is smaller than the interval between the furrows 141 of the first capillary structure 14. As a result, the density of the second capillary structure 20 is higher than that of the first capillary structure 14.
The third capillary structure 30 is a rectangular stripe. It is a component formed by sintered metal powder. In this embodiment there are two stripes of third capillary structures 30. In another embodiment, there can be only one or multiple third capillary structures 30. The third capillary structures 30 are contained in the containing chamber 13, and clipped between another face of the second capillary structure 20 and the above first capillary structure 14. As shown in
FIG. 4, the two sides of the two third capillary structures 30 and the upper and lower boards 11 and 12 surrounds three air passages 50. Furthermore, the interior of the third capillary structures 30 also has a plurality of pores. The interval between these pores is smaller than the interval between the holes of the second capillary structure 20. As a result, the density of the third capillary structure 30 is higher than the density of the second capillary structure 20. This allows the third capillary structures 30 to form a plurality of air-guiding bags. For the same reason, the third capillary structures 30 can be other kind of capillary, such as a fiber bundle.
The working fluid 40, as shown in FIG. 4 can be pure water or other kind of liquid. It is filled into the interior of the containing chamber 13. Under room temperature the working fluid 40 is in its liquid form and be absorbed by the capillary structures 14, 20, and 30. After receiving heat, some or all of the working fluid 40 will evaporate and become air, which will then bring out a lot of heat towards a low temperature area in the containing chamber 13.
The above description is given by way of example, and not limitation. Given the above disclosure, one skilled in the art could devise variations that are within the scope and spirit of the invention disclosed herein, including configurations ways of the recessed portions and materials and/or designs of the attaching structures. Further, the various features of the embodiments disclosed herein can be used alone, or in varying combinations with each other and are not intended to be limited to the specific combination described herein. Thus, the scope of the claims is not to be limited by the illustrated embodiments.

Claims

1. A thin-type heat pipe structure, comprising:

a flat pipe, having two boards corresponding to each other and a containing chamber surrounded by the two boards, a first capillary structure being set up on the inner surface of the boards;

a second capillary structure, contained inside the containing chamber and covering a part of the first capillary structure;

a third capillary structure, being a stripe, contained inside the containing chamber and clipped in between the second capillary structure and another part of the first capillary structure; and

a working fluid, filled in the containing chamber.

2. The structure of claim 1, wherein the first capillary structure is a plurality of furrows, a plurality of smooth surfaces, or a combination of a plurality of furrows and a plurality of smooth surfaces formed on the boards.

3. The structure of claim 1, wherein the second capillary structure is a metal mesh.

4. The structure of claim 1, wherein the third capillary structure is a sintered metal powder component or a fiber bundle.

5. The structure of claim 1, wherein the first capillary structure is a plurality of furrows formed on the boards, the second capillary structure is a metal mesh, and the density of the second capillary structure is higher than the density of the first capillary structure.

6. The structure of claim 5, wherein the third capillary structure is a sintered metal powder component, and the density of the third capillary structure is higher than the density of the second capillary structure.

7. The structure of claim 1, wherein two sides of the third capillary structure and the two boards surround two air passages.

8. The structure of claim 1, wherein the flat pipe is formed through pressing a round pipe.

9. A thin-type heat pipe structure, comprising:

a flat pipe, having two boards corresponding to each other and a containing chamber formed between the two boards, the height of the two boards and the containing chamber being below 1.5 millimeters, a first capillary structure being set on the inner surface of the boards;

a working fluid, filled in the containing chamber.

10. The structure of claim 9, wherein the first capillary structure is a plurality of furrows, a plurality of smooth surfaces, or a combination of a plurality of furrows and a plurality of smooth surfaces, formed on the boards.

11. The structure of claim 9, wherein the second capillary structure is a metal mesh.

12. The structure of claim 9, wherein the third capillary structure is a sintered metal powder component or a fiber bundle.

13. The structure of claim 9, wherein the first capillary structure is a plurality of furrows formed on the boards, the second capillary structure is a metal mesh, and the density of the second capillary structure is higher than the density of the first capillary structure.

14. The structure of claim 13, wherein the third capillary structure is a sintered metal powder component, and the density of the third capillary structure is higher than the density of the second capillary structure.

15. The structure of claim 9, wherein two sides of the third capillary structure and the two boards surround two air passages.

16. The structure of claim 9, wherein the flat pipe is formed through pressing a round pipe.