WO2022181343A1

WO2022181343A1 - Cooling device

Info

Publication number: WO2022181343A1
Application number: PCT/JP2022/005181
Authority: WO
Inventors: 和宏西川; 雅昭花野
Original assignee: 日本電産株式会社
Priority date: 2021-02-25
Filing date: 2022-02-09
Publication date: 2022-09-01
Also published as: CN116917685A

Abstract

This cooling device comprises a flow path through which a refrigerant flows, and a plurality of heat pipes. The heat pipes extend from the upstream side of the flow path toward the downstream side thereof, and are arrayed in a direction orthogonal to the direction in which the heat pipes extend. The heat pipes each have a casing that has an internal space in which a working fluid is disposed, and a sealing part that seals the working fluid in the internal space. At least one of the sealing parts is disposed on the upstream side of the flow path.

Description

Cooling system

The present invention relates to cooling devices.

2. Description of the Related Art Conventionally, cooling devices having heat pipes are known. For example, cooling devices with heat pipes are used as heat sinks for vehicles. Conventional cooling devices have multiple heat pipes. The heat pipes extend in a predetermined direction and are arranged in a direction perpendicular to the predetermined direction (see Patent Document 1, for example).

Japanese Unexamined Patent Publication No. 2006-278923

A conventional heat pipe has a working fluid in the interior space. In order to seal this working fluid in the internal space, the heat pipe has, for example, a seal at one end. The sealing part is, for example, a welded part and a part with a low cooling function. For this reason, there is a possibility that the heat source will be insufficiently cooled in the sealed portion of the heat pipe and its surroundings.　

An object of the present invention is to cool a heat source well when using a heat pipe.

An exemplary cooling device of the present invention comprises a channel through which a coolant flows and a plurality of heat pipes. The heat pipes extend from the upstream side toward the downstream side of the channel and are arranged in a direction perpendicular to the direction in which the heat pipes extend. The heat pipe has a housing with an interior space in which the working fluid is placed, and a sealing portion that seals the working fluid in the interior space. At least one seal is positioned upstream of the flow path.

According to the exemplary cooling device of the present invention, the heat source can be well cooled when the heat pipe is used.

FIG. 1 is an exploded perspective view of a cooling device according to an embodiment. FIG. 2 is a perspective view when the cooling device according to the embodiment is viewed from below. FIG. 3 is a cross-sectional view of the support plate according to the embodiment. FIG. 4 is a cross-sectional view of the heat pipe according to the embodiment. FIG. 5 is a schematic diagram showing an arrangement pattern of heat pipes according to the embodiment. FIG. 6 is a schematic diagram showing a first modification of the arrangement pattern of the heat pipes. FIG. 7 is a schematic diagram showing a second modification of the arrangement pattern of the heat pipes. FIG. 8 is a plan view when an upper plate having pin fins according to a modification is viewed from above.

Exemplary embodiments of the invention are described below with reference to the drawings.　

In this specification, the vertical direction is defined such that the side on which the cooling device 100 is arranged with respect to the heat source 200 is the top, and the side on which the heat source 200 is arranged with respect to the cooling device 100 is the bottom. Note that this definition of the vertical direction does not limit the actual orientation and positional relationship of each component.　

<1. Schematic Configuration of Cooling Device> FIG. 1 is an exploded perspective view of a cooling device 100 according to an embodiment. FIG. 2 is a perspective view when the cooling device 100 according to the embodiment is viewed from below. In FIG. 2, a heat source 200 cooled by the cooling device 100 is illustrated.　

A cooling device 100 is a device that cools a plurality of heat sources 200 . The number of heat sources 200 assigned to a single cooling device 100 is not particularly limited. For example, multiple heat sources 200 are arranged in one direction.　

Heat source 200 is, for example, an inverter power transistor. An inverter is provided, for example, in a traction motor for driving wheels of a vehicle. The power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor).　

The cooling device 100 includes a channel 10 through which a coolant flows. A coolant is, for example, a liquid. The cooling device 100 also includes a cover 1 . The cover 1 is, for example, a member called a water jacket.　

The cover 1 is arranged above the upper plate 2 . The upper plate 2 has a substantially rectangular shape when viewed from above and below. A cover 1 covers the upper surface of the upper plate 2 . The cover 1 has channels 10 in its inner region. In other words, channel 10 is provided in the region between cover 1 and upper plate 2 . Coolant flows along the upper surface of the upper plate 2 in the area between the cover 1 and the upper plate 2 .　

The cover 1 has an upper wall portion 11 and side wall portions 12 . The upper wall portion 11 has a substantially rectangular shape when viewed in the vertical direction. The side wall portion 12 extends downward from the outer edge of the upper wall portion 11 . A lower end of the side wall portion 12 contacts the upper surface of the upper plate 2 . For example, the lower ends of the side walls 12 are joined to the upper surface of the upper plate 2 .　

The cover 1 has a supply port 101 through which the coolant is supplied to the upstream side of the channel 10 . Further, the cover 1 has a discharge port 102 through which the refrigerant is discharged on the downstream side of the flow path 10 . The coolant flows from the supply port 101 side of the cover 1 toward the discharge port 102 side. By using the cover 1 having the supply port 101 and the discharge port 102, the direction in which the coolant flows can be arbitrarily set. Therefore, one side in the direction in which the heat pipe 5 extends, which will be described later, can be easily set as the upstream side of the flow path 10 , and the other side can be set as the downstream side of the flow path 10 . In other words, the heat pipe 5 can be easily arranged to extend from the upstream side to the downstream side of the channel 10 .　

The cover 1 has a supply port 101 and a discharge port 102 in the upper wall portion 11 . For example, the cover 1 has a supply port 101 on one side in the longitudinal direction of the upper wall portion 11 and a discharge port 102 on the other side when viewed from above and below. The supply port 101 and the discharge port 102 are through-holes that vertically pass through the upper wall portion 11 . Note that the supply port 101 and the discharge port 102 may be provided in the side wall portion 12 .　

Tubes (not shown) are arranged at the supply port 101 and the discharge port 102 . Then, the coolant is supplied to the region between the cover 1 and the upper plate 2, that is, the flow path 10, through the tube on the supply port 101 side. Also, the coolant is discharged from the region between the cover 1 and the upper plate 2, that is, the flow path 10, through the tube on the discharge port 102 side.　

The cooling device 100 also includes fins 3 . Fins 3 protrude upward from the upper surface of upper plate 2 . In other words, the upper plate 2 has fins 3 on its upper surface. Fins 3 may be integral with upper plate 2 . For example, the number of fins 3 is plural.　

Fins 3 extend from the upstream side of channel 10 toward the downstream side. For example, the fins 3 are flat. Fins 3 extend parallel to the longitudinal direction of upper plate 2 . Further, the fins 3 are arranged at intervals in the lateral direction of the upper plate 2 .　

Fins 3 are arranged in the area between the cover 1 and the top plate 2 . In other words, the fins 3 are arranged in the area through which the coolant flows. As a result, the area between the fins 3 adjacent to each other in the lateral direction of the upper plate 2 becomes the flow path 10 .

Here, the cooling device 100 has a support plate 4 . The cooling device 100 also includes a plurality of heat pipes 5 . As a constituent material of the support plate 4, for example, a metal such as copper is used. As a constituent material of the heat pipe 5, for example, a metal such as copper is used.　

A support plate 4 supports the heat pipes 5 . Specifically, the support plate 4 has a support area 40 . The support plate 4 contacts the heat pipes 5 at support areas 40 . The support area 40 is an area of the upper surface of the support plate 4 . That is, the heat pipes 5 are arranged on the upper surface of the support plate 4 . In other words, the support plate 4 supports the heat pipes 5 on the upper surface.　

The support plate 4 has a substantially rectangular shape whose longitudinal direction is the same as the longitudinal direction of the upper plate 2 and whose lateral direction is the same as the lateral direction of the upper plate 2 when viewed from above. That is, the fins 3 extend parallel to the longitudinal direction of the support plate 4 and are arranged at intervals in the lateral direction of the support plate 4 . In this configuration, the coolant flowing through the flow path 10 is directed from one side of the support plate 4 in the longitudinal direction to the other side. In other words, one longitudinal side of the support plate 4 is the upstream side of the channel 10 , and the other longitudinal side is the downstream side of the channel 10 .　

A support plate 4 is arranged below the upper plate 2 . Thereby, the upper plate 2 is arranged above the heat pipes 5 . That is, the heat pipe 5 is covered with the upper plate 2 from above. For example, heat pipes 5 contact upper plate 2 .　

A heat source 200 is arranged below the support plate 4 . The heat sources 200 are arranged at intervals in the longitudinal direction of the support plate 4 . That is, the longitudinal direction of the support plate 4 is the direction in which the heat sources 200 are arranged. Moreover, the heat source 200 contacts the lower surface of the support plate 4, for example. Note that the heat source 200 may indirectly contact the lower surface of the support plate 4 via, for example, a thermal sheet.　

Hereinafter, in this specification, the longitudinal direction of the support plate 4 will be referred to as the "first direction", and the lateral direction of the support plate 4 will be referred to as the "second direction". Also, the first direction is denoted by D1, and the second direction is denoted by D2. The first direction D1 and the second direction D2 are orthogonal to the vertical direction.　

The heat pipe 5 extends from the upstream side toward the downstream side of the flow path 10 . For example, the heat pipe 5 extends linearly in a direction parallel to the first direction D1 when viewed from above. In other words, the heat pipes 5 extend in the same direction as the fins 3 . In other words, heat pipe 5 extends in the direction in which heat sources 200 are arranged.　

In the configuration in which the coolant flows in the direction in which the fins 3 extend, by extending the heat pipes 5 in the same direction as the fins 3, the cooling device 100 having the heat pipes 5 extending from the upstream side to the downstream side of the flow path 10 can be easily obtained. can be obtained. In the configuration in which the heat pipes 5 extend in the direction in which the heat sources 200 are arranged, all the heat sources 200 can overlap the heat pipes 5 when viewed from above and below, so all the heat sources 200 can be cooled well.　

Also, the heat pipes 5 are arranged in a direction perpendicular to the direction in which the heat pipes 5 extend. Note that the heat pipe 5 extends in the first direction D1. That is, the heat pipes 5 are arranged in the second direction D2 orthogonal to the first direction D1.　

For example, the cross-sectional shape of the heat pipe 5 cut along the second direction D2 is a flat shape elongated in the second direction D2. However, the cross-sectional shape of the heat pipe 5 is not particularly limited. A cross-sectional shape of the heat pipe 5 cut along the second direction D2 may be circular.　

<2. Configuration of Support Plate> FIG. 3 is a cross-sectional view of the support plate 4 according to the embodiment. FIG. 3 shows a cross-sectional structure when the support plate 4 is cut along the second direction D2. Moreover, in FIG. 3, the heat pipe 5 is indicated by a dashed line.　

The support plate 4 has a plurality of support portions 41 supporting the plurality of heat pipes 5 in the support area 40 . The support portion 41 is a concave portion recessed downward from the upper surface of the support plate 4 . The support portion 41 extends linearly in the first direction D1. That is, the support portion 41 extends in the same direction as the heat pipe 5 extends. Further, the support portions 41 are arranged at intervals in the second direction D2.　

One heat pipe 5 is arranged on each support portion 41 . At least part of the heat pipe 5 arranged on the support portion 41 contacts the inner surface of the support portion 41, that is, the inner surface of the recess. Note that the heat pipe 5 may indirectly contact the inner surface of the support portion 41 via, for example, a thermally conductive adhesive member.　

<3. Configuration of Heat Pipe> FIG. 4 is a cross-sectional view of the heat pipe 5 according to the embodiment. FIG. 4 shows a cross-sectional structure when the heat pipe 5 is cut along the first direction D1. Note that FIG. 4 shows the sealing portion 52 of the heat pipe 5 and its surroundings in an enlarged manner.　

The heat pipe 5 has a housing 51 and a sealing portion 52 . The housing 51 is a tubular body extending in the first direction D1. The housing 51 has an interior space 50 in which the hydraulic fluid is arranged. The working fluid is pure water, for example. Alcohol or the like can also be used as the working fluid. The sealing portion 52 seals the working fluid in the internal space 50 .　

Here, the heat pipe 5 has a capillary structure on the inner wall. That is, the internal space 50 of the heat pipe 5 is a space surrounded by a capillary structure. When the heat pipe 5 is heated by the heat of the heat source 200 , the working fluid is vaporized in the heating portion of the heat pipe 5 and the vaporized working fluid moves to the upstream side of the flow path 10 . The upstream side of the flow path 10 is the side to which the low-temperature coolant is supplied. That is, the vaporized working fluid moves to the low temperature portion of the heat pipe 5 . Then, the working fluid is liquefied at the low temperature portion of the heat pipe 5 and moves to the heating portion of the heat pipe 5 by capillary action. Heat is transported by the movement of the working fluid in this way.　

For example, in manufacturing the heat pipe 5 , a pipe with one end open is prepared as the material for the heat pipe 5 . A working fluid is injected into the internal space of the material pipe, and then sealed. For example, the opening at one end of the material pipe is closed by welding. As a result, the hydraulic fluid injected into the internal space of the material pipe is sealed. As a result, heat pipe 5 having sealing portion 52 at one end is formed. That is, the sealing portion 52 is a processed portion processed to seal the working fluid in the internal space 50 . In addition, the sealing method is not particularly limited. The shape and size of the sealing portion 52 vary depending on the sealing method.　

<4-1. Arrangement Pattern of Heat Pipes> FIG. 5 is a schematic diagram showing an arrangement pattern of the heat pipes 5 according to the embodiment. In FIG. 5, the sealing portion 52 is indicated by a hatched pattern, and the heat source 200 is indicated by a dashed line. Further, in the following description, the left side in the first direction D1 in FIG. 5 is the upstream side of the flow channel 10, and the right side in the first direction D1 in FIG.　

In addition, although seven heat pipes 5 are shown in FIG. 5 for convenience, the number of heat pipes 5 is not particularly limited. The number of heat pipes 5 may be more or less than seven. Furthermore, the number of heat pipes 5 may be odd or even.　

The heat pipes 5 are arranged at intervals in the second direction D2. Here, the sealed portion 52 is a welded portion, and is a portion where heat is not substantially transported by the working fluid. That is, the sealing portion 52 is a portion secured as a welding margin for sealing the hydraulic fluid, and has a low cooling function.　

Therefore, at least one sealing portion 52 is arranged on the upstream side of the channel 10 . That is, at least one sealing portion 52 is arranged on one side in the first direction D1, which is the upstream side of the channel 10 . In this configuration, for at least one heat pipe 5 , a low-function portion having a low cooling function can be arranged on the upstream side of the flow path 10 .　

In the heat pipe 5 in which the sealing portion 52 is arranged on the upstream side of the flow path 10, a low-function portion having a low cooling function does not exist on the downstream side of the flow path 10, so the heat source 200 located on the downstream side of the flow path 10 heat is smoothly transported to the upstream side of the flow path 10 . As a result, the heat source 200 positioned on the downstream side of the flow path 10 can be cooled well compared to a configuration in which all the sealing portions 52 of the heat pipes 5 are arranged on the downstream side of the flow path 10 . That is, when the heat pipe 5 is used, the heat source 200 can be well cooled.　

Note that a region of the cooling device 100 on the upstream side of the flow path 10 is a region where the low-temperature coolant continues to be supplied, and has a lower temperature than a region on the downstream side of the flow path 10 . Therefore, by arranging the sealing portion 52 of the heat pipe 5 on the upstream side of the flow path 10, even if the sealing portion 52 does not function, the heat source 200 located in the sealing portion 52 and its periphery, that is, The heat source 200 positioned on the upstream side of the flow path 10 can be well cooled.　

Here, in the cooling device 100, the heat pipe 5 having the sealing portion 52 on the upstream side of the flow path 10 and the heat pipe 5 having the sealing portion 52 on the downstream side of the flow path 10 are mixed. Specifically, the plurality of heat pipes 5 includes first heat pipes 5A and second heat pipes 5B. The first heat pipe 5</b>A is the heat pipe 5 having the sealing portion 52 on the upstream side of the flow path 10 . The second heat pipe 5B is the heat pipe 5 having the sealing portion 52 on the downstream side of the flow path 10. As shown in FIG. As a modification, the sealing portions 52 of all the heat pipes 5 may be arranged upstream of the flow path 10 .　

In the configuration in which the first heat pipe 5A and the second heat pipe 5B are mixed, the heat of the heat source 200 located downstream of the flow path 10 is smoothly transferred to the upstream side of the flow path 10, i. can be transported. The heat of the heat source 200 located upstream of the flow path 10 can be smoothly transported to the upstream side of the flow path 10, that is, the low temperature section, by the second heat pipe 5B. Thereby, the plurality of heat sources 200 including the heat source 200 located downstream of the flow path 10 and the heat source 200 located upstream of the flow path 10 can be evenly cooled.　

For example, more than half of the plurality of heat pipes 5 are first heat pipes 5A. When the number of heat pipes 5 is odd, the number of first heat pipes 5A is greater than the number of second heat pipes 5B. If the total number of heat pipes 5 is seven, the number of first heat pipes 5A is four or more. When the number of heat pipes 5 is even, the number of first heat pipes 5A is the same as or greater than the number of second heat pipes 5B.　

By setting more than half of the plurality of heat pipes 5 as the first heat pipes 5</b>A, the sealing portions 52 of more than half of the heat pipes 5 are arranged on the upstream side of the flow path 10 . That is, the number of heat pipes 5 in which the low-function parts are arranged downstream of the flow path 10 is reduced. Thereby, the heat source 200 located downstream of the flow path 10 can be cooled satisfactorily.　

Further, the support plate 4 has a mixed region 401 in at least part of the support region 40 . A mixed region 401 is a region where the first heat pipe 5A and the second heat pipe 5B are mixed. Specifically, the mixed area 401 is an area in which the first heat pipes 5A and the second heat pipes 5B are alternately arranged. In the mixed region 401, the first heat pipes 5A having the first number as one unit and the second heat pipes 5B having the second number as one unit are alternately arranged in the second direction D2.　

The mixed region 401 includes a first heat pipe 5A capable of smoothly transporting the heat of the heat source 200 located downstream of the flow path 10 to the low temperature section and a heat pipe 5A capable of smoothly transporting the heat of the heat source 200 located upstream of the flow path 10 to the low temperature area. A second heat pipe 5B that can be transported to a part is mixed. In this configuration, by overlapping the plurality of heat sources 200 with respect to the mixed region 401, the plurality of heat sources 200 including the heat source 200 located downstream of the flow path 10 and the heat source 200 located upstream of the flow path 10 are unevenly distributed. can be cooled without　

The support plate 4 has a mixed area 401 over the entire support area 40 . Specifically, the support region 40 does not have a region where the first heat pipes 5A exceeding the first number are arranged continuously. Further, in the support area 40, there is no area in which the second heat pipes 5B exceeding the second number are continuously arranged. In other words, the area where the first heat pipes 5A and the second heat pipes 5B are alternately arranged reaches from one end of the support area 40 to the other end in the second direction D2.

By setting the entire support area 40 as the mixed area 401 , a plurality of heat sources 200 including the heat source 200 positioned downstream of the flow path 10 and the heat source 200 positioned upstream of the flow path 10 are distributed over the entire support area 40 . can be cooled evenly.　

Note that the first number and the second number are not particularly limited. The first number and the second number may be the same number. Also, the first number and the second number may be one. In the embodiment, in the mixed region 401, the same number of the first heat pipes 5A and the second heat pipes 5B are alternately arranged. Specifically, in the mixed region 401, the first heat pipes 5A and the second heat pipes 5B are alternately arranged one by one.　

By alternately arranging the same number of the first heat pipes 5A and the second heat pipes 5B in the mixed region 401, the heat sources 200 positioned downstream of the flow path 10 and the heat sources 200 positioned upstream of the flow path 10 In addition to being able to evenly cool the plurality of heat sources 200 including , cooling unevenness in the second direction D2 can be suppressed. By alternately arranging the first heat pipes 5A and the second heat pipes 5B one by one in the mixed region 401, uneven cooling in the second direction D2 can be further suppressed.　

Specifically, although not shown, when the number of heat pipes 5 is seven, the four first heat pipes 5A are arranged on one side in the second direction D2, and the three second heat pipes 5B are arranged on the second side. Assume that it is arranged on the other side of the direction D2. In this case, the cooling performance on one side in the second direction D2 may be worse than the cooling performance on the other side. On the other hand, the configuration in which the first heat pipes 5A and the second heat pipes 5B are alternately arranged can reduce the difference in cooling performance between one side and the other side in the second direction D2. That is, cooling unevenness in the second direction D2 can be suppressed.　

<4-2. Modification of Arrangement Pattern> FIG. 6 is a schematic diagram showing a first modification of the arrangement pattern of the heat pipes 5 . FIG. 7 is a schematic diagram showing a second modification of the arrangement pattern of the heat pipes 5. As shown in FIG. 6 and 7, the sealing portion 52 is indicated by a hatched pattern. 6 and 7 respectively show 11 and 13 heat pipes 5 for convenience, but the number of heat pipes 5 is not particularly limited. Further, in the following description, the left side in the first direction D1 in FIGS. 6 and 7 is the upstream side of the flow channel 10, and the right side in the first direction D1 in FIGS.　

The arrangement pattern of the heat pipes 5 can be changed according to the size of the cooling device 100, installation location, application, object to be cooled, and the like. Also, the arrangement pattern of the heat pipes 5 can be changed according to the total number, shape and material of the heat pipes 5 .　

Here, regarding the arrangement pattern of the heat pipes 5, even if it differs from the arrangement pattern of the embodiment shown in FIG. Similar to the embodiment shown, the heat source 200 located on the downstream side of the flow path 10 can be cooled well compared to the configuration in which all the sealing portions 52 of the heat pipes 5 are arranged on the downstream side of the flow path 10. can be obtained.　

Modifications of the arrangement pattern of the heat pipes 5 will be described below with reference to FIGS. 6 and 7. FIG. The modified examples shown in FIGS. 6 and 7 are only examples, and various other modified examples can be adopted.　

In the first modification shown in FIG. 6, the support plate 4 has a mixed region 401 over the entire support region 40 . However, in the first modified example, the first number and the second number are not the same. For example, the first number is two and the second number is one. That is, two first heat pipes 5A and one second heat pipe 5B are alternately arranged in the second direction D2.　

Note that the first number and the second number can be changed as appropriate. For example, when the total number of heat pipes 5 is large, each of the first number and the second number may be plural. Also, the first number may be smaller than the second number.　

In the second modification shown in FIG. 7, the support plate 4 has a mixed region 401 and a non-mixed region 402 in the support region 40. In the second modification shown in FIG. Only one of the first heat pipe 5A and the second heat pipe 5B is arranged in the non-mixed area 402 . For example, in the non-mixed area 402, only the first heat pipes 5A are arranged.　

For example, the support plate 4 has non-mixed areas 402 on one side and the other side in the second direction D2. The support plate 4 has a mixed region 401 between the non-mixed region 402 on one side and the non-mixed region 402 on the other side in the second direction D2. That is, the support plate 4 has the mixed region 401 in the central portion in the second direction D2.　

Note that only the second heat pipes 5B may be arranged in the non-mixed area 402 . Also, the regions on both sides in the second direction D2 may be the mixed regions 401, and the central portion in the second direction D2 may be the non-mixed region 402. FIG. Also, a plurality of mixed areas 401 and a plurality of non-mixed areas 402 may exist.　

<5. Pin Fins> FIG. 8 is a plan view of the upper plate 2 having the pin fins 30 according to the modification as viewed from above. In FIG. 8, the cover 1 is indicated by dashed lines.　

The fin 3 according to the embodiment (see FIG. 1) is a plate-shaped member linearly extending in the first direction D1. Therefore, in the embodiment, the channel 10 extends parallel to the first direction D1. On the other hand, in a modification, the cooling device 100 includes pin fins 30 as shown in FIG. A pin fin 30 according to a modification has a plurality of pins 31 . The pins 31 of the pin fins 30 protrude upward from the upper surface of the upper plate 2 . That is, the pin 31 protrudes in a direction perpendicular to the direction in which the heat pipes 5 extend and the direction in which the heat pipes 5 are arranged.　

In the modified example, the coolant flows so as to weave between the pins 31 of the pin fins 30 . Therefore, the coolant easily spreads in the second direction D2. However, the coolant supplied from supply port 101 of cover 1 is finally discharged from discharge port 102 of cover 1 . That is, even when the pin fins 30 are used, one side in the first direction D1 is the upstream side of the channel 10 and the other side in the first direction D1 is the downstream side of the channel 10 .　

As a result, even when the pin fins 30 are used, the heat pipe 5 is extended in the first direction D1, and the sealing portion 52 is arranged on one side of the first direction D1, that is, on the supply port 101 side. A low-function portion of the pipe 5 can be placed upstream of the flow path 10 .　

<6. Others> Above, the embodiments of the present invention have been described. It should be noted that the scope of the present invention is not limited to the above-described embodiments. The present invention can be implemented with various modifications without departing from the gist of the invention. Moreover, the above-described embodiments can be combined arbitrarily as appropriate.　

INDUSTRIAL APPLICABILITY The present invention can be used, for example, for cooling various heat sources such as IGBTs.

1 Cover 3 Fin 4 Support plate 5 Heat pipe 5A First heat pipe 5B Second heat pipe 10 Channel 30 Pin fin 31 Pin 40 Support area 50 Internal space 51 Housing 52 Sealing part 100 Cooling device 101 Supply port 102 Discharge port 200 Heat source 401 mixed area

Claims

a channel through which the coolant flows;

a plurality of heat pipes;

The heat pipes extend from the upstream side to the downstream side of the flow path and are arranged in a direction orthogonal to the direction in which the heat pipes extend,

The heat pipe is

a housing having an internal space in which the hydraulic fluid is placed;

a sealing portion that seals the working fluid in the internal space;

The cooling device, wherein at least one of said seals is arranged upstream of said flow path.
A cover having the flow path in an inner region,

The cover is

a supply port through which the coolant is supplied to the upstream side of the flow path;

2. The cooling device according to claim 1, further comprising an outlet through which said coolant is discharged on the downstream side of said flow path.
A cooling device for cooling a plurality of heat sources,

3. The cooling device according to claim 1, wherein said heat pipe extends in a direction in which said heat sources are arranged.
A fin extending from the upstream side toward the downstream side of the flow path,

The cooling device according to any one of claims 1 to 3, wherein the heat pipe extends in the same direction as the fins.
a pin fin having a plurality of pins;

The cooling device according to any one of claims 1 to 3, wherein the pins protrude in a direction perpendicular to the direction in which the heat pipes extend and the direction in which the heat pipes are arranged.
the plurality of heat pipes,

a first heat pipe having the sealing portion upstream of the flow path;

The cooling device according to any one of claims 1 to 5, further comprising a second heat pipe having said sealing portion on the downstream side of said flow path.
7. The cooling device according to claim 6, wherein more than half of said plurality of heat pipes are said first heat pipes.
a support plate having a support area in contact with the heat pipe;

The cooling according to any one of claims 1 to 7, wherein the support plate has, in at least part of the support area, a mixed area in which the first heat pipes and the second heat pipes are alternately arranged. Device.
9. The cooling device according to claim 8, wherein said support plate has said mixed area over said support area.
10. The cooling device according to claim 8, wherein the same number of said first heat pipes and said second heat pipes are alternately arranged in said mixed area.
11. The cooling device according to claim 10, wherein the first heat pipes and the second heat pipes are alternately arranged in the mixed area.