JP2009024996A - Method of manufacturing heat pipe - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a heat pipe capable of effectively cooling a heat source. <P>SOLUTION: The method of manufacturing the heat pipe comprises steps for performing diameter reducing work to the end of a tubular container 2 with an outer diameter D of 8 mm or larger, then putting an operating medium in the container 2 and sealing the container 2. Since the outer diameter D of the container 2 is 8 mm or larger, the maximum heat transport quantity per heat pipe 1 is increased compared with a conventional one, and heat transfer performance equivalent to the conventional one can be obtained with a smaller number of heat pipes. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a heat pipe that is mounted in an electronic device and cools a heat source.

  Conventionally, this type of heat pipe is a sealed container made of copper or copper alloy in which a condensable fluid such as pure water is sealed as a working medium, and heat is transferred using the latent heat of vaporization of the working medium. Is done. Such a heat pipe is disposed in an electronic device having a heat source such as a notebook personal computer. For example, in order to reduce the size of the personal computer, a heat pipe having a small heat transfer capacity is required.

For example, in Patent Document 1, a wick made of a wire mesh or a groove formed on the inner surface of a container is provided inside a container enclosing a working medium, and when the working medium around the heating section evaporates due to heat from the outside, the vapor is generated. After flowing to the low-temperature / low-pressure heat dissipation part, it dissipates heat and condenses, and the capillary force generated when the working medium in the heating part evaporates and decreases is increased by the wick provided in the container, thereby dissipating heat. The working medium accumulated in the part is efficiently conveyed to the heating part.
Japanese Patent No. 3408033

  In the above configuration, notebook computers equipped with heat pipes are increasing the amount of heat generated by the CPU that is the heat source year by year, and it is not possible to carry the working medium from the heat radiation part of the heat pipe to the heating part. The CPU is somehow cooled by increasing the size or using several heat pipes. However, in this case, the mobility that is the original advantage of the notebook personal computer is lost, and there is a problem that the user cannot be satisfied in terms of size and weight.

  On the other hand, it is extremely difficult to eliminate the non-compressed gas inside the container at the time of manufacture, and since a chemical reaction may occur inside the container due to use for many years, an uncompressed gas may be generated. There is a small amount of uncompressed gas inside. However, if the non-compressed gas is collected at the tip of the heat dissipating part during operation of the heat pipe, heat transport is not performed at the location where the non-compressed gas in the heat dissipating part is collected, and the function as a heat pipe is partially lost. Is called. Therefore, as described above, it has been necessary to increase the shape of the container or use several heat pipes to ensure the necessary heat transport capability.

  Therefore, in view of the above problems, the present invention provides a method for manufacturing a heat pipe capable of effectively cooling a heat source without increasing the container shape or using a plurality of heat pipes. Is the purpose.

  In the invention of claim 1, since the outer diameter of the container is 8 mm or more, the maximum heat transport amount per one heat pipe is larger than the conventional one, and the heat transfer performance equivalent to the conventional one with a smaller number of heat pipes. Can be obtained. Therefore, it is possible to effectively cool the heat source by reducing the space occupied by the heat pipe without using a plurality of heat pipes. In addition, since the container end is sealed after the diameter reduction processing is performed, even if the outer diameter of the container is 8 mm or more, the sealed portion of the container end is securely sealed, and the airtightness in the container As a result, it becomes possible to improve reliability.

  In the invention of claim 2, the container made of copper or copper alloy can enhance the thermal conductivity of the heat receiving member and the heat radiating member thermally connected to the container, and the inside of the container is evacuated and pure as a working medium. By using a liquid such as water, it becomes possible to quickly transport heat to the heat radiating section.

  In the invention of claim 3, the container end is reduced in diameter by the reduced diameter portion. Therefore, it becomes possible to sufficiently reduce the diameter of the sealed portion at the container end, and it is possible to further improve the airtightness in the container and thus the reliability.

  In the invention of claim 4, the diameter reduction processing of the container end can be easily performed by swaging processing and spinning processing which are generally spread.

  In the invention of claim 5, by flattening the container, it is possible to make the thermal connection with each member such as the heat receiving member and the heat radiating member stronger by using the flat portion, The thermal resistance can be reduced by ensuring a large contact area with the member that is thermally connected.

Since the present invention is as described above, the following effects can be obtained.

  According to the first aspect of the present invention, it is possible to cool the heat source effectively by reducing the space occupied by the heat pipe without using a plurality of heat pipes, and also to improve the airtightness and reliability in the container. Can be increased.

  In invention of Claim 2, while being able to improve thermal conductivity with the member thermally connected with a container, it becomes possible to perform the heat transport to a thermal radiation part rapidly.

  In the invention of claim 3, by sufficiently reducing the diameter of the sealed portion at the container end, it becomes possible to further improve the airtightness in the container and hence the reliability.

  In the invention of claim 4, the diameter reduction processing of the container end can be easily performed.

  In the invention of claim 5, it is possible to secure a large contact area with the member thermally connected to the flat portion and reduce the thermal resistance.

  Hereinafter, preferred embodiments of the heat pipe manufacturing method according to the present invention will be described with reference to the accompanying drawings.

Reference example

  1 to 6 show a reference example of the present invention. In FIGS. 1 to 5, the hollow cylindrical container 2 which is the main body of the heat pipe 1 is preferably made of copper having a high thermal conductivity. Or it forms from metal pipe materials, such as a copper alloy. Moreover, in the state before the bending process shown in FIG. 1, the container 2 is entirely linear, and the outer diameter and the wall thickness are formed uniformly over the entire length in the axial direction except for the ends. Furthermore, sealing portions 2A and 2B are formed at both ends of the container 2 by appropriate means such as Tig welding, for example, and the inside of the container 2 is sealed in a vacuum state.

  By the way, when the heat pipe 1 is installed in a thin electronic device such as a notebook personal computer, the installation space in the thin electronic device is limited. Therefore, as shown in FIG. 2 and FIG. As necessary, a bent portion 9 is formed, and a flat portion 11 that is crushed is formed on a part or the whole of the container 2. The surface of the container 2 in which the flat portion 11 is formed is substantially flat, but will be described later because the container 2 is cylindrical and the inside of the container 2 is sealed in a decompressed state. When the container 2 is crushed without forming the convex portion 15, a recess 12 is partially generated on the surface of the flat portion 11 as shown in FIG. 6. A method for maximizing the influence of the depression 12 on the performance of the heat pipe 1 will be described in detail later.

  As shown in the cross-sectional view of FIG. 4, the inner wall surface of the container 2 is provided with a large number of fins 4 projecting along the axial direction, and the working medium sealed and accommodated in the container 2 is provided between the fins 4. A groove 5 is formed for allowing pure water (not shown) to flow by capillary action. That is, in this reference example, a groove type wick 6 is formed by the fins 4 and the grooves 5 formed on the inner surface of the container 2, and the grooves 5 are filled with pure water. A hollow portion in the container 2 surrounded by the wick 6 is formed as a steam flow path 7. In this reference example, the groove wick structure is shown with an internally grooved tube with the inner wall of the container 2 made uneven. However, another wick structure in which a mesh or a thin line for promoting the flow of the working medium is provided on the inner wall of the container 2 is used. It may be adopted. Here, for convenience, a heating unit 13 that receives heat from a heat source such as a CPU is formed at one end of the heat pipe 1, and a cooling unit 14 as a heat radiating unit that is cooled by a fan (not shown) is the other end of the heat pipe 1. Formed in the part. In which position of the heat pipe 1 the heating unit 13 and the cooling unit 14 are formed is not particularly limited.

  A flat portion 11 having a substantially planar upper side and lower side is formed at one end and the other end of the heat pipe 1 located at the heating unit 13 and the cooling unit 14. The end portion of the flat portion 11 forming the sealing portion 2B is provided with a cross-sectional area larger than that of the flat portion 11 and thus the internal flow path 7, so that the non-inside of the container 2 when the heat pipe 1 is operated. A convex portion 15 for storing the condensed gas is formed. The convex portion 15 is formed by leaving the container 2 positioned at the end of the flat portion 11 as it is when the flat portion 11 is formed by crushing as the cooling portion 14. It is provided to avoid the road 7 becoming insufficient. As shown in FIG. 2, when viewed from the direction in which the flat portion 11 is crushed, the width of the flat portion 11 in the left-right direction is wider than the convex portion 15, but as shown in FIG. 3, the flat portion 11 is crushed. When viewed perpendicularly to the direction, the width of the convex portion 15 in the vertical direction (the crushing direction) is wider than the flat portion 11 because the flat portion 11 is crushed. What is necessary is just to select suitably the amount of crushing of the flat part 11 here according to the thickness of the container 2, the shape of the radiation fin 33 mentioned later, etc.

  The flat portion 11 is formed in a part or the whole of the container 2 corresponding to the accommodation space in the thin electronic device to which the heat pipe 1 is mounted, but receives heat from the CPU 31 as shown in FIG. In order to secure the maximum contact area with the flat heat receiving plate 32 as the heat receiving member and the rectangular heat radiating fin 33 as the heat radiating member, and to strengthen the heat connection with each other, the above-mentioned flatness is also provided. Part 11 is provided. Such a flat part 11 is provided according to the surrounding situation of the heat pipe 1. In this reference example, the flat part 11 is located in the heating part 13 for thermally connecting the heat receiving plate 32 and the heat radiating part 14 for connecting the radiation fins 33. , Respectively, are partially provided in the container 2. In FIG. 5, the heat receiving plate 32 is tightly connected to the lower surface side of the substantially flat flat portion 11 formed in the heating portion 13, and the radiating fins 33 through which the wind from the blower (not shown) passes, The flat part 11 formed in the cooling part 14 is tightly connected to the upper surface side. Note that the heat receiving plate 32 and the heat radiating fins 33 may be configured as a part of the blower.

  Next, the operation of the above configuration will be described. When the heat of the CPU 31 is transferred from the heat receiving plate 32 to the heating unit 13 that is one end of the heat pipe 1 when using the notebook computer, the container 2 around the heating unit 13 is heated. As the temperature of the inner wall rises, the pure water in the inner wall evaporates and the latent heat of vaporization is taken away, thereby cooling the CPU 31 operating inside the notebook computer. On the other hand, in the wick 6 located in the heating unit 13, the vapor evaporated from the pure water moves to a place where the temperature is low due to the pressure difference inside the container 2 and condenses. At that time, while releasing the latent heat of condensation, the heat is carried from the heating part 13 on one end side of the heat pipe 1 to the cooling part 14 on the other end side of the heat pipe 1 cooled by the radiation fins 33 or the like. The heating unit 13 decreases in pure water as it evaporates, while the heat radiating unit increases in pure water due to the condensation of steam, so that capillary force is generated in the groove-type wick 6 and the pure water is cooled along the grooves 5. It is carried from the part 14 to the heating part 13.

  In this series of cooling cycles, in order to maximize the contact area between the heat receiving plate 32 and the container 2, and between the container 2 and the radiation fin 33, and to strengthen the heat connection between them, A flat part 11 is formed in the cooling part 14 by crushing. However, as shown in FIG. 6, due to the crushing process when the flat portion 11 is formed, a recess 12 is formed in the flat portion 11 so that the steam flow path 7 becomes extremely narrow, and the heat transport amount inside the container 2 decreases. To do.

  In addition, it is extremely difficult to eliminate the non-condensable gas inside the container 2, and a chemical reaction may occur inside the container 2 due to long-term use, and non-condensable gas may be generated. Such non-condensable gas is collected on the tip side (sealing part 2B side) of the cooling unit 14 by the operation of the heat pipe 1, and the location where the non-condensable gas is collected in the cooling unit 14 is left as it is. The heat transport function as 1 will be lost. In order to avoid such a problem, in this reference example, the convex section 15 having a large cross-sectional area as a non-condensable gas reservoir is provided on the tip side of the cooling section 14, so that the function due to the non-condensable gas in the cooling section 14 is achieved. The decline can be minimized. As a result, the heat pipe is optimal for thin electronic devices such as notebook computers with limited installation space, without increasing the overall shape of the container 2 or increasing the number of heat pipes 1 used. 1 can be provided.

  Further, by forming the flat part 11 by the crushing process in the cooling part 14 located at the other end of the heat pipe 1 while leaving the convex part 15, the above-described depression 12 is less likely to be generated in the flat part 11, It is possible to perform sufficient crushing processing on the portion 11. Therefore, it is possible to secure a large contact area with the radiating fins 33 that are thermally connected to the flat portion 11 positioned in the cooling portion 14 to reduce the thermal resistance, and to provide the heat pipe 1 having excellent heat transfer performance.

  As described above, in this reference example, in the heat pipe 1 that puts the working medium in the container 2, the flat part 11 that forms a part of the cooling part 14 is formed in the container 2 by crushing processing. For example, a convex portion 15 having a larger cross-sectional area than the flat portion 11 is formed at the end portion.

  Thus, by operating the heat pipe 1, the non-condensable gas inside the container 2 is collected on the cooling unit 14 side. On the cooling unit 14 side, the convex portion 15 that stores the non-condensable gas at the end of the flat portion 11. Therefore, even if the shape of the container 2 is enlarged or several heat pipes 1 are not used, the adverse effect of the uncompressed gas on the cooling unit 14 can be minimized and the heat source can be effectively used. It becomes possible to cool. In addition, when the flat part 11 by crushing processing is simply formed in the container 2, a hollow 12 that narrows the steam flow path 7 is formed in the flat part 11, but the crushing process is performed while leaving the convex part 15 at the end. When the flat portion 11 is formed, the depression 12 is less likely to be generated in the flat portion 11. Therefore, it becomes possible to perform sufficient crushing processing on the flat part 11, and it is possible to reduce the thermal resistance by ensuring a large contact area with the heat radiating member (for example, the heat radiating fin 33) thermally connected to the flat part 11. As a result, the heat pipe 1 having excellent heat transfer performance can be provided.

  In this reference example, the container 2 is made of copper or a copper alloy, and pure water as a working medium is sealed in the container 2 in a vacuum state.

  In this way, the container 2 made of copper or copper alloy can increase the thermal conductivity of, for example, the heat receiving plate 32 that is a heat receiving member thermally connected to the container 2 and the heat radiating fin 33 that is a heat radiating member, By evacuating the inside of the container 2 and using pure water which is a liquid as a working medium, it becomes possible to quickly carry out heat transport to the cooling unit 14 which is a heat radiating unit.

  Next, an embodiment of the present invention will be described with reference to FIGS. The heat pipe 1 used here is exactly the same as the reference example. Therefore, the same parts as those in the reference example are denoted by the same reference numerals, and description of the common parts is omitted as much as possible.

  First, the overall configuration of the heat pipe 1 before sealing will be described with reference to FIG. 7. The container 2 in this embodiment has an outer diameter D of 8 mm or more, and is similar to the fin 4 described in the reference example. A groove type wick 6 is formed on the inner surface. That is, the groove 5 of the container 2 made of an internally grooved tube functions as a groove-type wick 6 in the heat pipe 1. The first reduced diameter portion 42 having an outer diameter smaller than that of the body portion 41 of the container 2 that is not processed is first formed at both ends of the container 2 that is entirely linear. The first reduced diameter portion 42 is preferably subjected to swaging on both ends of the barrel portion 41 of the container 2 having a uniform outer diameter D and a cross-sectional shape so as to be coaxial with the central axis of the barrel portion 41. In addition to the outer diameter, the inner diameter is reduced. Further, a first taper portion 43 is formed between the trunk portion 41 and the first reduced diameter portion 42 of the container 2 during the swaging process. In the present embodiment, the first reduced diameter portion 42 formed at one end of the container 2 is formed longer than another first reduced diameter portion 42 formed at the other end of the container 2. This is because the working fluid is injected and vacuumed from one end side of the container 2 later. Further, in the present embodiment, the groove wick structure is shown by the inner grooved tube in which the inner wall of the container 2 is made uneven. However, another wick structure in which the inner wall of the container 2 is provided with a mesh or a fine line for promoting the flow of the working medium. May be adopted.

  After forming the aforementioned first reduced diameter portion 42, as shown in FIG. 8, swaging is again applied to each first reduced diameter portion 42, and the outer diameter is larger than the first reduced diameter portion 42. It is preferable to form a second reduced diameter portion 45 having a smaller diameter. When the diameter reduction processing is performed a plurality of times as described above, both ends of the container 2 can be reduced to a desired outer diameter even if the outer diameter D1 of the body 41 of the container 2 is large to some extent. The internal airtightness can be increased. In this way, after performing the diameter reduction process once or a plurality of times, the sealing part 2B by, for example, Tig welding is formed in the second diameter reducing part 45 on the other end side of the heat pipe 1. Subsequently, by using another second reduced diameter portion 45 on one end side of the heat pipe 1, the inside of the container 2 is evacuated and a predetermined amount of pure water as a working fluid is put therein, and the heat pipe 1 A similar sealing portion 2A by, for example, Tig welding is formed in the second reduced diameter portion 45 on the one end side of each. Thereby, the inside of the container 2 is completely sealed in a state where the groove 5 of the wick 6 on the inner surface of the container 2 is filled with pure water.

  In addition, as a method of integrally forming the first reduced diameter portion 42 and the second reduced diameter portion 45 in the heat pipe 1, in addition to the above swaging process, a spinning process in which a drawing process is performed while rotating a pipe material. May be adopted. Any processing method has an advantage that the first reduced diameter portion 42 and the second reduced diameter portion 45 having a desired shape can be formed at low cost. Further, a diameter reducing method other than drawing may be used.

  When the heat pipe 1 is installed in a thin electronic device such as a notebook personal computer, the installation space in the thin electronic device is limited. Therefore, as shown in FIG. 10 and FIG. Accordingly, a bent portion 9 is formed, and a flat portion 11 that is crushed is formed on a part or the whole of the container 2. The flat part 11 is provided according to the surrounding situation of the heat pipe 1, and is located in the heating part 13 that thermally connects the heat receiving plate 32 and the cooling part 14 that connects the radiation fins 33 in this embodiment, Each is partially provided in the container 2.

  As shown in FIG. 12, one side surface of a heat receiving plate 32 as a heat receiving member is thermally connected to the lower surface side of the substantially flat flat portion 11 formed in the heating unit 13 by, for example, soldering and the like. A CPU 31 mounted on the notebook computer is thermally connected to the other side of the plate 32. Furthermore, the heat radiating fins 33 as heat radiating members through which the wind from the blower (not shown) passes are thermally connected to the upper surface side of another flat portion 11 formed in the cooling portion 14 by, for example, soldering.

  Also in this embodiment, when the heat of the CPU 31 is transmitted from the heat receiving plate 32 to the heating unit 13 which is one end of the heat pipe 1 when the notebook computer is used, the temperature of the inner wall of the container 2 around the heating unit 13 rises. The CPU 31 is cooled by evaporating the deionized water and removing the latent heat of vaporization. On the other hand, in the wick 6 located in the heating unit 13, the vapor evaporated from the pure water moves to a place where the temperature is low due to the pressure difference inside the container 2 and condenses. From the heating part 13 on one end side of the pipe 1, it is carried to the cooling part 14 on the other end side of the heat pipe 1 cooled by the radiation fins 33 or the like. The heating unit 13 decreases in pure water as it evaporates, while the heat radiating unit increases in pure water due to the condensation of steam, so that capillary force is generated in the wick 6, and the pure water flows from the cooling unit 14 along the groove 5. It is carried to the heating unit 13.

  In this series of cooling cycles, in order to maximize the contact area between the heat receiving plate 32 and the container 2, and between the container 2 and the radiation fin 33, and to strengthen the heat connection between them, A flat part 11 is formed in the cooling part 14 by crushing. However, since the inner diameter grooved copper pipe constituting the container 2 conventionally has an outer diameter D of less than 8 mm, the single heat pipe 1 cannot exhibit sufficient heat transport capability, and the heat pipes must be arranged side by side. Did not get. Therefore, if the container 2 is made of an internally grooved copper tube having an outer diameter D of 8 mm or more as in this embodiment, the flat portion of the flat portion 11 has a larger area and more heat connection with the heat receiving member and the heat radiating member is achieved. As a result, the number of heat pipes 1 can be reduced, and the space occupied by the heat pipes 1 in the thin electronic device can be reduced. In addition, when the outer diameter D of the container 2 is 8 mm or more, there is a concern that sealing at both ends of the heat pipe 1 is not sufficiently performed. Also in this embodiment, the swaging process is preferably performed a plurality of times. The airtightness at the sealed portion is improved by performing diameter reduction processing in advance. Thereby, the optimum heat pipe 1 can be supplied even in a thin electronic device such as a notebook personal computer having a small installation space.

  As described above, in this embodiment, after reducing the diameter of the end of the tubular container 2 having an outer diameter D of 8 mm or more, that is, both ends, the working medium is put into the container 2 and both ends of the container 2 are moved. For example, a method of manufacturing a heat pipe sealed by Tig welding or the like is adopted.

  In this way, since the outer diameter D of the container 2 is 8 mm or more, the maximum heat transport amount per one heat pipe is larger than before, and the heat transfer performance equivalent to the conventional one can be achieved with a smaller number of heat pipes. Obtainable. Therefore, the space occupied by the heat pipe 1 can be reduced and the heat source can be effectively cooled without using a plurality of heat pipes 1. In addition, since both ends of the container 2 are sealed after being subjected to diameter reduction processing, even if the outer diameter of the container 2 is 8 mm or more, the sealed portions at both ends of the container 2 are securely sealed, It becomes possible to improve the airtightness in 2 and the reliability.

  Moreover, the container 2 in a present Example consists of copper or a copper alloy, and encloses the pure water which is a liquid as a working medium in the container 2 in a vacuum state.

  In this way, the container 2 made of copper or copper alloy can enhance the thermal conductivity of the heat receiving plate 32 and the heat radiating fins 33 that are thermally connected to the container 2, and the inside of the container 2 is evacuated and used as a working medium. By using pure water that is a liquid, it becomes possible to quickly carry out heat transport to the cooling unit 14 that is a heat radiating unit.

  Furthermore, in this embodiment, the first reduced diameter portion 42 and the second reduced diameter portion 45 as reduced diameter portions are formed at both ends of the container 2 by the diameter reduction processing.

  In this way, both ends of the container 2 are preferably reduced in a stepwise manner (two steps) by the first reduced diameter portion 42 and the second reduced diameter portion 45. Therefore, the diameter of the sealed portions at both ends of the container 2 can be sufficiently reduced, and the airtightness in the container 2 and thus the reliability can be further improved.

  Moreover, the diameter reduction process of the container 2 both ends in a present Example is performed in multiple times, for example by the swaging process or the spinning process.

  In this way, the diameter reduction process at both ends of the container 2 can be easily performed by the swaging process and the spinning process that are generally widely used. In addition, if the diameter reduction process is performed a plurality of times, the sealed portions at both ends of the container 2 are obtained. Can be sufficiently reduced in diameter, and the hermeticity in the container 2 and thus the reliability can be further improved.

  In this embodiment, the container 2 is flattened after both ends of the container 2 are sealed.

  Thus, by flattening the container 2, it is possible to make the thermal connection with each member such as the heat receiving plate 32 and the heat radiating fin 33 stronger by using the flat portion 11. The thermal resistance can be reduced by ensuring a large contact area with the member thermally connected to the portion 11.

  In addition, this invention is not limited to the said Example, It can change in the range which does not deviate from the meaning of this invention.

It is a top view before the bending crushing process of the heat pipe in the reference example of this invention. Claims as originally claimed It is a top view of the heat pipe after giving a bending crushing process same as the above. It is a front view of the flat part of the heat pipe in FIG. 2 same as the above. FIG. 3 is a cross-sectional view of the flat portion shown in FIG. It is a front view of the state which thermally connected various members to the heat pipe shown in FIG. 3 same as the above. It is a top view which shows the example which performed the crushing process of the heat pipe, without forming a convex part. It is a top view of the heat pipe just after forming the 1st reduced diameter part in the Example of this invention. It is a top view of the heat pipe just after sealing the both ends of a container same as the above. It is a side view of the heat pipe in FIG. 8 same as the above. It is a top view of the heat pipe after giving a bending crushing process same as the above. It is a front view of the flat part of the heat pipe in FIG. It is a front view of the state which thermally connected various members to the heat pipe shown in FIG. 11 same as the above.

Explanation of symbols

1 Heat pipe 2 Container
42 First reduced diameter part (reduced diameter part)
45 Second reduced diameter part (reduced diameter part)

Claims (5)

After the first diameter reduction process and the second diameter reduction process are performed on a tubular container end having an outer diameter of 8 mm or more, the container is sealed by putting a working medium in the container. Heat pipe manufacturing method. 2. The method of manufacturing a heat pipe according to claim 1, wherein the container is made of copper or a copper alloy, and a liquid is sealed in the container as the working medium. The heat pipe manufacturing method according to claim 1, wherein a plurality of reduced diameter portions are formed in the container by the plurality of reduced diameter processing. The heat pipe manufacturing method according to any one of claims 1 to 3, wherein the container diameter reduction processing is performed by swaging processing or spinning processing. The method for manufacturing a heat pipe according to any one of claims 1 to 4, wherein the container is flattened after the container is sealed.

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