US20100270007A1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
US20100270007A1
US20100270007A1 US12/428,590 US42859009A US2010270007A1 US 20100270007 A1 US20100270007 A1 US 20100270007A1 US 42859009 A US42859009 A US 42859009A US 2010270007 A1 US2010270007 A1 US 2010270007A1
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US
United States
Prior art keywords
heat
seat
base
pipes
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/428,590
Inventor
Wen-Te Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LEA-MIN TECHNOLOGIES Co Ltd
Original Assignee
LEA-MIN TECHNOLOGIES Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LEA-MIN TECHNOLOGIES Co Ltd filed Critical LEA-MIN TECHNOLOGIES Co Ltd
Priority to US12/428,590 priority Critical patent/US20100270007A1/en
Assigned to LEA-MIN TECHNOLOGIES CO., LTD. reassignment LEA-MIN TECHNOLOGIES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, WEN-TE
Publication of US20100270007A1 publication Critical patent/US20100270007A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink has a conducting heat seat, multiple heat pipes and multiple heat dissipating fins. The heat pipes are mounted through the conducting heat seat and each heat pipe has a central portion and two distal portions. The central portion is flat. The distal portions on one side of the conducting heat seat lined zigzag. The flat central portions and zigzag lined distal portions allow more heat pipes to be mounted through the seat per unit area. The heat dissipating fins are separately mounted on the first conducting distal portions of the heat pipes to transfer heat to the atmosphere.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat sink, especially to a heat sink for a central processing unit (CPU) with improved thermal exchange.
  • 2. Description of the Prior Arts
  • With reference to FIGS. 13 to 15, a heat sink in accordance with the prior art is used to mount a central processing unit (CPU) on a motherboard and allow heat from the CPU to be dissipated to the air to prevent damage and improve operating efficiency. The heat sink has a seat (90), multiple heat pipe (91) and multiple heat dissipating fins (92). The seat (90) has two sides and multiple through holes (93). The through holes (93) are formed through the sides of the seat (90). The heat pipes (91) are U-shaped and each heating tube (91) has a central portion (94) and two distal portions (95). The central portion (94) is mounted through one through hole (93) of the seat (90), is circular in cross section and has two ends and a diameter. The distal portions (95) are respectively formed on the two ends of the central portion (91) of the heat pipe (91). The heat dissipating fins (92) are mounted around the distal portions (95) of the heat pipes (91) to increase dissipation area of the heat sink.
  • However, a number of heat pipes (91) that may be mounted through the seat (90) is limited by the diameter of the central portion (94).
  • To overcome the shortcomings, the present invention provides a heat sink to mitigate or obviate the aforementioned problems.
    • SUMMARY OF THE INVENTION
  • The main objective of the present invention is to provide a heat sink for a central processing unit (CPU) with improved thermal exchange.
  • A heat sink has a conducting heat seat, multiple heat pipes and multiple heat dissipating fins. The heat pipes are mounted through the conducting heat seat and each heat pipe has a central portion and two distal portions. The central is flat. The distal portions on one side of the conducting heat seat lined zigzag. The flat central portions and zigzag lined distal portions allow more heat pipes to be mounted through the seat per unit area. The heat dissipating fins are separately mounted on the first conducting distal portions of the heat pipes to transfer heat to the atmosphere.
  • Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of a first embodiment of a heat sink in accordance with the present invention;
  • FIG. 2 is a side view of the heat sink in FIG. 1;
  • FIG. 3 is a partly exploded perspective view of the heat sink in FIG. 1;
  • FIG. 4 is a perspective view of the first kind of a heat pipe of the heat sink in FIG. 1;
  • FIG. 5 is a side view of the heat pipe of the heat sink in FIG. 4;
  • FIG. 6 is a perspective view of the second kind of a heat pipe of the heat sink in FIG. 1;
  • FIG. 7 is a side view of the heat pipe of the heat sink in FIG. 6;
  • FIG. 8 is a perspective view of the third kind of a third tube of the heat sink in FIG. 1;
  • FIG. 9 is a side view of the heat pipe of the heat sink in FIG. 8;
  • FIG. 10 is a top view of the heat sink in FIG. 1;
  • FIG. 11 is a front view of the heat sink in FIG. 1;
  • FIG. 12 is a side view of a second embodiment of a heat sink;
  • FIG. 13 is a side view of the heat sink in accordance with the prior art;
  • FIG. 14 is a perspective view of the heat pipe of the heat sink in FIG. 11; and
  • FIG. 15 is a: side view of the heat sink in FIG. 12.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • With reference to FIGS. 1 to 3, a first embodiment of a heat sink in accordance with the present invention comprises a conducting heat seat (10), multiple heat pipes (20) and multiple heat dissipating fins (30).
  • The conducting heat seat (10) has two opposite sides, a base (11) and a cover (12). The base (11) has an inner surface and multiple base recesses (111).
  • The base recesses (111) are formed in the inner surface of the conducting heat seat (10).
  • The cover (12) is mounted securely on the base (11) and has an inner surface, multiple cover recesses (121). The cover recesses (121) are formed in the inner surface of the cover (12), respectively correspond to the base recesses (111).
  • With further reference to FIGS. 4 to 9, the heat pipes (20A, 20B, 20C) are mounted through the conducting heat seat (10), are mounted respectively in the base recesses (111) of the base (11) and are mounted respectively in the cover recesses (121) of the cover (12). Each heat pipe (20) has a central portion (22A, 22B, 22C) and two distal portions (23A, 23B, 23C).
  • The central portion (22A, 22B, 22C) is substantially flat, is mounted in one base recess (111) of the base (11) and one cover recess (121) of the cover (12) and has a transverse length (223A, 223B, 223C), a longitudinal depth (221A, 221B, 221C), a vertical thickness (222A, 222B, 222C) and two ends. The longitudinal depth (221A, 221B, 221C) correspond to heights of the base and cover recesses (111, 121). The vertical thickness (222A, 222B, 222C) are less than the longitudinal depth (221A, 221B, 221C) and correspond to depths of the base and cover recesses (111, 121). Furthermore, the central portions (22A, 22B, 22C) of the heat pipes of the first embodiment are separate, as shown in FIG. 2.
  • The distal portions (23A, 23B, 23C) are respectively formed on the ends of the heat pipe (20A, 20B, 20C) and are substantially perpendicularly to the conducting heat seat (10). The heat pipes (20A, 20B, 20C) are first heat pipes (20A), second heat pipes (20B) and third heat pipes (20C). The first, second and third heat pipes (20A, 20B, 20C) are arranged in a staggered arrangement so that the distal portions (23A, 23B, 23C) of the heat pipes (20A, 20B, 20C) on one side of the conducting heat seat (10) is arranged in a zigzag line as shown in FIGS. 10 and 11. The distal portions (23A, 23B, 23C) in the zigzag lines cooperate with the flat central portions (22A, 22B, 22C) and allow adjacent heat pipes (20A, 20B, 20C) to be closer and abut tighter each other when compared to central portions of a conventional heat pipe arranged in a straight line.
  • The heat dissipating fins (30) are separately mounted around the distal portions (23A, 23B, 23C) of the heat pipes (20A, 20B, 20C) and have multiple through holes (31). The through holes (31) are formed through the heat dissipating fin (30), correspond respectively to and are mounted respectively around the distal ends (23) of the heat pipes (20A, 20B, 20C) and align with through holes (31) in adjacent dissipating fins (30). Each through hole (31) has a rim (32) and a shoulder (33). The shoulder (33) is formed around the rim (32) of the through hole (31).
  • With further reference to FIG. 12, a second embodiment of the heat sink is similar to the first embodiment, the base and cover recesses (111, 121) are arranged more compact and the heat pipes is in a closer arrangement when compared to the first embodiment. Therefore, the central portions (22A, 22B, 22C) of adjacent heat pipes (20A, 20B, 20C) abut and contact each other.
  • Since the vertical thickness (222A, 222B, 222C) of the heat pipes (20A, 20B, 20C) are less than the longitudinal depths (221A, 221B, 221C) and the distal portions (23A, 23B, 23C) are in the zigzag lines, more heat pipes (20A, 20B, 20C) per unit area can be arranged through the seat (10) to conduct heat generated by a CPU to the heat dissipating fins (30). Therefore, the thermal dissipation of the heat sink is improved.
  • Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and features of the invention, the disclosure is illustrative only. Changes may be made in the details, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (4)

1. A heat sink comprising
a conducting heat seat having two opposite sides;
multiple heat pipes being mounted through the conducting heat seat and each heat pipe having
a central portion being substantially flat and having
a longitudinal depth;
a vertical thickness being less than the longitudinal depth;
a transverse length; and
two ends; and
two distal portions being respectively formed on the ends of the heat pipe and being substantially perpendicularly to the conducting heat seat, the distal portions of the heat pipes on one side of the conducting heat seat are arranged in a zigzag line; and
multiple heat dissipating fins being separately mounted around the distal portions of the heat-pipes and having
multiple through holes being formed through the heat dissipating fin, corresponding respectively to and being mounted respectively around the distal ends of the heat pipes, aligning with through holes in adjacent dissipating fins and each through hole having
a rim; and
a shoulder being formed around the rim of the through hole.
2. The heat sink as claimed in claim 1, wherein
the conducting heat seat has
a base having
an inner surface; and
multiple base recesses being formed in the inner surface of the conducting heat seat; and
a cover being mounted securely on the base and having
an inner surface;
multiple cover recesses being formed in the inner surface of the cover and respectively corresponding to the base recesses; and
the heat pipes are mounted respectively in the base recesses of the base and mounted respectively in the cover recesses of the cover and each central portion is mounted in one base recess of the base and one cover recess of the cover.
3. The heat sink as claimed in claim 2, wherein the central portions of the adjacent heat pipes are separate.
4. The heat sink as claimed in claim 2, wherein the central portions of adjacent heat pipes abut and contact each other.
US12/428,590 2009-04-23 2009-04-23 Heat sink Abandoned US20100270007A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/428,590 US20100270007A1 (en) 2009-04-23 2009-04-23 Heat sink

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Application Number Priority Date Filing Date Title
US12/428,590 US20100270007A1 (en) 2009-04-23 2009-04-23 Heat sink

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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
US20120152496A1 (en) * 2010-12-20 2012-06-21 Foxconn Technology Co., Ltd. Heat dissipation device and method of manufacturing same
US20120222840A1 (en) * 2011-03-04 2012-09-06 Tsung-Hsien Huang Heat pipe mounting method and heat pipe assembly thereof
US20120241132A1 (en) * 2011-03-22 2012-09-27 Tsung-Hsien Huang Non-base block heat sink
US20120312508A1 (en) * 2011-06-08 2012-12-13 Shen Chih-Yeh Gapless heat pipe combination structure and combination method thereof
CN103429047A (en) * 2013-02-27 2013-12-04 上海理工大学 Radiating device
WO2014092057A1 (en) * 2012-12-11 2014-06-19 古河電気工業株式会社 Cooling device
US20180168069A1 (en) * 2016-12-09 2018-06-14 Cooler Master Technology Inc. Parallel heat-pipes type heat sink and manufacturing method thereof
EA033570B1 (en) * 2016-10-12 2019-11-06 Baltimore Aircoil Co Inc Indirect heat exchanger
WO2020137569A1 (en) * 2018-12-28 2020-07-02 古河電気工業株式会社 Heatsink
US20220051907A1 (en) * 2019-05-09 2022-02-17 Zalman Tech Co., Ltd. Method of fabricating electronic component cooling apparatus including heat pipes and heat transfer block
USD954005S1 (en) 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
EP4131369A4 (en) * 2020-03-27 2024-04-17 Sony Interactive Entertainment Inc Heat dissipation device and electronic apparatus

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050257920A1 (en) * 2004-05-21 2005-11-24 Foxconn Technology Co., Ltd Heat dissipating device
US20060219392A1 (en) * 2005-04-01 2006-10-05 Tong-Hua Lin Heat dissipating apparatus
US20060266500A1 (en) * 2005-05-29 2006-11-30 Tong-Hua Lin Heat dissipating apparatus
US20070044944A1 (en) * 2005-08-30 2007-03-01 Sheng-Huang Lin Radiator module structure
US20070131390A1 (en) * 2005-12-09 2007-06-14 Kuo-Hsin Chen Heat dissipating module and method of fabricating the same
US20070227712A1 (en) * 2006-03-31 2007-10-04 Bugler Thomas W Iii Heat exchanger apparatus incorporating elliptically-shaped serpentine tube bodies
US20070267181A1 (en) * 2006-05-16 2007-11-22 Kuo-Len Lin Juxtaposing Structure For Heated Ends Of Heat Pipes

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050257920A1 (en) * 2004-05-21 2005-11-24 Foxconn Technology Co., Ltd Heat dissipating device
US20060219392A1 (en) * 2005-04-01 2006-10-05 Tong-Hua Lin Heat dissipating apparatus
US20060266500A1 (en) * 2005-05-29 2006-11-30 Tong-Hua Lin Heat dissipating apparatus
US20070044944A1 (en) * 2005-08-30 2007-03-01 Sheng-Huang Lin Radiator module structure
US20070131390A1 (en) * 2005-12-09 2007-06-14 Kuo-Hsin Chen Heat dissipating module and method of fabricating the same
US20070227712A1 (en) * 2006-03-31 2007-10-04 Bugler Thomas W Iii Heat exchanger apparatus incorporating elliptically-shaped serpentine tube bodies
US20070267181A1 (en) * 2006-05-16 2007-11-22 Kuo-Len Lin Juxtaposing Structure For Heated Ends Of Heat Pipes

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
US20120152496A1 (en) * 2010-12-20 2012-06-21 Foxconn Technology Co., Ltd. Heat dissipation device and method of manufacturing same
US8881793B2 (en) * 2011-03-04 2014-11-11 Tsung-Hsien Huang Heat pipe assembly
US20120222840A1 (en) * 2011-03-04 2012-09-06 Tsung-Hsien Huang Heat pipe mounting method and heat pipe assembly thereof
US8806748B2 (en) * 2011-03-04 2014-08-19 Tsung-Hsien Huang Heat pipe mounting method
US20120241132A1 (en) * 2011-03-22 2012-09-27 Tsung-Hsien Huang Non-base block heat sink
US8746325B2 (en) * 2011-03-22 2014-06-10 Tsung-Hsien Huang Non-base block heat sink
US20120312508A1 (en) * 2011-06-08 2012-12-13 Shen Chih-Yeh Gapless heat pipe combination structure and combination method thereof
WO2014092057A1 (en) * 2012-12-11 2014-06-19 古河電気工業株式会社 Cooling device
JP5620032B1 (en) * 2012-12-11 2014-11-05 古河電気工業株式会社 Cooling system
CN103429047A (en) * 2013-02-27 2013-12-04 上海理工大学 Radiating device
EA033570B1 (en) * 2016-10-12 2019-11-06 Baltimore Aircoil Co Inc Indirect heat exchanger
US20180168069A1 (en) * 2016-12-09 2018-06-14 Cooler Master Technology Inc. Parallel heat-pipes type heat sink and manufacturing method thereof
US10772235B2 (en) * 2016-12-09 2020-09-08 Cooler Master Technology Inc. Heat sink and manufacturing method thereof
WO2020137569A1 (en) * 2018-12-28 2020-07-02 古河電気工業株式会社 Heatsink
JP2020106245A (en) * 2018-12-28 2020-07-09 古河電気工業株式会社 Heat sink
TWI722736B (en) * 2018-12-28 2021-03-21 日商古河電氣工業股份有限公司 Heat sink
USD971862S1 (en) * 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
US20220051907A1 (en) * 2019-05-09 2022-02-17 Zalman Tech Co., Ltd. Method of fabricating electronic component cooling apparatus including heat pipes and heat transfer block
USD954005S1 (en) 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
EP4131369A4 (en) * 2020-03-27 2024-04-17 Sony Interactive Entertainment Inc Heat dissipation device and electronic apparatus

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Legal Events

Date Code Title Description
AS Assignment

Owner name: LEA-MIN TECHNOLOGIES CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, WEN-TE;REEL/FRAME:022586/0319

Effective date: 20090423

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION