CN103429047A - Radiating device - Google Patents
Radiating device Download PDFInfo
- Publication number
- CN103429047A CN103429047A CN201310062709XA CN201310062709A CN103429047A CN 103429047 A CN103429047 A CN 103429047A CN 201310062709X A CN201310062709X A CN 201310062709XA CN 201310062709 A CN201310062709 A CN 201310062709A CN 103429047 A CN103429047 A CN 103429047A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- air
- fins set
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
A radiating device for cooling electronic devices is characterized by comprising a substrate part of which one surface is equipped with an installing groove for installing electronic devices, and the other surface is equipped with grooves; a radiating part comprising a fin group formed by parallelly arranging at least a plurality of fins, and at least a plurality of heat pipe groups formed by at least a plurality of heat pipes, wherein the heat pipe groups are embedded and welded in the grooves and are welded in the fin group in a penetration manner; an air flow forming part comprising at least one fan for generating an air flow and an air channel surrounding and protecting component concentrating the air flow along the fins, wherein the fin group is equipped with at least a plurality of penetrating hole groups by which the heat pipes groups are welded in the penetration manner, each penetrating hole group is equipped with at least a plurality of penetrating holes, and the number of the penetrating holes corresponds to the number of the heat pipes; the air flow forming part is arranged on the side surface vertical with the fins, and the distances between the penetrating hole groups and the side surface are different.
Description
Technical field
The present invention relates to the electronic equipment dissipating heat field, be specifically related to a kind of forced air-cooled heat abstractor.
Background technology
At present, radiating mode has passive heat radiation and active heat removal, and the active heat removal mode is generally strong than passive radiating mode heat-sinking capability.Active heat removal need to be taked the forced heat radiation measure, such as air blast cooling, water-cooled etc.
Electronic device has miniaturization, modular development trend, and the hear rate of the electronic device of high power, high-density packages also increases sharply, and its surface heat flux has reached tens of watts and even gone up every square centimeter of hectowatt.Water cooling method can't be implemented because of the limitation of conditions, and the heat-sinking capability of high-density packages electronic device just has been subject to challenge.
In air blast cooling heat radiation, utilizing fan-type air blast cooling heat radiation, heat pipe fin air blast cooling heat radiation is all more general radiating mode, but often due to heat pipe and fin, utilizes insufficiently, and the surface area that carries out heat exchange is too concentrated, reduces radiating efficiency.
Summary of the invention
The object of the present invention is to provide a kind of forced air-cooled heat abstractor based on heat pipe and fin, but being dispelled the heat of the power-type electronic equipment that the effects on surface density of heat flow rate is high, wherein heat pipe and fin utilization are abundant, the surface area that carries out heat exchange evenly utilizes, improve radiating efficiency, the working temperature of electronic device is limited in the reasonable scope, thereby normally stablize, work safely.
A kind of heat abstractor that electronic device is dispelled the heat provided by the invention has such feature: comprises, and baseplate part, one side is provided with the mounting groove of mounting electronic device, and another side is provided with groove; Radiating part, comprise fins set, at least a plurality of heat pipe heat be comprised of at least a plurality of heat pipes that at least a plurality of fins be arranged in parallel and form, and heat pipe heat embeds to be welded on groove and to intert and is welded in fins set; The air-flow forming portion, comprise that at least one produces the fan of air-flow, makes the air-flow air channel fender member concentrated along fins set, wherein, fins set is provided with at least a plurality of through hole groups corresponding to the interspersed welding of heat pipe heat, the through hole group is provided with at least a plurality of through holes, the quantity of through hole is corresponding with the quantity of heat pipe, and the air-flow forming portion is arranged on a side perpendicular with fin, through hole group and a side apart from inequality.
A kind of heat abstractor provided by the invention can also have such feature: also comprise, be provided with ventilating opening, be arranged on the package casing section of filter screen and the mounting bracket at ventilating opening place.
A kind of heat abstractor provided by the invention can also have such feature: wherein, heat pipe heat is provided with and imports end, and the shape of importing end and the shape of groove are chimeric.
Effect of the present invention is:
The mounting groove that baseplate part is provided with can be installed one or more electronic device, heat pipe heat is provided with different length, heat pipe heat runs through and is welded in fins set and the through hole group is uniformly distributed in fins set, the heat exchange surface of fin is evenly utilized, improve radiating efficiency, the working temperature of electronic device is limited in the reasonable scope.
The accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is the front view of heat abstractor in embodiments of the invention;
Fig. 2 is the rearview of heat abstractor in embodiments of the invention;
Fig. 3 is the internal structure schematic diagram of heat abstractor in embodiments of the invention;
Fig. 4 is the internal structure elevational schematic view of heat abstractor in embodiments of the invention.
Concrete case study on implementation
Fig. 1 is the front view of heat abstractor in embodiments of the invention.
As shown in Figure 1, electronic device 1 is arranged on the mounting groove 3 that is positioned at heat-radiating substrate 2 outsides, and package casing 4 is provided with the ventilating opening 5 of grid form, and the ventilating opening place can install filter screen 6 additional, reduces the impact that heat abstractor is subject to dust and moisture.
Also be provided with the mounting bracket 7 with installing hole 7a on package casing 4, electronic device 1 integrally is arranged on installed surface by this mounting bracket 7 with heat abstractor 100.
Fig. 2 is the rearview of heat abstractor in embodiments of the invention.
As shown in Figure 2, not only in the two sides of package casing 4, be provided with ventilating opening 5, and the trailing flank that is positioned at package casing 4 also is provided with ventilating opening 5.
Fig. 3 is the internal structure schematic diagram of heat abstractor in embodiments of the invention.
As shown in Fig. 3, the heat-radiating substrate 2 of the red copper material of good heat conductivity, to strengthen the heat conduction of heat-radiating substrate 2.Heat pipe heat 8 all is bent into U-shaped in manufacturing process, an end of heat pipe heat 8 and the medial surface 2a of heat-radiating substrate 2 welding, and the lateral surface 2b of heat-radiating substrate 2 is provided with mounting groove 3.Heat pipe heat 8 penetrates the whole fins set 9 of welding.The quantity of fin in fins set 9 can be set as required, in order to reach optimum radiating effect, setting parallel to each other between fin.
Fig. 4 is the internal structure elevational schematic view of heat abstractor in embodiments of the invention.
As shown in Figure 4, the medial surface 2a of heat-radiating substrate 2 is provided with groove 10, in order to make contact-making surface, strengthens, and an end of heat pipe heat 8 is flattened formation importing end 8a embedding and is welded in groove 10.
Comprise in longer heat pipe 13, the second heat pipe heat 12 of the six roots of sensation and comprise the shorter heat pipe 14 of the six roots of sensation in the first heat pipe heat 11 of two kinds of different lengths of heat pipe heat 8 employings, the second heat pipe heat 12, the first heat pipe heat 11.The longer heat pipe 13 of the six roots of sensation and the shorter heat pipe 14 of the six roots of sensation all are bent into U-shaped in manufacturing process.
Be provided with first through hole group 15, the second through hole group 16 corresponding with the first heat pipe heat 11, the second heat pipe heat 12 in fins set 9, the first through hole group 15 comprises six corresponding with the longer heat pipe 13 of the six roots of sensation respectively the first through holes 17, the second through hole group 16 comprises six corresponding with the shorter heat pipe 14 of the six roots of sensation respectively the second through holes 18, and above-mentioned the first through hole group 15 penetrates in whole in fins set 9 with above-mentioned the second through hole group 16 is parallel.
The upper side 9a of the fins set 9 shown in Fig. 4, be also simultaneously, outside heat pipe heat 8 U-shaped, to be provided with an air-flow forming portion 19, the circulation of air between the fin that the air-flow of generation has been accelerated to be arranged in parallel, thus improve radiating efficiency.Be provided with two blast type fans 20 in air-flow forming portion 19, be placed in air channel fender member 21.After fan 20 produces air-flow, air channel fender member 21 makes said flow concentrate and flow to fins set 9.Air channel fender member 21 is other also is provided with line outlet 22, can be for the assembly outlet of fan 20 and electronic device 1.
The first through hole group 15 is nearer with the first distance H 23 of the upper side 9a of above-mentioned fins set 9, the second through hole group 16 is greater than above-mentioned the first distance H 23 with the second distance h24 of the upper side 9a of above-mentioned fins set 9, thereby known, above-mentioned fins set 9 upper side 9a are far away for the second through hole group 16 distance, and six the first through holes 17, six mutual cross arrangements of the second through hole 18 and be evenly distributed in fins set 9.
The other end of the longer heat pipe 13 of the six roots of sensation interts and is welded in six the first through holes 17 respectively, and penetrates whole fins set 9.The other end of the shorter heat pipe 14 of the six roots of sensation interts and is welded in six the second through holes 18 respectively, and penetrates whole fins set 9.The longer heat pipe 13 of the six roots of sensation, the shorter heat pipe 14 of the six roots of sensation cross one another and arrange and equally distributed interspersed being welded in fins set 9.
Wherein, heat pipe heat 8 and fins set 9 all adopt the red copper material of good heat conductivity.
As shown in Figure 2, Figure 3 and Figure 4, locate to be equipped with the ventilating opening 5 of grid form at package casing 4 near the both sides in heat-radiating substrate 2 zones corresponding to installation place, the fins set 9 of fan 20 respectively.
As shown in Figures 1 to 4, also be provided with package casing 4 heat-radiating substrate 2, heat pipe heat 8, fins set 9, fan 20 and air channel fender member 21 are packaged into to one.
Effect and the effect of invention
Above-mentioned execution mode is preferred case of the present invention, is not used for limiting the scope of the invention.In sum, effect of the present invention is:
Heat pipe heat is uniformly distributed formula interspersed being welded in fins set also, evenly utilize the heat exchange surface of fin, improves radiating efficiency, and the working temperature of electronic device is limited in the reasonable scope.
The mounting groove that baseplate part is provided with can be installed one or more electronic device, and the mounting groove in heat abstractor of the present invention can also be used the groove that bursts at the seams, dig the forms such as groove.
The form of mounting bracket is not only the form of installing hole, and in heat abstractor of the present invention, the form of mounting bracket can also be to make it to be arranged on hook on installed surface or frame, draw-in groove form etc.
The material that baseplate part, heat pipe heat and fins set adopt not only is limited to red copper, also can be the material of other good heat conductivity such as aluminium.
In order to encapsulate needs, heat pipe heat is designed to U-shaped, and can also be affect heat radiation and embed welding, with fins set, evenly intert other moulding shapes such as L-type of welding with heat-radiating substrate.
The downside that the installation site of air-flow forming portion also can be fins set is also U-shaped inboard simultaneously, and the flow direction of the formed air-flow of air-flow forming portion is parallel with fin to be got final product.
In fins set, the type of fin can also be other fin types such as straight wing or slitted fin, serrated fin.
In the present embodiment, heat pipe heat and baseplate part the same side embed welding, and heat abstractor of the present invention can also be that heat pipe heat and baseplate part one side or the multi-lateral embed welding.
Fan can also adopt blade profile being arranged or all can without the blade profile fan of the air draught type that can accelerate air current flow or type air blast.
Claims (3)
1. the heat abstractor that electronic device is dispelled the heat, is characterized in that, comprising:
Baseplate part, one side is provided with the mounting groove that described electronic device is installed, and another side is provided with groove;
Radiating part, comprise fins set, at least a plurality of heat pipe heat be comprised of at least a plurality of heat pipes that at least a plurality of fins be arranged in parallel and form, and described heat pipe heat embeds to be welded in described groove and to intert and is welded in described fins set;
The air-flow forming portion, comprise that at least one produces the fan of air-flow, makes the described air-flow air channel fender member concentrated along described fins set,
Wherein, described fins set is provided with at least a plurality of through hole groups corresponding to the interspersed welding of described heat pipe heat, and described through hole group is provided with at least a plurality of through holes, and the quantity of described through hole is corresponding with the quantity of described heat pipe,
Described air-flow forming portion is arranged on a side perpendicular with described fin, described through hole group and a described side apart from inequality.
2. according to the heat abstractor described in claim 1, it is characterized in that:
Also comprise, be provided with ventilating opening, be arranged on the package casing section of filter screen and the mounting bracket at described ventilating opening place.
3. according to the heat abstractor described in claim 1, it is characterized in that:
Wherein, described heat pipe heat is provided with and imports end, and the shape of described importing end and the shape of described groove are chimeric.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310062709XA CN103429047A (en) | 2013-02-27 | 2013-02-27 | Radiating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310062709XA CN103429047A (en) | 2013-02-27 | 2013-02-27 | Radiating device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103429047A true CN103429047A (en) | 2013-12-04 |
Family
ID=49652966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310062709XA Pending CN103429047A (en) | 2013-02-27 | 2013-02-27 | Radiating device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103429047A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104411143A (en) * | 2014-11-26 | 2015-03-11 | 无锡鸿声铝业有限公司 | Aluminum-profile radiator |
CN105188316A (en) * | 2015-08-21 | 2015-12-23 | 四川斯普信信息技术有限公司 | Dual-system mutually-backup-cabinet heat pipe backplate heat-extraction system |
CN109826764A (en) * | 2019-03-13 | 2019-05-31 | 浙江大学 | Bearing cooler and wind-driven generator including it |
CN110660763A (en) * | 2019-09-26 | 2020-01-07 | 长春工程学院 | Communication type pulsating heat pipe type electronic component heat dissipation device |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1061657A (en) * | 1990-10-22 | 1992-06-03 | 松下电器工业有限公司 | The band fin heat exchanger |
CN2480797Y (en) * | 2001-03-21 | 2002-03-06 | 孙朋林 | High-efficient low-resistance finned pipe for heat-exchanger |
CN2667664Y (en) * | 2003-11-26 | 2004-12-29 | 珍通科技股份有限公司 | Radiator |
CN2681346Y (en) * | 2003-11-13 | 2005-02-23 | 联想(北京)有限公司 | Heat pipe radiator for assistant heat radiation using power supply fan |
CN1681113A (en) * | 2004-04-08 | 2005-10-12 | 广达电脑股份有限公司 | Hot-piping radiator |
JP2006269634A (en) * | 2005-03-23 | 2006-10-05 | Fujikura Ltd | Heat sink with fan |
CN2833886Y (en) * | 2005-10-19 | 2006-11-01 | 讯凯国际股份有限公司 | Heat radiation structure |
CN201407940Y (en) * | 2009-06-02 | 2010-02-17 | 海尔集团公司 | Heat exchanger fin structure and heat exchanger |
US20100270007A1 (en) * | 2009-04-23 | 2010-10-28 | Wen-Te Lin | Heat sink |
CN101893393A (en) * | 2010-07-19 | 2010-11-24 | 上海贝洱热系统有限公司 | Staggered pipe assembly-type radiator |
US8132615B2 (en) * | 2008-03-20 | 2012-03-13 | Cpumate Inc. | Heat sink and heat dissipation device having the same |
-
2013
- 2013-02-27 CN CN201310062709XA patent/CN103429047A/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1061657A (en) * | 1990-10-22 | 1992-06-03 | 松下电器工业有限公司 | The band fin heat exchanger |
CN2480797Y (en) * | 2001-03-21 | 2002-03-06 | 孙朋林 | High-efficient low-resistance finned pipe for heat-exchanger |
CN2681346Y (en) * | 2003-11-13 | 2005-02-23 | 联想(北京)有限公司 | Heat pipe radiator for assistant heat radiation using power supply fan |
CN2667664Y (en) * | 2003-11-26 | 2004-12-29 | 珍通科技股份有限公司 | Radiator |
CN1681113A (en) * | 2004-04-08 | 2005-10-12 | 广达电脑股份有限公司 | Hot-piping radiator |
JP2006269634A (en) * | 2005-03-23 | 2006-10-05 | Fujikura Ltd | Heat sink with fan |
CN2833886Y (en) * | 2005-10-19 | 2006-11-01 | 讯凯国际股份有限公司 | Heat radiation structure |
US8132615B2 (en) * | 2008-03-20 | 2012-03-13 | Cpumate Inc. | Heat sink and heat dissipation device having the same |
US20100270007A1 (en) * | 2009-04-23 | 2010-10-28 | Wen-Te Lin | Heat sink |
CN201407940Y (en) * | 2009-06-02 | 2010-02-17 | 海尔集团公司 | Heat exchanger fin structure and heat exchanger |
CN101893393A (en) * | 2010-07-19 | 2010-11-24 | 上海贝洱热系统有限公司 | Staggered pipe assembly-type radiator |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104411143A (en) * | 2014-11-26 | 2015-03-11 | 无锡鸿声铝业有限公司 | Aluminum-profile radiator |
CN105188316A (en) * | 2015-08-21 | 2015-12-23 | 四川斯普信信息技术有限公司 | Dual-system mutually-backup-cabinet heat pipe backplate heat-extraction system |
CN109826764A (en) * | 2019-03-13 | 2019-05-31 | 浙江大学 | Bearing cooler and wind-driven generator including it |
CN110660763A (en) * | 2019-09-26 | 2020-01-07 | 长春工程学院 | Communication type pulsating heat pipe type electronic component heat dissipation device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103167780B (en) | Power model combined radiator assembly | |
CN103429047A (en) | Radiating device | |
CN104214747A (en) | Heat dissipation device | |
CN203086912U (en) | Water cooling heat radiation plate for high power module | |
US20070240868A1 (en) | Air-guiding structure for heat-dissipating fin | |
CN201726633U (en) | Hollow laminar type cooling plate unit structure | |
CN205070765U (en) | Can be at converter of high pollution degree environment use | |
CN104457347A (en) | High-power plane heating unit liquid-cooling heat dissipating device and manufacturing method thereof | |
JP5705570B2 (en) | Electronic component cooling system | |
KR101239172B1 (en) | Multi directional cooling panel | |
CN205030038U (en) | Air cooling radiator | |
CN213692028U (en) | Efficient radiator module for air-cooled module | |
CN201119247Y (en) | Liquid cooling auxiliary heat radiation device | |
CN105324016B (en) | A kind of cabinet | |
TW201433252A (en) | Cooling apparatus and heat sink thereof | |
CN205755250U (en) | A kind of power electronics radiator with graphite heat radiation fin | |
CN203221274U (en) | Electric welding machine radiator | |
CN103138181A (en) | Heat pipe heat conduction and radiation device for sealed power distribution cabinet | |
CN205161015U (en) | Die cavity heat pipe electronic heat dissipation device | |
CN204130519U (en) | Based on the fixing of plug-in type MOSFET pipe and radiator structure | |
CN205124223U (en) | Alternating expression radiator unit | |
JP2013042138A (en) | Heat sinking plate | |
CN203840683U (en) | Heat pipe type radiator fixing device | |
CN102647891A (en) | Air cooling radiator | |
CN217307207U (en) | Sustainable high-efficient radiating totally closed resin pouring bus duct |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131204 |