CN213692028U - Efficient radiator module for air-cooled module - Google Patents
Efficient radiator module for air-cooled module Download PDFInfo
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- CN213692028U CN213692028U CN202022705376.6U CN202022705376U CN213692028U CN 213692028 U CN213692028 U CN 213692028U CN 202022705376 U CN202022705376 U CN 202022705376U CN 213692028 U CN213692028 U CN 213692028U
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Abstract
The utility model discloses an air-cooled module is with high-efficient radiator module relates to radiator equipment technical field, including installing the base plate of being heated in the module, the base plate one end of being heated is provided with a plurality of heat radiation fins, heat radiation fins one end fixed mounting has radiator fan, radiator fan is just right radiator fin's side is provided with the guide plate, the guide plate by heat radiation fins's middle part is to neighbouring heat radiation fins's tip slope. The utility model discloses an it increases the flow speed of air between the heat radiation fins to add on heat radiation fins to be equipped with radiator fan, has improved heat radiation fins and the atmospheric heat exchange efficiency in outside, simultaneously, sets up guide plate and through-hole on heat radiation fins, guarantees heat radiation fins tip and limit portion heat radiation fins heat transfer performance, and can become turbulent state with the air current, makes the forced air cooling reach the best effect, improves the radiating efficiency.
Description
Technical Field
The utility model relates to a radiator equipment technical field especially relates to an air-cooled high-efficient radiator module for module.
Background
The power semiconductor module is a combination of certain functions and modes, and the power semiconductor module is formed by combining and encapsulating high-power electronic power devices into a whole according to certain functions. The power semiconductor module can realize different functions according to different packaged components.
The power semiconductor module generates heat loss during operation, and if the heat generation amount is too large and cannot be timely dissipated to the outside, the power semiconductor module fails due to overhigh temperature. In order to avoid the over-high temperature of the power semiconductor element, the heat dissipation efficiency of the power semiconductor element is generally improved by additionally arranging a heat radiator, but along with the rise of power, the heat dissipation requirement of the power semiconductor module cannot be met by the common heat radiator, and further the normal use of components can be influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that, overcome prior art's shortcoming, provide an air-cooled high-efficient radiator module for module.
In order to solve the technical problem, the technical scheme of the utility model as follows:
the utility model provides an air-cooled module is with high-efficient radiator module, is including installing be heated the base plate on the module, the base plate of being heated is kept away from the one end of module is provided with a plurality of radiator fin, radiator fin keeps away from the one end fixed mounting who is heated the base plate has radiator fan, just radiator fan is just right to the module, radiator fan is just right radiator fin's side is provided with the guide plate, the guide plate by radiator fin's middle part is to being close to radiator fin's tip slope, just the guide plate is close to the one end of radiator fin tip is adjacent to be heated the base plate.
As an air-cooled is an optimal selection scheme of high-efficient radiator module for module, wherein: and two guide plates are arranged on the side surface of any one of the radiating fins, which is opposite to the radiating fan.
As an air-cooled is an optimal selection scheme of high-efficient radiator module for module, wherein: the two guide plates are symmetrically arranged by taking the axis of the length direction of the radiating fins as a symmetry axis.
As an air-cooled is an optimal selection scheme of high-efficient radiator module for module, wherein: the heat radiating fins except the heat radiating fins positioned at the two sides of the heated substrate are provided with through holes, and the through holes penetrate through the heat radiating fins along the thickness direction of the heat radiating fins.
As an air-cooled is an optimal selection scheme of high-efficient radiator module for module, wherein: the distance between any two adjacent radiating fins opposite to the radiating fan is larger than the distance between any two adjacent radiating fins on two sides of the radiating fan.
As an air-cooled is an optimal selection scheme of high-efficient radiator module for module, wherein: the radiating fins are all made of aluminum.
The utility model has the advantages that:
(1) the radiating fan is additionally arranged on the radiating fins, the flowing speed of air between the radiating fins is effectively increased through the radiating fan, and the heat exchange efficiency between the radiating fins and the outside atmosphere is improved, so that the radiating efficiency is improved;
(2) the utility model discloses in the side of the heat radiation fin that radiator fan just right is provided with the guide plate of slope, the guide plate leads the air current that radiator fan produced to heat radiation fin both ends, guarantees the heat transfer performance of heat radiation fin tip, and the guide plate becomes turbulent state with the air current, makes the forced air cooling reach the best effect, has further improved heat dispersion;
(3) the utility model discloses all set up the through-hole that runs through heat radiation fins on the heat radiation fins in the middle part, the air current in the clearance between two adjacent heat radiation fins can move to the clearance between the adjacent heat radiation fins through this through-hole to guaranteed the heat transfer performance of the heat radiation fins that are located the radiator fan both sides, and made the air current between the heat radiation fins be turbulent state, improved the air-cooled effect;
(4) the space between the plurality of radiating fins opposite to the radiating fan is smaller than the space between the radiating fins on the two sides of the radiating fan, so that the radiating performance of the contact part of the heated substrate and the module is ensured, and the manufacturing cost of the radiator is reduced on the premise of ensuring the radiating performance;
(4) the utility model discloses well heat radiation fins is the aluminum product, and heat conduction efficiency is high, has improved heat radiation fins's heat dispersion.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic structural view of an efficient radiator module for an air-cooled module according to the present invention;
fig. 2 is a schematic structural view of a plurality of heat dissipation fins directly opposite to the heat dissipation fan in the high-efficiency heat sink module for an air-cooled module according to the present invention;
wherein: 1. a heated substrate; 2. heat dissipation fins; 3. a heat radiation fan; 4. a baffle; 5. and a through hole.
Detailed Description
In order that the present invention may be more readily and clearly understood, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
The embodiment provides a high-efficiency radiator module for an air-cooled module, which comprises a heated substrate 1, wherein a power semiconductor module is fixedly arranged on the end face of the heated substrate 1. The end face of the heated substrate 1 far away from the power semiconductor module is provided with a plurality of radiating fins 2 vertical to the heated substrate 1, the radiating fins 2 are all made of aluminum materials, and the radiating fins 2 are all arranged along the length direction of the heated substrate 1. The end surfaces of the plurality of radiating fins 2 far away from the heated substrate 1 are fixedly provided with radiating fans 3, the radiating fans 3 supply air to the heated substrate 1, and the radiating fans 3 are opposite to the power semiconductor module on the heated substrate 1. The heat radiation fan 3 effectively increases the flow speed of air between the heat radiation fins 2, and improves the heat exchange efficiency of the heat radiation fins 2 and the external atmosphere, thereby improving the heat radiation efficiency.
The side surfaces of the plurality of radiating fins 2 opposite to the radiating fan 3 are respectively provided with a guide plate 4, the guide plate 4 inclines from the middle part of the radiating fins 2 to the end part of the length direction of the radiating fins 2, and the distance between one end of the guide plate 4 close to the end part of the radiating fins 2 and the heated substrate 1 is smaller than the distance between one end of the guide plate 4 close to the middle part of the radiating fins 2 and the heated substrate 1. The guide plate 4 can guide the airflow generated by the heat radiation fan 3 to the end part of the heat radiation fin 2, so as to ensure the heat exchange performance of the end part of the heat radiation fin 2, and the guide plate 4 changes the airflow into a turbulent flow state, so that the air cooling achieves the best effect.
The distance between any two adjacent heat dissipation fins 2 opposite to the heat dissipation fan 3 is greater than the distance between any two adjacent heat dissipation fins 2 located on two sides of the heat dissipation fan 3.
Preferably, two flow deflectors 4 are arranged on the side surface of any one of the heat dissipation fins 2 opposite to the heat dissipation fan 3, and the two flow deflectors 4 are symmetrically arranged by taking the axis of the heat dissipation fin 2 in the length direction as a symmetry axis. The two flow deflectors 4 convey the airflow conveyed by the heat dissipation fan 3 toward the two ends of the heat dissipation fins 2.
In addition, through holes 5 are formed in all the heat dissipation fins 2 except the heat dissipation fins 2 located on both sides of the heated substrate 1, and the through holes 5 penetrate through the heat dissipation fins 2 located there along the thickness direction of the heat dissipation fins 2. The air flow in the gap between two adjacent radiating fins 2 can move to the gap between the adjacent radiating fins 2 through the through holes 5, so that the heat exchange performance of the radiating fins 2 positioned at two sides of the radiating fan 3 is ensured, the through holes 5 enable the air flow between the radiating fins 2 to be in a turbulent flow state, and the air cooling effect is improved. It should be noted that. The number of the through holes 5 on the radiating fins 2 is more than or equal to two.
Therefore, the utility model discloses an it increases the flow velocity of air between heat radiation fin 2 to add on heat radiation fin 2 to be equipped with radiator fan 3, has improved heat radiation fin 2 and outside atmospheric heat exchange efficiency, simultaneously, sets up guide plate 4 and through-hole 5 on heat radiation fin 2, guarantees 2 tip of heat radiation fin and 2 heat transfer performances of limit portion heat radiation fin, and can become turbulent state with the air current, makes the forced air cooling reach the best effect, improves the radiating efficiency.
In addition to the above embodiments, the present invention may have other embodiments; all the technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope claimed by the present invention.
Claims (6)
1. The utility model provides an air-cooled efficient radiator module for module which characterized in that: comprising a heated substrate (1) mounted on the module,
a plurality of radiating fins (2) are arranged at one end of the heated substrate (1) far away from the module, a radiating fan (3) is fixedly arranged at one end of the radiating fins (2) far away from the heated substrate (1), and the radiating fan (3) is right opposite to the module,
the side face, opposite to the radiating fins (2), of the radiating fan (3) is provided with a guide plate (4), the guide plate (4) inclines from the middle of the radiating fins (2) to the end portion, adjacent to the radiating fins (2), of the guide plate (4), and one end, adjacent to the end portion of the radiating fins (2), of the guide plate (4) is adjacent to the heated substrate (1).
2. The high efficiency heat sink module for an air-cooled module according to claim 1, wherein: and two guide plates (4) are arranged on the side surface of any one of the radiating fins (2) opposite to the radiating fan (3).
3. The high efficiency radiator module for an air-cooled module according to claim 2, wherein: the two guide plates (4) are symmetrically arranged by taking the axis of the length direction of the radiating fins (2) as a symmetry axis.
4. The high efficiency heat sink module for an air-cooled module according to claim 1, wherein: the radiating fins (2) except the radiating fins (2) positioned at two sides of the heated substrate (1) are provided with through holes (5), and the through holes (5) penetrate through the radiating fins (2) along the thickness direction of the radiating fins (2).
5. The high efficiency heat sink module for an air-cooled module according to claim 1, wherein: the distance between any two adjacent radiating fins (2) opposite to the radiating fan (3) is larger than the distance between any two adjacent radiating fins (2) positioned at two sides of the radiating fan (3).
6. The high efficiency heat sink module for an air-cooled module according to claim 1, wherein: the radiating fins (2) are all made of aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022705376.6U CN213692028U (en) | 2020-11-20 | 2020-11-20 | Efficient radiator module for air-cooled module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022705376.6U CN213692028U (en) | 2020-11-20 | 2020-11-20 | Efficient radiator module for air-cooled module |
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| Publication Number | Publication Date |
|---|---|
| CN213692028U true CN213692028U (en) | 2021-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022705376.6U Active CN213692028U (en) | 2020-11-20 | 2020-11-20 | Efficient radiator module for air-cooled module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115863687A (en) * | 2022-12-27 | 2023-03-28 | 上海捷氢科技股份有限公司 | Bipolar plate and temperature-equalizing plate integrated electric pile |
| TWI815513B (en) * | 2022-02-11 | 2023-09-11 | 廣達電腦股份有限公司 | Heat sink and computing device |
-
2020
- 2020-11-20 CN CN202022705376.6U patent/CN213692028U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI815513B (en) * | 2022-02-11 | 2023-09-11 | 廣達電腦股份有限公司 | Heat sink and computing device |
| US12052846B2 (en) | 2022-02-11 | 2024-07-30 | Quanta Computer Inc. | Combination heat sink |
| CN115863687A (en) * | 2022-12-27 | 2023-03-28 | 上海捷氢科技股份有限公司 | Bipolar plate and temperature-equalizing plate integrated electric pile |
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