CN201119247Y - Liquid cooling auxiliary heat radiation device - Google Patents
Liquid cooling auxiliary heat radiation device Download PDFInfo
- Publication number
- CN201119247Y CN201119247Y CNU2007203064087U CN200720306408U CN201119247Y CN 201119247 Y CN201119247 Y CN 201119247Y CN U2007203064087 U CNU2007203064087 U CN U2007203064087U CN 200720306408 U CN200720306408 U CN 200720306408U CN 201119247 Y CN201119247 Y CN 201119247Y
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- CN
- China
- Prior art keywords
- cooling
- liquid
- box
- cooling fluid
- fin group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 81
- 230000005855 radiation Effects 0.000 title abstract description 9
- 239000007788 liquid Substances 0.000 title abstract description 5
- 239000012809 cooling fluid Substances 0.000 claims abstract description 50
- 125000004122 cyclic group Chemical group 0.000 claims description 7
- 238000000605 extraction Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010616 electrical installation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model relates to a liquid cooling type auxiliary heat radiation device, which is suitable to be connected on a pipeline of a liquid cooling type heat radiation system. The auxiliary heat radiation device comprises a cooling box, a cooling wafer arranged on the cooling box and a second radiating fin group arranged on the cooling wafer. The cooling wafer is provided with a low temperature surface and a high temperature surface after being powered on, the low temperature surface is stuck on the surface of the cooling box in order to provide a low temperature cooling environment for the cooling box, the second radiating fin group is arranged on the high temperature surface of the cooling wafer for dissipating the heat of the high temperature surface to the outer space, through the cooling wafer and the second radiating fin group arranged on the cooling box, the heat radiation and the temperature deduction can be more effectively performed to the cooling fluid stored in the cooling box, to further enhance the overall cooling efficiency.
Description
[technical field]
The utility model relates to a kind of heat abstractor, particularly relates to a kind of liquid-cooled auxiliary radiating device.
[background technology]
Quick progress along with electronic technology, the operational paradigm of electronic component greatly promotes, relatively, the heat energy that is produced during its running also significantly increases thereupon, for avoiding the impaired or fault of electronic component Yin Gaore, except generally being used to be installed in the radiator fan on the electronic component, the heat abstractor that adopts the liquid cooling principle design is also arranged on the market at present, as commonly directly be installed on the electronic component, and in order to the water-cooled head unit of heat radiation etc.
As shown in Figure 1, it is the heat abstractor of an existing electronic component, the heat abstractor of this electronic component is the electronic component 41 that can produce the electric equipment 4 of high temperature when being used to be installed in a running, with auxiliary these electronic component 41 heat radiations, this heat abstractor 1 comprises the heat absorbing member 11 of a hollow, one cooling fluid 2 that can in this heat absorbing member 11, circulate, one with first conduit 12 that is connected of this heat absorbing member 11, one with second conduit 13 that is connected of this heat absorbing member 11, one with this first, two conduits 12,13 condensing parts that are connected 14, one is arranged on this electric equipment 3 and connects the fan 15 of establishing this condensing part 14, and one is arranged at and pumps part 16 on this first conduit 12.This condensing part 14 has one and is communicated with this first and second conduit 12,13 respectively and is the condenser pipe 141 of continuous bending, and several pieces are arranged at intervals at the radiating fin 142 of 141 of this condenser pipes.
Compared to the existing water-cooled head unit that directly is installed on the electronic component, the heat abstractor of above-mentioned electronic component on this first conduit 12 installing this pump part 16, and can effectively promote the cycle efficieny of cooling fluid 2 in this heat abstractor 1, and can overcome because of cooling fluid 2 in pipeline condense with evaporation to circulating the influence of direction, and the condensing part 14 of exempting existing heat abstractor must be higher than the installing restriction of this heat absorbing member 11.
Yet, although by above-mentioned design, the cycle efficieny of cooling fluid 2 is promoted to some extent, and acceleration cooling fluid 2 is mobile, but it is relative, cooling fluid 2 also shortened by the time of this condenser pipe 141 thereupon, therefore, the cooling effect of 141 pairs of cooling fluids that pass through 2 of this condenser pipe also decreases, can reduce to lower temperature efficiently in the time of not only can't making cooling fluid 2 by this condenser pipe 141, the temperature of cooling fluid 2 that may cause injecting this heat absorbing member 11 on the contrary is too high, and causes the not good situation of integral heat sink efficient to take place.
[utility model content]
The purpose of this utility model is for a kind of liquid-cooled auxiliary radiating device that improves radiating efficiency with auxiliary heat dissipation is provided.
For achieving the above object, liquid-cooled auxiliary radiating device of the present utility model can be for putting cooling fluid in interior, comprises a cooling box, and be arranged at cooling wafer, on this cooling box and be arranged at the second radiating fin group on this cooling wafer.
This cooling box have one define one can be for the box body of the cyclic space that puts cooling fluid, and first a radiating fin group that is arranged in the cyclic space of this box body, this box body has a cooling fluid outlet and a cooling fluid inlet.Have a low temperature face and a high temperature face after this cooling wafer energising, this low temperature face is to paste on the box surface that is arranged at this cooling box, and appearance can be stored in the cooling fluid cooling in this cooling box.This second radiating fin group is to be arranged on the high temperature face of this cooling wafer, and can with by the heat loss of this high temperature face conduction to space outerpace.
Beneficial functional of the present utility model is: by the setting that this cooling wafer and this second radiating fin group are set on this cooling box, and can make the cooling fluid fast cooling that injects in this cooling box more efficiently, when liquid-cooled auxiliary radiating device of the present utility model is arranged on the pipeline of other liquid-cooled radiating system, just can bring into play the auxiliary heat dissipation function, to promote whole cooling effectiveness.
[description of drawings]
Fig. 1 is a schematic diagram, and the aspect of an existing liquid-cooling heat radiator is described.
Fig. 2 is a three-dimensional exploded view, and the aspect of a preferred embodiment of the present utility model is described.
Fig. 3 one removes the schematic perspective view of the roof of outer casing member.
Fig. 4 is a schematic perspective view, and the use aspect of this preferred embodiment is described.
Fig. 5 is a schematic perspective view, and another configuration aspect that has a fan in this preferred embodiment is described.
Fig. 6 is a schematic perspective view, and another configuration aspect that has two fans in this preferred embodiment is described.
[embodiment]
Below in conjunction with drawings and Examples the utility model is elaborated.Before the utility model is described in detail, be noted that in the following description similar elements is to represent with identical numbering.
Consult Fig. 2,3,4, a preferred embodiment of the utility model liquid-cooled auxiliary radiating device 3 is to supply to put cooling fluid 2, and in order to install and to be communicated on the liquid-cooled radiating system 5, with the cooling effectiveness of this liquid-cooled radiating system 5 of service hoisting.In addition, in this preferred embodiment, this cooling fluid 2 is that the employing refrigerant is an example, and in addition, this cooling fluid 2 also can adopt materials such as water, liquid helium, and should not exceed with the particular example that this preferred embodiment is lifted.
This liquid-cooled auxiliary radiating device 3 comprises the outer casing member 36 that without exception is the open drawer-like of an end, one is placed in this outer casing member 36 and but the cooling box 31, that cooling fluid 2 puts is placed in this outer casing member 36 and be communicated in the cooling wafer 32, that the pump group 34, of this cooling box 31 is arranged on this cooling box 31 and paste the second radiating fin group 33 that is arranged on this cooling wafer 32, and two are arranged on this cooling box 31 and are adjacent to the fan 35 of this second radiating fin group 33.In addition, in this preferred embodiment, the aspect of this outer casing member 36 is generally to have association area background person to be easy to change and to migrate, and therefore should not exceed with the revealer of institute in this preferred embodiment.
This cooling box 31 have one define one for the cyclic space 310 that puts cooling fluid 2 general rectangular box body 311, and first a radiating fin group 312 that is arranged in the cyclic space 310 of this box body 311, this box body 311 is to be arranged in this outer casing member 36, and have a cooling fluid outlet 313 and a cooling fluid inlet 314, and the cooling fluids that offer an able to turn on or off and cooling fluid 2 perfusions on the roof 362 of this box body 311 replenish mouthfuls 315.
This pump group 34 is to be communicated in this cooling box 31, and have one and be positioned at this outer casing member 36 and connect first feed tube 342 of this cooling fluid outlet 313 and 341 of this pumps in order to the pump 341, with cooling fluid 2 cyclic suction, and an end connects this pump 341 and second feed tube 343 in order to the cooling fluid 2 of these pump 341 extractions is sent.
This cooling wafer 32 is to be electrically connected on a power supply (figure does not show), and have a low temperature face 321 and a high temperature face 322, this low temperature face 321 is to paste the wall that is arranged at this cooling box 31, and can produce lower temperature, cool off with the cooling fluid 2 that appearance is stored in this cooling box 31, and on the high temperature face 322 of this cooling wafer 32, be provided with this second radiating fin group 33, whereby, the heat of these high temperature face 322 generations outwards can be conducted loss.
Described fan 35 is sides that are arranged at the box body 311 of this cooling box 31, and be adjacent to this second radiating fin group 33, get rid of with the heat that this second radiating fin group 33 is distributed, what deserves to be mentioned is, be to be example in this preferred embodiment so that two fans 35 to be set, but also can be as shown in Figure 5, only in a side of the box body 311 of this cooling box 31, and contiguous this second radiating fin group 33 (because of therefore the visual angle relation does not show in figure) locates to be provided with a fan 35, perhaps as shown in Figure 6, two fans 35 are arranged at two opposition sides of the box body 311 of this cooling box 31 respectively, and be adjacent to this second radiating fin group 33 (because of the visual angle relation so in not shown in the figures), and the exhausting demand of cooperation fan 35, make this outer casing member 36 corresponding these fans 35 the position being set and change into and be all ostiolate aspect in two ends, yet, the configuration of described fan 35, except that above-mentioned particular example, also can be according to the actual demand adjustment, therefore the quantity and the installation position of configuration fan 35 are not exceeded by the particular example of this preferred embodiment should.
Consult Fig. 2 again, 3,4, when using the utility model liquid-cooled auxiliary radiating device 3, and when being arranged on this liquid-cooled radiating system 5, be that this second feed tube 343 with this pump group 34 is connected with an intake pipeline 51 of this liquid-cooled radiating system 5, and make one of this liquid-cooled radiating system 5 send the cooling fluid inlet 314 that pipeline 52 is communicated in this cooling box 31, and make cooling fluid 2 after the heat absorption of sending by this liquid-cooled radiating system 5, can send pipeline 52 and inject in the cooling box 31 of this liquid-cooled auxiliary radiating device 3 via this, with the cooling heat dissipation of assisting, and again will be through the cooling fluid 2 after the cooling, inject this intake pipeline 51 of this liquid-cooled radiating system 5 once again via this second feed tube 343 by these pump group 34 extractions, to reach the effects that the cooling fluids in this liquid-cooled radiating system 52 are further lowered the temperature.
When this cooling fluid 2 injects in this cooling box 31 by this liquid-cooled radiating system 5, the heat of cooling fluid 2 will conduct to this first radiating fin group 312, and by the setting of this first radiating fin group 312, make the space circulation of cooling fluid 2 along this first radiating fin group 312, and the return flow path of cooling fluid 2 in cooling box 31 is restricted, therefore cooling fluid 2 is stopped the longer time in this cooling box 31, to reach better heat exchange effect; While is by the exhausting of 35 pairs of these second radiating fin groups 33 of described fan, so that the heat of this second radiating fin group 33 is taken away, and, be different from existing heat abstractor the heat radiation cooling can only be provided under the environment of room temperature, this cooling wafer 32 is to be electrically connected on this power supply (figure does not show), and can provide the more cooling effect of low temperature by 321 pairs of these cooling boxes 31 of this low temperature face, and utilize these second radiating fin group, 33 heats to be distributed to space outerpace with this high temperature face 322, therefore, when even if cooling fluid 2 produces faster flow circuit via this pump group 34, also can be the time by this cooling box 31, promptly cooled off, more can reach and improve integral heat sink efficient to reach effect to this liquid-cooled radiating system 5 auxiliary heat dissipations, in addition, in the time of on being installed in this liquid-cooled radiating system 5, since this outer casing member 36 be with cooling box 31 elements such as grade all collect be loaded in, therefore this liquid-cooled auxiliary radiating device 3 is to be provided with independently, and need only keep being communicated with the effect that just can reach auxiliary heat dissipation with this liquid-cooled radiating system 5, be directly necessary and the adjacent setting of electrical installation of institute's desire heat radiation and do not need as this liquid-cooled radiating system 5.
In sum, the utility model liquid-cooled auxiliary radiating device 3 is the settings by this cooling wafer 32 and this second radiating fin group 33, and can provide the cooler environment of a low temperature to this cooling box 31, and make cooling fluid 2 fast coolings that inject in this cooling box 31 more efficiently, and can bring into play better auxiliary heat dissipation function to promote cooling effectiveness to this liquid-cooled radiating system 5, therefore can reach the purpose of this utility model really.
Claims (5)
1. a liquid-cooled auxiliary radiating device is used to be installed in a liquid-cooled radiating system, for putting cooling fluid in interior, it is characterized in that:
This liquid-cooled auxiliary radiating device comprises a cooling box, one pastes the cooling wafer that is arranged on this cooling box, and second a radiating fin group that is arranged on this cooling wafer, this cooling box has one and defines a box body for the cyclic space that puts cooling fluid, and first a radiating fin group that is arranged in the cyclic space of this box body, this box body has a cooling fluid outlet and a cooling fluid inlet, this cooling wafer has a low temperature face and a high temperature face, this low temperature face is to paste on the box surface that is arranged at this cooling box, be received in cooling fluid in this cooling box with cooling, this second radiating fin group is to be arranged on the high temperature face of this cooling wafer, and the heat loss that will be conducted by this high temperature face is to space outerpace.
2. liquid-cooled auxiliary radiating device as claimed in claim 1 is characterized in that: this liquid-cooled auxiliary radiating device also includes a pump group in order to cooling fluid is extracted out by this cooling fluid outlet and sent into toward this cooling fluid inlet direction that is arranged in this cooling box communicatively.
3. liquid-cooled auxiliary radiating device as claimed in claim 2, it is characterized in that: this pump group has a pump, and connects first feed tube between this cooling fluid outlet and this pump, and an end connects this pump and second feed tube in order to the cooling fluid of this pump extraction is sent.
4. as claim 2 or 3 described liquid-cooled auxiliary radiating devices, it is characterized in that: this liquid-cooled auxiliary radiating device also includes a vicinity and is arranged at the fan that this second radiating fin group is got rid of in order to the heat that this second radiating fin group is distributed.
5. liquid-cooled auxiliary radiating device as claimed in claim 4 is characterized in that: this liquid-cooled auxiliary radiating device also comprises an outer casing member, for ccontaining this cooling box, cooling wafer, the second radiating fin group, fan and pump group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007203064087U CN201119247Y (en) | 2007-11-27 | 2007-11-27 | Liquid cooling auxiliary heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007203064087U CN201119247Y (en) | 2007-11-27 | 2007-11-27 | Liquid cooling auxiliary heat radiation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201119247Y true CN201119247Y (en) | 2008-09-17 |
Family
ID=39993859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007203064087U Expired - Fee Related CN201119247Y (en) | 2007-11-27 | 2007-11-27 | Liquid cooling auxiliary heat radiation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201119247Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102608507A (en) * | 2011-12-09 | 2012-07-25 | 致茂电子(苏州)有限公司 | Temperature control system and automatic semiconductor testing table with temperature control system |
| CN107333445A (en) * | 2017-07-25 | 2017-11-07 | 奇鋐科技股份有限公司 | The heat exchange structure of water cooling plant |
| CN110621138A (en) * | 2018-06-20 | 2019-12-27 | 鸿富锦精密工业(武汉)有限公司 | Liquid cooling heat radiator and electronic device using same |
-
2007
- 2007-11-27 CN CNU2007203064087U patent/CN201119247Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102608507A (en) * | 2011-12-09 | 2012-07-25 | 致茂电子(苏州)有限公司 | Temperature control system and automatic semiconductor testing table with temperature control system |
| CN102608507B (en) * | 2011-12-09 | 2015-06-03 | 致茂电子(苏州)有限公司 | Temperature control system and automatic semiconductor testing table with temperature control system |
| CN107333445A (en) * | 2017-07-25 | 2017-11-07 | 奇鋐科技股份有限公司 | The heat exchange structure of water cooling plant |
| CN110621138A (en) * | 2018-06-20 | 2019-12-27 | 鸿富锦精密工业(武汉)有限公司 | Liquid cooling heat radiator and electronic device using same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080917 Termination date: 20091228 |