JP5705570B2 - Electronic component cooling system - Google Patents

Description

  The present invention relates to an electronic component cooling apparatus.

  A vehicle or the like that is driven by electricity includes a power control device in a power control housing in order to control a drive motor and the like. The power control apparatus is composed of a power device such as an IGBT and other electronic components. Since these electronic components generate heat due to heat loss, they are usually attached to an electronic component cooling device and cooled. This type of electrical component cooling device is configured to efficiently cool the mounted electrical components using forced air cooling or wind generated by vehicle movement (see Patent Documents 1 and 2).

Japanese Patent No. 3700870 JP 2006-32798 A

  As the performance of vehicles and the like increases, power control devices are becoming more complex. Accordingly, a plurality of different types of elements are used as electronic components constituting the power control apparatus. In addition, the amount of heat generated by each electronic component is also high. Therefore, there is a need for an electronic component cooling device with better cooling efficiency. However, the conventional electronic component cooling apparatus has a problem that the cooling efficiency may be greatly reduced depending on the direction of the wind.

  The present invention has been made in view of the above, and an object of the present invention is to provide an electronic component cooling device in which a decrease in cooling efficiency is suppressed.

  In order to solve the above-described problems and achieve the object, an electronic component cooling device according to the present invention includes a heat receiving block thermally connected to a heat generating electronic component, a heat receiving portion, and a part of the heat receiving portion. A plurality of heat-dissipating portions extending along the surface of the heat-receiving block, and the heat-dissipating portions are erected with respect to the surface of the heat-receiving block. A heat pipe, and a plurality of fins provided in the heat radiating section of the plurality of heat pipes, wherein the plurality of heat pipes are the first heat pipe and the heat receiving section than the first heat pipe. And a second heat pipe having a long length.

  In the electronic component cooling device according to the present invention, in the above invention, the first heat pipe and the second heat pipe are configured such that the heat receiving portions are substantially parallel to each other, and The one end is arranged so as to be substantially aligned in a predetermined direction.

  In the electronic component cooling device according to the present invention as set forth in the invention described above, the second heat pipe is arranged such that the heat receiving portion extends from a high temperature portion to a low temperature portion of the heat receiving block. .

  According to the present invention, it is possible to realize an electronic component cooling device in which a decrease in cooling efficiency is suppressed.

FIG. 1 is a schematic plan view of an electronic component cooling device according to an embodiment. 2 is a view of the electronic component cooling device shown in FIG.

  Embodiments of an electronic component cooling device according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

(Embodiment)
FIG. 1 is a schematic plan view of an electronic component cooling apparatus according to an embodiment of the present invention. 2 is a view of the electronic component cooling device shown in FIG.

  As shown in FIGS. 1 and 2, the electronic component cooling apparatus 10 includes a heat receiving block 1, 16 heat pipes 2, four heat pipes 3, and heat radiating fins 4.

  The heat receiving block 1 is plate-shaped and has opposing surfaces 1a and 1b. The heat receiving block 1 is made of a metal material having high thermal conductivity such as aluminum, aluminum alloy, copper, or copper alloy. Electronic components D1, D2, and D3 are placed on the surface 1a of the heat receiving block 1. The electronic components D1, D2, and D3 are electronic components that generate heat, such as an IGBT, a thyristor, a diode, and a resistor. The heat receiving block 1 is thermally connected to the electronic components D1, D2, and D3 on the surface 1a.

  The heat pipe 2 that is the first heat pipe includes a heat receiving portion 2a and two heat radiating portions 2b extending from both ends of the heat receiving portion 2a. The heat pipe 2 has a U-shaped shape as a whole. The heat pipe 2 is attached to the surface 1b side of the heat receiving block 1. The heat receiving portion 2a is accommodated in a groove 1c formed on the surface 1b of the heat receiving block 1, and extends along the surface 1b. The heat radiation part 2b is erected with respect to the surface 1b.

  As with the heat pipe 2, the heat pipe 3 as the second heat pipe has a heat receiving portion 3a and two heat radiating portions 3b extending from both ends of the heat receiving portion 3a. It has the shape of The heat pipe 3 is attached to the surface 1 b side of the heat receiving block 1. The heat receiving portion 3a is accommodated in a groove 1d formed on the surface 1b of the heat receiving block 1 and extends along the surface 1b. The heat radiating part 3b is erected with respect to the surface 1b. Here, the heat receiving portion 3 a of the heat pipe 3 is longer than the heat receiving portion 2 a of the heat pipe 2.

  Each of the heat pipes 2 and 3 is made of a metal material having high thermal conductivity. Further, hydraulic fluid is accommodated in the heat pipes 2 and 3.

  The radiating fin 4 has a structure in which a plurality of plate members made of a metal material having high thermal conductivity are arranged substantially in parallel. The heat radiating fins 4 are attached to the heat radiating portions 2 b and 3 b of the heat pipes 2 and 3.

  Here, the 16 heat pipes 2 are arranged in three rows so that the heat receiving portions 2a are substantially parallel to each other and one end of each heat receiving portion 2a is aligned substantially along the direction of arrow A. ing. Further, the four heat pipes 3 are respectively disposed between the heat pipes 2. Each heat pipe 3 is arranged so that each heat receiving portion 3a is substantially parallel to each heat receiving portion 2a of heat pipe 2, and one end of each heat receiving portion 3a is aligned substantially linearly with respect to one end of each heat receiving portion 2a. Has been. Thus, since each heat pipe 2 and 3 is arrange | positioned so that the end of each heat receiving part 2a and 3a may become substantially uniform, more heat pipes 2 and 3 can be provided with respect to the heat receiving block 1. FIG. .

  The electronic component cooling device 10 is used in, for example, a power control device provided in a vehicle or the like. The electronic component cooling device 10 is arranged so that the wind flows along the surface of the radiating fin 4. When the electronic components D1, D2, and D3 constituting the power control device generate heat during operation, the generated heat is conducted to the heat receiving portions 2a and 3a of the heat pipes 2 and 3 through the heat receiving block 1. In each of the heat receiving portions 2a and 3a, the internal working fluid is evaporated by the conducted heat and moves to each of the heat radiating portions 2b and 3b. Each heat radiation part 2b, 3b is cooled by the wind being applied to the heat radiation fin 4 along the surface. As a result, the evaporated working fluid is cooled and condensed in the heat radiating portions 2b and 3b, and returns to the heat receiving portions 2a and 3a. Through the operation as described above, the heat generated in the electronic components D1, D2, and D3 moves to the heat radiating portions 2b and 3b and is radiated there. As a result, the electronic components D1, D2, and D3 are cooled.

  Here, if the wind blows in the direction of arrow A, the heat is dissipated by the heat dissipating part 2b of each heat pipe 2 located on the leeward side by the heat dissipating part 2b of the heat pipe 2 that is most upstream. However, as shown in FIG. 2, when viewed in the direction of the arrow A, the heat radiating part 3 b at one end of the heat pipe 3 does not overlap the heat radiating part 2 b of the heat pipe 2 that is most upstream. Accordingly, the heat radiating portion 3b is not interrupted by the heat radiating portion 2b but is hit by the wind. As a result, a decrease in the cooling efficiency of the electronic component cooling device 10 is suppressed.

  In addition, when the wind blows in the direction of arrow B shown in FIG. 1, when viewed in the direction of arrow A, the heat radiating portion 3 b that does not overlap the heat radiating portion 2 b is It will overlap. However, in this case, the heat radiating portion 3b at the other end of the heat pipe 3 and the heat radiating portions 2b of several heat pipes 2 located on the leeward side are the The wind hits without being interrupted. As a result, a decrease in the cooling efficiency of the electronic component cooling device 10 is suppressed.

  Moreover, as for the heat receiving block 1, the area | region in which the electronic components D1, D2, and D3 were mounted becomes high temperature part S1, S2, S3, and the circumference | surroundings become the low temperature part S4 whose temperature is lower than a high temperature part. . As shown in FIG. 1, for example, the heat pipe 3 disposed below the electronic component D2 is disposed such that the heat receiving portion 3a extends from the high temperature portion S2 to the low temperature portion S4. As a result, the temperature distribution is made more uniform in the surface of the heat receiving block 1. Thereby, the electronic component cooling apparatus 10 can cool each electronic component D1, D2, and D3 more uniformly.

  In addition, in the said embodiment, although the heat pipe has a U-shaped shape, you may use the L-shaped heat pipe from which the thermal radiation part has extended only from one edge part of a heat receiving part. However, a loop type heat pipe may be used. Further, the arrangement of the heat pipe is not limited to that of the above embodiment. For example, when viewed from any direction on the outer periphery of the heat receiving block, arrange the heat pipes so that the number of heat dissipating parts that do not overlap with the heat dissipating parts of other heat pipes is within a certain number or within a specified range. May be. Moreover, in the said embodiment, although two types of heat pipes from which the length of a heat receiving part differs are provided, you may make it provide three or more types of heat pipes from which the length of a heat receiving part differs from each other.

  The electronic component cooling device according to the present invention is oriented so that the heat receiving portion of the heat pipe is horizontal, and the heat radiating portion is at the same height as the heat receiving portion or higher than the heat receiving portion with respect to the ground. Then, the installation angle of the heat receiving block can be used at any angle. That is, for example, the surface of the heat receiving block may be installed horizontally, vertically, or inclined.

  Moreover, the electronic component cooling device according to the present invention is not limited to a vehicle, and can be used, for example, for cooling an electrical component for controlling an elevator motor. Or it is also possible to use it for electronic component cooling, such as an inverter apparatus which converts the direct current power supply from a solar power generation device into alternating current power supply.

  Further, other embodiments, examples, operation techniques, and the like made by those skilled in the art based on the above-described embodiments are all included in the present invention.

DESCRIPTION OF SYMBOLS 1 Heat receiving block 1a, 1b Surface 1c, 1d Groove 2, 3 Heat pipe 2a, 3a Heat receiving part 2b, 3b Heat radiating part 4 Heat radiating fin 10 Electronic component cooling device A, B Arrow D1, D2, D3 Electronic component S1, S2, S3 High temperature part S4 Low temperature part

Claims (2)

A heat receiving block thermally connected to the heat generating electronic components;
A heat receiving portion; and a heat radiating portion extending from a part of the heat receiving portion, the heat receiving portion extending along a surface of the heat receiving block, and the heat radiating portion standing on a surface of the heat receiving block. A plurality of heat pipes attached to the heat receiving block,
A plurality of fins provided in the heat dissipation portion of the plurality of heat pipes;
Wherein the plurality of heat pipes, a first heat pipe in which the heat receiving portion is disposed in the high temperature portion of the heat receiving block, the length of the heat-receiving portion than the first heat pipe length KuKatsu A second heat pipe in which the heat receiving part is arranged so as to extend from a high temperature part to a low temperature part of the heat receiving block; and a third heat pipe in which the heat receiving part is arranged only in the low temperature part of the heat receiving block. An electronic component cooling device comprising:   The first heat pipe and the second heat pipe are arranged such that the respective heat receiving portions are substantially parallel to each other and one end of each of the heat receiving portions is substantially aligned in a predetermined direction. The electronic component cooling apparatus according to claim 1.

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