JP2008218589A5

JP2008218589A5 -

Info

Publication number: JP2008218589A5
Application number: JP2007052169A
Authority: JP
Filing date: 2007-03-02
Publication date: 2009-04-23
Anticipated expiration: 2027-03-02

Claims

In the cooling device that cools the heating element mounted on the electronic device by heat transfer of the refrigerant,
The cooling device includes a heat receiving member that receives heat from the heating element by the refrigerant,
A heat dissipating member that dissipates heat received by the refrigerant;
A piping member arranged to circulate the refrigerant between the heat receiving member and the heat radiating member;
The heat receiving member is configured to form a sealed space in which a refrigerant can flow inside by a base member thermally connected to the heating element and a case member, and is opposed to the base member thermally connected to the heating element. In a predetermined area of the plane, fins constituting a flow path through which the refrigerant flows are integrally formed in the sealed space, and the thickness of the base member in the area of the base member where the fins are formed is set. A cooling device for electronic equipment, characterized by having a structure thinner than the thickness of the other base part not forming fins.

The cooling device according to claim 1, wherein
The cooling device for an electronic device according to claim 1, wherein the fin formed on the base member is formed by being scraped and formed by skiving at a recess position where the base member is dug.

In the cooling device according to claim 1 and claim 2,
The base member is inclined toward the thick part height position of the base member from the thin part height position of the base member on which the fin is formed, at both ends of the flow path of the fin formed on the base member. A cooling device for electronic equipment, comprising a surface.

In the cooling device according to claim 1 and claim 2,
The case member is formed integrally or separately and has a pressing member that presses the upper end of the fin when the heat receiving member is configured with the base member, and the size of the fin pressing member is A cooling device characterized in that it is shorter than the fin width length in the longitudinal direction of the fin flow path and longer than the fin row formation length in the orthogonal direction of the fin flow path.

In claims 1 to 4,
The case member is provided with an inlet passage for the refrigerant on an upper surface of the case member, and a header through which the refrigerant flowing in from the inlet passage flows from the upper portion of the fin is orthogonal to the flow path by the fin at the upper portion of the fin. A cooling device provided with a length substantially equal to a row formation length in a direction.

The cooling device according to claim 5, wherein
The header has a wedge-shaped section plane from the center of the fin toward the periphery.
A cooling device characterized by that.

  A cooling device that cools a heating element mounted on an electronic device by heat transfer of a refrigerant,
  A narrow pitch fin for transferring heat generated by the heating element to the refrigerant;
  A fin base that is thermally connected to the heating element and in which the narrow pitch fin is formed has a member thickness that is thinner than a member thickness in a region in which the narrow pitch fin is not formed,
  A cooling device connected to the fin base to form a sealed space through which the refrigerant flows.

The cooling device according to claim 7,
The cooling device according to claim 1, wherein the fin base forms an inclined surface from a thin part height position of the base member on which the fin is formed toward a thick part height position of the base member.

  The cooling device according to claim 8,
  The narrow pitch fin has a plurality of fins arranged in parallel in one direction of the fin base so that the refrigerant flows.
  A cooling device having a refrigerant inflow header having a space perpendicular to the fin on a side facing the fin base of the narrow pitch fin.

The cooling device according to claim 9, wherein
The refrigerant flowing in from the inflow header flows between the fins of the narrow pitch fins in a down flow manner, and is discharged from the fin longitudinal direction of the narrow pitch fins.