JP4962836B2 - Electronic component package with cooling section and method for forming the same - Google Patents

Description

  The present invention includes an electronic component package in which a concave portion for housing an electronic component is formed in a metal plate, a cavity type package used for a so-called stiffener or heat spreader, and a cooling unit, and a cooling unit. The present invention relates to a method for forming an electronic component package.

  In recent years, computer equipment has been increasingly reduced in size and performance. However, with the increase in performance, the amount of heat generated from semiconductor elements and integrated circuits is also increasing, and the efficient cooling method of the amount of heat is a problem in promoting further downsizing and higher performance of computer equipment. It has become. In order to cool a high output, highly integrated chip or the like, generally, a heat sink for heat dissipation is joined to the package, and forced air cooling is performed by a cooling fan as necessary.

  In Japanese Patent Laid-Open No. 2001-127201 (Patent Document 1), the present applicant proposes a package with a radiator that can obtain a high heat radiation effect by forming a radiator having thin heat radiation fins integrally with the package. did. FIG. 15 and FIG. 16 show the above package with a radiator.

  The package 100 is made of a metal material, and a substantially rectangular recess 102 is formed on one surface 100a side. A bottom plate 100c having a predetermined plate thickness is formed on the bottom surface of the recess 102, and the cavity 100 is formed as a whole. . Further, a radiator 101 having a plurality of heat radiation fins 101 a is integrally formed on the other surface 100 b side of the package 100. This radiator 101 is formed by standingly radiating fins 101 a by scraping the surface of a metal plate that is a material of the package 100, and the radiating fins 101 a formed in a substantially rectangular thin plate shape are formed on the other side of the package 100. It is made to stand upright symmetrically with a predetermined angle from the direction 100b.

  A wiring board 103 made of TAB, a flexible printed board, a normal printed board, or the like is bonded and fixed to one surface 100a of the package 100 with an adhesive or the like. On the wiring board 103, printed wiring (not shown) is provided between a large number of terminal portions 104 and external terminals provided on the outer edge. Further, the chip of the semiconductor integrated circuit 105 is accommodated in the recess 102 formed in the one surface 100 a of the package 100. A large number of terminals 106 provided in the semiconductor integrated circuit 105 are electrically connected to the terminal portions 104 of the wiring substrate 103 by bonding wires 107. Further, the semiconductor integrated circuit 105 and the bonding wire 107 are sealed by injecting a sealant 108 into the recess 102 of the package 100. Solder balls 109 are disposed on external terminals provided on the outer edge of the wiring board 103, and the solder balls 109 are heated and melted at predetermined positions on a circuit board of an electronic device (not shown), so that the wiring board 103 and the electronic terminals The circuit board of the device is electrically connected.

  In this way, by integrally forming the radiator 101 on the other surface 100b side of the package 100, the heat of the package 100 is directly transmitted to the radiator 101, so that heat transfer loss is reduced and heat dissipation efficiency is improved. Can do. In order to dissipate the heat generated from the semiconductor integrated circuit 105 housed in the recess 102 of the package 100, it is necessary to increase the heat dissipating area of the heat dissipating fin 101a, and thus the heat dissipating fin 101a must be formed high. As a result, there is a problem that the package 100 becomes thick and cannot be mounted on an electronic device such as a small computer. On the other hand, in the case of the small package 100, the heat radiating fins 101a cannot be formed high, and a sufficient heat radiating area cannot be obtained. Therefore, there is a problem that heat generated from the semiconductor integrated circuit 5 cannot be radiated.

  Since the heat sink 101 is formed so as to protrude from the package 100, the heat sink 101 makes the package 100 unstable when the semiconductor integrated circuit 105 is accommodated in the recess 102 or when the wiring substrate 103 is bonded and fixed. . For this reason, there is a serious problem that an automated production line that has been generally used cannot be used, a special production line must be installed, and a large capital investment is required.

JP 2001-127201 A

  SUMMARY OF THE INVENTION The problem to be solved by the present invention is to provide an electronic component package and a method for forming the package that can obtain a high heat dissipation effect even if it is downsized by providing a cooling unit integrally with the package, and can be formed thin and flat. Is to provide.

In order to solve the above-mentioned problem, the invention described in claim 1 is a package in which a concave portion for housing an electronic component is formed on one side of a flat metal plate having good thermal conductivity,
A cooling part is integrally provided on the other surface side of the package,
The cooling part has a groove formed between a plurality of plate-like fins integrally formed on the other side of the package, and a metal plate is formed in a substantially dish shape so as to cover the groove. And the crowned member
The groove is formed with a predetermined width between a large number of plate-like fins raised at a predetermined interval by digging up a convex portion that is formed to protrude on the other surface side of the package when the concave portion is recessed. And at least the tips of the plurality of fins are curled, and the tips are brought into contact with the inner surface of the crown member facing each other in a pressed state so that the inner surface of the crown member from the other surface side of the package. Formed during
The gist is that the crown member corresponding to both sides of the groove portion is provided with an inlet and an outlet for circulating a cooling fluid in the middle groove portion .

  Further, in the invention described in claim 3, the width of the groove formed in a plurality of strips is formed to be smaller than the width of the inner surface of the crown member, and hollow fluid reservoirs are formed on both sides of the groove. The gist is that the crown member is provided with the inlet and outlet in communication with the fluid reservoir.

The invention according to claim 3 is a package in which a concave portion for housing an electronic component is formed on one side of a metal plate,
The package is formed from a metal plate such as aluminum or copper with good thermal conductivity,
The package press-forms the concave portion having a dimension shallower than the plate thickness by pressing or the like from one side of the metal plate having a predetermined thickness, and protrudes to the other side when the concave portion is pressed. A concave portion forming step for forming the convex portion to be formed ;
A plurality of strips formed by curling at least the tip by digging up in a state having a predetermined angle and sequentially moving the blade part of the tool repeatedly and digging up the convex part protrudingly formed on the other surface of the metal plate. A groove portion forming step in which plate-like fins are continuously and standingly formed, and a groove portion having a predetermined width is formed between each of the fins,
A substantially dish-shaped crowned member provided with an inlet and an outlet at positions corresponding to both sides of the groove covers the numerous fins and the grooves formed on the other surface of the package, and the tips of the fins summarized in that together with the bears so as to abut in pressing state to the inner surface of the opposing Hikanmuri member comprises a cooling portion forming step of sealing the periphery of the opening end and the package of the target crown member And

  According to the present invention, an electronic component housed in the recess of the electronic component package is cooled with high heat dissipation efficiency by providing a cooling unit integrally with the electronic component package and circulating a cooling fluid in the cooling unit. It becomes possible to do. Since this cooling part is composed of a plurality of grooves formed integrally protruding on the other surface side of the package, the heat generated from the electronic components such as the semiconductor integrated circuit is directly transmitted to the cooling part, so that the heat transfer. Loss is greatly reduced, and the cooling efficiency of electronic components can be increased.

  In addition, since the groove portion having a predetermined width is formed between the plate-like fins formed upright by digging up the metal plate itself of the package, the cooling portion can be configured with the minimum number of parts. In addition, since the thermal insulation resistance is minimized between the package and the cooling unit, the heat of the electronic component can be cooled with high efficiency.

  Furthermore, by forming hollow fluid reservoirs on both sides of the groove formed in the multiple strips, the cooling fluid flowing in from the inlet provided in the crown member is decompressed by the fluid reservoir on the inlet, The cooling fluid can be distributed almost evenly in each of the grooves, and this cooling fluid is collected from the fluid reservoir on the outlet side and guided to the outlet, so that the cooling power of the entire cooling part is substantially equal. It becomes possible to.

  By forming a groove in the convex portion on the other surface side that protrudes when the concave portion is pressed on one side of the metal plate, the convex portion that is inevitably formed on the other surface side can be used as it is. Therefore, the cooling part can be formed at a low cost by a small number of steps.

  When the tip of a plurality of fins standing upright on the other surface of the package is curled to form a substantially cylindrical shape, the cylindrical portion is pressed against the inner surface of the crowned member, so a groove formed between the plurality of fins Are separated from each other, and the cooling fluid can be distributed almost evenly in the respective grooves. Even if the height of the fins varies, the curling portion absorbs the variations when pressed, so that the grooves can be reliably separated.

By digging down one side of the metal plate, which is the material of the package, toward the inside of the metal plate using a digging tool, the plate-like fins are continuously formed upright integrally. A groove can be easily formed between them. Then, by bears the to be crown member inlet and an outlet is provided at a position corresponding to both sides of the groove, facilitates cooling unit flow path is formed for circulating cooling fluid to the grooves Therefore, the cost can be reduced.

  By forming the groove in the convex portion on the other side that protrudes when the concave portion is pressed and formed on the one surface side of the metal plate by the concave portion forming step, the opposing position between the groove portion of the cooling portion and the concave portion of the package is ensured. Can match. And since the convex part inevitably formed in the other surface side can be utilized as it is, the package for electronic components provided with the cooling part can be formed at low cost with few processes.

  In the electronic component package, a concave portion for housing the electronic component is formed on one side of a flat metal plate having good thermal conductivity, and a cooling unit is integrated on the other side of the electronic component package. Provided. The cooling unit includes a crown-shaped member formed in a substantially dish shape to be crowned on the other surface side of the package, and a plurality of plate-like fins integrally formed to protrude from one inner surface of the package. And a groove formed between the fins. Further, the crown member corresponding to both sides of the groove portion is provided with an inlet and an outlet for flowing a cooling fluid into the hollow portion and flowing out through the groove portion. Then, heat generated from the electronic component housed in the concave portion of the package is transmitted to the other surface side of the package through the package. The heat on the other surface side is cooled by the cooling fluid flowing through the groove portion in the cooling portion, and the temperature rise of the electronic component is suppressed.

  On the other surface of the package or the inner surface of the crown member, a plurality of plate-like fins are formed at predetermined intervals by digging up the metal plate itself into the hollow portion, and each of the above-mentioned The groove having a predetermined width is formed between the fins. Furthermore, the tips of the plurality of fins are brought into contact with the other surface side of the opposing package or the inner surface of the crown member, and the groove is between the other surface side of the package and the inner surface of the crown member. Formed.

  The width dimension of the groove part formed in multiple strips is formed smaller than the width dimension of the inner surface of the crown member, and hollow fluid reservoirs are formed on both sides of the groove part, respectively. The crown member is provided with the inlet and the outlet so as to communicate with the fluid reservoir.

The package for electronic components is formed from a metal plate such as aluminum or copper having a good thermal conductivity. First, in the recess forming step, from the one side of the metal plate having a predetermined plate thickness, press or the like from the plate thickness. A recess is formed by pressing a shallow dimension to form a package. In this package, a plurality of plate-like fins are integrated by digging up in a state having a predetermined angle on the other surface side in a groove forming step and moving the blade portion of the tool repeatedly and digging up the other surface sequentially. Continuously standing and forming a groove having a predetermined width between the fins. Thereafter, in the cooling part forming step, a substantially dish-shaped crowned member provided with an inlet and an outlet at positions corresponding to both sides of the groove is provided on the other surface side so as to cover the groove. Furthermore, the cooling end is formed by sealing the opening end of the sealing member and the peripheral edge of the package.

  When the concave portion is pressed and formed on the one surface side of the metal plate by the concave portion forming step, a convex portion is projected and formed on the other surface side. By digging up this convex portion with the digging tool, a large number of the fins can be integrally formed upright, and the groove portions can be formed between the fins.

  FIG. 1 is a cross-sectional view showing an electronic component package having a cooling unit according to the first embodiment of the present invention, FIG. 2 is a plan view showing the cooling unit of the electronic component package, and FIG. 1 is a side sectional view, and FIG. 4 is a partial sectional perspective view.

  The electronic component package 1 (hereinafter abbreviated as “package 1”) is made of a metal plate. The metal plate has rigidity and matches the thermal expansion coefficient with an electronic component, a wiring board, etc., which will be described later. A copper alloy, stainless steel, or aluminum having good conductivity and capable of plastic working is employed.

  The package 1 has a substantially rectangular recess 2 formed on one side 1a, and a bottom plate 1c having a predetermined plate thickness is formed on the bottom surface of the recess 2 to form a cavity mold as a whole. Further, a cooling unit 20 is formed on the other surface 1 b side of the package 1. On the other surface 1 b side of the package 1, a plurality of fins 3 formed in a plate shape are formed at predetermined intervals, and a plurality of groove portions 4 having a predetermined width are formed between the fins 3. Then, on the other surface 1 b side of the package 1, a crowned member 5 formed in a substantially dish shape so as to cover the multiple groove portions 4 is crowned, and the opening end of the crowned member 5 and the other of the package 1 are covered. It is formed hollow by sealing the outer peripheral edge on the side of the direction 1b with a sealing means such as welding, brazing or adhesion.

  As shown in FIGS. 2 and 3, the longitudinal width of the fins 3 and the grooves 4 formed on the other surface 1 b side of the package 1 is smaller than the width of the inner surface of the crowned member 5. Hollow fluid reservoirs 6 are formed on both sides of 4 respectively. The plurality of fins 3 are set to a height at which the tips abut against the inner surface of the crowned member 5 facing each other. As a result, the height of the groove 4 is formed between the other surface 1 b side of the package 1 and the inner surface of the crowned member 5.

  Further, the crown member 5 is provided with an inflow port 7 and an outflow port 8 at a position corresponding to the fluid reservoir 6. The inflow port 7 and the outflow port 8 are formed so as to project integrally on the outer surface side of the crown member 5 and are formed in a hollow cylindrical shape so as to communicate with the fluid reservoir 6. An injection pipe 11 connected to a cooling fluid injection means (not shown) is inserted into the inlet 7, and an outlet pipe 12 is inserted into the outlet 8.

  The cooling fluid introduced from the inlet 7 through the injection pipe 11 is once stored in the fluid reservoir 6 and then flows through the multiple grooves 4. At this time, the heat generated from the electronic component housed in the recess 2 of the package 1 is cooled by the cooling fluid flowing through the groove portion 4, and the temperature rise of the electronic component is suppressed. The cooling fluid heated by flowing through the groove 4 is stored in the fluid reservoir 6 on the outlet 8 side and then flows out from the outlet 8 through the outlet pipe 12. As the cooling fluid that circulates in the groove portion 4, a liquid or gas such as water, alternative chlorofluorocarbon, acetone, methanol, helium, or nitrogen can be used.

  As shown in FIG. 1, a wiring substrate 23 made of TAB, a printed circuit board, or the like is fixed to one surface 1a of the package 1. A window hole is formed in the wiring board 23, and a large number of terminal portions having a line width and a pitch of about 37 μm are formed around the window hole. Furthermore, the chip of the semiconductor integrated circuit 22 is accommodated in the recess 2 formed on the one surface 1a of the package 1, and is fixed to the bottom plate 1c of the recess 2 with an adhesive in a surface-bonded state. A large number of terminals having the same line width and pitch as the terminal portions formed on the wiring substrate 23 are provided on the upper surface of the semiconductor integrated circuit 22. The semiconductor integrated circuit 22 and the terminal portion of the wiring board 23 are electrically connected by a bonding wire 24. Further, the semiconductor integrated circuit 22 and the bonding wire 24 are sealed by injecting a sealant 25 into the recess 2 of the package 1.

  On the other hand, solder balls 26 are disposed on external terminals provided on the outer edge of the wiring board 7. In order to mount the package 1 containing such integrated circuit components on a circuit board of an electronic device (not shown), the solder ball 26 is melted by heating in a state temporarily fixed at a predetermined position of the circuit board of the electronic device, The wiring board 23 and the circuit board of the electronic device are electrically connected.

  Next, the cooling unit 20 provided integrally with the electronic component package 1 will be described. The multiple grooves 4 formed on the other surface 1b side of the package 1 are formed between the multiple fins 3 as shown in FIG. The fin 3 has at least a tip formed in a substantially cylindrical shape by curling. And the plate | board thickness t of the fin 3 is formed in 0.1-1 mm, and the width w of the groove part 4 in a bottom part is formed in about 0.01-5.0 mm. Further, the depth d of the groove portion 4 is substantially equal to the height of the fin 3 and is formed to be about 0.1 to 7.0 mm which is a height to be pressed against the inner surface of the crowned member 5.

  That is, when the crown member 5 is crowned on the other surface 1 b side of the package 1, the cylindrical portion at the tip of the fin 3 is pressed against the inner surface of the crown member 5, so that the height of the fin 3 is the height of the crown member 5. Since it is regulated by the inner surface, the depth d of the groove 4 is equal to the height to the inner surface of the crowned member 5. By forming in this way, the groove portions 4 formed between the plurality of fins 3 are separated from each other, and the cooling fluid can be circulated almost uniformly in each groove portion 4. Moreover, even if the height of the fin 3 varies, the curling portion absorbs the variation when pressed, so that the grooves 4 can be reliably separated. The wall thickness of the bottom plate 1c is 0.1 to 2.0 mm.

  FIG. 5B shows a fin 3 that is partially enlarged as a modification of the fin 3, and is formed in a flat plate shape than the fin 3 shown in FIG. The shape of the fin 3 varies depending on the shape of the blade portion of the digging tool described later or the digging angle. Further, since the fin 3 formed by the blade portion of the digging tool is formed thinly from the base end to the tip end on the bottom plate 1c side, the width w1 of the cross-sectional shape of the groove portion 4 also increases from the bottom portion to the opening portion. It is formed to be slightly wider.

  Next, a method for forming the package 1 including the cooling unit 20 having the above-described configuration will be described with reference to FIGS.

  First, a method for forming the package 1 will be described with reference to FIG. The above-described metal plate used for the package 1 is formed in a flat plate shape having a plate thickness and a width necessary for forming the package 1.

  6A shows a metal plate 12 made of a flat metal plate as a material of the package 1, and FIG. 6B shows a recess forming step. After placing the metal plate 12 in a state of being positioned with respect to the die 13 of a press machine (not shown), the punch 14 mounted on the press machine is pressed from the one surface 12a side of the metal plate 12 by pressing. A recess 2 having a predetermined depth is formed.

  In this way, by forming the recess 2, the meat existing in the recess 2 is shifted to the other surface 12 b side of the metal plate 12, and the protrusion 15 having a height h substantially equal to the depth of the recess 2 is formed to protrude. Is done. The outer dimension Lu of the convex portion 15 is a similar shape slightly smaller than the opening side dimension Ld of the concave portion 2. The reason why the dimensional relationship is similar is that the convex portion 15 does not cut from the metal plate 12 and always maintains a connected state.

  A plurality of grooves 4 of the cooling unit 20 are formed on the protrusions 15 of the package 1 formed as described above. Hereinafter, a method for forming the groove 4 will be described with reference to FIGS.

  The digging tool 30 has a blade 31 formed at the bottom end. The digging tool 30 is attached to a driving device (not shown) so as to be inclined at a predetermined angle θ so that the rear end side becomes higher with respect to the convex portion 15 of the package 1. The inclination angle θ of the digging tool 30 is appropriately set depending on the height of the fins 3, the plate thickness, the material of the package 1, etc., but is generally set to 5 degrees to 20 degrees.

  First, the metal plate 12 is placed in a state of being positioned on a die (not shown). As shown in FIG. 8 (A), after the digging tool 30 is brought into contact with one end side of the convex portion 15, the digging tool 30 driven by a driving device (not shown) is moved in the direction of the concave portion 2 at a predetermined angle. Move to. Then, as shown in FIG. 8B, the convex portion 15 is dug up by the blade portion 31 at the tip of the digging tool 30, and the tip of the thin fin 3 stands up. When the digging tool 30 is further moved to a predetermined position, as shown in FIG. 7C, the convex portion 15 is gradually digged deeply, and the first fin 3a is formed at a predetermined height d. It is desirable that the depth of digging by the digging tool 30 does not exceed the height of the convex portion 15. Further, a work surface 16 is formed on the trace where the first fin 3a is dug up. Then, after forming the first fin 3a, the digging tool 30 is retracted and returned to the standby position.

  As described above, after the first fin 3a is erected, the next second fin 3b is formed. At this time, the metal plate 12 is sent to the downstream side on the right side of the figure by a predetermined pitch, and the position is determined and fixed to the die. Then, as shown in FIG. 8D, the blade portion 31 of the digging tool 30 is brought into contact with the upstream side of the work surface 16. This contact position is set to a position where a predetermined digging allowance t is obtained on the work surface 16. Incidentally, the excavation allowance t is set to about 0.01 mm to 0.5 mm.

  Thereafter, the digging tool 30 is moved in the direction of the recess 2 by a predetermined angle, and the blade 31 of the digging tool 30 is moved to a position where the predetermined pitch p is reached as shown in FIG. The thin second fins 3b are formed upright by digging up. As a result, the work surface 16 is formed. Then, the digging tool 30 is retracted again and returned to the standby position. Thus, the groove part 4 is formed between the first fin 3a formed previously and the second fin 3b formed next.

  Further, a plurality of fins 3 are erected and formed on the convex portion 15 projecting from the metal plate 12 and the digging tool 30 is moved to form the fins 3 having a predetermined pitch in order to form the plurality of groove portions 4. To do. That is, after the metal plate 12 is sent to the downstream side and positioned and fixed to the die, the digging tool 30 is moved to repeat the process of erecting the fins 3 on the convex portion 15, thereby forming the convex portion 15 of the metal plate 12 on the convex portion 15. A plurality of fins 3 are continuously formed at a predetermined pitch, and a plurality of groove portions 4 having a predetermined width are continuously formed, whereby the package 1 shown in FIGS. 1 and 2 is formed. As described above, by forming the multiple groove portions 4 on the convex portions 15 of the metal plate 12, the periphery on the other surface 1b side of the package 1 is formed flat.

  On the other hand, the crowned member 5 is formed by forming a metal plate such as copper, stainless steel, or aluminum that can be plastically processed into a substantially dish shape as shown in the drawing. As shown in FIG. 3, the width dimension of the inner surface of the crown member 5 is formed to be smaller than the width dimension in the longitudinal direction of the groove portion 4, and the hollow fluid reservoir portions 6 are respectively formed on both sides of the groove portion 4. ing. Further, a hollow cylindrical inlet 7 and outlet 8 are integrally formed at a position corresponding to the fluid reservoir 6 so as to communicate with the fluid reservoir 6. The inflow port 7 and the outflow port 8 are formed by appropriate means such as burring.

  Then, the crowned member 5 is crowned so that the open end of the crowned member 5 is brought into contact with the periphery of the other surface 1b side of the package 1 so as to cover the multiple grooves 4. At this time, the inner surface of the crown member 5 and the tip of the fin 3 are joined in a pressed state. The opening end of the crowned member 5 and the outer peripheral edge on the other surface 1b side of the package 1 are fixed by fixing means such as welding, brazing or adhesion so that the cooling fluid does not leak.

  As the metal plate described above, a hoop-like metal plate such as aluminum, an aluminum alloy, copper, a copper alloy, or stainless steel can be used. That is, as shown in FIG. 9, after placing the hoop-shaped metal plate 40 in a state of being positioned on a die (not shown), the punch mounted on the press machine from one side of the metal plate 40 by the above-described recess forming step. A concave portion having a predetermined depth is formed by pressing (not shown), and the meat existing in the concave portion is transferred to the other surface side of the metal plate 40, and the convex portion having a height substantially equal to the depth of the concave portion. 41 is formed to protrude. And the convex part 41 is dug up by the blade part 31 of the dug-up tool 30 mentioned above, and the thin fin 42 of predetermined height is formed upright.

  Thereafter, the hoop-shaped metal plate 40 is fed by a predetermined pitch and positioned and fixed to the die. And after making the blade part 31 of the digging tool 30 upstream from the surface 43 to be processed and contacting a position where a predetermined digging allowance is obtained, the digging tool 30 is moved by a predetermined angle, and the convex part By digging up 41, the next thin fin 42 is erected and formed at a position spaced a predetermined pitch from the fin 42 erected previously. Thus, the groove 44 is formed between the previously formed fin 42 and the next formed fin 42.

  The above groove 44 forming process is repeated until the groove 44 is formed on the entire surface of the convex portion 41. And after forming the groove part 44 of many stripes, after moving the said hoop-shaped metal plate 40 to the position of the next convex part 41, as mentioned above, the fins 42 of many stripes are raised and formed by the digging tool 30. At the same time, a plurality of groove portions 44 are formed between the fins 42. In this way, after the convex portions 41 are sequentially projected and formed on the hoop-like metal plate 40, the groove portion forming step of forming a plurality of groove portions 44 on the convex portions 41 is sequentially repeated.

  Thus, after forming the groove part 44 in the convex part 41 formed at predetermined intervals, the package 1 is cut by cutting at a position of a predetermined cut line, or by cutting into a predetermined shape as necessary. It is formed. This cutting step may be performed immediately after the groove portion 44 is formed on one convex portion 41 or may be cut after the groove portions 44 are formed on the plurality of convex portions 41.

  FIG. 10 shows a second embodiment in which the electronic component package including the cooling unit 20 is formed thin. That is, FIG. 10 (A) shows the recess forming step, and the metal plate 12 made of a flat metal plate as the material of the package 1 presses a punch mounted on a press machine (not shown) from the one surface 12a side. By doing so, the recess 2 having a predetermined depth is formed. Then, by forming the recess 2, the meat existing in the recess 2 is shifted to the other surface 12 b side of the metal plate 12, and a protrusion 15 having a height substantially equal to the depth of the recess 2 is formed. After that, the convex portion 15 is deleted by dividing the convex portion 15 once or plural times by, for example, a cutter 55 until it is flush with the other surface 12 b of the metal plate 12. After that, as shown in FIG. 10B, a large number of groove portions 4 are formed on the plane formed on the other surface 12b side of the metal plate 12.

  The method for forming the groove 4 is the same as the method shown in FIG. 8 described above, and a detailed description thereof will be omitted. Only the differences in the present embodiment will be described. That is, in FIG. 10B, similarly to the forming method described above, after the digging tool 30 is brought into contact with a predetermined position on the other surface 12b of the metal plate 12, the digging tool 30 is moved in the direction of the recess 2 at a predetermined angle. The thin fins 3 are erected by moving to and digging up the metal plate 12. Then, the next thin fin 3 is separated by a predetermined pitch by retreating the digging tool 30 to the upstream side and digging up the work surface formed by standing up the fin 3 first with a predetermined digging allowance. By standing up and repeating this operation thereafter, a large number of groove portions 4 are formed on the other surface 12b side of the metal plate 12, whereby the package 1 is formed.

  At this time, the multiple grooves 4 are formed so that a flat surface is formed on the outer periphery of the package 1, and the width dimension in the longitudinal direction is reduced so that hollow fluid reservoirs are formed on both sides of the groove 4. Yes. Therefore, the width of the digging tool 30 is set to be smaller than the width of the package 1, and flat surfaces that are fluid reservoirs are formed on both sides of the digging tool 30. Further, as shown in FIG. 10B, the position of the groove 4 to be formed first is set closer to the center of the predetermined dimension from the front edge of the package 1, and the position of the groove 4 to be formed last is also the rear edge of the package 1. It is set closer to the center of the predetermined dimension from the edge.

  Thereafter, as shown in FIG. 10C, the other end 12b side of the package 1 abuts the opening end of the crowned member 5 formed in a substantially dish shape, and covers the multiple grooves 4. To be crowned. At this time, the tip of the fin 3 is brought into contact with the inner surface of the crowned member 5. Then, the opening end of the crowned member 5 and the outer peripheral edge on the other surface 1b side of the package 1 are fixed by fixing means such as welding, brazing or adhesion. In this way, the cooling unit 20 is configured by covering the multiple groove portions 4 with the crown member 5. Similarly to the above-described example, a hollow cylindrical inlet 7 and outlet 8 are integrally formed on the crown member 5 so as to communicate with the fluid reservoir 6.

  Thus, the convex part 15 which protrudes and is formed on the other surface 12b side of the package 1 is deleted to form a flat surface, and a plurality of grooves 4 are formed on the flat surface, thereby providing an electronic component including the cooling unit 20. The package 1 can be made thinner.

  11 and 12 show a third embodiment for further thinning the electronic component package including the cooling unit 20. In FIG. 11, the difference from the package described above is that a flat surface 61a is formed by cutting the top portion of the fin 61 formed in the package 60, and a shallow groove portion 62 having a substantially square cross section is formed. .

  As for the formation method of the groove portion 62, as in the above-described formation method, first, as shown in FIG. 12A, the metal plate 12 in which the concave portion 2 is formed by the concave portion formation step of FIG. After being placed in a state of being positioned at 65, by repeating the process of digging up one side of the metal plate 12 with the digging tool 30, a large number of fins 61 having a predetermined height are formed, and groove portions are formed between the fins 61. 62 is formed. Thereafter, as shown in FIG. 12B, the top of the fin 61 formed on one surface of the metal plate 12 is cut with a cutting tool such as a grinder 66 to form a flat surface 61 a at the tip of the fin 61.

  The fins 61 are set to a height at which the flat surface 61a at the tip is joined while slightly pressing the inner surface when the crown member 63 is crowned. Then, the opening end of the crowned member 63 and the outer peripheral edge on the other surface side of the package 60 are fixed by fixing means such as welding, brazing or adhesion. In this way, the cooling unit 20 is configured by covering the multiple groove portions 62 with the crowned member 63.

  Thus, the package 60 can be thinned by cutting the top part of the fin 61 with the cutting tool 33 to form the flat surface 61a at the tip, and even if the cooling part 20 is provided, the electronic component package is further thinned. Can be formed. Further, by forming the flat surface 61a at the tip of the fin 61, the flat surface 61a is surface-bonded to the inner surface of the crown member 63, so that each groove 62 can be separated and the cooling fluid can be dispersed.

  FIG. 13 shows a modification of the electronic component package including the cooling unit 20 shown in FIGS. 1 to 3, and the hollow cylindrical inlet 7 and outlet 8 provided in the crown member 5 are connected to the crown member. 5 is provided on the side surface. In FIG. 13, the same reference numerals as those in FIGS. 1 to 3 denote the same components or the same components, and detailed descriptions thereof are omitted.

  In FIG. 13, an inflow port 71 and an outflow port 72 are provided on the side surface of the crowned member 70 at a position corresponding to the fluid reservoir 6. That is, a through hole 70a communicating with each fluid reservoir 6 is formed on the side surface of the crowned member 70 formed in a substantially dish shape, and the inlet 71 made of a hollow cylindrical pipe member is formed in the through hole 70a. And the outflow port 72 is inserted and fixed. At this time, it is desirable to seal by a sealing means such as welding, brazing or adhesion so that the cooling fluid does not flow out between the inlet 71 and the outlet 72 and the through hole 70a. In this way, the cooling unit 20 is configured by covering the multiple grooves 4 with the crowned member 70.

  And while inserting the injection pipe connected to the cooling fluid injection | pouring means which is not shown in figure at the inlet 71 of the cooling part 20, the outflow pipe was inserted in the outlet 72, and it was made to flow in from the inlet 71 via the injection pipe. After the cooling fluid is accumulated in the fluid reservoir 6, the multiple grooves 4 are circulated, and after being accumulated in the fluid reservoir 6 on the outlet 72 side, the refrigerant is discharged from the outlet 72 via the outlet pipe. At this time, the heat generated from the electronic component housed in the recess 2 of the package 1 is cooled by the cooling fluid flowing through the groove portion 4, and the temperature rise of the electronic component is suppressed.

  FIG. 14 shows an embodiment in which the cooling part 20 is configured by forming a groove part on the inner surface of the crowned member. In FIG. 14, a package 80 has a recess 80a formed on one surface and a flat surface on the other surface 80b. On the other hand, the crowned member 82 is formed from a metal plate made of the same material as the package 80. Similarly to the crown member described above, the crown member 82 is formed in a substantially dish shape, and a large number of fins 83 formed in a plate shape are formed on the inner surface side at predetermined intervals. A plurality of grooves 81 having a predetermined width and having a capillary force are formed therebetween. The fin 83 and the groove 81 are the same as the method for forming the fin and the groove formed on the other surface of the package described above, and the description thereof is omitted.

  The crown member 82 is formed in a substantially dish shape after the fin 83 and the groove 81 are formed on a flat metal plate. Further, as described above, the hollow cylindrical inflow port 84 and the outflow port are integrally formed at the position corresponding to the fluid reservoir portion so as to communicate with the fluid reservoir portion. The inflow port 84 and the outflow port are formed by appropriate means such as burring.

  Then, the crown member 82 is crowned on the other surface side 80b of the package 80, and the opening end of the crown member 82 and the outer peripheral edge of the other surface side 80b of the package 80 are fixed by welding, brazing, bonding, or the like. Fixed by. In this way, the cooling unit 20 is configured by covering the multiple groove portions 4 with the crowned member 82.

  In the electronic component package including the cooling unit 20 shown in FIG. 14, the heat generated from the electronic components such as the semiconductor integrated circuit 22 housed in the recess 80a of the package 80 is packaged as in the above-described examples. It is transmitted to the other surface side via 80. The heat on the other surface side is cooled by the cooling fluid flowing through the groove 81 in the cooling unit 20, and the temperature rise of the semiconductor integrated circuit 22 is suppressed.

  In each of the embodiments described above, the fin is raised and the groove is formed by moving the digging tool while the metal plate is positioned and fixed. On the contrary, the digging tool is fixed and the metal plate is fixed. The fins may be formed by moving the plate, and the fins can be formed upright by relatively moving the metal plate and the digging tool. Also, the groove is formed on either the package or the crown member, but the fins are erected on both sides, and the tops of the fins are joined together to form the groove that communicates from the package side to the crown member side. May be. Thus, the present invention is not limited to these examples and can be variously modified without departing from the present invention.

  The present invention is particularly applicable to packages that house electronic components such as semiconductor integrated circuits that generate heat.

It is sectional drawing which shows the package for electronic components provided with the cooling part concerning this invention. It is a top view which shows the package for electronic components provided with the cooling unit concerning this invention. It is side sectional drawing which shows the package for electronic components provided with the cooling part concerning this invention. It is a partial cross section perspective view which shows the package for electronic components provided with the cooling unit concerning this invention. (A), (B) is an expanded sectional view which shows the groove part in the package for electronic components. (A), (B) is explanatory drawing which shows the process of forming a recessed part and a convex part in the package for electronic components. It is a perspective view which shows the process of forming a groove part in the package for electronic components concerning this invention. (A) thru | or (E) is explanatory drawing which shows the formation process of the groove part of the package for electronic components concerning this invention. It is a perspective view which shows the groove part formation process which forms a groove part in a hoop-shaped metal plate. (A), (B), (C) is explanatory drawing which shows the formation process of the 2nd Example of the package for electronic components provided with the cooling part concerning this invention. It is sectional drawing which shows the example which formed the shallow groove part in the package for electronic components concerning this invention. (A), (B) is process explanatory drawing which shows the process of forming the shallow groove part in FIG. It is a sectional side view which shows the 3rd Example of the package for electronic components provided with the cooling part concerning this invention. It is sectional drawing which shows the example which formed the groove part in the inner surface of a to-be-crowned member in the package for electronic components provided with the cooling part concerning this invention. It is a perspective view which shows the conventional package for electronic components. It is sectional drawing which shows the package for electronic components shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component package 1a One side 1b The other side 2 Concave part 3 Fin 4 Groove part 5 Crowned member 6 Fluid accumulation part 7 Inlet 8 Outlet 12 Metal plate 15 Convex part 20 Cooling part 22 Semiconductor integrated circuit (electronic component)
30 Digging tool 31 Blade 40 Hoop-shaped metal plate

Claims (3)

A package in which a concave portion for housing an electronic component is formed on one side of a flat metal plate having good thermal conductivity,
A cooling part is integrally provided on the other surface side of the package,
The cooling part has a groove formed between a plurality of plate-like fins integrally formed on the other side of the package, and a metal plate is formed in a substantially dish shape so as to cover the groove. And the crowned member
The groove is formed with a predetermined width between a large number of plate-like fins raised at a predetermined interval by digging up a convex portion that is formed to protrude on the other surface side of the package when the concave portion is recessed. And at least the tips of the plurality of fins are curled, and the tips are brought into contact with the inner surface of the crown member facing each other in a pressed state so that the inner surface of the crown member from the other surface side of the package. Formed during
The package for an electronic component according to claim 1, wherein the crown member corresponding to both sides of the groove is provided with an inlet and an outlet for circulating a cooling fluid in the groove .   A width dimension of the groove portion formed in a plurality of strips is smaller than a width dimension of the inner surface of the crown member to form hollow fluid reservoirs on both sides of the groove portion, and the crown member has the fluid The electronic component package comprising the cooling unit according to claim 1, wherein the inflow port and the outflow port are provided in communication with a reservoir. It is a package in which a recess for storing electronic components is formed on one side of a metal plate, and the package is formed from a metal plate such as aluminum or copper having good thermal conductivity,
The package press-forms the concave portion having a dimension shallower than the plate thickness by pressing or the like from one side of the metal plate having a predetermined thickness, and protrudes to the other side when the concave portion is pressed. A concave portion forming step for forming the convex portion to be formed ;
A plurality of strips formed by curling at least the tip by digging up in a state having a predetermined angle and sequentially moving the blade part of the tool repeatedly and digging up the convex part protrudingly formed on the other surface of the metal plate. A groove portion forming step in which plate-like fins are continuously and standingly formed, and a groove portion having a predetermined width is formed between each of the fins,
A substantially dish-shaped crowned member provided with an inlet and an outlet at positions corresponding to both sides of the groove covers the numerous fins and the grooves formed on the other surface of the package, and the tips of the fins characterized in that together with the bears so as to abut in pressing state to the inner surface of the opposing Hikanmuri member comprises a cooling portion forming step of sealing the periphery of the opening end and the package of the target crown member A method for forming an electronic component package including a cooling unit.

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