JP3247357B2 - Package with radiator and method of forming the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package with a radiator in which a radiator is integrally formed with a cavity type package used for a so-called stiffener in which a concave portion for accommodating an electronic component is formed in a metal plate.

[0002]

2. Description of the Related Art With the miniaturization of information devices in recent years, the packages of electronic components typified by semiconductor integrated circuits and hybrid circuits have also been reduced in size and density. As a result, the amount of heat generated by the semiconductor integrated circuit increases,
A radiator for heat dissipation is joined to the package,
Forced cooling is performed by a cooling fan as necessary.

FIG . 13 shows a heat radiating means conventionally used in general. That is, the package 1 is made of a metal material, has rigidity, matches the coefficient of thermal expansion with a wiring board or the like described later, has good thermal conductivity required as a heat spreader, and is capable of plastic working. As the metal material, a copper alloy, stainless steel, or aluminum is used.

[0004] On one side 1a side of the package 1, a substantially quadrangular concave portion 2 is formed. Further, a bottom plate 1c having a predetermined thickness is formed on the bottom surface of the concave portion 2, and is formed as a cavity as a whole. Further, on one surface 1a of the package 1, TAB, a flexible printed board,
Alternatively, a wiring board 3 made of a normal printed board or the like is bonded and fixed with an adhesive or the like.

A chip of a semiconductor integrated circuit 5 is accommodated in a recess 2 formed on one surface 1a of the package 1. The semiconductor integrated circuit 5 is fixed to the bottom plate 1c of the concave portion 2 by an adhesive in a surface bonding state. A large number of terminals provided on the upper surface of the semiconductor integrated circuit IC are electrically connected to terminal portions formed on the wiring board PB by bonding wires 7. Further, a sealant 8 is injected into the concave portion 2 of the package 1 to seal the semiconductor integrated circuit IC and the bonding wire 7.

[0006] Solder balls 9 are provided on the wiring board 3 and are electrically connected to terminals formed on a circuit board of an electronic device (not shown) by thermal melting. On the other hand, heat generated during operation of the semiconductor integrated circuit 5 is dissipated by being transmitted to the package 1 functioning as a heat spreader. Further, this heat is transmitted to the radiator 100 bonded to the package 1 and radiated outward. The radiator 100 is made of a metal material having good thermal conductivity, such as aluminum, and has a generally well-known structure in which a large number of plate-shaped radiating fins 101 are formed to protrude. The package 1 and the radiator 100 are joined by an adhesive sheet 102 having thermal conductivity.

[0007]

However, in the above-mentioned conventional radiator 100, since the radiating fins 101 are formed to be thick, the expected radiating performance cannot be obtained.
In order to obtain the required heat radiation effect, it is necessary to enlarge the heat radiator itself. Furthermore, since the adhesive sheet 102 is interposed between the package 1 and the radiator 100, the adhesive sheet 102 becomes a thermal resistor, and the heat of the package 1 is not sufficiently transmitted to the radiator 100. There is.

In general, in order to enhance the heat radiating effect of the radiator, it is preferable that the heat radiating fins be formed thin. However, since this type of radiator is usually formed by drawing out an aluminum material as an inexpensive processing method, there is a limit in reducing the thickness of the radiating fins, and the ideal thickness is about 0.2 mm or less. It is difficult to form a perfect radiating fin. On the other hand, the package 1 and the radiator 100 are separate components, and an adhesive sheet 1 for joining the two.
02 is inevitable, and the adhesive sheet 102
From the thermal resistance and the heat dissipation limit of the radiator itself,
The heat radiating means of the conventional package had to be totally inefficient.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the conventional method, and a high heat radiation effect can be obtained by forming a radiator having thin heat radiation fins integrally with a package. And a method for forming the same.

[0010]

To achieve SUMMARY OF THE INVENTION The above object, an invention according to claim 1, a package housing an electronic component within a recess depressed formed on one surface of the metal plate, the recess By pressing the metal plate
The height corresponding to the depth of the recess formed on the other surface
Of the metal plate is substantially parallel to the other surface of the metal plate.
A plurality of radiating fins standing up are formed integrally by shaving the surface of the portion to a small thickness.

According to a second aspect of the present invention, there is provided a method of forming a package for accommodating an electronic component in a recess formed in a metal plate.
This package, depending on the pressing together form a said recess is pressed forming a recessed portion which is shallower dimension than the thickness of one surface by a press or the like of a metal plate having a predetermined plate thickness
The height corresponding to the depth of the recess on the other side of the metal plate.
Forming step of projecting the convex portion of the projection, and a table of the convex portion
After shaving the surface side almost in parallel with the other surface of the metal plate with a shaving blade and erecting the radiation fin integrally by erecting at a predetermined angle while leaving the base end portion, the shaved portion is removed. Front side
The step of shaving the metal plate thinly in parallel with the other surface of the metal plate and erecting the radiating fin integrally by standing up at a predetermined angle while leaving the base end portion is repeated, and the projecting shape is formed on the other surface of the metal plate.
The method is characterized by including at least a radiating fin forming step of forming a plurality of radiating fins on the formed convex portion .

A package with a radiator according to claim 3 .
The method of forming the recesses with pressing form shallow predetermined shape than the plate thickness dimension of the metal plate from one side of the metal plate, the convex portion of slightly smaller similar shape than the recess and protrude on the other surface side Further, a plurality of radiating fins that stand up by shaving the convex portion from the surface side thinly are integrally formed.

A package with a radiator according to claim 4 .
The method of forming the dice is to move the pair of left and right shaving blades from both sides of the convex portion formed on the other surface side of the metal plate in a direction substantially parallel to the other surface of the metal plate toward the center of the convex portion so as to be thin. It is characterized in that the heat radiation fins that are almost symmetrical to the left and right are formed integrally by shaving.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a package according to the present invention will be described in detail based on an embodiment shown in the drawings. FIG.
FIG. 2 shows an example of a package for a semiconductor integrated circuit to which the package with a radiator according to the present invention is applied.
The basic configuration of the package 1 itself is a conventional example shown in FIG.
The package is the same as the package shown in FIG. 3 , and the detailed description is omitted here.

The package 1 is made of a metal material, has rigidity, matches the coefficient of thermal expansion with a wiring board or the like to be described later, has good thermal conductivity required as a heat spreader, and is capable of plastic working. As a suitable metal material, a copper alloy, stainless steel, or aluminum is employed.

The package 1 has a substantially rectangular recess 2 formed on one side 1a, and a bottom plate 1c having a predetermined thickness formed on the bottom surface of the recess 2 to form a cavity as a whole. Further, a radiator 20 having a plurality of radiating fins 20a is integrally formed on the other surface 1b side of the package 1. As described later, the radiator 20 is formed by erecting a heat radiation fin 20a by shaving the surface of a metal plate as a material of the package 1 so as to be thin, and the heat radiation fin 20a is formed in a substantially square thin plate shape. Are formed upright at a predetermined angle from the other surface 1 b of the package 1. In the embodiment shown in FIG. 1 and FIG. 2, the plurality of heat radiation fins 20a are bilaterally symmetrical to form a substantially radial form.

Since the heat radiation fins 20a are formed by shaving the surface of a metal plate, the thickness of the heat radiation fins 20a can be made extremely thin. A plate thickness of about 01 mm is preferred. As described above, since the radiator 20 is formed integrally with the package 1, the heat of the package 1 can be directly transmitted to the radiator 20, and the heat transfer loss can be greatly improved. Further, since the thickness of the radiating fins 20a is made thin, it is possible to make the radiating fins 20a closer to the ideal as generally accepted, and there is a feature that the radiating efficiency is greatly improved.

On the other hand, one surface 1a of the package 1 has T
A wiring board 3 made of AB, a flexible printed board, a normal printed board, or the like is bonded and fixed with an adhesive or the like. The wiring board 3 is formed with a window hole 3a having substantially the same size as the concave portion 2, and further, a large number of terminal portions 4 having a line width and a pitch of about 37 nm are formed by printed wiring. A printed wiring (not shown) is provided between the terminal portion 4 and an external terminal provided on the outer edge of the wiring board 3.

Further, the chip of the semiconductor integrated circuit 5 is accommodated in the concave portion 2 formed on one surface 1a of the package 1, and is fixed to the bottom plate 1c of the concave portion 2 by an adhesive in a surface bonding state. On the upper surface of the semiconductor integrated circuit 5, a large number of terminals 6 having the same line width and pitch as the terminal portions 4 formed on the wiring substrate 3 are provided. Then, as shown in FIG. 2, the semiconductor integrated circuit 5 and the terminal portion 4 of the wiring board 3
They are electrically connected by bonding wires 7. Furthermore, the semiconductor integrated circuit 5 and the bonding wires 7 are injected by injecting the sealing agent 8 into the concave portions 2 of the package 1.
Is sealed.

On the other hand, solder balls 9 are arranged on external terminals provided on the outer edge of the wiring board 3. And
In order to mount the package 1 containing such integrated circuit components on a circuit board of an electronic device (not shown), the solder ball 9 is melted by heating while temporarily fixed to a predetermined position of the circuit board of the electronic device, 3 is electrically connected to the circuit board of the electronic device.

Next, a method of forming the package 1 with a radiator will be described with reference to FIG. FIG. 3A shows a metal plate 10 that is finally formed as the package 1, and the material is selected from a copper alloy, stainless steel, aluminum, or the like. FIG. 3B shows the pressing step. After the metal plate 10 is placed in a state of being positioned with respect to a die 11 of a press machine (not shown), a concave portion is formed from one side 10a of the metal plate 10 by a pressing tool including a punch 12 mounted on the press machine. Form 2 The depth of the recess 2 is set according to the shape of the chip of the semiconductor integrated circuit 5 described above. still,
Although the recess 2 shown in FIG. 3 is a quadrangle like the recess 2 shown in FIG. 1, it may be formed in any other shape such as another polygon or a circle.

By forming the recess 2 in this manner, the metal of the recess 2 is transferred to the other surface 10b side of the metal plate 10, and the protrusion 3 having a height h substantially equal to the depth of the recess 2 is formed. Are formed to protrude. The outer dimension Lu of the projection 3 is a similar shape slightly smaller than the dimension Ld on the opening side of the recess 2. Such a dimensional relationship is for the projection 3 to always maintain the connected state without cutting from the metal plate 10. In order to maintain such a connected state, as shown in FIG. 11, a taper portion 121a may be formed such that the tip of the pressing tool including the punch 121 becomes thinner toward the tip. As a result, when the recess 2 is formed, the tip of the pressing tool is separated from the corner of the die 11, so that the projection 3 can be kept in a connected state without being cut from the metal plate 10.

FIGS. 3C to 3G show the steps of forming the radiating fins 20a of the radiator 20. FIG. That is, the surface side of the other surface side 10b of the metal plate 10 is sharply thinned by the shaving blade 13 and is raised at a predetermined angle while leaving the base end portion.
After integrally forming the first radiating fin 20a, the surface side of the portion where the first radiating fin 20a has been shaved is cut with a blade 13
To form a second radiating fin 13a by standing up at a predetermined angle while leaving the base end portion, and by repeating this process n times, n radiating fins 20a are formed on the metal plate 10. Like that. Hereinafter, the radiation fin forming step will be described in detail.

FIG. 3C shows the first radiation fin 20a.
Is shown in a standing state. First, a pair of left and right shaving blades 13 are brought into contact with both side surfaces of the convex portion 3 formed to project from the other surface 10b of the metal plate 10 and the other surface 1 of the metal plate 10 is contacted.
Each shaving blade 13 is moved from left and right toward the center in parallel with 0b, and stopped at a position near the center of the projection 3. As a result, the flesh on the surface of the convex portion 3 stands up while being shaved by the shaving blade 13 from the surface of the convex portion 3 at a predetermined thickness and angle, and its base end portion is connected to the convex portion 3 to form a pair of right and left. Of 1
The second radiation fin 20a is formed.

The shaving blade 13 used in this step has a blade portion 13a formed at an angle of approximately 30 to 80 degrees with respect to a plane parallel to the surface of the convex portion 3, and has a width equal to the above-mentioned width. The width is set to be equal to or larger than the width of the convex portion 3. The shaving allowance to be shaved by the shaving blade 13 is set to a thickness required for the radiating fins 20a to be formed upright.

After the first radiating fin 20a is formed upright, as shown in FIG.
0a, this second heat radiation fin 20a
Are formed on the traces shaved to form the first radiation fins 20a. That is, a pair of left and right shaving blades 13 are brought into contact with both side surfaces of the trace portion on the surface of the convex portion 3, and the shaving blades 13 are moved from the left and right in parallel with the other surface 10 b of the metal plate 10 as in FIG. First, it is stopped at a position upstream of the first heat radiation fin 20a by a predetermined distance. As a result, the shaving blade 1
3, the surface side of the convex portion 3 stands up while being shaved at a predetermined thickness and angle, and its base end portion is connected to the convex portion 3 to form a pair of left and right second heat radiation fins 20a. . The height of the second radiating fin 20a is reduced by the shorter cutting allowance dimension.

Third, fourth and fifth radiating fins 20
As shown in FIGS. 3 (E) to 3 (G), a is sequentially formed on the trace portion shaved to form the heat radiation fin 20a formed immediately before, similarly to the second heat radiation fin 20a. When the fifth radiating fin forming step is completed,
Ten radiating fins 20 a are formed on the left and right sides of the other surface 10 b of the metal plate 10. In the embodiment shown in FIG. 3, the last fifth radiating fin 20a is
3, the same surface as the surface of the metal plate 10 is shaved.
The height of the heat radiation fins 20a gradually decreases as the third fin, the fourth fin, and the fifth fin progress. FIG. 4 shows a state immediately after the fifth radiation fin 20a is formed upright.

When the metal plate 10 is shaved by the shaving blade 13, the radiating fins 20a may curl depending on the material of the metal plate 10. In this case, the blade 1 is located downstream of the shaving blade 13.
A guide parallel to 3a is installed.
Curling can be prevented by causing the heat radiation fins 3a to enter between them. In addition, the shaving blade 13
Of the metal plate 10 as in the above-described example.
Even if it is not a plane having an acute angle with respect to the surface of the shaving blade 131, as shown in FIG.
May be formed on an arc surface. Further, as shown in FIG. 12B, the blade portion 132a of the shaving blade 132 may be formed on a plane perpendicular to the surface of the metal plate 10 or a plane 133 obtuse.

As described above, the plurality of radiation fins 20a
Is thinned on the other side 10b of the metal plate 10 by the shaving blade 13 in order, whereby a thin radiating fin 20a having a good heat radiation effect can be easily formed. In addition, since the number, thickness and height of the radiating fins 20a can be arbitrarily set, the radiating power required for the package 1 can be arbitrarily adjusted.

FIG. 5 shows a modified example of the radiator.
All the radiation fins 21a are erected in the same direction. Also in this example, the radiating fins are formed using the shaving blade 13 in the same manner as the method shown in FIG. The difference from FIG. 3 is that the shaving blade 13 is used only on one side.

That is, the shaving blade 13 is brought into contact with one side surface of the convex portion 3 protruding from the other surface 10b of the metal plate 10 and is directed toward the other of the convex portion 3 in parallel with the other surface 10b of the metal plate 10. Move and stop just before the other side. As a result,
The first surface of the projection 3 is erected while the surface of the projection 3 is shaved by the shaving blade 13 from the projection 3 with a predetermined thickness and angle, and its base end is connected to the vicinity of the other end of the projection 3. The fin 21a is formed.

Next, the second radiating fin 21a is formed at a trace portion formed to form the first radiating fin 21a. That is, the shaving blade 13 is brought into contact with one side surface of the trace portion on the surface of the convex portion 3, the shaving blade 13 is moved toward the other side in parallel with the other surface 10 b of the metal plate 10, and the first radiation fin is formed. It stops at a position upstream by a predetermined distance from 21a. As a result, the surface side of the convex portion 3 is raised by the shaving blade 13 while being shaved at a predetermined thickness and angle, and its base end portion is connected to the convex portion 3 to form the second heat radiation fin 21a. Is done. The height of the second radiating fin 21a is reduced by the shorter cutting allowance dimension.

Thereafter, the third, fourth, and nth heat radiation fins 21a are sequentially formed. As in the example of FIG.
The next radiating fins 21a are similarly formed sequentially on the traces shaved to form the radiating fins 21a formed immediately before, and when the nth radiating fin forming step is completed, the metal plate 10 N radiation fins 2 are provided on the other surface 10b side.
1a is formed. Thus, the n heat radiation fins 21a
Are sequentially raised, the height of the radiation fins 21a is gradually reduced.

FIG. 6 shows another modified example of the radiator, in which the radiator 22 described with reference to FIG. 1 is formed on the convex portion 3 formed by projecting the radiator 22 on the other surface 10b side of the metal plate 10. The radiator 22 is formed on the other surface 10b of the metal plate 10 itself. That is, the method of forming the radiator 20 on the convex portion 3 is the same as in the above-described example, and the description is omitted, and the method of forming the radiator 22 formed on the other surface 10b of the metal plate 10 will be described.

First, the shaving blade 13 is brought into contact with both side surfaces of the metal plate 10 on the other surface 10b side, and the other surface 1 of the metal plate 10 is contacted.
The pair of left and right shaving blades 13 is moved from left and right toward the center in parallel with 0b, and stopped at positions near both sides of the convex portion 3. As a result, the meat on the surface of the convex portion 3 is removed
, While being erected with a predetermined thickness and angle, the base ends of which are connected to the metal plate 10 to form a pair of left and right first radiating fins 22a.

Next, the second radiating fins 22a are formed on the traces shaved to form the first radiating fins 22a. That is, a pair of left and right shaving blades 13 are brought into contact with both side surfaces of the trace portion on the surface of the metal plate 10, the shaving blades 13 are moved from the left and right, and stopped at a position upstream from the first radiating fin 22a by a predetermined distance. As a result, the surface side of the metal plate 10 is raised by the shaving blade 13 while being shaved at a predetermined thickness and angle, and its base end is connected to the metal plate 10 to form a pair of left and right second radiating fins. 22a are formed. The height of the second radiating fins 22a becomes lower as the cutting allowance dimension is shorter.

The third and fourth radiation fins 22a are:
Similarly, the heat radiation fin 22a formed immediately before is formed sequentially on the traced portion which has been shaved. In this example as well, the height of the radiation fins 22a gradually decreases as the third, fourth, and fifth fins advance, but can be corrected as described above.

FIG. 7 shows still another modification of the radiator, in which a plurality of radiators 2 are provided on the other surface 10 b side of the metal plate 10.
0 and 23 are formed. That is, for example, the first convex portion (not shown in FIG. 7) described with reference to FIG. 3 is formed on the other surface 10b side of the metal plate 10 so as to protrude, and the radiation fin 20a is formed on the first convex portion. By forming a second convex portion (not shown in FIG. 7) protruding and forming a radiation fin 23a on the second convex portion, two radiators 20 are provided on the other surface 10b side of the metal plate 10. 23 are integrally formed. Note that the method of forming the radiators 20 and 23 on these convex portions is the same as in the above-described example, and a description thereof will be omitted. Thus, a plurality of radiators can be formed at appropriate positions.

FIGS. 8 to 10 show the other surface 1 of the metal plate 10.
The example which deform | transformed the radiation fin of the radiator formed in 0b side is shown. FIG. 8 shows that the radiation fins 24 are inclined at a predetermined angle with respect to each side of the convex portion 3 formed so as to protrude from the other surface 10 b of the metal plate 10. In order to form such a radiating fin 24, the shaving blade 14 is brought into contact with the side surface of the opposite corner of the convex portion 3, and the other surface 10 of the metal plate 10 is formed.
It moves toward the center in a state parallel to b, and stops just before the center. As a result, the flesh on the surface of the convex portion 3 stands up while being shaved by the shaving blade 14 from the convex portion 3 at a predetermined thickness and angle, and one base end thereof is connected to the vicinity of the other end of the convex portion 3. The radiation fins 24a of the eyes are formed. Thereafter, the plurality of heat dissipating fins 24 a
By erecting, the package 1 described above is
The radiator shown in FIG. 8 is formed.

FIG. 9 shows a configuration in which the radiating fins 25a of the radiator 25 are bent in an L-shape, and the tops of the radiating fins 25a are directed toward the center of the projection 3. As shown in the figure, the shaving blade 15 used here has a blade portion at the tip formed substantially at a right angle. Then, the pair of left and right shaving blades 15 is moved from the center of the opposing sides of the convex portion 3 toward the center, and is stopped near the center, thereby forming opposed arrow-shaped radiation fins 25a. Thereafter, a plurality of radiating fins 25a are formed upright in the same manner as in each of the above-described examples. further,
Similarly, a pair of left and right shaving blades 15 are moved from the center of the opposite sides of the convex portion 3 toward the center from the other two opposite sides of the convex portion 3a rotated by 90 degrees, and are successively repeated, so that the tops of the convex portions 3a are mutually positioned. L-shaped radiating fins 25a are formed so that they face each other toward the center of the convex portion 3.

In the above-described forming method, a pair of radiating fins 25a is formed by moving the pair of left and right shaving blades 15 toward the center of the convex portion 3, but as shown in FIG. The pair of shaving blades 15 may be moved toward the center of the convex portion 3 to form two pairs of radiating fins at the same time.

FIG. 10 shows a radiator 26 in which radiating fins are formed in a step shape. Sharpener 16 used here
As shown in the figure, the blade portion at the tip is formed in a step shape, and the pair of left and right shaving blades 16 are moved from the center of the opposite side of the convex portion 3 toward the center and stopped near the center. As a result, opposed stepwise radiation fins 26a are formed. After that, a plurality of heat radiation fins 26a are sequentially formed in the same manner as in the above-described respective examples. Furthermore, the convex part 3 rotated by 90 degrees
Similarly, from the other two opposite sides, a pair of left and right
Is moved from the center of the opposite side of the convex portion 3 to the center and is sequentially repeated, thereby forming a step-shaped heat radiation fin 26 in which the tops are directed toward the center of the convex portion 3.

The shaving blade 16 to be used first and then 90
Although the number of steps is different from that of the shaving blade 17 used in a state rotated by a degree, both can be made the same by setting the number of steps according to the size of the convex portion 3. As shown in the drawing, a pair of shaving blades 16 and another pair of shaving blades 1 are provided.
7 may be moved toward the center of the convex portion 3 to simultaneously form the entire heat radiation fin.

In the embodiment described above, a semiconductor integrated circuit is illustrated as an electronic component housed in the recess 2 of the package 1, but other electronic components such as a hybrid circuit, an inductor chip, or a register array may be used. Good. In addition, the shape of the radiator and the shape of the radiation fin
In addition to the examples disclosed in the respective embodiments, it is needless to say that the shape can be changed to an arbitrary shape such as a substantially arc shape or a polygonal shape. Fins may be formed. Furthermore, additional processing is performed on the radiation fins formed as described above,
It is also possible to divide the heat radiation fins at predetermined intervals, or to bend some of them to modify the structure to further enhance the heat radiation effect, and the present invention is not limited to these embodiments and deviates from the present invention. Various changes can be made without departing from the scope.

[0045]

As described above, in the package with a radiator according to the present invention, a plurality of erect packages are formed by pressing the recesses and shaving the projections formed on the other surface of the metal plate so as to be thin. Since the heat radiating fins are integrally formed, a high heat radiating effect can be obtained by the thin heat radiating fins. Furthermore, since the radiator is formed integrally with the package, since there is no intervening material between the two, the heat of the package can be directly transmitted to the radiator, and the heat radiation characteristics can be greatly improved. . Further, since a plurality of heat radiation fins are integrally formed by using the convex portion formed by pressing the concave portion as it is, the thickness and function required for the package are not affected. Furthermore, according to the method of forming a package with a radiator, a plurality of radiating fins are thinly shaved by a shaving blade on a protruding portion formed on the other surface side of a metal plate to be a package, so that a heat radiating effect is improved. Since good thin radiating fins can be easily formed, and the number, thickness and height of the radiating fins can be arbitrarily set, the radiating power required for the package can be arbitrarily set.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a package with a radiator according to the present invention.

FIG. 2 is a cross-sectional view showing a state in which electronic components are provided in a package with a radiator according to the present invention.

FIGS. 3A to 3G are process explanatory views showing a method for forming a package with a radiator according to the present invention; FIGS.

FIG. 4 is a perspective view showing the state of formation of FIG. 3 (G).

FIG. 5 is a perspective view showing another embodiment of the package with a radiator according to the present invention.

FIG. 6 is a perspective view showing still another embodiment of the package with a radiator according to the present invention.

FIG. 7 is a perspective view showing still another embodiment of the package with a radiator according to the present invention.

FIG. 8 is a plan view showing another embodiment of the radiation fins in the package with a radiator according to the present invention.

FIG. 9 is a plan view showing still another embodiment of the radiation fins in the package with a radiator according to the present invention.

FIG. 10 is a plan view showing still another embodiment of the radiation fins in the package with a radiator according to the present invention.

FIG. 11 is a cross-sectional view showing a modification of a pressing tool formed of a punch.

FIGS. 12A and 12B are cross-sectional views showing modified examples of the shaving blade.

FIG. 13 is a sectional view showing a conventional package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package 2 Concave part 3 Convex part 10 Metal plate 10a One surface 10b The other surface 13 Sharpening blade 20 Radiator 20a Radiating fin

Claims (4)

(57) [Claims] 1. A package for accommodating an electronic component in a recess formed on one surface of a metal plate, wherein the package is formed by pressing the recess to form a projection on the other surface of the metal plate. A plurality of radiating fins are integrally formed on the convex portion having a height corresponding to the depth by shaving the surface of the convex portion thinly almost in parallel with the other surface of the metal plate. Package with radiator. 2. A method for forming a package for accommodating an electronic component in a recess formed in a metal plate, comprising:
This package is on the other side of the metal plate by pressing the above depressions with presses form a recess which is shallower dimension than the thickness by a press or the like from one side of the metal plate having a predetermined plate thickness A concave portion forming step of protruding and forming a convex portion having a height corresponding to the depth of the concave portion, and shaving the surface side of the convex portion almost in parallel with the other surface of the metal plate with a sharpening blade, and shaping the base end portion. After leaving the radiating fins integrally formed by standing up at a predetermined angle, the surface side of the shaved portion is shaved thinly almost in parallel with the other surface of the metal plate, and erected at a predetermined angle while leaving the base end portion. A method for forming a package with a heat radiator, comprising at least a step of forming a plurality of radiating fins on a projecting portion formed on the other surface of the metal plate by repeating a step of integrally forming a radiating fin. 3. A recess having a predetermined shape, which is shallower than the thickness of the metal plate, is formed on one side of the metal plate by pressing, and a similar projection slightly smaller than the recess is formed on the other surface of the metal plate. , to claim 2 which is integrally formed a plurality of radiation fins standing by discouraging from the surface side to the thin to the projections
A method for forming the package with a radiator according to the above . 4. A pair of left and right shaving blades are moved from both side surfaces of a convex portion formed on the other surface side of the metal plate in a direction substantially parallel to the other surface of the metal plate toward the center of the convex portion so as to be thinned. claim 2 which is integrally formed a substantially radiating fins symmetrical than that
3. The method for forming a package with a radiator according to item 1 .