CN101257784B - Cooling device for information equipment - Google Patents
Cooling device for information equipment Download PDFInfo
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- CN101257784B CN101257784B CN200810080940.0A CN200810080940A CN101257784B CN 101257784 B CN101257784 B CN 101257784B CN 200810080940 A CN200810080940 A CN 200810080940A CN 101257784 B CN101257784 B CN 101257784B
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- fin
- refrigerant
- cooling device
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A cooling device for electronic equipment, comprises a heat receiving member composed of a base member thermally connected to a heat generating element, and a casing member, which are defined therebetween a closes space in which a coolant can flow, the base member is integrally incorporated with fins in a predetermined zone of its planar surface opposite to the heat generating element thermally connected to the base member, and the base member has a thickness which is thinner in the zone where the fins are formed than in the other zone where no fins are formed. With this configuration, the heat receiving member which can enhance the heat-exchanging performance of a liquid cooling system, can be manufactured at a low cost.
Description
Claim of priority
The application advocates Japan of proposing on March 2nd, 2007 priority of patent application JP2007-052169 number formerly, and introduces its full content in this application to do reference.
Technical field
The present invention relates to be equipped with the electronic equipment of semiconductor integrated circuit in inside such as personal computers, particularly for the performance that improves electronic equipment or improve reliability, the hot swapping of the cooling device of the heating of cooling semiconductor integrated circuit expeditiously.
Background technology
In electronic equipment in recent years, the CPU that is equipped with personal computer is the such high performance semiconductor integrated circuit of representative.Improve in the performance demands at electronic equipment, require this semiconductor integrated circuit high speed hastily, highly integrated, accompany therewith, caloric value also increases.Yet, when semiconductor integrated circuit is the temperature of regulation when above, not only can not keep the performance that semiconductor integrated circuit has, and in excessive heating, also can be destroyed.Therefore, necessity of cooling off of the useful any mode of the semiconductor integrated circuit of electronic equipment.
The general cooling means of the semiconductor integrated circuit of electronic equipment is for making heat sink (ヒ one ト シ Application Network) and semiconductor integrated circuit hot link, thus the air cooling mode of utilizing fan to make cooling air ventilate and cool off at heat sink.But, in this air cooling mode, and since corresponding with the rising of the heating temp of heater, cooling performance improved, carry the fan of big shape or high speed rotary, increase ventilation quantity.On the other hand, also there is variation in the purposes of electronic equipment, and the exploitation of the small-sized machine of movable-type is rapid.That is, the cooling device of the semiconductor integrated circuit of electronic equipment requires small-sized and high performance cooling device.Therefore in the cooling device of air cooling mode, present situation is the problem that can not solve noise, and the type of cooling that transmits the liquid cooling that improves cooling performance of the heat by cooling medium liquid begins noticeable.
In addition, in this liquid cooling mode, the essential cooling performance that improves, and realize miniaturization, this can improve the heat exchange performance based on refrigerant.That is, enlarge the amount of cooling medium liquid acceptance from the heat of heater, the amount that the heat that expansion is accepted from cooling medium liquid is dispelled the heat of making.
About this heat exchange performance, in order to improve the heat transference efficiency with the refrigerant of heat exchanger, the fin miniaturization is progressive.As the formation method of fin, in Japanese kokai publication sho 48-57242 communique, following method has been described, that is, utilize the surface of cutting tools with substrate, it is thick to cut thin-walled with fine spacing, forms the method for scraping of revolving of a plurality of thin fin on base material.In addition, in TOHKEMY 2001-326308 communique, illustrated and improved the technology of utilizing the radiating effect that revolves the fin of scraping method formation.
In addition, in TOHKEMY 2005-338715 communique, illustrated in the liquid cooling mode, as the cooling medium liquid stream of heating part, the technology that constitutes by the miniature fin of microfabrication.Following technology in the specific cooling at semiconductor device also has been described in TOHKEMY 2003-243590 communique, promptly, utilize edging processing etc., on the substrate of semiconductor device, form microchannels, improve thermal efficiency, in order to simplify the cooling back installation of cooling medium liquid by heating part, utilize the technology of heating part vaporizing refrigerant liquid.
In the heat exchanger of liquid cooling mode,, in above-mentioned prior art, there is the essential technical problem that solves in order to realize well behaved heating part cheap and small-sizedly.
On the heat exchanger shown in the Japanese kokai publication sho 48-57242 communique is surface at aluminum pipe, constitute the structure of the fin of cooling usefulness integratedly with revolving the method for scraping, be illustrated as the cheap processing method of heat exchange.But it is the structure that constitutes as the fin of air cooling mode, and the consideration of the technology that the stream as the heating part of liquid cooling mode is constituted is without any explanation.
In addition, the thermal component shown in the TOHKEMY 2001-326308 communique is for utilizing and the same method of scraping, the heat sink of integrally formed fin of revolving described in the Japanese kokai publication sho 48-57242 communique.For corresponding, illustrated that improving with the good copper of conductivity of heat is the method for the strength problem of material when making heat sink with the cooling of the big heater of the such caloric value of CPU.But this patent is for about revolving the technology that fin forms material of scraping, for as the performance-relevant fin shape of thermal conversion of the stream of the heating part of liquid cooling mode or the technical descriptioon of structure, same with Japanese kokai publication sho 48-57242 communique, not explanation.
In addition, cooling structure shown in the TOHKEMY 2005-338715 communique is used for the liquid cooling apparatus of the small-sized mirror of the light that reflection sends from the light source of liquid crystal projector porjection type Optical devices such as (プ ロ ジ エ Network タ) for cooling, in order in the circulation cavity of the cooling medium liquid of the sleeve pipe that is heated of the heat of accepting small-sized mirror, to enlarge and to guarantee the refrigerant contact area, utilize corrosion (エ Star チ Application グ) processing to wait the miniature fin that minuteness space is set.By in the heating part of the cooling device that makes the refrigerant circulation, miniature fin being set, can provide heat absorption efficiency the good sleeve pipe that is heated.Illustrated that also the circulation that must make refrigerant in the formation of miniature fin does not have the problem of obstacle and consideration processability etc., but the solution of concrete technology has not been described.
In addition, the cooling device shown in the TOHKEMY 2003-243590 communique forms microchannels for utilizing corrosion processing on the substrate of semiconductor device, reaches the hot linked reliability of semiconductor device and heating part.Because the silicon materials to this housing device carry out corrosion processing, the microfabrication of the property sheet spacing of loosing etc. is possible, but cooling device as the liquid cooling mode, the formation that is used to enlarge the height etc. of the fin that increases with the contact area of the refrigerant of circulation is difficult, has the high problem of cost of corrosion processing.
Summary of the invention
The present invention consider above-mentioned prior art cooling device heating part problem and propose, its objective is by forming fine fin cheaply, formation can improve the heating part of thermal conversion efficient of the heating part of liquid cooling mode, thereby high-performance is provided and can enlarges the cooling device for electronic equipments of the object that is cooled.
In order to solve prior art problems, the present invention constitutes following structures.
The present invention is a kind of cooling device, and it utilizes the heat of refrigerant to transmit the heater of cooling lift-launch in electronic equipment, and this cooling device comprises: utilize the heating part of refrigerant acceptance from the heat of heater; Emit the thermal component of the heat of accepting by refrigerant; And between heating part and thermal component, the pipeline component that refrigerant is set capable of circulationly, the structure of heating part is by forming the confined space that can carry out the circulation of refrigerant in inside with hot linked substrate parts of heater and housing parts, in substrate parts and the regulation zone hot linked opposite planar of heater, form the fin that is formed in the stream that makes refrigerant circulation in the confined space, its structure is to make the thickness of substrate parts in zone of formation fin of substrate parts than other basal part thin thickness that do not form fin.
In addition, the fin in that substrate parts forms on the recessed position that substrate parts is sunk to, cuts formation by revolving to scrape to process.
In addition, substrate parts at the stream both ends of the fin that is formed at substrate parts, from forming the thinner wall section height and position of gelled substrate parts, towards the heavy section height and position of substrate parts, constitutes the inclined plane.
In addition, substrate parts one or split ground engage and form, have when utilizing substrate parts to constitute heating part, push the pressing component of the upper end of fin, the size of fin pressing component width dimensions than fin on the length direction of the stream of fin is short, on the orthogonal direction of fin stream, it is long to form length than the fin row.
In addition, housing parts is provided with the inflow crossing of refrigerant at the upper surface of housing parts, on the top of fin, form length length about equally with row, the head that the refrigerant that flows into from this inflows crossing is circulated is set with the orthogonal direction of the stream of fin.
Adopt the present invention, can form heating part, the cooling device that can provide the electronic equipment that can cool off the heater that caloric value increases expeditiously to use according to the good structure of production performance.
Description of drawings
Fig. 1 is the structure chart of the heating part of cooling device of the present invention;
Fig. 2 constitutes the stereogram of the shape of the fin of stream and press section for expression;
Fig. 3 is the stereogram of expression along the shape of the press section under the situation that laterally makes opening;
Fig. 4 is the general configuration figure of the electronic equipment of lift-launch cooling device of the present invention.
Embodiment
Below, with reference to the description of drawings embodiments of the invention.
Fig. 4 is the general configuration figure of the electronic equipment of lift-launch cooling device of the present invention.In electronic equipment 1, be equipped with circuit substrate 2, power supply 10, HDD11 etc.The heater 3 that on this circuit substrate 2, has semiconductor element etc.
In addition, be equipped with the cooling device 4 that this heater 3 is cooled off.Cooling device 4 is by constituting with lower member.Heating part 5 and heater 3 hot links are by absorbing heat with the heat transmission at the refrigerant of internal circulation.Thermal component 6 passes through in radiating tube etc. by making cooling air, and the heat that refrigerant is absorbed is discarded to the outside of electronic equipment 1.Fluid storage tank 7 is stored the refrigerant of cooling device 1.Pump 8 circulates between heating part 5 and thermal component 6 and drives refrigerant.Pipeline 9 connects according to the mode that refrigerant is circulated between heating part 5, thermal component 6, fluid storage tank 7 and pump 8.
Here, electronic equipment 1 is not the particular machines of imagination.In addition, in this embodiment, describing as heater 3 with semiconductor element, but be not to only limit to semiconductor element, is the structure of cooling device 4 that also is suitable for the heating of corresponding HDD etc.
Below, describe the heating part 5 of cooling device 4 of the present invention in detail.
Fig. 1 is the general configuration figure of the heating part of cooling device of the present invention.The part of Fig. 1 is represented sectional view.Fig. 2 constitutes the fin of stream and the stereogram of press section shape for expression.
As shown in Figure 1, the structure of heating part 5 engages for making 52 two unit constructions of substrate parts 51 and housing parts, constitutes to make the confined space of refrigerant at internal circulation.In the present invention, substrate parts 51 as base material, but under the situation of the copper material that uses good thermal conduction etc., can further improve thermal conversion efficient with the aluminium material that has superiority from processability and cost viewpoint.
On central area 516a,, form the groups of fins 512 of minuteness space with the height (H) of regulation by based on revolving the cutting of scraping processing as the opposite face 516 at the back side of the hot joining face 513 of substrate parts 51.In addition, in order to make processing simple, be formed on the plane identical with flange portion 514 at the periphery 516b of the groups of fins 512 that forms on the substrate parts 51.Be elaborated later on, the formation zone of fin 512 forms, and is than the thin-walled (t) of the thin thickness of hot joining face 513, thinner than the thickness (T) of the peripheral part of base station 511.
Here, utilize the spacing of 512 groups of fin that machining forms to be about 0.1～1.0mm, the opposite face 516a of cutting base station 511 forms row, constitutes the stream of refrigerant at the wall of adjacent parallel fin 512.
On the other hand, for the fin 512 that cuts stream as refrigerant, the housing parts 52 that existing explanation engages with substrate parts 51.The tubular structure of housing parts 52 for utilizing planar portions 521 and side wall portion 522 to constitute, in the 516b portion of the opposite face 516 of the end face of side wall portion 522 and base station 511, do not leak ground and engage via the joint (not illustrating among the figure) of back-up ring or associated methods (not illustrating among the figure) such as bonding by having.
In order to form the stream that constitutes based on fin 512, relative with fin 512 on housing parts 52, by one or the other joint of (Fig. 2) is provided with the pressing component 525 of the upper end that covers fin 512.Because the height (H) of the fin 512 that cutting forms is processed to form by revolving to scrape, so certain deviation is arranged.In order to form the stream that refrigerant does not leak from the upper surface of fin 512, pressing component 525 constitutes, and pushes the upper end of fin 512, as carrying out clamping than height (H) little size (h).
In addition, because 512 groups of whole fin are constituted as stream, the fin row that the flat shape of pressing component 525 forms than fin 512 form big (W+) of length (W); In addition, smooth for the circulation that makes refrigerant as described later, form (L-) littler than the fin width dimensions (L) of fin 512.
In addition, in the planar portions 521 of housing parts 52, the inflow crossing 523 in that the center upper portion portion of fin 512 is provided with refrigerant on the end top of fin 512, is provided with the outflow crossing 524 of refrigerant.In addition, beyond the planar portions 521 of housing parts 52, it is also passable that outflow crossing 524 is located at sidewall 522.In addition, if necessary, then can be as shown in Figure 3, but flow into also landscape configuration of crossing 523.
At pressing component 525 places that housing parts 52 constitutes, has head 526, this head 526 makes from flowing into the refrigerant that crossing 523 flows into, stream is classified in formation with fin 512 entirely as, on the stream orthogonal direction of fin 512, have with the fin row and form length (W) length about equally, the diffusion refrigerant.In addition, the shape of the fin 512 that exists in the end has the problem of instability highly etc. because of the cause in the processing, and under the situation that is not suitable for using, the opening that head 526 only is set in the scope of the fin that hope is used is also passable.In this case, pressing component 525 promptly can for the size of the scope+α of the fin of hope use.
The shape of head 526, be substantially shaped as the space of cuboid, but according to 512 heat transfer state, make therefrom mind-set and the disconnected plane space that periphery has wedge shape, make refrigerant increase also passable to the through-current capacity of the big part of the caloric value of heater 3 from heater 3 to fin.
In addition, fin 512 sinks at base station 511 places to utilize to revolve to scrape and is processed to form, but by thinner wall section height and position 516a face, constitute around the fin 512 towards the inclined plane on the heavy section height and position 516b surface of substrate parts from the substrate parts that is formed with fin 512.
The circulation of refrigerant then, is described.
In cooling device shown in Figure 44, circulation drives refrigerant.By the heating part 5 of substrate parts 51 and housing parts 52 assemblings, as shown in Figure 1.Refrigerant circulates in heating part 5 as shown by arrows.
The refrigerant that circulation drives flows into crossing 523 from refrigerant, flows down from the substantial middle portion of fin width dimensions and fin row length, flows into the inside of heating part 5.Refrigerant is in the inside of heating part 5, the head 526 on the top by being configured in fin 512, with 512 of each fin as stream, in figure about circulation.At this moment, the hot linked hot joining of the heat utilization of heater 3 and 513 carry out heat and transmit is the state that conducts heat to fin 512, and the refrigerant that comes with circulation carries out heat transmission to be made it to be heated.
Here, owing to, wish to reduce the thickness of substrate parts, so be preferably the substrate parts of thin-walled in order to increase heat output to fin 512.Yet the substrate attenuate can cause undercapacity.Therefore, it is constituted, the zone that forms fin 512 is sunk, make thin-walled (t), peripheral part is made the wall thickness (T) that to guarantee intensity.
Here, fin 512 becomes the shape after substrate 513 cuttings of thin-walled (t), and this can work to strengthen substrate 513.In addition, also there is relation in the thickness of fin and the gap of fin with the intensity enhancing of substrate 513, wish that the thickness of fin is more than 0.5 times with respect to the fin gap.In addition, in order to conduct heat to refrigerant, as mentioned above,, increase surface area with refrigerant by forming based on the fin 512 that revolves the minuteness space of scraping processing and manufacturing from fin 512.
Here, because to sinking fin 512, the stream height of refrigerant is for only adding on the height (h) of fin the height after the degree of depth (T-t) after the fin sinking.Yet, because stream height (h) and narrow height that the refrigerant terminal part of fin 512 streams constitutes for the wall thickness 518b by pressing component 525 and base station 51 hinder the smooth circulation of refrigerant.
Therefore, the wall thickness 516b from the basic face 512a of fin 512 towards base station 511 forms the inclined plane, simultaneously, makes the path direction length of pressing component 525 littler than the flow path width length (L) of fin.Like this, the outflow direction that can make refrigerant can make refrigerant circulate on the top of fin 512 smooth-goingly.In addition, enough at the fin height, or with respect to L, can reduce fully under the situation of L-, it is also passable to omit above-mentioned inclined plane.
The refrigerant of circulation is migrated in the space that is formed by fin 512 and housing parts 522 in fin 512, flow out from the outflow crossing 524 of making at housing parts 522, make the thermal component 6 that utilization is connected by pipeline 9, the structure of conducting heat and dispelling the heat from refrigerant.In addition, utilize to make refrigerant flow down the structure of (flowing downward), can improve the heat-transfer character of fin 512 and refrigerant from the stream center upper portion portion of heating part 5.
As mentioned above, form stream, can increase contact area greatly with refrigerant by the fine fin that utilizes the high heat transfer material to cut into integratedly.Owing to make the circulation of refrigerant, circulate according to the mode that flows down to fin, can improve heat transfer to refrigerant.Also, can carry out expeditiously, change planes so can production performance realize high performance thermal change well from the heat transfer of heater to refrigerant owing to be the structure of substrate thickness that can attenuate fin bottom.
Claims (9)
1. cooling device that electronic equipment is used, it utilizes the heat of refrigerant to transmit cooling and carries heater in electronic equipment, it is characterized in that,
This cooling device comprises: utilize the heating part of described refrigerant acceptance from the heat of heater;
Emit the thermal component of the heat of accepting by described refrigerant; With
Between described heating part and described thermal component, the pipeline component that described refrigerant is set capable of circulationly,
The structure of described heating part is by forming the confined space that can carry out the circulation of refrigerant in inside with hot linked substrate parts of described heater and housing parts, regulation zone at the face of described substrate parts and the opposition side hot linked hot joining face of described heater, form the fin that is formed in the stream that makes the circulation of described refrigerant in the described confined space, its structure is to make the thickness of substrate parts in described regulation zone of the described fin of formation of described substrate parts than other basal part thin thickness that do not form fin.
2. the cooling device that electronic equipment as claimed in claim 1 is used is characterized in that:
The described fin that forms in the described regulation zone of described substrate parts cuts formation by revolving to scrape to process.
3. the cooling device that electronic equipment as claimed in claim 1 or 2 is used is characterized in that:
Described substrate parts at the stream both ends of the described fin that is formed at described substrate parts, from the thinner wall section height and position of the described substrate parts that is formed with described fin, towards the heavy section height and position of described substrate parts, constitutes the inclined plane.
4. the cooling device that electronic equipment as claimed in claim 1 or 2 is used is characterized in that:
Described housing parts one or split ground engage and form, have when utilizing described substrate parts to constitute heating part, push the pressing component of the upper end of fin, the size on the length direction of the stream of described fin of described fin pressing component, width dimensions than fin is short, the size on the orthogonal direction of described fin stream of described fin pressing component, it is long to form length than the fin row.
5. the cooling device of using as each described electronic equipment in the claim 1～4 is characterized in that:
Described housing parts, be provided with the inflow crossing of described refrigerant at the upper surface of housing parts, top at described fin, form length length about equally with fin row, the head that the described refrigerant that flows into from this inflows crossing is circulated is set with the orthogonal direction of the stream of described fin.
6. cooling device, its heat by refrigerant transmit cooling and carry heater in electronic equipment, it is characterized in that, comprising:
The hot thin space fin that is passed to described refrigerant with described heater generation;
The fin substrate, itself and described heater hot link form the component thickness in the zone of described thin space fin, and be thinner than the component thickness in the zone that does not form described thin space fin; With
Housing, it is connected with described fin substrate, forms the confined space of described refrigerant circulation usefulness.
7. cooling device as claimed in claim 6 is characterized in that:
Described fin substrate, the heavy section height and position from the thinner wall section height and position that forms gelled described substrate parts towards described substrate parts constitutes the inclined plane.
8. cooling device as claimed in claim 6 is characterized in that:
Described thin space fin, the mode according to making the refrigerant circulation disposes a plurality of fin abreast on one direction of described fin substrate,
Inflow head with refrigerant, this head has the space with the fin quadrature in the side opposite with the fin substrate of described thin space fin.
9. cooling device as claimed in claim 8 is characterized in that:
Refrigerant from described inflow head flows into circulates between the fin of described thin space fin in the mode of flowing downward, and discharges from the fin length direction of described thin space fin.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-052169 | 2007-03-02 | ||
| JP2007052169A JP4876975B2 (en) | 2007-03-02 | 2007-03-02 | Cooling device and heat receiving member for electronic equipment |
| JP2007052169 | 2007-03-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101257784A CN101257784A (en) | 2008-09-03 |
| CN101257784B true CN101257784B (en) | 2010-12-15 |
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ID=39740475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810080940.0A Expired - Fee Related CN101257784B (en) | 2007-03-02 | 2008-02-29 | Cooling device for information equipment |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20080216991A1 (en) |
| JP (1) | JP4876975B2 (en) |
| CN (1) | CN101257784B (en) |
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| JP5117287B2 (en) * | 2008-06-06 | 2013-01-16 | 株式会社日立製作所 | Electronic equipment cooling system |
| JP5994103B2 (en) * | 2011-09-22 | 2016-09-21 | パナソニックＩｐマネジメント株式会社 | COOLING DEVICE AND ELECTRIC CAR AND ELECTRONIC DEVICE EQUIPPED WITH THE SAME |
| JP5957686B2 (en) * | 2012-01-13 | 2016-07-27 | パナソニックＩｐマネジメント株式会社 | COOLING DEVICE AND ELECTRONIC DEVICE AND ELECTRIC CAR HAVING THE SAME |
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| JP6124742B2 (en) | 2013-09-05 | 2017-05-10 | 三菱電機株式会社 | Semiconductor device |
| JP6238800B2 (en) * | 2014-03-17 | 2017-11-29 | 株式会社フジクラ | Cooling structure |
| JP6394289B2 (en) | 2014-11-04 | 2018-09-26 | 富士通株式会社 | Evaporator, cooling device, and electronic equipment |
| CN105025691B (en) * | 2015-08-10 | 2018-03-06 | 苏州大景能源科技有限公司 | A kind of electronic installation, heat abstractor and its cooling means using liquid-cooling heat radiation |
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| JP2007003164A (en) * | 2005-06-27 | 2007-01-11 | Nakamura Mfg Co Ltd | Tabular heat pipe or vapor chamber, and its forming method |
| US7900692B2 (en) * | 2005-10-28 | 2011-03-08 | Nakamura Seisakusho Kabushikigaisha | Component package having heat exchanger |
| JP4962836B2 (en) * | 2006-01-10 | 2012-06-27 | 中村製作所株式会社 | Electronic component package with cooling section and method for forming the same |
| US7537047B2 (en) * | 2006-03-23 | 2009-05-26 | Foxconn Technology Co., Ltd. | Liquid-cooling heat sink |
| US7731079B2 (en) * | 2008-06-20 | 2010-06-08 | International Business Machines Corporation | Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled |
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- 2007-03-02 JP JP2007052169A patent/JP4876975B2/en not_active Expired - Fee Related
-
2008
- 2008-02-29 US US12/039,962 patent/US20080216991A1/en not_active Abandoned
- 2008-02-29 CN CN200810080940.0A patent/CN101257784B/en not_active Expired - Fee Related
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| EP0577099B1 (en) * | 1992-07-03 | 1998-02-04 | Hitachi, Ltd. | Cooling apparatus for electronic elements |
| US6351382B1 (en) * | 1999-03-25 | 2002-02-26 | International Business Machines Corporation | Cooling method and device for notebook personal computer |
| CN1591849A (en) * | 2003-09-03 | 2005-03-09 | 株式会社日立制作所 | Electronic apparatus |
| CN1853269A (en) * | 2003-10-30 | 2006-10-25 | 富士通株式会社 | Cooling device and electronic device |
| CN1658122A (en) * | 2004-02-16 | 2005-08-24 | 株式会社日立制作所 | Cooling system for electronic apparatus, and electronic apparatus using the same |
| CN1841265A (en) * | 2005-04-01 | 2006-10-04 | 株式会社日立制作所 | Cooling jacket |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4876975B2 (en) | 2012-02-15 |
| CN101257784A (en) | 2008-09-03 |
| US20080216991A1 (en) | 2008-09-11 |
| JP2008218589A (en) | 2008-09-18 |
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