CN201156534Y - Flat shape electronic chip radiator - Google Patents

Flat shape electronic chip radiator Download PDF

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Publication number
CN201156534Y
CN201156534Y CNU2007201720876U CN200720172087U CN201156534Y CN 201156534 Y CN201156534 Y CN 201156534Y CN U2007201720876 U CNU2007201720876 U CN U2007201720876U CN 200720172087 U CN200720172087 U CN 200720172087U CN 201156534 Y CN201156534 Y CN 201156534Y
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heat
impeller
fin
cross
heat pipe
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秦彪
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Abstract

The utility model provides a flat-shaped radiator for electronic chip which is especially suitable for notebook computer. In the utility model, a condensation section of a thermotube (2) is bent to the arc shape for enabling the air convection and heat exchange expanding surface (4) (i.e. the rib) to surround and directly face an impeller (3), thus a wind cover is omitted and the corresponding occupied space and cost are omitted. The utility model introduces the structure of air intensified convection and heat transfer, increases the convective heat transfer coefficient of rib, further decreases the dimensions of rib, and consequently enables the structure of the radiator to be greatly compacted. A cooling plate (1) locates close to the impeller (3), thereby reducing the distance between the evaporation section and the condense section of the thermotube (2) and further increasing the heat radiation. The radiator of being light and thin as well as smaller can enable CPU to be randomly placed on the motherboard, the air discharged to be utilized again, the heat in the chassis to be discharged, thereby effectively solving the heat radiation problem of notebook computer.

Description

A kind of flat shape electronic chip radiator
Affiliated technical field
The utility model relates to the device of dissipation from electronic devices, and particularly profile is flat, and adopting has heat pipe and centrifugal fan, is mainly used in portable type electronic product, as the heat radiation of the electronic chip in the notebook computer.
Background technology
The thickness of notebook computer is more and more thinner, and the caloric value in the computer is increasing, and particularly the caloric value of central processing unit chip CPU and image processor chip GPU significantly increases.Heat radiation has become the bottleneck that the notebook computer performance improves development, and the volume of radiator has accounted for sizable space in the notebook computer, and notebook computer thickness reduces, and is subjected to the restriction of heat sink thickness size.Reducing heat sink size, reduce its shared useful space, make it compacter, and effectively improve computer integral heat sink amount and weight reduction, is one of key of further developing of notebook computer.
The structure of the radiator of using in the existing notebook computer is: the centrifugal fan of being furnished with fan housing, the general scroll casing type fan housing that adopts, constitute and concentrate air outlet, the cross-ventilation expansion heat-transfer surface of radiator (all adopts the rib-type structure, be called for short fin), just be arranged on air outlet, all adopt heat pipe usually, on the fin of the heat delivered that the CPU on the mainboard is produced to the air outlet.Such structural configuration is influenced by industrial air heat exchanger and existing other civil electric appliance product designs deeply, considers the flat requirement in the notebook again.Such radiator problem has: air outlet all is located at the side of casing, if blocked, heat just can not loose; Through the air process fin of fans drive, directly discharge, further be not utilized.The scroll casing type fan housing occupies most of space of fan, and be vacant, its effect only is the air conducting diffusion, takes up space in order to reduce fan housing, and increases air outlet width (to increase the fin spread length), fan housing and off-gauge scroll casing shape, thereby in the process of air diversed diffusion in fan housing, eddy current loss is very big, will reduce air mass flow, and air outlet place air flows skewness, this is all unfavorable to dispelling the heat.
Because be subjected to the restriction of cabling requirement, there is requirement the position of CPU on mainboard, can not be arranged on leaning on the arm of angle of mainboard, should to the CPU position one segment distance be arranged from the fin on the air outlet like this in the centre position.For heat pipe, because the restriction of the siphon power of heat pipe inner capillary tube structure, intraductal working medium liquid return speed is limited, i.e. heat transmission is limited, and the distance between evaporation section and the condensation segment is big more, and heat delivered is low more.For some radiator, because the restriction of CPU position and heat sink location, and the restriction of heat pipe bending radius, fin can not directly be welded on the heat pipe, and this has not only increased heat conducting pilot process (being thermal resistance), and technology manufacturing requirement and cost have also increased.
Summary of the invention
For overcoming above problem, the utility model is provided with the position by changing cross-ventilation expansion heat-transfer surface, can save the fan housing of fan, has saved that shared space and the fan housing material of water conservancy diversion diffusion takes up space, weight and cost; Fan can reduce the distance between (or saving) heat pipe condenser section and the evaporation section near electronic chip (CPU).Introduce the augmentation of heat transfer structure, further reduce the size of cross-ventilation expansion heat-transfer surface, reasonably optimizing structure more makes that radiator is not only simple in structure, cost is low, in light weight, and size is littler, more compact structure, and heat dissipation capacity will be higher.
The technical solution of the utility model is: radiator mainly constitutes and includes: coldplate, heat pipe, cross-ventilation expansion heat-transfer surface and fan; Fan is centrifugal, and impeller and motor are wherein arranged; The evaporation section of heat pipe is on coldplate, and coldplate has a burnishing surface, will be close on the radiating surface of the electronic chip that is cooled, and radiator integral is flat.Feature of the present utility model is: cross-ventilation expansion heat-transfer surface has adopted rib-type or pin pole structure, directly welds or be bonded on the condensation segment of heat pipe; The condensation segment of heat pipe bends to circular arc, and the cross-ventilation expansion heat-transfer surface on this circular arc condensation segment faces the impeller air outlet round the impeller of fan; Round the cross-ventilation of impeller expansion heat-transfer surface, to form by one section or several sections, each section radian sum is greater than 180 °.
The cross-ventilation expansion heat-transfer surface of rib-type structure is most widely used general, it is the most effective a kind of increase heat-transfer surface, reduce the air heat exchanger size, make it compact structure, as the air heat exchanger in the air-conditioning (condenser and evaporator), and all adopt the rib-type structure in the industrial large-sized air heat exchanger, also adopt this structure in the existing cpu heat.The pin pole structure, because manufacturing process cost problem, use wideless, but the pin pole structure itself has the augmentation of heat transfer characteristics, its cross-ventilation heat exchange coefficient is more than two times of continuous face fin, and at the applied field of the utility model, the heat sink size compact is very important, adopt the cross-ventilation expansion heat-transfer surface of pin pole structure in the utility model, will reduce shared area of radiator and space effectively.
Cross-ventilation expansion heat-transfer surface directly welds or is bonded on the condensation segment of heat pipe, has comprised by arts demand accompanying pad between the two that the existence of this pad does not increase heat transfer resistance between the two.Directly welding or bonding has deducted middle diabatic process (being thermal resistance), has also deducted material cost and technology cost.Contact heat resistance between the two can be effectively eliminated in welding, generally adopts soldering (tin soldering), but there is the danger of high-temperature heat pipe blast in the welding temperature height.The technique for sticking temperature is low, no explosion hazard, but the viscose glue that adopts must the thermal conductivity height, and contact area between the two is big as far as possible, compress bondingly, reduces gap between the two.For the pin pole structure, should not adopt technique for sticking.
The whole border of centrifugal fan impeller is an air outlet, during wheel rotation, flow out equably air border outside impeller is whole, the condensation segment of heat pipe bends to circular arc, round impeller, make cross-ventilation expansion heat-transfer surface face the impeller air outlet, and should leave as far as possible little gap with impeller outer edge, such structural configuration, the advantage of bringing has:
One, flows through round the even air of the cross-ventilation of impeller expansion heat-transfer surface the influence that is not subjected to some position opening of impeller border (as cross-ventilation expansion heat-transfer surface is not set) or is stopped up.Two, increase the length that cross-ventilation expansion heat-transfer surface is set, can reduce the flow through speed of cross-ventilation expansion heat-transfer surface of air, reduced air flow resistance, increased air mass flow.Three, do not have fan housing,, can directly not discharge casing, can utilize again, be used to cool off other device, the heat in the casing is taken out of from the air that radiator is discharged.Four, fan can be near the electronic chip that is cooled, coldplate is near fan like this, shortened the distance between heat pipe condenser section and the evaporation section widely, can eliminate the adiabatic changeover portion between condensation segment and the evaporation section, thereby the raising of the heat delivered of heat pipe, under equal heat delivered required, heat pipe diameter or quantity can reduce, not only reduce cost, also deducted shared space and the weight of heat pipe.Five, also be the most significant: can save the fan housing of fan, save shared space, weight and the cost of the material thickness of fan housing own, save the space of the water conservancy diversion diffusion in the fan housing, and the loss of the air flows in the water conservancy diversion diffusion.
The only remaining impeller of air heat exchanging part in the radiator, motor and cross-ventilation expansion heat-transfer surface, there have not been the parts that can save again, the gap of leaving between impeller and the cross-ventilation expansion heat-transfer surface is that process structure is necessary, prevent that impeller from being collided and pressing from both sides extremely, never again the space that can save.More than explanation: cross-ventilation expansion heat-transfer surface is round the structural configuration of blast fan, it has been compact structure, want further to reduce size, can only on expanding the concrete structure of heat-transfer surface and these two parts of fan, cross-ventilation take measures, as adopt and strengthen the convective heat transfer structure, improve convection transfer rate, reduce heat exchange area, promptly reduce the size of cross-ventilation expansion heat-transfer surface; And for example strengthen fin density, not only unit space has increased heat exchange area, also helps the raising convection transfer rate; According to the air force principle, optimize impeller design, improve wheel speed, can reduce impeller diameter or thickness, just can reduce radiator area occupied or thickness.
A fan can be furnished with one or several heat pipe, corresponding coldplate also can have number a plurality of, thereby expand heat-transfer surface round the cross-ventilation of impeller and can form by one section or several sections, be meant the fan-shaped angle of circular arc cross-ventilation expansion heat-transfer surface correspondence round the radian of impeller, the utility model require each section round the radian sum of impeller greater than 180 °, show and effectively to utilize air outlet place, impeller border, cross-ventilation expansion heat-transfer surface is set, reduce vacant area (space).
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the view of the schematic characteristic structure of a kind of back side of the present utility model (back side of the burnishing surface of coldplate) direction.
Fig. 2 is the feature structure schematic diagram that Fig. 1 passes a cross section of fan axis, also is the characteristic cross-section schematic diagram of the cross-ventilation heat exchanging part in the utility model.
Fig. 3 is the feature structure generalized section of the cross-ventilation heat exchanging part in a kind of the utility model, and circuit board is a sidewall of fan, and has air inlet.
Fig. 4 is the feature structure generalized section of the cross-ventilation heat exchanging part in a kind of the utility model, and fan is fixed on the circuit board.
Fig. 5 is the feature structure generalized section of the cross-ventilation heat exchanging part in a kind of the utility model, and fan is the bilateral air inlet.
Fig. 6 is the view of the schematic characteristic structure of a kind of back side of the present utility model direction, and a coldplate is furnished with two fans.
Fig. 7 is the view of the schematic characteristic structure of a kind of back side of the present utility model direction, and two coldplates are only joined a fan.
Fig. 8 is the view of the schematic characteristic structure of a kind of back side of the present utility model direction, and a plurality of coldplates are arranged, and is furnished with a plurality of fans.
Fig. 9 is impeller and the fin local feature structural representation in a kind of the utility model, and fin tilts along the rotation direction of impeller.
Figure 10 is impeller and the fin local feature structural representation in a kind of the utility model, the air intake leading edge of fin anti-the rotation direction bending of impeller.
Figure 11 is impeller and the fin local feature structural representation in a kind of the utility model, and fin has adopted shutter short rib shape structure, the air intake leading edge of fin anti-the rotation direction bending of impeller.
Figure 12 is a nest plate type fin feature structure schematic diagram.
Figure 13 is corrugated fin feature structure schematic diagram.
Figure 14 is stacked fin feature structure schematic diagram.
Figure 15 is the feature profile schematic diagram of fork row short rib shape augmentation of heat transfer structure.
Figure 16 is the feature profile schematic diagram of shutter short rib shape augmentation of heat transfer structure.
Among the figure: 1, coldplate, 2, heat pipe, 3, impeller, 4, cross-ventilation expansion heat-transfer surface, 5, motor, 6, the expression air flows, 7, circuit board, 8, fixed disk, 9, fin, 10, expression wheel rotation direction, 11, the location flanging, 12, the collar aperture flange.
Fig. 1 shows global feature structure of the present utility model, and the motor (5) of cross-ventilation expansion heat-transfer surface (4) and fan does not show in the figure.Heat pipe (2) round impeller (3) is a homogeneous tube, and two ends are evaporation sections, on coldplate (1).Usually the method that adopts welding or inlay is connected the evaporation section of heat pipe with coldplate, purpose is the contact heat resistance problem that solves between the two; Coldplate (1) nestles up impeller (3), shortened the distance between heat pipe evaporator section and the condensation segment so effectively, because the heat pipe bending radius is restricted, the heat pipe that is bent to circular arc can not be whole (promptly 360 °) round impeller, that is to say the cross-ventilation expansion heat-transfer surface of circular arc can not 360 ° of ground round impeller, by near coldplate (1) position opening is arranged, as shown in Figure 1, one end of heat pipe (2) is straight reaching on the coldplate (1), the other end bends on the coldplate (1), between opening is arranged.But cross-ventilation expansion heat-transfer surface can also be set on the heat pipe of stretching in the coldplate (1), make full use of each section on the heat pipe, eliminate the adiabatic section between condensation segment and the evaporation section, help the heat transfer of heat pipe.
Fig. 2 show by fan and heat pipe with and on the feature structure of the cross-ventilation heat exchanging part formed of cross-ventilation expansion heat-transfer surface, fan is centrifugal, axial admission, radially flow out, include impeller (3) and motor (5), the excircle of impeller (3) is an air outlet, and cross-ventilation expansion heat-transfer surface (4) faces the air outlet of impeller (3), directly enters cross-ventilation expansion heat-transfer surface (4) through impeller (3) driven air.For reducing outer garden size round the cross-ventilation expansion heat-transfer surface (4) of impeller (3), be and reduce the radiator area occupied, the gap is as far as possible little between impeller (3) and the cross-ventilation expansion heat-transfer surface (4), but must guarantee that impeller (3) can not run into cross-ventilation and expand heat-transfer surface (4) and heat pipe (2).In order to prevent directly to be back to fan air intake from the air that radiator is discharged, reduce heat dissipation capacity, can utilize the circuit board (pcb board) at the electronic chip place that is cooled, with circuit board (7) or be fixed on device on the circuit board (7) as a sidewall of fan, and offer air inlet, as shown in Figure 3, can effectively air inlet and exhaust be separated like this, can reduce fan thickness again.Being applied to notebook is on the computer, and the air that can also utilize radiator to discharge once more cools off other element, and the heat in the casing is taken out of.
The motor of fan (5) is because of the running of need long-time continuous, sometimes also need the ultrahigh speed running, bearing life in the motor (5) is limited, and by coldplate (1) and heat pipe (2) with and on the fixedly all-in-one-piece heat-transferring assembly formed of cross-ventilation expansion heat-transfer surface (4) do not have movement parts, the life-span is long.Maintenance and replacing for the ease of fan (motor (5)+impeller (3)), can fan and heat-transferring assembly is separately fixing, fan is fixed on the circuit board at electronic chip place, as shown in Figure 4, the motor of fan (5) directly is fixed on the circuit board (7), directly dismounting of fan, and need not move heat-transferring assembly.
For improving heat dissipation capacity, the height of thickening impeller, promptly increase air quantity, increased the height (promptly having increased heat exchange area) of cross-ventilation expansion heat-transfer surface again, when the total height of cross-ventilation expansion heat-transfer surface reaches more than ten millimeter, just cross-ventilation should be expanded heat-transfer surface and be divided into two partly, be separately positioned on heat pipe (2) condensation segment two back to the side on, as shown in Figure 5, the root (promptly by the heat pipe place) that can shorten cross-ventilation expansion heat-transfer surface like this is to the distance of the heat conduction between its top (it is long to be commonly referred to rib height or rib), promptly effectively improve the fin efficiency of cross-ventilation expansion heat-transfer surface, help improving heat dissipation capacity.In Fig. 5, fan also is fixed on the circuit board (7), and the motor of fan (5) is fixed on the circuit board (7) by fixed disk (8), and fan can directly be gone up dismounting from circuit board (7); The fan air inlet is the bilateral air inlet, and the air inlet of a side on fixed disk (8) enters from a side of circuit board (7), refluxes from the opposite side air inlet in order to prevent exhaust, this side-inlet should be directly adjacent to the air inlet of casing.For notebook computer, can consider to offer air inlet at lower casing, this side-inlet is directly faced toward the air inlet of lower casing.The air inlet of fan bilateral can reduce the air inlet flow losses, improves air quantity, and reliability also improves, in case a side-inlet is blocked, fan also has air inlet, and radiator can also work.
In order to reduce the thickness of radiator, improve the ventilation area of cross-ventilation expansion heat-transfer surface, reduce air flow resistance, heat pipe (2) should be selected the flat pipe for use, when especially heat pipe (2) was single, the heat pipe that is adopted among Fig. 2,3,4 (2) was single flat heat pipe.Also can adopt many heat pipes placed side by side, as shown in Figure 5, adopt two heat pipes.Adopt the advantage of many heat pipes to have: the diameter of single heat pipe (or equivalent diameter) is little, thereby the bending radius that heat pipe is allowed is also just little, is convenient to the design of radiator integral densification.Certainly the cost of many heat pipes wants height a bit.
By increase impeller (3) and round the heat pipe (2) of impeller (3) with and on the diameter of cross-ventilation expansion heat-transfer surface (4) improve the heat dissipation capacity of radiator, it or not extraordinary way, because this will increase liquid refrigerant in the heat pipe is back to evaporation section from condensation segment average distance, be unfavorable for the heat delivered in the heat pipe, the diameter of impeller (3) should not be above 60 millimeters; Increase fan thickness (being the thickness of impeller), with the height (being the heat exchange area of cross-ventilation expansion heat-transfer surface) of cross-ventilation expansion heat-transfer surface, realize that heat dissipation capacity improves, this will increase the thickness of radiator again, pursue thin thickness for notebook computer, very unfavorable.Can be by increasing number of fans, the method that adopts a coldplate (1) to be furnished with two or more fans (impeller (3)) solves and should improve heat dissipation capacity, can not increase the contradiction of thickness again, as shown in Figure 6, coldplate (1) is furnished with two impellers (3) (fan), and the heat pipe (2) that also shown is round each impeller (3) is divided into two sections, design is in order to shorten the length of single heat pipe like this, because the heat pipe that diameter is tiny, length are long more, it is big more to make difficulty of processing.
For on a circuit board, the situation that has the chip of two or more vicinities to cool off, can adopt such way: a fan has (bearing) two or more coldplates, and as shown in Figure 7, impeller (3) has two coldplates (1).In the radiator shown in Figure 8, three impellers (3) and three coldplates (1) are arranged, one of them coldplate is bigger, and three impellers (3) are all being born big coldplate (1) together, has two also bearing a little coldplate (1) respectively separately in these three impellers (3).Such radiator can be applied in the powerful notebook computer, big coldplate (1) is born the heat radiation of central processing element (CPU), two heat radiations of bearing picture processing chip (GPU) in little, another little coldplate (1) is born the north bridge chips heat radiation.
Because each chip size differs, chip of the same race is installed difference, the height and the depth of parallelism of each chip on the same circuit board are inconsistent, and radiator processing and manufacturing error, be adjacent to compression fit for guaranteeing coldplate and chip, the gap is little, for the radiator of a plurality of coldplates of fan belt, expand the heat-transferring assembly that heat-transfer surface is formed by coldplate and heat pipe and the cross-ventilation on this heat pipe on it, take to separate fixing method with other heat-transferring assembly.
The cross-ventilation expansion heat-transfer surface of rib-type structure is most widely used, and with this structure of first-selection, the cross-ventilation of this structure expansion heat-transfer surface will be called for short fin in the utility model.Air outlet in impeller (3), i.e. the excircle of impeller, air flows out impeller circumferential speed and radial velocity.The blade profile difference of impeller, circumferential speed and radial velocity distribute also just different, forward direction type impeller, the circumferential speed height, the circumferential speed of backward type is low, radial mode placed in the middle.No matter which kind of blade profile all has circumferential speed, and turning to of direction and impeller is consistent.If the fin that impeller air outlet place is provided with radially is radiation and arranges, the direction of air of fin air intake leading edge and outflow impeller has an angle, is referred to as the angle of attack in the aerodynamics usually.The angle of attack is big more, and the flow through flow losses (resistance) of fin of air are also just big more, and this will reduce air mass flow, be unfavorable for heat radiation.In order to reduce the angle of attack, the fin (9) round impeller (3) can be tilted along impeller (3) rotation direction, as shown in Figure 9, so just can reduce the angle of attack.Can also adopt following method: will round the air intake leading edge of the fin (9) of impeller (3) anti-the crooked or bending of impeller (3) rotation direction.As shown in figure 10, fin (9) is bent, and the flow channel of forming between the fin (9) is exactly a diffusion flow-guiding channel, and fin this moment (9) not only plays a part the cross-ventilation heat exchange, or air deflector, plays a part the water conservancy diversion diffusion.The pin pole structure does not have direction, the angle of attack in air-flow.
Nest plate type fin and corrugated fin generally adopt in existing air heat-exchanging device, also will be adopted by the utility model.The hole that the band flange is arranged in the nest plate type fin, heat pipe just inserts this hole, this flange is also referred to as the collar aperture flange, as shown in figure 12, the heat of heat pipe (2) passes on the fin (9) from collar aperture flange (12) and heat pipe (2) transmission of heat by contact exactly, solve and eliminate contact heat resistance problem herein, the most reliable and effective method is welding, generally is soldering (soldering).Even in order to guarantee the pitch of fins between the fin, the production efficiency height is processed with location flanging (11) on the both sides of nest plate type fin.Adopt the nest plate type fin, two of heat pipe (2) be provided with cross-ventilation expansion heat-transfer surface (4) naturally, shown in similar Figure 15 back to the side.Fin shown in Figure 13 (9) is exactly corrugated fin, fin (9) adopts continuous strip material to be processed into similar corrugated, the general welding procedure that adopts, corrugated fin is fixed on the heat pipe (2), this is because fin (9) and heat pipe (2) contact area are little, and the employing technique for sticking can not guarantee to solve the contact heat resistance problem between fin (9) and the heat pipe (2).
Figure 14 shows a kind of stacked fin, is flanging at the root of fin (9), and this flanging is close to heat pipe (2), and the heat of heat pipe (2) is exactly by transmission of heat by contact between this flanging and the heat pipe (2), passes on the fin (9).Because the flanging of the fin of this structure is big with the contact area of heat pipe, and guarantees easily that flanging is compacted and be attached on the heat pipe (2), thereby except that welding procedure, can also adopt technique for sticking, the contact heat resistance problem between solution fin (9) and the heat pipe (2).In order to guarantee that a pitch of fins is even between the fin, the production efficiency height is on the root flanging of stacked fin and be processed with location flanging (11) on the top flap, as shown in Figure 14.
In order to reduce the volume size of fin, go up employing at fin (9) and strengthen the cross-ventilation heat transfer structure, Figure 15,16 shows short rib shape augmentation of heat transfer structure, Figure 15 is fork row short rib shape, Figure 16 is the shutter short rib shape, their essential characteristic is: the surface that air is flowed through is die-cut into a section discontinuous surface, air whenever flow through one section (short rib), boundary layer on it all is in the The initial segment in boundary layer, makes whole heat convection surface make full use of the favourable characteristics that the boundary layer The initial segment is thin, thermal resistance is little, heat exchange coefficient is high.When shutter short rib shape fin is set on the heat pipe of impeller, note the direction of the short rib bending of shutter, the air intake leading edge should be anti-the direction bending of wheel rotation, as shown in figure 11.
According to thermal conduction study, the cross-ventilation heat exchange coefficient roughly is inversely proportional to a pitch of fins, that is to say that reducing a pitch of fins not only can increase fin quantity, and promptly heat exchange area can also greatly improve the cross-ventilation heat exchange coefficient.A best pitch of fins should be lower than 1 millimeter, but also will consider other factors in actual design.For the continuous-surface shape fin, a pitch of fins should be not more than 1.5 millimeters, considers production technology, and the hazards of dust gathering pollution, and a pitch of fins should be less than 0.7 millimeter.For the fin that has adopted short rib shape augmentation of heat transfer structure, a pitch of fins should be not less than 0.7 millimeter, is not more than 2.0 millimeters, and the width of short rib is in 2.0 millimeter.In the utility model, fin is arranged on the circular arc heat pipe, pitch of fins import department between the fin is little, and the exit is big, thereby an above-mentioned pitch of fins should be an average pitch of fins, consider that pitch of fins import and export are inconsistent, the width of fin (being the fin radial dimension) is big more, and import and export pitch of fins difference is big more, considers that also radiator should be compact small and exquisite, impeller diameter should not be too big, and the fin width should be not more than 10 millimeters.

Claims (10)

1, a kind of flat shape electronic chip radiator that is used for the cool electronic chip, include: coldplate (1), heat pipe (2), cross-ventilation expansion heat-transfer surface (4) and fan, fan is centrifugal, comprising impeller (3) and motor (5), the evaporation section of heat pipe (2) is on coldplate (1), coldplate (1) has burnishing surface, radiator integral is flat, it is characterized in that: cross-ventilation expansion heat-transfer surface (4) has adopted rib-type or pin pole structure, directly welds or be bonded on the condensation segment of heat pipe (2); The condensation segment of heat pipe (2) bends to circular arc, and the cross-ventilation expansion heat-transfer surface (4) on this circular arc condensation segment faces the air outlet of impeller (3) round the impeller (3) of fan; Form by one section or several sections round the cross-ventilation of impeller (3) expansion heat-transfer surface (4), each section cross-ventilation expansion heat-transfer surface (4) round the radian sum of impeller (3) greater than 180 °.
2, radiator according to claim 1 is characterized in that: circuit board at electronic chip place (7) or the device that is fixed on this circuit board are a sidewall of fan, and have air inlet.
3, radiator according to claim 2 is characterized in that: fan is the bilateral air inlet.
4, radiator according to claim 1 is characterized in that: a fan has the heat-transferring assembly that two or more are made up of the expansion heat-transfer surface of the cross-ventilation on coldplate (1) and the heat pipe on it (2) and this heat pipe (4).
5, radiator according to claim 1 is characterized in that: a coldplate (1) is furnished with two or more fans.
6, radiator according to claim 1 is characterized in that: heat pipe (2) is single flat heat pipe, or many heat pipes side by side; The condensation segment of heat pipe (2) two back to the side all be provided with cross-ventilation expansion heat-transfer surface (4).
7, radiator according to claim 1 is characterized in that: the cross-ventilation expansion heat-transfer surface (4) of rib-type structure has adopted the nest plate type structure, or laminated structure, or corrugated structure; On nest plate type and stacked fin (9), location flanging (11) is arranged.
8, radiator according to claim 7 is characterized in that: fin (9) has adopted fork row short rib shape or shutter short rib shape enhanced heat exchange structure.
9, radiator according to claim 7 is characterized in that: the fin (9) round impeller (3) tilts along the rotation direction of impeller (3); Or round the air intake leading edge of the fin (9) of impeller (3) anti-the crooked or bending of rotation direction of impeller (3).
10, according to claim 7 or 8 or 9 described radiators, it is characterized in that: the average pitch of fins of fin (9), the fin for the short rib shape structure is not more than 2.0mm, and the fin for continuous-surface shape is not more than 1.5mm; The width of fin (9) is not more than 10mm.
CNU2007201720876U 2007-09-29 2007-09-29 Flat shape electronic chip radiator Expired - Fee Related CN201156534Y (en)

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CN107085456A (en) * 2017-06-26 2017-08-22 华北电力大学(保定) A kind of Novel bladeless fan radiator for high-performance CPU
CN109855580A (en) * 2019-01-17 2019-06-07 北京地平线机器人技术研发有限公司 Structural failure determines method and apparatus
CN113026864A (en) * 2021-04-21 2021-06-25 常州大学 Condensing type water making device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104813760A (en) * 2014-03-18 2015-07-29 华为终端有限公司 Heat radiation assembly and electric device
CN104813760B (en) * 2014-03-18 2018-02-02 华为终端(东莞)有限公司 A kind of radiating subassembly and electronic equipment
US10103087B2 (en) 2014-03-18 2018-10-16 Huawei Device (Dongguan) Co., Ltd. Heat dissipation assembly and electronic device
US10497641B2 (en) 2014-03-18 2019-12-03 Huawei Device Co., Ltd. Heat dissipation assembly and electronic device
CN107085456A (en) * 2017-06-26 2017-08-22 华北电力大学(保定) A kind of Novel bladeless fan radiator for high-performance CPU
CN109855580A (en) * 2019-01-17 2019-06-07 北京地平线机器人技术研发有限公司 Structural failure determines method and apparatus
CN113026864A (en) * 2021-04-21 2021-06-25 常州大学 Condensing type water making device

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