CN101290531B - Portable computer - Google Patents
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- CN101290531B CN101290531B CN 200810067795 CN200810067795A CN101290531B CN 101290531 B CN101290531 B CN 101290531B CN 200810067795 CN200810067795 CN 200810067795 CN 200810067795 A CN200810067795 A CN 200810067795A CN 101290531 B CN101290531 B CN 101290531B
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Abstract
The invention provides a portable computer. A heat pipe (2) is changed into an arc shape from a bending shape through the improvement to a radiator of a CPU or a GPU chip (18), which ensures that an air convection extension heat exchange surface (4) (a fin) surrounds a fan (5) and opposites to an air outlet of an impeller, thereby greatly reducing the size and the weight of the radiator, improving the whole radiating effect, reducing the mounting limitation of the radiator, and realizing the standardization of the radiator series. Based on the heat emission improvement, the thickness and the weight of the computer are reduced, a shell (14) on the host is taken as a main frame, a mainboard (7), a battery and a hard disk are fixed on the main frame, which can realize the standardization of the portable computer series, reduce the cost, and be convenient for a user to make remodeling update.
Description
Affiliated technical field
The present invention relates to portable electron device, particularly formed both foldables portable computers together by flat-panel monitor and main frame.
Background technology
The thickness requirement of portable computer is more and more thinner, performance constantly promotes, thermal value is increasing, particularly the thermal value of central processor core CPU and image processor chip GPU significantly increases, heat radiation has become the bottleneck that the portable computer performance improves development, heating radiator is thrown away the spiral case that do not fall just as the snail back, stick on CPU or the GPU chip, the volume of heating radiator has accounted for sizable space in the portable computer, portable computer thickness reduces, and is subject to the restriction of heat sink thickness size.
The structure of the heating radiator of using in the existing notebook computer is: the centrifugal fan of being furnished with fan housing, the general scroll casing type fan housing that adopts, consist of and concentrate air outlet, the cross-ventilation expansion heat-transfer surface of heating radiator (all adopts the rib-type structure, be called for short fin), just be arranged on air outlet, usually all adopt heat pipe, the heat that the CPU on the mainboard is produced is transferred on the fin on the air outlet.Such heating radiator problem has: air outlet is concentrated, if blocked, heat just falls apart not out; Through the air process fin of fans drive, directly discharge, further be not utilized; Fan housing occupies most of space of fan, and is vacant, take up space in order to reduce fan housing, and fan housing and off-gauge scroll casing shape, thereby the air eddy loss is very large, and air outlet place Air Flow skewness, this is all unfavorable to dispelling the heat.Be subjected to the restriction of cabling requirement, in the middle of CPU should lean on the position on mainboard, to the CPU position one segment distance arranged from the fin on the air outlet like this, for heat pipe, heat pipe length increases, and the distance between evaporator section and the condensation segment increases, and the heat transmission reduces.
Because the heat dissipation problem of CPU or GPU chip, so that the heating radiator in the existing notebook computer can not form series standardized, the computer-internal topology layout is also just ever-changing, different serial complete different layouts, even with a series of, because function, performance boost are only because heat dissipation problem just must carry out large change.So that product design costs is high, die cost is high, cause the notebook computer performance to can not show a candle to desktop computer, but price is higher than desktop computer like this.The user can not be as with desktop computer, self-changeable or increase parts, and expansion promotes computing power.
Summary of the invention
For overcoming the above problem of now producing, the present invention is by improving heating radiator, change the layout that arranges of cross-ventilation expansion heat-transfer surface (fin), save the fan housing of fan, the shortening heat length of tube, introduce the augmentation of heat transfer structure, reduce the size of cross-ventilation expansion heat-transfer surface, not only make heating radiator compact, heat dissipation capacity is higher, also make the installation site restricted minimizing of heating radiator on mainboard, improve integral heat sink in the cabinet, can realize that heating radiator is series standardized, thereby make portable computer not only frivolous, and cost, the user can reequip the lifting computing power voluntarily, even notebook capable of automatic assembling also.
Technical scheme of the present invention is: contour structures and existing notebook are similar, include: display, main frame, and display and main frame are flat pattern, and connect together by coupling arrangement, can closure stack, and open during use, and display is established; Be provided with mainboard, battery, hard disk in the main frame, be provided with keyboard at the upper surface of main frame; Be provided with heat-pipe type radiator on CPU on the mainboard or the GPU chip, the fan on the heating radiator is centrifugal.Feature of the present invention is: the shell of main frame is made of upper shell and lower casing, and mainboard is fixed on shell, and CPU or GPU chip are in mainboard one side down, and battery and hard disk directly or by mainboard are fixed on, or the slotting shell that hangs over; The condensation segment of radiator heat pipe bends to circular arc, and the cross-ventilation on this circular arc condensation segment is expanded heat-transfer surface round the impeller of fan, and faces the impeller air outlet; Cross-ventilation expansion heat-transfer surface has adopted rib-type or pin pole structure, directly welds or is bonded on the condensation segment of heat pipe.
The cross-ventilation expansion heat-transfer surface of rib-type structure is most widely used general, be the most effective a kind of increase heat-transfer surface, reduce the air heat exchanger size, make it compact structure, such as the air heat exchanger in the air-conditioning (condenser and evaporator), also adopt this structure in the existing cpu heat.The pin pole structure, because manufacturing process Cost Problems, use wideless, but the pin pole structure itself has the augmentation of heat transfer characteristics, its cross-ventilation coefficient of heat transfer is more than two times of continuous surface fin, and for the applied field of the present invention, the heat sink size compact is very important, adopt the cross-ventilation expansion heat-transfer surface of pin pole structure among the present invention, will effectively reduce the shared area of heating radiator and space.
Cross-ventilation expansion heat-transfer surface directly welds or is bonded on the condensation segment of heat pipe, comprised by arts demand accompanying pad between the two, this pad have a not obvious increase heat transfer resistance between the two.Directly welding or bonding has deducted middle diabatic process (being thermal resistance).Thermal contact resistance between the two can be effectively eliminated in welding, generally adopt soldering (tin soldering), but welding temperature is high, has the danger of high-temperature heat pipe blast.The technique for sticking temperature is low, and without explosion danger, but the viscose glue that adopts is must temperature conductivity high, and contact area between the two is large as far as possible, compress bondingly, reduces gap between the two.For the pin pole structure, should not adopt technique for sticking.
The whole outer border of centrifugal fan impeller is air outlet, during wheel rotation, air flows out equably from the whole outer border of impeller, the condensation segment of heat pipe bends to circular arc, round impeller, make cross-ventilation expansion heat-transfer surface face the impeller air outlet, and should leave as far as possible little gap with the impeller outer garden, such structural arrangement, the advantage of bringing has:
One, flow through even round the air of the cross-ventilation of impeller expansion heat-transfer surface, the impact that is not subjected to some position opening of impeller border (as cross-ventilation expansion heat-transfer surface is not set) or is stopped up.Two, increase the length that cross-ventilation expansion heat-transfer surface is set, can reduce air stream through the speed of cross-ventilation expansion heat-transfer surface, reduced air flow resistance, increased air mass flow.Three, fan can shorten the distance between heat pipe condenser section and the evaporator section near the electronic chip that is cooled, thereby the heat of heat pipe transmission raising, has also deducted shared space and the weight of heat pipe.Four, also be the most significant: can save the fan housing of fan, save shared space, weight and the cost of the material thickness of fan housing own, save the space of the water conservancy diversion diffusion in the fan housing, and the loss of the Air Flow in the water conservancy diversion diffusion; Do not have fan housing, the air from heating radiator is discharged can be used further to cool off other device, such as hard disk, battery, internal memory etc., the heat in the casing is taken out of.
Heating radiator is remaining heat pipe, fan and cross-ventilation expansion heat-transfer surface only now, has not had parts and the space that can save again.Want further to reduce size, can only take measures at the concrete structure that cross-ventilation is expanded heat-transfer surface and these two parts of fan, strengthen the convection heat transfer' heat-transfer by convection structure as adopting, strengthen fin density, optimize Impeller Design.
There is not fan housing; need not concentrate exhausr port; then the suffered restriction in heating radiator installation site reduces, as long as guarantee that air inlet is unimpeded, heating radiator can arbitrarily be placed on mainboard with CPU or GPU chip; heat sink size is little, lightweight; not to account for main space and weight, thereby heating radiator can be divided into series by heat dissipation capacity and thickness, be designed and manufactured into the standard fitting product; large-scale production reduces cost.The realization that heating radiator is series standardized, the casing of notebook (upper shell and lower casing), mainboard installs and fixes just can be series standardized.
Among the present invention, the upper shell of host housing is main frame, mainboard, battery, hard disk, CD-ROM drive etc. are fixed on shell directly or indirectly, and from the air that heating radiator is discharged, play again the effect to these parts heat radiations, thereby lower casing only is a lower cover, need not bear the effect of radiating surface, can adopt injection molding, bottom surface can not feel to have blanching during use, upper shell equally also can adopt injection molding, and production cost is low like this.If there is not lower casing, computing machine can also work in the same old way, and assembling is also just simple, the user can change voluntarily easily, the parts that increase, and as changing CPU and heating radiator, increases internal memory, battery etc., if thickness increases after the amplification, just can as long as change the lower casing of thickening.Further develop, notebook can be as desktop computer, and the user buys the parts such as the casing with display and keyboard, mainboard, battery, hard disk, cpu chip and heating radiator of standard, goes out notebook computer with regard to capable of automatic assembling.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is a kind of schematic characteristic knot of the back side (back side of the burnishing surface of coldplate) direction of heating radiator of the present invention
Fig. 2 is the feature structure synoptic diagram in cross section, A-A place among Fig. 1, also is the characteristic cross-section synoptic diagram of the cross-ventilation heat exchanging part in a kind of heating radiator of the present invention.
Fig. 3,4 is respectively the feature structure diagrammatic cross-section of two kinds of cross-ventilation heat exchanging part in the heating radiator of the present invention.
Fig. 5,6 is respectively the view of schematic characteristic structure of the back side direction of two kinds of heating radiators of the present invention.
Fig. 7,8 is respectively two kinds of impeller and fin Similarity of Local Characteristic Structure synoptic diagram in the heating radiator of the present invention.
Fig. 9 is the feature profile synoptic diagram of fork row short rib shape augmentation of heat transfer structure.
Figure 10 is the feature profile synoptic diagram of window shutter short rib shape augmentation of heat transfer structure.
Figure 11,12,13,14 is respectively four kinds of feature structure diagrammatic cross-sections of the present invention.
Among the figure, 1, coldplate, 2, heat pipe, 3, impeller, 4, cross-ventilation expansion heat-transfer surface, 5, fan, 6, the expression Air Flow, 7, mainboard, 8, shaft collar, 9, fin, 10, expression vane rotary direction, 11, display, 12, air intake opening, 13, keyboard, 14, upper shell, 15, the gas outlet, 16, lower casing, 17, main frame, 18, CPU or GPU chip, 19, pillar.
Embodiment
Fig. 1 shows a kind of global feature structure of heating radiator of the present invention, does not show among cross-ventilation expansion heat-transfer surface 4 these figure.Heat pipe 2 round impeller 3 is homogeneous tubes, and two ends are evaporator sections, on coldplate 1 back side.The front of coldplate 1 is burnishing surface, will be close on CPU or the GPU chip.Usually the method that adopts welding or inlay is connected the evaporator section of heat pipe with coldplate, purpose is the thermal contact resistance problem that solves between the two; Coldplate 1 nestles up impeller 3, so effectively shortened the distance between heat pipe evaporator section and the condensation segment, because the heat pipe bending radius is restricted, the heat pipe that is bent to circular arc can not be whole (namely 360 °) round impeller, that is to say the cross-ventilation expansion heat-transfer surface of circular arc can not 360 ° of ground round impeller, by near coldplate 1 position opening is arranged.As shown in Figure 1, an end of heat pipe 2 is straight reaching on the coldplate 1, and the other end bends on the coldplate 1, between opening is arranged.But cross-ventilation expansion heat-transfer surface can also be set on the heat pipe of stretching in the coldplate 1, take full advantage of each section on the heat pipe.
Fig. 2 show by fan and heat pipe with and on the feature structure of the cross-ventilation heat exchanging part that forms of cross-ventilation expansion heat-transfer surface, fan 5 is centrifugal, axial admission, radially flow out, the excircle of impeller 3 is air outlet, cross-ventilation expansion heat-transfer surface 4 faces the air outlet of impeller 3, and the air that drives through impeller 3 directly enters cross-ventilation expansion heat-transfer surface 4.For reducing the outer garden size round the cross-ventilation expansion heat-transfer surface 4 of impeller 3, be and reduce the heating radiator area occupied, impeller 3 and cross-ventilation expansion heat-transfer surface 4 gaps are as far as possible little, but must guarantee that impeller 3 can not run into cross-ventilation and expand heat-transfer surface 4 and heat pipe 2.In order to prevent directly being back to fan air intake from the hot-air that heating radiator is discharged, reduce heat dissipation capacity, with the sidewall of mainboard 7 as fan 5, and offer air intake opening, as shown in Figure 3, can effectively air inlet and exhaust be separated like this, can reduce fan thickness again, the air that can also again utilize heating radiator to discharge cools off other parts, such as battery, hard disk, the heat in the casing is taken out of.
Increase the height of cross-ventilation expansion heat-transfer surface, increase heat interchanging area, to improve heat dissipation capacity.But, when the overall height of cross-ventilation expansion heat-transfer surface reaches more than ten millimeter, just cross-ventilation should be expanded heat-transfer surface and be divided into two parts, be separately positioned on heat pipe 2 condensation segment two back to the side on, as shown in Figure 4, can shorten like this root (namely by the heat pipe place) of cross-ventilation expansion heat-transfer surface to the distance of the heat conduction between its top (it is long to be commonly referred to rib height or rib), namely the Effective Raise fin efficiency is conducive to improve heat dissipation capacity.In Fig. 4, fan 5 is fixed on the mainboard 7 by shaft collar 8, fan can be directly dismounting from the mainboard 7, be convenient to fan and change; Two up and down air inlets have been adopted in the fan air inlet, can reduce the air inlet flow losses, improve air quantity, if a side-inlet is blocked, fan also has air intake opening, and heating radiator can also work, and reliability also just improves.
In order to reduce the thickness of heating radiator, improve the ventilation area of cross-ventilation expansion heat-transfer surface, reduce air flow resistance, heat pipe 2 should be selected the flat pipe, when especially heat pipe 2 is single.The heat pipe 2 that adopts among Fig. 2,3 is single flat heat pipe.Also can adopt many heat pipes placed side by side, as shown in Figure 4, adopt two heat pipes.Adopt the advantage of many heat pipes to have: the diameter of single heat pipe (or equivalent diameter) is little, thereby the bending radius that heat pipe is allowed is also just little, is convenient to the radiator integral compact designed.Certainly the cost of many heat pipes wants height a bit.
By increasing the diameter round the cross-ventilation expansion heat-transfer surface 4 of impeller 3, increasing heat interchanging area, improve the heat dissipation capacity of heating radiator, is not extraordinary way, because this liquid refrigerant that will increase in the heat pipe is back to the mean distance of evaporator section from condensation segment, be unfavorable for the heat transmission in the heat pipe; Increase the height of cross-ventilation expansion heat-transfer surface, realize that heat dissipation capacity improves, this will increase again the thickness of heating radiator, pursue thin thickness for notebook computer, and will be very unfavorable.Can be by increasing the quantity of fan, adopt a coldplate 1 to be furnished with two or more fans and the method for the cross-ventilation that matches expansion heat-transfer surface, solve and to improve heat dissipation capacity, can not increase again the contradiction of thickness, as shown in Figure 5, coldplate 1 is furnished with two impellers 3 (fan), the heat pipe 2 that also shown is round each impeller 3 is divided into two sections, and design is in order to shorten the length of single heat pipe, because the tiny heat pipe of diameter like this, length is longer, and it is larger to make difficulty of processing.
For on a circuit board, the situation that has the chip of two or more vicinities to cool off, can adopt such way: a fan is with (bearing) two or more coldplates, and as shown in Figure 6, impeller 3 is with two coldplates 1.
The cross-ventilation expansion heat-transfer surface of rib-type structure is most widely used, and with this structure of first-selection, the cross-ventilation of this structure expansion heat-transfer surface will be called for short fin among the present invention.At the air outlet of impeller, i.e. the excircle of impeller, air stream goes out impeller circumferential speed and radial velocity.The blade profile of impeller is different, and circumferential speed and radial velocity distribute also just different, forward direction type impeller, and circumferential speed is high, and the circumferential speed of backward type is low, radial mode placed in the middle.No matter which kind of blade profile all has circumferential speed, and turning to of direction and impeller is consistent.If the fin that impeller air outlet place arranges radially is radiation and arranges, the direction of air of fin air intake leading edge and outflow impeller has an angle, usually is referred to as the angle of attack in the aerodynamics.The angle of attack is larger, and air stream is also just larger through the flow losses (resistance) of fin, and this will reduce air mass flow, be unfavorable for heat radiation.In order to reduce the angle of attack, the fin 9 round impeller 3 can be tilted along impeller 3 rotation directions, as shown in Figure 7, so just can reduce the angle of attack.Can also adopt following method: will round the air intake leading edge of the fin 9 of impeller 3 anti-the crooked or bending of impeller 3 rotation directions.As shown in Figure 8, fin 9 is bent, and the gas channel that forms between the fin 9 is exactly the diffusion flow-guiding channel, and this moment, fin 9 not only played a part the cross-ventilation heat exchange, played a part the water conservancy diversion diffusion.The pin pole structure does not have direction, the angle of attack in air-flow.
In order to reduce the volume size of fin, adopt reinforcement cross-ventilation heat transfer structure at fin 9, Fig. 9,10 shows short rib shape augmentation of heat transfer structure, Fig. 9 is fork row short rib shape, Figure 10 is the window shutter short rib shape, their essential characteristic is: the surface of air stream warp is die-cut into a section discontinuous surface, air whenever flow through one section (short rib), boundary layer on it all is in the initial segment in boundary layer, makes whole convection heat transfer surface take full advantage of the favourable characteristics that the boundary layer the initial segment is thinner, thermal resistance is little, the coefficient of heat transfer is high.When the heat pipe round impeller arranges window shutter short rib shape fin, note the direction of the short rib bending of window shutter, the air intake leading edge should be anti-the direction bending of wheel rotation, reduce the angle of attack.
According to thermal conduction study, the cross-ventilation coefficient of heat transfer roughly is inversely proportional to a pitch of fins, that is to say that reducing a pitch of fins not only can increase fin quantity, and namely heat interchanging area can also greatly improve the cross-ventilation coefficient of heat transfer.A best pitch of fins should be lower than 1 millimeter, but also will consider other factors in actual design.For the continuous-surface shape fin, a pitch of fins should be not more than 1.5 millimeters, considers production technology, and the hazards of dust gathering pollution, and a pitch of fins should be less than 0.7 millimeter.For the fin that has adopted short rib shape augmentation of heat transfer structure, a pitch of fins should be not less than 0.7 millimeter, is not more than 2.0 millimeters, and the width of short rib is in 2.0 millimeter.In the present invention, fin is arranged in circular arc, and the place, garden is little in the pitch of fins between the fin, and place, outer garden is large, thereby an above-mentioned pitch of fins should be an average pitch of fins.
Figure 11 shows characteristic feature of the present invention, display 11 is flat, main frame 17 also is flat plate shape, and display 11 and main frame 17 connect together by coupling arrangement, open when using, display 11 is established, main frame 17 is flat sleeping, and keyboard 13 is on host housing, and display 11 and main frame 17 can be superimposed together, as shown in phantom in FIG., these structures and existing notebook computer are similar.The shell of main frame 17 is made of upper shell 14 and lower casing 16, mainboard 7 near or pasting in the upper wall of go up shell 14, be fixed on the shell 14, adopt screw fixing better.CPU on the mainboard 7 or GPU chip 18 are in mainboard 7 one side down, being convenient to like this heating radiator of the present invention installs, also be convenient to the installation of other parts and change, such as battery, hard disk, CD-ROM drive etc., if memory bank and card slot etc. are arranged on the mainboard 7, also be convenient to the installation of these parts and change, compact overall structure is convenient to design standards.
Shown in Figure 11, upper wall at upper shell 14 has air intake opening 12, and is the air intake opening that faces fan 5, adopts air intake opening 12 to open at upper shell 14 upper walls, and face or near the structure of the air intake opening of fan, can reduce the resistance in the air inlet process.The gas outlet 15 of host housing will be as far as possible away from air intake opening, and a plurality of gas outlets are arranged, can utilize the slit of the interface of external equipment, as the gas outlet, the one, reduce the hot air reflow of discharging and arrive air intake opening, the 2nd, the hot-air in the main frame 17 is all evenly discharged, make other parts in the main frame, also can evenly be cooled off such as battery, hard disk etc.Heating radiator shown in Figure 11 is arranged on the end by display 11, and gas outlet 15 is at the other end, and is arranged on the sidewall of host housing, is on the sidewall of lower casing 16.The parts such as battery, hard disk are not shown among the figure, and they are by mainboard 7, or directly fix or slotting hanging on the shell 14.Being connected and fixed between upper shell 14 and the lower casing 16 can be adopted the screw mode, also can adopt the snapping mode, and perhaps the two combines.
The present invention shown in Figure 12, air intake opening 12 is arranged on the sidewall of host housing, can reduce the possibility that air intake opening is blocked like this; Have gas port on the mainboard 7, and face fan air intake, mainboard 7 plays at this air inlet cold wind and exhaustion hot wind is separated, and prevents that hot air reflow is to fan air intake in main frame; Upper shell 14 upper walls sideling, and mainboard 7 forms angles, so that the gap of air intake opening 12 place's inlet channels is enough large, guarantee that air inlet is unimpeded, and compact overall structure reduces vacant space.Shown in Figure 12, the middle part between upper shell 14 and lower casing 16 is provided with pillar 19, is stressed above the upper shell 14, passes to lower casing 16 by pillar 19, and the rigidity intensity that this has just improved the upper wall of upper shell 14 reduces to be subjected to the indentation distortion.
Among the present invention shown in Figure 13, heating radiator has adopted and has been similar to structure shown in Figure 4, cross-ventilation expansion heat-transfer surface 4 is double-deck, fan 5 has adopted up and down bilateral air intake structure, upper shell 14 and lower casing 16 all have respectively air intake opening 12, and face the air intake opening of fan 5, make air inlet unimpeded reliable.
The keyboard of existing notebook computer does not also play air inlet and heat radiation usually, have under the button of keyboard with main frame in the blow vent that communicates, if there is water to splash into keyboard, will enter in the machine, may cause inner electrical equipment damage.In the present invention, can not need keyboard air inlet heat radiation, thereby can adopt the conductive rubber button of film key, monoblock, so not only thin thickness also can be prevented sealing in keyboard inflow machine, and cost is also low.
Specify: the hard disk described in the present invention comprises: mechanical rotation hard disk and solid state hard disc.
Claims (10)
1. portable computer, include: display (11), main frame (17), display (11) and main frame (17) are flat plate shape, and connect together by coupling arrangement, be provided with mainboard (7) in the main frame (17), battery, hard disk, upper surface at main frame is provided with keyboard (13), be provided with heat-pipe type radiator on CPU on the mainboard or the GPU chip, fan on the heating radiator is centrifugal, it is characterized in that: the shell of main frame (17) is made of upper shell (14) and lower casing (16), mainboard (7) is fixed on shell (14), and CPU or GPU chip are in mainboard (7) one side down; Battery and hard disk directly or by mainboard (7) are fixed on or the slotting upper shell (14) that hangs over; The condensation segment of heat pipe (2) has bending to be circular arc, and cross-ventilation on this circular arc condensation segment expansion heat-transfer surface (4) is round the impeller (3) of fan and face the air outlet of impeller (3); Cross-ventilation expansion heat-transfer surface (4) has adopted rib-type structure or pin pole structure, and is directly to weld or be bonded on the heat pipe (2).
2. portable computer according to claim 1 is characterized in that: the cross-ventilation expansion heat-transfer surface (4) of rib-type structure has adopted poor row short rib shape or window shutter short rib shape enhanced heat exchange structure.
3. portable computer according to claim 1 is characterized in that: when cross-ventilation expansion heat-transfer surface (4) adopts the rib-type structure, the fin (9) round impeller (3) tilts along the rotation direction of impeller (3); Or round the air intake leading edge of the fin (9) of impeller (3) anti-the crooked or bending of rotation direction of impeller (3).
4. portable computer according to claim 1, it is characterized in that: mainboard has air intake opening on (7), and faces the air intake opening of fan (5).
5. portable computer according to claim 1 is characterized in that: the upper wall of upper shell (14) has air intake opening (12), and faces or near the air intake opening of fan (5).
6. portable computer according to claim 1 is characterized in that: bilateral air intake structure about fan (5) has adopted.
7. portable computer according to claim 1 is characterized in that: have air intake opening (12) on the side wall of outer shell.
8. portable computer according to claim 1 is characterized in that: the middle part between upper shell (14) and the lower casing (16) is provided with pillar (19).
9. portable computer according to claim 1, it is characterized in that: keyboard (13) is keyboard with touch screen.
10. portable computer according to claim 9, it is characterized in that: display (11) can take off from main frame (17) easily.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810067795 CN101290531B (en) | 2008-06-18 | 2008-06-18 | Portable computer |
| PCT/CN2008/071772 WO2009043240A1 (en) | 2007-09-29 | 2008-07-28 | Flat heat pipe radiator and application thereof |
| US12/733,924 US8837139B2 (en) | 2007-09-29 | 2008-07-28 | Flat heat pipe radiator and application thereof |
| US14/455,209 US20140347801A1 (en) | 2007-09-29 | 2014-08-08 | Flat Heat Pipe Radiator and Portable Computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810067795 CN101290531B (en) | 2008-06-18 | 2008-06-18 | Portable computer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101290531A CN101290531A (en) | 2008-10-22 |
| CN101290531B true CN101290531B (en) | 2013-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810067795 Expired - Fee Related CN101290531B (en) | 2007-09-29 | 2008-06-18 | Portable computer |
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| Country | Link |
|---|---|
| CN (1) | CN101290531B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011006301A1 (en) * | 2009-07-16 | 2011-01-20 | Qin Biao | Notebook type computer and its enclosure and motherboard |
| CN107168459B (en) * | 2017-03-27 | 2020-07-24 | 联想(北京)有限公司 | Portable electronic equipment |
| TWI693503B (en) * | 2017-12-28 | 2020-05-11 | 仁寶電腦工業股份有限公司 | Laptop computer |
| CN111338431B (en) * | 2020-02-29 | 2023-05-16 | 重庆顺贞科技有限公司 | Notebook keyboard protection device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1420412A (en) * | 2001-11-21 | 2003-05-28 | 联想(北京)有限公司 | Heat sink of computer system |
| CN1728043A (en) * | 2004-07-30 | 2006-02-01 | 株式会社东芝 | Electronic apparatus with cooling device |
| CN101090097A (en) * | 2007-05-30 | 2007-12-19 | 秦彪 | Heat pipe type CPU radiator and manufacturing technology |
-
2008
- 2008-06-18 CN CN 200810067795 patent/CN101290531B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1420412A (en) * | 2001-11-21 | 2003-05-28 | 联想(北京)有限公司 | Heat sink of computer system |
| CN1728043A (en) * | 2004-07-30 | 2006-02-01 | 株式会社东芝 | Electronic apparatus with cooling device |
| CN101090097A (en) * | 2007-05-30 | 2007-12-19 | 秦彪 | Heat pipe type CPU radiator and manufacturing technology |
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| CN101290531A (en) | 2008-10-22 |
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