CN101364576B - Radiator for semi-conductor electronic device - Google Patents
Radiator for semi-conductor electronic device Download PDFInfo
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- CN101364576B CN101364576B CN 200810216143 CN200810216143A CN101364576B CN 101364576 B CN101364576 B CN 101364576B CN 200810216143 CN200810216143 CN 200810216143 CN 200810216143 A CN200810216143 A CN 200810216143A CN 101364576 B CN101364576 B CN 101364576B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention provides an improvement on a radiator for an electronic device like a computer video card chip. A fan (1) adopts a centrifugal type; the shape of air flow suits better the flow shape of air in the radiator which enters axially and exits radially. Furthermore, the wind pressure is high, thereby more effectively overcoming high-flow resistance caused by high-density ribbed plates and a reinforced heat exchange structure. An air-convection expansion heat exchange surface (2) (ribbed plates or ribbed columns) is directly welded or stuck on a heat conduction plate (4) so as to effectively reduce the thickness of the ribbed plates and improve the density thereof. Since a short rib-shaped reinforced air-convection heat exchange structure is adopted, the radiator is more compact, cutting and processing are saved, and the processing cost and waste materials are reduced.
Description
Affiliated technical field
The present invention relates to the heat dissipation technology field of semi-conductor electronic device, particularly by the radiator of forming by heat-conducting plate, fin and fan.
Background technology
Power raising along with semiconductor power device, light emitting semiconductor device, the particularly increase of semiconductor integrated circuit number of transistors, and the increase of operating frequency, its caloric value is also along with increase, and current computer CPU and GPU chip cooling problem have become the obstacle in the computer evolution.For a long time, the heat radiation of electronic device gets the brush-off, technology is in the original heat transfer conceptual phase always, last century 60 is to the seventies, the research of heat transfer technology is very perfect, as long as incite somebody to action achievement in research wherein, adopts correct method, introduce the heat dissipation technology of electronic device, just can obtain significant result.
In the radiator of the video card chip (GPU chip) of existing desktop computer two kinds of similar cpu chip radiators are arranged.First kind is the similar sun fancy structure that is called as, and cross-ventilation expansion heat-transfer surface (being radiated rib) radially; Second kind of structure is the most general, and radiated rib is in a row parallel to be stretched out from a flat board (heat-conducting plate).Because the video card integral thickness is restricted, in order to reduce video card chip radiator thickness, drawn in the middle of the radiator and dug, in the middle of fan is embedded in, this just with the difference of cpu chip heat spreader structures.
The problem of these two kinds of GPU chip radiators has: one, because radiated rib is to adopt the aluminium extrusion process forming, though fin and heat-conducting plate are one, guaranteed the heat conduction between fin and the heat-conducting plate.But,, be subjected to the restriction of this manufacturing process because fin extrudes out, the thickness of fin is generally wanted more than the 0.5mm, though sheet is thick, helps fin efficiency and improves, but problem has: the aluminum consumption is many, cost increases, and importantly, fin thickness occupies too much ventilation area, be unfavorable for highly compactization, such as pitch of fins 1.0mm, sheet is thick to be 0.5mm, densification design like this, the thickness of fin just accounts for 1/3rd, be that ventilation area has only 2/3rds, like this, the air velocity of the fin of flowing through increases, air flow resistance is big, cause air mass flow to reduce, cause that heat dissipation capacity can not get effective raising, may also reduce.
Two, adopt tube-axial fan, air flows is axially to advance, axially go out in the tube-axial fan, and air mobile in radiator is axially to advance, radially go out, thereby from air-flow direction, is not suitable for, and the air flows loss is big.
Three, the rib structure of above-mentioned second kind of radiator is in a row parallel, and the fans drive air flows radially, thereby have only the part fin to arrange along air-flow direction, air flows inhomogeneous in fin, air flow resistance is big, have flow dead, this all is unfavorable for the cross-ventilation heat exchange; The radiator of above-mentioned first kind of similar heronsbill, though fin radially, air flows in fin evenly, resistance is little, but the heat-conducting section of fin root place (with the heat-conducting plate junction) long-pending little (because extrusion process and fan must embed due to the installation), and heat conduction distance in the fin, this all is unfavorable for heat radiation.Also have in addition, these two kinds of radiator machining cutting outputs are big, processing cost height not only, and it is many to produce waste materials, i.e. material cost height.
For electronic equipment, the video card on the computer particularly, device radiator not only will improve constantly heat dissipation capacity, satisfy chip performance to improve constantly and produce higher heat, but also want cube small and exquisite, flat (thickness is restricted), the cost cost is also low, more than the existing radiator of two kinds of structures, do not satisfy these demands.
Summary of the invention
The present invention be directed to above-mentioned radiator and improve, adopt other fin forming technology, realize reducing fin thickness, increase fin density, reach the purpose that increases area of dissipation.Adopt centrifugal fan, fin is arranged along air-flow direction, eliminates the air flows dead band, reduces flow resistance, improves air mass flow, and has saved machine cut processing, reduces the waste wood amount.Introduce the augmentation of heat transfer structure, optimize size, further reduce the size of dispelling the heat.
Technical scheme of the present invention is: the main parts of radiator include: heat-conducting plate, fan, cross-ventilation expansion heat-transfer surface, fan and cross-ventilation expansion heat-transfer surface are arranged on the same one side of heat-conducting plate, the electronic device that is cooled the invention is characterized at another side: fan is a centrifugal fan; Cross-ventilation expansion heat-transfer surface is formed circular arc, round the impeller of fan, faces the impeller air outlet; Cross-ventilation expansion heat-transfer surface has adopted corrugated structure or laminated structure fin or pin pole structure rib post, and is to weld or be bonded on the heat-conducting plate.
The air intake of centrifugal fan is that axially air-out is for radially, and is consistent with air flow process in the radiator described in the present invention, thereby adopts centrifugal fan, and the flow losses of air reduce.Also have, the blast height of centrifugal fan for improving cross-ventilation heat-transfer surface (fin) density, increases heat exchange area, and will adopt the air flow resistance due to the enhanced heat exchange structure to increase, and centrifugal fan then just can satisfy its requirement.And tube-axial fan not only blast is low, and big in this kind air flows form current downflow loss, thereby further reduce blast, its result is exactly that air quantity reduces, heat dissipation capacity is low.
The cross-ventilation expansion heat-transfer surface of rib-type structure is most widely used general, be the most effective a kind of increase heat-transfer surface, reduce the air heat exchanger size, make it compact structure, as the air heat exchanger in the air-conditioning (condenser and evaporator), also adopt this structure in the existing cpu heat.The pin pole structure is because manufacturing process cost problem is used wideless.But pin pillar cross-ventilation expansion heat-transfer surface does not have as rib-type in moving air, and the angle of attack of relative air flows is arranged, and the angle of attack is excessive, the problem that the flow losses resistance is big; Also have the pin pole structure itself to have the augmentation of heat transfer characteristics, its cross-ventilation heat exchange coefficient is more than two times of continuous face fin.
According to thermal conduction study, fin efficiency is the function of mL, descends along with the increase of mL, is the functional relation that curve descends, and mL is 1.0 o'clock, and the fin efficiency decrease speed is the fastest, and for straight rib (involved in the present invention), this moment, fin efficiency was roughly 76%.Wherein L is that rib is long, and the square root of the thickness of m and fin is inversely proportional to.If fin thickness reduces 4 times, the long L of rib reduces 2 times, and then fin efficiency is constant.Illustrate to reduce fin thickness, can reduce the fin material usage effectively, fin (aluminium) thickness in the air heat exchanger in the existing air-conditioning is reduced to below the 0.1mm.Existing product adopts aluminium extruded system technology, and the thick minimum of rib also has 0.5mm, and it is very meaningful to reduce rib thickness: reduce material, promptly reduce cost, reduce the thick shared circulation area of rib, the space of vacating can increase the fin number, has promptly increased area of dissipation.
The present invention adopts welding or bonding mode cross-ventilation is expanded heat-transfer surface to be arranged on the heat-conducting plate, and one, then can realize adopting thin wire to be cut into a section, be arranged on the heat-conducting plate, constitute pin pillar cross-ventilation expansion heat-transfer surface; Two, fin is arranged on the heat-conducting plate after then can realizing adopting thin plate section bar processing, thereby the thickness of fin can attenuate, is not subjected to process technology limit.The thickness of fin is chosen and is not more than 0.4mm among the present invention, preferably chooses below the 0.2mm.The thickness of fin has reduced, and not low in order to guarantee fin efficiency, the rib height of fin can not be oversize, chooses rib height (from sharp to fin with heat-conducting plate welding or bonding part) among the present invention and is not more than 20mm for rationally.
Adopt welding or bonding mode that fin and pin post heat-transfer surface are set, and around fan, heat-conducting plate is exactly the simple plate of a block structure, will have saved to the setting-in fan adopts cutting to draw and dig technology, reduce (elimination) waste material and produce.
Though the conductive coefficient of fine copper is the nearly twice of fine aluminium, the proportion of copper is nearly three times of aluminium, and the price of copper is also high, closely is three times in the price of aluminium, by volume calculates, and expensive nearly 9 times than aluminium of copper by volume calculate and make the radiator material.Involved in the present invention to device heating density also do not reach must adopt copper do heat-conducting plate can not degree, thereby can select for use aluminium to do heat-conducting plate fully, if thermal conduction resistance is bigger, can pass through thickened material.Fin (cross-ventilation expansion heat-transfer surface) changes aluminium into by copper material, can then can not reduce fin efficiency by increasing rib thickness (doubling).Thereby cross-ventilation is expanded heat-transfer surface (fin and rib post) and heat-conducting plate all adopts aluminium, and weight is lighter, and is more economical.
Corrugated structure fin is to adopt continuous thin strip (being generally aluminium strip) to be processed into similar corrugated, adopting soldering processes, this corrugated fin is arranged on the heat-conducting plate, adopt rolling technology to be processed into corrugated fin, production efficiency is very high, corrugated fin is widely used in air heat exchange product, as the water tank on the automobile.Laminated structure also is to adopt thin strip, is die-cut into blocks of fin, two ends band flanging and location flanging, and these fins build up circular arc blocks ofly, adopt welding or bonding process again, are arranged on the heat-conducting plate.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is a kind of positive feature structural representation of radiator of the present invention, and cross-ventilation expansion heat-transfer surface is a pin pole structure rib post.
Fig. 2 is the side-looking profile features structural representation of Fig. 1.
Fig. 3 is a kind of positive feature structural representation of radiator of the present invention, and cross-ventilation expansion heat-transfer surface is a fin.
Fig. 4 is the side-looking profile features structural representation of Fig. 3.
Fig. 5 is corrugated fin feature structure schematic diagram.
Fig. 6 is stacked fin feature structure schematic diagram.
Fig. 7 is the feature profile schematic diagram of fork row short rib shape enhanced heat exchange structure.
Fig. 8 is the feature profile schematic diagram of shutter short rib shape enhanced heat exchange structure.
Fig. 9 is a kind of positive feature structural representation of radiator of the present invention, and cross-ventilation expansion heat-transfer surface is a rib-type, and is divided into two-layer.
Figure 10 is the side-looking profile features structural representation of Fig. 9.
Figure 11,12, the 13rd, impeller in the radiator of the present invention and fin local feature structural representation.
Figure 14 is a kind of side-looking profile features structural representation of radiator of the present invention.
Among the figure: 1, fan, 2, cross-ventilation expansion heat-transfer surface, 3, impeller, 4, heat-conducting plate, 5, the arrow of expression air-flow direction, 6, fin, 7, the arrow of expression wheel rotation direction, 8, electronic device.
Radiator shown in Fig. 1,2, what cross-ventilation expansion heat-transfer surface (2) adopted is pin pole structure rib post.Heat-conducting plate (4) is a plectane, centrifugal fan (1) is in the centre, the air outlet of blast fan (3) (being the excircle of impeller) by the many rib posts of establishing round, air drives through impeller (3), axially suck, radially blow out, shown in arrow (5), entire radiator is pancake, and overall structure is very compact.Radiator shown in Fig. 3,4, employing be rib-type cross-ventilation expansion heat-transfer surface, fin (6) is arranged radially, whole enclosing the land surrounds fan, guarantees that like this air is mobile even whole fin (6) in.
Fin shown in Figure 5 (6) is exactly corrugated fin, fin (6) adopts continuous strip material to be processed into similar corrugated, the general welding procedure that adopts, corrugated fin is fixed on the heat-conducting plate (4), this is because fin (6) and heat-conducting plate (4) contact area are little, and the employing technique for sticking can not guarantee to solve the contact heat resistance problem between fin (6) and the heat-conducting plate (4).
Fig. 6 shows a kind of stacked fin, is flanging at the root of fin (6), and this flanging is close to heat-conducting plate (4), and the heat of heat-conducting plate (4) is exactly by transmission of heat by contact between this flanging and the heat-conducting plate (4), passes on the fin (6).Because the flanging of the fin of this structure and the contact area of heat-conducting plate are big, and guaranteeing easily that flanging is compacted is attached on the heat-conducting plate (4), thereby except that welding procedure, can also adopt technique for sticking, solve the contact heat resistance problem between fin (6) and the heat-conducting plate (4).In order to guarantee that a pitch of fins is even between the fin, the production efficiency height is on the root flanging of stacked fin and be processed with the location flanging on the top flap, as shown in Figure 6.
In order to reduce the volume size of fin, go up employing at fin (6) and strengthen the cross-ventilation heat exchange structure, Fig. 7,8 shows short rib shape augmentation of heat transfer structure, Fig. 7 is fork row short rib shape, Fig. 8 is the shutter short rib shape, their essential characteristic is: the surface that air is flowed through is die-cut into a section discontinuous surface, air whenever flow through one section (short rib), boundary layer on it all is in the The initial segment in boundary layer, makes whole heat convection surface make full use of the favourable characteristics that the boundary layer The initial segment is thin, thermal resistance is little, heat exchange coefficient is high.
According to thermal conduction study, the cross-ventilation heat exchange coefficient roughly is inversely proportional to a pitch of fins, that is to say that reducing a pitch of fins not only can increase fin quantity, and promptly heat exchange area can also greatly improve the cross-ventilation heat exchange coefficient.A best pitch of fins should be lower than 1 millimeter, but also will consider other factors in actual design.For the continuous-surface shape fin, a pitch of fins should be not more than 1.6 millimeters, considers production technology, and the hazards of dust gathering pollution, and a pitch of fins should be less than 0.7 millimeter, and a pitch of fins is preferably got about 1.2mm.For the fin that has adopted short rib shape augmentation of heat transfer structure, a pitch of fins should be not less than 0.7 millimeter, is not more than 2.0 millimeters, preferably gets about 1.5mm, and the width of short rib is in 2.0 millimeter.In the present invention, fin is in the arc-shaped to be arranged on the heat-conducting plate, and the pitch of fins import department between the fin is little, and the exit is big, thereby an above-mentioned pitch of fins should be an average pitch of fins, and a pitch of fins is defined as the distance between the fin, does not contain fin thickness.
In Fig. 9, the radiator shown in Figure 10, fin (6) round impeller (3) has two-layer, adopt the purpose of this structure to be: it is inhomogeneous to reduce between identical two fins pitch of fins, because fin radially, round impeller, the pitch of fins at fin cylindrical place is greater than the pitch of fins of inner circle, inside and outside circle diameter difference is big more, the difference of two place's pitch of fins is also just big more, this is unfavorable for the raising of heat dissipation capacity, and is two-layer or more multi-layered if a fin round impeller is divided into, and then can reduce the difference of a pitch of fins, the effect that fork row short rib shape enhanced heat exchange is also arranged in addition.
Air outlet in impeller (3), i.e. the excircle of impeller, air flows out impeller circumferential speed and radial velocity.The blade profile difference of impeller, circumferential speed and radial velocity distribute also just different, forward direction type impeller, the circumferential speed height, the circumferential speed of backward type is low, radial mode placed in the middle.No matter which kind of blade profile all has circumferential speed, and turning to of direction and impeller is consistent.If the fin that impeller air outlet place is provided with, radial radiation is arranged, and the direction of air of fin air intake leading edge and outflow impeller has an angle, is referred to as the angle of attack in the aerodynamics usually.The angle of attack is big more, and the flow through flow losses (resistance) of fin of air are also just big more, and this will reduce air mass flow, be unfavorable for heat radiation.In order to reduce the angle of attack, the fin (6) round impeller (3) can be toppled over along impeller (3) rotation direction, as shown in figure 11, so just can reduce the angle of attack.Can also adopt following method: will round the air intake leading edge of the fin (6) of impeller (3) anti-the crooked or bending of impeller (3) rotation direction, as shown in figure 12.Fin (6) is bent, and the flow channel of forming between the fin (6) is exactly a diffusion flow-guiding channel, and fin this moment (6) not only plays a part the cross-ventilation heat exchange, or air deflector, plays a part the water conservancy diversion diffusion.Fin among Figure 13 (6) has adopted shutter short rib shape fin, the direction (in the air intake leading edge) of the short rib bending of shutter should be anti-the direction bending of wheel rotation.The pin pole structure does not have direction, the angle of attack in air-flow.
In the radiator shown in Figure 14, heat-conducting plate (4) middle opening, air enters fan from a side shaft of heat-conducting plate to passing opening, a plurality of electronic devices (8) of being cooled disperse to be arranged on the heat-conducting plate (4) by fin root place, such radiator is not suitable for the heat radiation of CPU in the computer or GPU chip, but be very suitable for the heat radiation of the illuminating LED of picture, because LED can disperse, evenly be arranged on dispersedly by fin root place, then reduced the heat conduction distance in the heat-conducting plate (4), this is very beneficial for conducting heat, and can reduce the thickness of heat-conducting plate, i.e. material saving.
Claims (7)
1. radiator for semi-conductor electronic device, include: heat-conducting plate (4), cross-ventilation expansion heat-transfer surface (2), fan (1), cross-ventilation expansion heat-transfer surface (2) and fan (1) are arranged on the same one side of heat-conducting plate (4), the electronic device that is cooled is characterized in that at another side: fan (1) is a centrifugal fan; Cross-ventilation expansion heat-transfer surface (2) is formed circular arc, round the impeller (3) of fan, faces impeller (3) air outlet; Cross-ventilation expansion heat-transfer surface (2) welds or is bonded on the heat-conducting plate (4);
Cross-ventilation expansion heat-transfer surface (2) adopted pin pole structure rib post,
Or cross-ventilation expansion heat-transfer surface (2) has adopted corrugated structure or laminated structure fin, fin (6) round impeller (3) is toppled over along the rotation direction of impeller (3), or round the air intake leading edge of the fin (6) of impeller (3) anti-the rotation direction bending or the bending of impeller (3).
2. radiator for semi-conductor electronic device according to claim 1 is characterized in that: fin (6) has adopted fork row short rib shape or shutter short rib shape enhanced heat exchange structure.
3. according to claim 1 or 2 described radiator for semi-conductor electronic device, it is characterized in that: the thickness of fin (6) is no more than 0.4mm, and the rib height is no more than 20mm.
4. according to claim 1 or 2 described radiator for semi-conductor electronic device, it is characterized in that: fin (6) round fan (1) radial direction have two-layer or two-layer more than.
5. radiator for semi-conductor electronic device according to claim 1 is characterized in that: the average pitch of fins of fin (6) is not more than 1.6mm.
6. radiator for semi-conductor electronic device according to claim 2 is characterized in that: the average pitch of fins of fin (6) is not more than 2.0mm.
7. according to claim 1 or 2 described radiator for semi-conductor electronic device, it is characterized in that: heat-conducting plate (4) and cross-ventilation expansion heat-transfer surface (2) all adopt aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810216143 CN101364576B (en) | 2008-09-19 | 2008-09-19 | Radiator for semi-conductor electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810216143 CN101364576B (en) | 2008-09-19 | 2008-09-19 | Radiator for semi-conductor electronic device |
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| Publication Number | Publication Date |
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| CN101364576A CN101364576A (en) | 2009-02-11 |
| CN101364576B true CN101364576B (en) | 2011-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200810216143 Expired - Fee Related CN101364576B (en) | 2008-09-19 | 2008-09-19 | Radiator for semi-conductor electronic device |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018207033B3 (en) * | 2018-05-07 | 2019-07-04 | Siemens Aktiengesellschaft | Arrangement of electrical modules, power converters and aircraft with such an arrangement and method for producing the arrangement |
| CN111197585B (en) * | 2018-11-16 | 2021-09-14 | 神讯电脑(昆山)有限公司 | Centrifugal fan and heat dissipation system |
| CN109696951A (en) * | 2018-12-27 | 2019-04-30 | 联想(北京)有限公司 | A kind of host and its video card |
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| CN101212891A (en) * | 2006-12-28 | 2008-07-02 | 日本电产株式会社 | Heat sink fan |
| CN101227813A (en) * | 2007-01-15 | 2008-07-23 | 日本电产株式会社 | Radiator, heat sink fan, and radiator manufacturing method |
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- 2008-09-19 CN CN 200810216143 patent/CN101364576B/en not_active Expired - Fee Related
Patent Citations (10)
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| GB2287837A (en) * | 1994-03-09 | 1995-09-27 | Ming Der Chiou | CPU cooling device |
| CN1430269A (en) * | 2001-12-29 | 2003-07-16 | 台达电子工业股份有限公司 | Side-blow heat radiator |
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| EP1621970A2 (en) * | 2004-07-30 | 2006-02-01 | Kabushiki Kaisha Toshiba | Electronic apparatus with cooling device |
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