CN1946276A - Pulse heat pipe radiator for electronic cooling - Google Patents
Pulse heat pipe radiator for electronic cooling Download PDFInfo
- Publication number
- CN1946276A CN1946276A CNA2006100324909A CN200610032490A CN1946276A CN 1946276 A CN1946276 A CN 1946276A CN A2006100324909 A CNA2006100324909 A CN A2006100324909A CN 200610032490 A CN200610032490 A CN 200610032490A CN 1946276 A CN1946276 A CN 1946276A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- pulsating heat
- radiating
- section
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
This invention discloses a pulse thermotube radiator used in electronic cooling including a radiation base, radiation fins and a pulse thermotube, in which, the radiation fins are parallel- welded on the radiation base vertically, the pulse thermotube is a snake circuit formed by a bended capillary Cu tube to be welded, it is bended at the middle, the lower part is welded in the radiation base, the upper part passes through the through hole of the fins and welded together with the fins, when using, the central position of the radiation base is close to the electronic device, the pulse thermotube not only transfers heat from the center of the radiation base to circumference to turn the base to a warm uniform plate, but also transfers heat to its upper part and the radiation fins so as to increase the efficiency of fins.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of pulsating heat pipe radiator that is used for the electronics cooling.
Background technology
The current radiator kind that is used for desktop cpu is a lot, and technology is constantly ripe, and self-cold radiating device, air-cooled radiator, water-filled radiator, semiconductor cooler and heat-pipe radiator are arranged.When heat sink technology was constantly ripe, also in continuous development, integration density was increasing for the electronics packaging technology, and the heat density of its generation is also increasing.In the CPU of the Intel processor of same size, power mostly between 20W-50W, have in addition surpass 50W.Therefore, require very highly for the heat-sinking capability of radiator, the self-cold radiating device can not meet the demands, and the semiconductor cooler inefficiency also is not suitable for the electronic component of big power consumption.The more of usefulness is air-cooled and water-filled radiator in the market, yet separately very big weakness arranged all.
Air-cooled radiator is mainly driven by blower fan, strengthens the forced heat-exchanging of radiating fin and air, improves heat-sinking capability.Wind speed is high more, and heat-sinking capability is good more, but has also increased the wearing and tearing of blower fan simultaneously, reduces its useful life, and fan noise obviously increases more than 6000 commentaries on classics.
As cooling working medium, radiating effect is significant more than air-cooled, forms defectives such as structure is numerous and diverse, volume and weight is big, pump noise is big but it exists, and is not easy to generally promote with water for water-filled radiator.
Summary of the invention
For solving the existing technical problem of above-mentioned radiator, the invention provides that a kind of volume is little, in light weight, cost is low, easy to process, heat transfer efficiency is high, the stable and muting pulsating heat pipe radiator that is used for the electronics cooling.
The technical scheme that the present invention solves the problems of the technologies described above is: comprise that radiating seat, some parallel longitudinals are welded in the radiating fin on the radiating seat, also be provided with a pulsating heat pipe, pulsating heat pipe is the snakelike loop of sealing, be divided into bringing-up section and cooling section, bringing-up section embeds in the radiating seat, cooling section passes from the through hole of radiating fin, and welds together with radiating fin.
The above-mentioned heat-pipe radiator that is used for the electronics cooling, described pulsating heat pipe is upwards to stretch in the radiating fin again for one section by thin copper pipe complications in radiating seat, behind tortuous one section of radiating fin, stretch in the radiating seat tortuous downwards, upwards stretch into again in the radiating fin then, be in turn connected into the snakelike loop of a sealing like this.
Technique effect of the present invention is: pulsating heat pipe upwards stretches in the radiating fin for one section by thin copper pipe complications in radiating seat again among the present invention, behind tortuous one section of radiating fin, stretch in the radiating seat tortuous downwards, upwards stretch in the radiating fin again then, be in turn connected into the snakelike loop of a sealing like this, the different local heats of radiating seat can pass on the radiating fin with the mobile of working media simultaneously like this, lower the temperature by radiating fin, because thin copper pipe has very low heat transfer resistance, and pulsating heat pipe is snakelike loop, its contact area is bigger, pulsating heat pipe not only reaches periphery with the heating of electronic device from the center of radiating seat like this, make radiating seat become a temperature-uniforming plate, also heat is reached its first half, and pass to radiating fin, thereby improve the efficient of fin greatly.In addition, have originally that volume is little, in light weight, cost is low, heat transfer efficiency is high, an advantage such as stable and noiseless, be suitable for the cooling of modern high energy consumption electronic devices such as CPU.
Description of drawings
Fig. 1 structural representation of the present invention.
Embodiment
Referring to Fig. 1, the present invention includes radiating fin 1, pulsating heat pipe 2 and radiating seat 3.Parallel longitudinal is welded in the some diffusing stainless steel hot fin 1 on the radiating seat on the radiating seat 3, be milled with groove on the radiating seat 3, pulsating heat pipe 2 is the snakelike loops that formed by capillary bending and welding, by bending in the middle of it, the latter half is welded in the groove, and as heating section, the first half is passed from the through hole of fin 1, and weld together, as cooling section.Pulsating heat pipe 2 is provided with the interface 4 of a sealing, is used to vacuumize
In the production process of radiator, require heat pipe copper pipe cleaning inside, in copper pipe when welding, is seamless, and the welding between fin 1, pulsating heat pipe 2 and radiating seat 3 requires closely with contact, in pulsating heat pipe 2 by guaranteeing the sealing of interface 4 behind the interface 4 injection working medias.Under the heat radiation situation of difficult, increase fin 1 area that can be suitable or increase one or more axial flow blowers.
Operation principle of the present utility model: the utility model pulsating heat pipe radiator is bonded in its center with heat-conducting glue or silicone grease with the electronic device (as CPU) that is cooled in use, or with the way that clamps the two is fully contacted.The heat that is distributed by electronic device passes to the heating section of pulsating heat pipe 2 by radiating seat 3, because heating section evenly distributes on radiating seat 3, makes the received heat of radiating seat 3 centers scatter very soon, has reduced the temperature of center.A part of heat on the base is passed to the radiating fin of base near-end, and another part heat is absorbed by the pulsating heat pipe heating section, and reaches its cooling section by pulsating heat pipe very soon, passes to the radiating fin of base far-end then, is distributed in the air then.Improved the heat transfer efficiency of radiating fin so greatly.
Claims (4)
1, a kind of pulsating heat pipe radiator that is used for the electronics cooling, comprise that radiating seat, some parallel longitudinals are welded in the radiating fin on the radiating seat, it is characterized in that: also be provided with a pulsating heat pipe, pulsating heat pipe is the snakelike loop of sealing, be divided into bringing-up section and cooling section, bringing-up section embeds in the radiating seat, and cooling section passes from the through hole of radiating fin, and welds together with radiating fin.
2, the pulsating heat pipe radiator that is used for the electronics cooling according to claim 1 is characterized in that: described pulsating heat pipe is to make of thin copper pipe.
3, the pulsating heat pipe radiator that is used for the electronics cooling according to claim 2, it is characterized in that: described pulsating heat pipe is upwards to stretch in the radiating fin again for one section by thin copper pipe complications in radiating seat, behind tortuous one section of radiating fin, stretch in the radiating seat tortuous downwards, upwards stretch into again in the radiating fin then, be in turn connected into the snakelike loop of a sealing like this.
4, according to claim 1 or the 2 or 3 described pulsating heat pipe radiators that are used for the electronics cooling, it is characterized in that: fill 50% hydraulic fluid in the described pulsating heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100324909A CN100435609C (en) | 2006-10-31 | 2006-10-31 | Pulse heat pipe radiator for electronic cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100324909A CN100435609C (en) | 2006-10-31 | 2006-10-31 | Pulse heat pipe radiator for electronic cooling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1946276A true CN1946276A (en) | 2007-04-11 |
| CN100435609C CN100435609C (en) | 2008-11-19 |
Family
ID=38045418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100324909A Expired - Fee Related CN100435609C (en) | 2006-10-31 | 2006-10-31 | Pulse heat pipe radiator for electronic cooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100435609C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101818999A (en) * | 2010-04-20 | 2010-09-01 | 中南大学 | Pulsating heat pipe heat-transfer device for low grade heat energy utilization |
| CN101291570B (en) * | 2007-04-20 | 2011-06-29 | 富准精密工业(深圳)有限公司 | Heat pipe radiator and manufacturing method thereof |
| WO2011137776A1 (en) * | 2010-11-11 | 2011-11-10 | 华为技术有限公司 | Heat radiating apparatus |
| EP2876400A1 (en) * | 2013-11-20 | 2015-05-27 | ABB Oy | Cooling element |
| CN105633037A (en) * | 2016-01-08 | 2016-06-01 | 西安交通大学 | Pulsation heat pipe radiating apparatus for cooling chips |
| CN105929915A (en) * | 2016-04-08 | 2016-09-07 | 吉首大学 | CPU temperature monitoring and heat dissipation device |
| WO2018090398A1 (en) * | 2016-11-18 | 2018-05-24 | 佛山市蓝方科技有限公司 | Fireplace self-power device with high power generation capacity |
| CN112996358A (en) * | 2021-02-18 | 2021-06-18 | 南京航空航天大学 | Wedge-shaped turbulent flow phase change heat sink device and method based on pulsating heat pipe |
| EP3816562B1 (en) * | 2019-10-31 | 2023-05-03 | Hamilton Sundstrand Corporation | Oscillating heat pipe integrated thermal management system for power electronics |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10220915A (en) * | 1997-02-05 | 1998-08-21 | Sanyo Electric Co Ltd | Refrigerator |
-
2006
- 2006-10-31 CN CNB2006100324909A patent/CN100435609C/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101291570B (en) * | 2007-04-20 | 2011-06-29 | 富准精密工业(深圳)有限公司 | Heat pipe radiator and manufacturing method thereof |
| CN101818999A (en) * | 2010-04-20 | 2010-09-01 | 中南大学 | Pulsating heat pipe heat-transfer device for low grade heat energy utilization |
| CN101818999B (en) * | 2010-04-20 | 2011-05-18 | 中南大学 | Pulsating heat pipe heat-transfer device for low grade heat energy utilization |
| WO2011137776A1 (en) * | 2010-11-11 | 2011-11-10 | 华为技术有限公司 | Heat radiating apparatus |
| US8737071B2 (en) | 2010-11-11 | 2014-05-27 | Huawei Technologies Co., Ltd. | Heat dissipation device |
| EP2876400A1 (en) * | 2013-11-20 | 2015-05-27 | ABB Oy | Cooling element |
| CN105633037A (en) * | 2016-01-08 | 2016-06-01 | 西安交通大学 | Pulsation heat pipe radiating apparatus for cooling chips |
| CN105929915A (en) * | 2016-04-08 | 2016-09-07 | 吉首大学 | CPU temperature monitoring and heat dissipation device |
| WO2018090398A1 (en) * | 2016-11-18 | 2018-05-24 | 佛山市蓝方科技有限公司 | Fireplace self-power device with high power generation capacity |
| EP3816562B1 (en) * | 2019-10-31 | 2023-05-03 | Hamilton Sundstrand Corporation | Oscillating heat pipe integrated thermal management system for power electronics |
| CN112996358A (en) * | 2021-02-18 | 2021-06-18 | 南京航空航天大学 | Wedge-shaped turbulent flow phase change heat sink device and method based on pulsating heat pipe |
| CN112996358B (en) * | 2021-02-18 | 2022-04-08 | 南京航空航天大学 | Wedge-shaped turbulent flow phase change heat sink device based on pulsating heat pipe and heat exchange method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100435609C (en) | 2008-11-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081119 Termination date: 20091130 |