CN2904296Y - IC water cooler - Google Patents
IC water cooler Download PDFInfo
- Publication number
- CN2904296Y CN2904296Y CN 200620200257 CN200620200257U CN2904296Y CN 2904296 Y CN2904296 Y CN 2904296Y CN 200620200257 CN200620200257 CN 200620200257 CN 200620200257 U CN200620200257 U CN 200620200257U CN 2904296 Y CN2904296 Y CN 2904296Y
- Authority
- CN
- China
- Prior art keywords
- cooling
- radiator
- water
- cooling water
- water pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a water cooling unit with an integrate circuit(IC), pertaining to the technical sector of coolers, comprising a cooling water jacket, a water pump and a radiator both connecting the cooling water jacket in series through water pipes. Between the cooling pipelines of the radiator are furnished with heat exchanging fins in two paralleled wave ribbons and between such heat exchanging fins are provided with belt spacers. In comparison with currently available technologies, with respect to radiators of an identical volume size, the utility model may remarkably add the radiating area of the radiation belt, and improve the radiator's capacity; in other words, the utility model is capable of considerably reducing a radiator's volume size and the weight with identical radiation performance requirements, and thereby enhance the radiator's connection strength in a great margin and the equipment reliability as well, avoiding using of any lead-containing solder and any environmental contamination arisen.
Description
Technical field
The utility model relates to the cooler technical field, especially a kind of cooling device that is used for cooling integrated circuit.
Background technology
Some integrated level height, volume is little but integrated circuit that power consumption is relatively large, as the central processing unit (CPU) integrated circuit, if untimely the distributing of heat of its generation of when work, will influence the operate as normal of integrated circuit, when serious even can cause that device is overheated to be burnt out.The cooling device of existing integrated circuit is the water cooling plant of central processing unit (CPU) integrated circuit commonly, this water cooling plant is by being sleeved on the outer cooling jacket of central processing unit (CPU) integrated circuit heating face and by the be in series water pump, radiator of connection and form to the blower fan of radiator air blast etc. of water pipe and this cooling jacket.And the fin between its cooling water pipe of the radiator of this integrated circuit water cooling plant is the wave belt that adopts wall scroll, the radiator of this structure, heat exchange area between the air of the heat of the water in its cooling water pipe and the radiator of flowing through is limited, if just strengthen the volume of radiator simply, not only often be subjected to the restriction of electronic equipment volume, and can cross the weight that increases equipment greatly.Therefore, under the service condition of limited volume and weight, existing this integrated circuit water cooling plant is not good to the heat radiation cooling effect of integrated circuit.In addition, existing its material of this radiator has two kinds of copper and aluminium matter.The wherein backplate in the former cooling water pipe, fin, the outside and the mutual connections such as hydroecium that are connected in the cooling water pipe two ends, all be to adopt tin or tin-lead solder to weld, the intensity that this connection one is a scolder is little, the 2nd, scolder is different with material between the member, the coefficient of expansion is inconsistent, sealing-off takes place in this syndeton easily under the frequent repeatedly working condition that colds and heat succeed each other, the reliability of device is still not high enough, and the 3rd, leaded have pollution to environment.Wherein the latter's material is aluminium and aluminium alloy, and its cold-resistant but corrosion and electrochemical corrosion resistant performance are all relatively poor, and the perforation leakage that in use is corroded easily makes the reliability extreme difference of device.
Summary of the invention
The purpose of this utility model provides a kind of integrated circuit water cooling plant, and what it mainly solved is the not good problem of cooling effect under the little and lightweight condition of volume.
In order to address the above problem, the scheme that the utility model adopted is:
Water pump and radiator that it includes cooling jacket, is in series and connects by water pipe and described cooling jacket, the heat exchange fin that two wave belt shapes are arranged between the cooling water pipe of described radiator and the cooling water pipe side by side is equipped with banded partition between these two heat exchange fins.
The heat exchange fin that two wave belt shapes can be arranged between the cooling water pipe of above-mentioned radiator and the side guard plate side by side can be equipped with banded partition between these two heat exchange fins; The intake chamber of above-mentioned radiator and water-supplying chamber can be arranged side by side, and they can be communicated with hydroecium in the middle of by many described cooling water pipes respectively; The intake chamber of above-mentioned radiator, water-supplying chamber, cooling water pipe, fin, partition and backplate can adopt copper material to make, and the connection between these members can be corronil scolder soldered joint.
Owing to adopted such scheme, the utility model compared with prior art has following beneficial effect:
1, can under identical radiator volume size condition, enlarge markedly the heat-sinking capability of the area of dissipation raising radiator of heat-radiation belt; Can under the requirement of satisfying identical heat dispersion, significantly reduce the volume size and the weight of radiator.
2, improve the radiator bonding strength significantly, improve the reliability of device.
3, exempt solder containing pb, avoided of the pollution of plumbous material environment.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
Shown in Figure 1 is the water cooling plant that is used for the central processing unit (CPU) integrated circuit, it is made of cooling jacket 5, water pump 6, radiator and the water pipe 2 that is connected them, the intake chamber 1 and the water-supplying chamber 7 of radiator are arranged side by side, and they are communicated with middle hydroecium 12 by many cooling water pipes arranged side by side 8 respectively; All be connected with side guard plate 11 in the outside between intake chamber 1 and the middle hydroecium 12, between water-supplying chamber 7 and the middle hydroecium 12.Between cooling water pipe 8 and the cooling water pipe 8, between cooling water pipe 8 and the side guard plate 11, the heat exchange fin 9 of two wave belt shapes all is housed abreast, banded partition 10 is housed between these two heat exchange fins 9, the intake chamber 1 of radiator, water-supplying chamber 7, cooling water pipe 8, heat exchange fin 9, partition 10 and backplate 11 all adopt copper material to make, and are connected to corronil scolder soldered joint between them.
The utility model is when work, and water pump 6 orders about cooling water and circulates along connecting water pipe 2 between cooling jacket 5, radiator.Be contained in the heat that the central processing unit (CPU) integrated circuit 4 on the computer motherboard 3 produces, the heat absorption end face by the cooling jacket 5 that is close together with its heat release end face conducts heat to the cooling water in the cooling jacket 5 of flowing through, and makes the cooling water heat temperature raising.The cooling that when radiator, is cooled again of cooling water flow after the intensification, and then flow back to again after water pump 6 pressurizations of flowing through in the cooling jacket 5 once more that heat absorption heats up, go round and begin again reciprocation cycle.After wherein the water inlet of the cooling water of higher temperature above intake chamber 1 enters radiator, the half of cooling water pipe 8 in the symmetrical center line of flowing through a downwards left side, hydroecium 12 in the middle of entering, upwards flow into water-supplying chamber 7 through the right half of cooling water pipe 8 of symmetrical center line again, when the cooling water pipe 8 that cooling water flow is half of through a symmetrical center line left side or the right side is half of, heat in the cooling water passes tube wall by the inner wall surface of cooling water pipe 8, be transmitted to the surface of heat exchange fin 9 and partition 10 through the corronil scolder, be dispersed into this surperficial air of flowing through from their surface again and be pulled away, the temperature of cooling water reduces because of emitting heat, after the cooling water that cools flows out radiator by the delivery ports above the water-supplying chamber 7, thereby finish the functional requirement that the utility model dispels the heat and cools cooling water.
Outside the utility model dewaters, also can adopt other liquid coolant.
Claims (5)
1. integrated circuit water cooling plant, water pump and radiator that it includes cooling jacket, is in series and connects by water pipe and described cooling jacket, it is characterized in that: the heat exchange fin of two wave belt shapes is arranged between the cooling water pipe of described radiator and the cooling water pipe side by side, banded partition is housed between these two heat exchange fins.
2. integrated circuit water cooling plant according to claim 1 is characterized in that: the heat exchange fin of two wave belt shapes is arranged between the cooling water pipe of described radiator and the side guard plate side by side, banded partition is housed between these two heat exchange fins.
3. integrated circuit water cooling plant according to claim 1 and 2 is characterized in that: the intake chamber and the water-supplying chamber of described radiator are arranged side by side, and they are communicated with hydroecium in the middle of by many described cooling water pipes respectively.
4. integrated circuit water cooling plant according to claim 1 and 2, it is characterized in that: the intake chamber of described radiator, water-supplying chamber, cooling water pipe, fin, partition and backplate adopt copper material to make, and are connected to corronil scolder soldered joint between these members.
5. integrated circuit water cooling plant according to claim 3 is characterized in that: the intake chamber of described radiator, water-supplying chamber, cooling water pipe, fin, partition and backplate adopt copper material to make, and are connected to corronil scolder soldered joint between these members.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620200257 CN2904296Y (en) | 2006-03-14 | 2006-03-14 | IC water cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620200257 CN2904296Y (en) | 2006-03-14 | 2006-03-14 | IC water cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2904296Y true CN2904296Y (en) | 2007-05-23 |
Family
ID=38079709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620200257 Expired - Lifetime CN2904296Y (en) | 2006-03-14 | 2006-03-14 | IC water cooler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2904296Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017012336A1 (en) * | 2015-07-23 | 2017-01-26 | 中兴通讯股份有限公司 | Water cooling system on board module level |
| CN108024488A (en) * | 2018-01-09 | 2018-05-11 | 无锡巨日电子科技有限公司 | Water-jacket typ circuit plate heat dissipating device |
| CN112179163A (en) * | 2020-09-14 | 2021-01-05 | 东莞汉旭五金塑胶科技有限公司 | Water-cooling radiator capable of increasing radiating area |
-
2006
- 2006-03-14 CN CN 200620200257 patent/CN2904296Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017012336A1 (en) * | 2015-07-23 | 2017-01-26 | 中兴通讯股份有限公司 | Water cooling system on board module level |
| CN108024488A (en) * | 2018-01-09 | 2018-05-11 | 无锡巨日电子科技有限公司 | Water-jacket typ circuit plate heat dissipating device |
| CN108024488B (en) * | 2018-01-09 | 2023-10-17 | 无锡巨日电子科技有限公司 | Water jacket type circuit board heat abstractor |
| CN112179163A (en) * | 2020-09-14 | 2021-01-05 | 东莞汉旭五金塑胶科技有限公司 | Water-cooling radiator capable of increasing radiating area |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070523 |
|
| EXPY | Termination of patent right or utility model |