CN100435609C - Pulsating Heat Pipe Heat Sinks for Electronics Cooling - Google Patents
Pulsating Heat Pipe Heat Sinks for Electronics Cooling Download PDFInfo
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- CN100435609C CN100435609C CNB2006100324909A CN200610032490A CN100435609C CN 100435609 C CN100435609 C CN 100435609C CN B2006100324909 A CNB2006100324909 A CN B2006100324909A CN 200610032490 A CN200610032490 A CN 200610032490A CN 100435609 C CN100435609 C CN 100435609C
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- Prior art keywords
- heat
- heat pipe
- heat dissipation
- cooling
- pulsating
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- 238000001816 cooling Methods 0.000 title claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 24
- 238000005452 bending Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 2
- 230000010349 pulsation Effects 0.000 abstract 2
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明公开了一种用于电子冷却的脉动热管散热器，包括散热座、散热翅片、脉动热管，散热翅片纵向平行焊接于散热座上，脉动热管是由毛细铜管弯折和焊接形成的蛇形回路，通过将其中间弯折，下半部分焊接在散热座内，上半部分从散热翅片的通孔中穿过，并与散热翅片焊接在一起。使用时，将散热座中心位置紧贴电子器件放置，脉动热管不仅将电子器件的发热从散热座的中心位置传至周边，使底座成为一块均温板，还将热量传至其上半部分，并传给散热翅片，从而大大提高翅片的效率。本发明是一种体积小、重量轻、传热效率高、成本低、加工方便、无噪声的新型散热器，具有广泛的应用推广价值。
The invention discloses a pulsating heat pipe radiator for electronic cooling, which comprises a heat dissipation seat, a heat dissipation fin, and a pulsation heat pipe. The heat dissipation fins are longitudinally and parallel welded on the heat dissipation seat, and the pulsation heat pipe is formed by bending and welding a capillary copper tube. By bending the middle of the serpentine loop, the lower half is welded in the heat sink, and the upper half passes through the through hole of the heat dissipation fin and is welded together with the heat dissipation fin. When in use, place the center of the heat sink close to the electronic device. The pulsating heat pipe not only transmits the heat of the electronic device from the center of the heat sink to the surrounding area, making the base a uniform temperature plate, but also transfers the heat to the upper part. And pass to the cooling fins, thereby greatly improving the efficiency of the fins. The invention is a novel radiator with small volume, light weight, high heat transfer efficiency, low cost, convenient processing and no noise, and has wide application and popularization value.
Description
技术领域 technical field
本发明涉及一种散热装置，特别涉及一种用于电子冷却的脉动热管散热器。The invention relates to a cooling device, in particular to a pulsating heat pipe radiator for electronic cooling.
背景技术 Background technique
当前用于台式电脑CPU的散热器种类很多，技术不断成熟，有自冷散热器、风冷散热器、水冷散热器、半导体制冷器和热管散热器。在散热器技术不断成熟的同时，电子组装技术也在不断的发展，集成密度越来越大，其产生的热量密度也在增加。同样尺寸的英特尔CPU处理器中，功率大都在20W-50W之间，有的甚至超过50W。因此，对于散热器的散热能力要求很高，自冷散热器已经不能满足要求了，半导体制冷器工作效率低，亦不适用于大功耗的电子元件。目前市场上用的较多的是风冷和水冷散热器，然而各自均有很大的弱点。There are many types of radiators currently used for desktop computer CPUs, and the technology is constantly maturing, including self-cooling radiators, air-cooling radiators, water-cooling radiators, semiconductor refrigerators and heat pipe radiators. While heat sink technology continues to mature, electronic assembly technology is also developing continuously, the integration density is getting higher and higher, and the heat density generated by it is also increasing. Among the Intel CPU processors of the same size, the power is mostly between 20W-50W, and some even exceed 50W. Therefore, the heat dissipation capability of the radiator is very high, and the self-cooling radiator can no longer meet the requirements. The semiconductor refrigerator has low working efficiency and is not suitable for electronic components with large power consumption. At present, air-cooled and water-cooled radiators are mostly used in the market, but each has its own great weakness.
风冷散热器主要由风机带动，增强散热翅片与空气的强制换热，提高散热能力。风速越高，散热能力越好，但同时也增加了风机的磨损，减少其使用寿命，风机噪声在6000转以上明显增大。The air-cooled radiator is mainly driven by a fan to enhance the forced heat exchange between the cooling fins and the air and improve the heat dissipation capacity. The higher the wind speed, the better the cooling capacity, but it also increases the wear of the fan and reduces its service life. The noise of the fan increases significantly above 6000 rpm.
水冷散热器以水作为冷却工质，散热效果比风冷显著的多，但是其存在组成结构繁杂、体积和重量大、水泵噪音大等缺陷，不便于普遍推广。Water-cooled radiators use water as the cooling medium, and the heat dissipation effect is much more significant than that of air-cooled radiators. However, it has defects such as complicated composition and structure, large volume and weight, and loud pump noise, which is not easy to be widely promoted.
发明内容 Contents of the invention
为解决上述散热器所存在的技术问题，本发明提供一种体积小、重量轻、成本低、加工方便、传热效率高、运行稳定且无噪声的用于电子冷却的脉动热管散热器。In order to solve the technical problems of the above radiators, the present invention provides a pulsating heat pipe radiator for electronic cooling that is small in size, light in weight, low in cost, convenient in processing, high in heat transfer efficiency, stable in operation and noiseless.
本发明解决上述技术问题的技术方案是：包括散热座、若干纵向平行焊接于散热座上的散热翅片，还设有一脉动热管，脉动热管为封闭的蛇形回路，分为加热段和冷却段，加热段嵌入散热座中，冷却段从散热翅片的通孔中穿过，并与散热翅片焊接在一起，所述脉动热管是由细铜管在散热座中曲折一段再向上伸入散热翅片中，在散热翅片曲折一段后再向下伸入散热座中曲折，然后又向上伸入散热翅片中，这样依次连接成一封闭的蛇形回路。The technical solution of the present invention to solve the above-mentioned technical problems is: comprising a cooling seat, a plurality of cooling fins longitudinally parallel welded on the cooling seat, and a pulsating heat pipe, which is a closed serpentine circuit, divided into a heating section and a cooling section , the heating section is embedded in the heat dissipation seat, the cooling section passes through the through hole of the heat dissipation fin, and is welded together with the heat dissipation fin. In the fins, after the heat dissipation fins are bent for a while, they extend downwards into the heat dissipation seat, and then extend upwards into the heat dissipation fins, so that they are sequentially connected to form a closed serpentine circuit.
本发明的技术效果在于：本发明中脉动热管由细铜管在散热座中曲折一段再向上伸入散热翅片中，在散热翅片曲折一段后再向下伸入散热座中曲折，然后又向上伸入散热翅片中，这样依次连接成一封闭的蛇形回路，这样散热座不同地方的热量可同时随传热介质的流动传到散热翅片上，通过散热翅片降温，由于细铜管具有很低的传热热阻，且脉动热管是蛇形回路，其接触面积较大，这样脉动热管不仅将电子器件的发热从散热座的中心位置传至周边，使散热座成为一块均温板，还将热量传至其上半部分，并传给散热翅片，从而大大提高翅片的效率。另外，本具有体积小、重量轻、成本低、传热效率高、运行稳定且无噪声等优点，适合于CPU等现代高能耗电子器件的冷却。The technical effect of the present invention is: the pulsating heat pipe in the present invention bends a thin copper tube in the heat sink for a section and then extends upward into the heat dissipation fins, and then extends downwards into the heat dissipation seat after the heat dissipation fins are bent for a section, and then bends again It extends upward into the heat dissipation fins, and is connected in turn to form a closed serpentine circuit. In this way, the heat from different parts of the heat dissipation seat can be transferred to the heat dissipation fins with the flow of the heat transfer medium at the same time, and the temperature is lowered through the heat dissipation fins. Since the thin copper tube has Very low heat transfer resistance, and the pulsating heat pipe is a serpentine circuit with a large contact area, so that the pulsating heat pipe not only transmits the heat of the electronic device from the center of the heat sink to the periphery, making the heat sink a uniform temperature plate, It also transfers heat to its upper half and to the cooling fins, thereby greatly improving the efficiency of the fins. In addition, this product has the advantages of small size, light weight, low cost, high heat transfer efficiency, stable operation and no noise, and is suitable for cooling modern high-energy-consuming electronic devices such as CPUs.
附图说明 Description of drawings
图1本发明的结构示意图。Fig. 1 is a structural schematic diagram of the present invention.
具体实施方式 Detailed ways
参见图1，本发明包括散热翅片1、脉动热管2和散热座3。散热座3上纵向平行焊接于散热座上的若干散不锈钢热翅片1，散热座3上铣有凹槽，脉动热管2是由毛细管弯折和焊接形成的蛇形回路，通过将其中间弯折，下半部分焊接在凹槽里，作为受热段，上半部分从翅片1的通孔中穿过，并焊接在一起，作为冷却段。脉动热管2上设有一个封闭的接口4，用于抽真空和充传热介质用。脉动热管2内充注50％左右的传热介质。Referring to FIG. 1 , the present invention includes a cooling fin 1 , a pulsating heat pipe 2 and a
在散热器的生产过程中，要求热管铜管内部清洁，铜管焊接时无缝隙，在翅片1、脉动热管2和散热座3之间的焊接和接触要求紧密，在脉动热管2内通过工艺管6注入工质后要保证工艺管6的密封。在散热困难的情况下，可以适当的增加翅片1面积或者增加一个或多个轴流风机。In the production process of the radiator, it is required that the inside of the copper tube of the heat pipe is clean, and there is no gap when the copper tube is welded. After the tube 6 is injected with the working medium, the sealing of the process tube 6 must be ensured. In the case of difficult heat dissipation, the area of the fin 1 can be appropriately increased or one or more axial flow fans can be added.
本发明的工作原理：本发明脉动热管散热器在使用时，用导热胶或硅脂将被冷却的电子器件(如CPU)粘合在其中心位置，或用夹紧的办法使二者充分接触。由电子器件散发的热量通过散热座3传递给脉动热管2的受热段，由于受热段在散热座3上均匀分布，使得散热座3中心位置的受热量很快散开，降低了中心位置的温度。底座上的一部分热量传给底座近端的散热翅片，另一部分热量被脉动热管受热段吸收，并很快通过脉动热管传至其冷却段，然后传给底座远端的散热翅片，然后散发至空气中。这样大大提高了散热翅片的传热效率。The working principle of the present invention: when the pulsating heat pipe radiator of the present invention is in use, the cooled electronic device (such as CPU) is bonded to its central position with thermal conductive glue or silicone grease, or the two are fully contacted by clamping. . The heat dissipated by the electronic device is transferred to the heating section of the pulsating heat pipe 2 through the
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100324909A CN100435609C (en) | 2006-10-31 | 2006-10-31 | Pulsating Heat Pipe Heat Sinks for Electronics Cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100324909A CN100435609C (en) | 2006-10-31 | 2006-10-31 | Pulsating Heat Pipe Heat Sinks for Electronics Cooling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1946276A CN1946276A (en) | 2007-04-11 |
| CN100435609C true CN100435609C (en) | 2008-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006100324909A Expired - Fee Related CN100435609C (en) | 2006-10-31 | 2006-10-31 | Pulsating Heat Pipe Heat Sinks for Electronics Cooling |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101291570B (en) * | 2007-04-20 | 2011-06-29 | 富准精密工业(深圳)有限公司 | Heat pipe radiator and manufacturing method thereof |
| CN101818999B (en) * | 2010-04-20 | 2011-05-18 | 中南大学 | Pulsating heat pipe heat-transfer device for low grade heat energy utilization |
| CN102130080B (en) * | 2010-11-11 | 2012-12-12 | 华为技术有限公司 | Heat radiation device |
| EP2876400B1 (en) * | 2013-11-20 | 2016-10-05 | ABB Technology Oy | Cooling element |
| CN105633037A (en) * | 2016-01-08 | 2016-06-01 | 西安交通大学 | Pulsation heat pipe radiating apparatus for cooling chips |
| CN105929915A (en) * | 2016-04-08 | 2016-09-07 | 吉首大学 | CPU temperature monitoring and heat dissipation device |
| CN206272526U (en) * | 2016-11-18 | 2017-06-20 | 佛山市蓝方科技有限公司 | A kind of big fireplace self-generating device of generated energy |
| US11051428B2 (en) * | 2019-10-31 | 2021-06-29 | Hamilton Sunstrand Corporation | Oscillating heat pipe integrated thermal management system for power electronics |
| CN112996358B (en) * | 2021-02-18 | 2022-04-08 | 南京航空航天大学 | Wedge-shaped turbulent flow phase change heat sink device based on pulsating heat pipe and heat exchange method |
| CN114071955A (en) * | 2021-10-28 | 2022-02-18 | 上海电气风电集团股份有限公司 | Cooling device and electronic equipment comprising same |
| TWM662068U (en) * | 2024-06-26 | 2024-10-21 | 酷碼科技股份有限公司 | Air-cooled radiator |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10220915A (en) * | 1997-02-05 | 1998-08-21 | Sanyo Electric Co Ltd | Refrigerator |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10220915A (en) * | 1997-02-05 | 1998-08-21 | Sanyo Electric Co Ltd | Refrigerator |
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