GB2287837A - CPU cooling device - Google Patents

CPU cooling device Download PDF

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Publication number
GB2287837A
GB2287837A GB9415495A GB9415495A GB2287837A GB 2287837 A GB2287837 A GB 2287837A GB 9415495 A GB9415495 A GB 9415495A GB 9415495 A GB9415495 A GB 9415495A GB 2287837 A GB2287837 A GB 2287837A
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GB
United Kingdom
Prior art keywords
base plate
flat base
radiating fins
cooling device
cpu
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9415495A
Other versions
GB2287837B (en
GB9415495D0 (en
Inventor
Ming Der Chiou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB9415495D0 publication Critical patent/GB9415495D0/en
Publication of GB2287837A publication Critical patent/GB2287837A/en
Application granted granted Critical
Publication of GB2287837B publication Critical patent/GB2287837B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A CPU cooling device includes a radiating flange (4) having a plurality of radiating fins (402) spaced on a flat base plate (401), and a fan (5) mounted on the flat base plate and surrounded by the radiating fins. <IMAGE>

Description

CPU COOLING DEVICE BACKGROUND OF THE INVENTION The present invention relates to a CPU cooling device for cooling the CPU of an electronic apparatus, and relates more particularly to a CPU cooling device comprised of an integral radiating flange and a fan mounted on the radiating flange and surrounded by radiating fins of the radiating flange.
During the operation of the CPU of a computer system or the like, heat must be quickly carried away from the CPU so as not to damage the other components of the electronic circuit of the computer system or the like. Figure 4 shows a CPU cooling device according to the prior art, which comprises a radiating flange 2 mounted on the CPU 1 at the top by hooked joints, and a fan 3 fastened to the radiating flange 2 at the top by screws 201. When operated, currents of air are caused by the fan 3 and distributed through radial gaps between radiating fins of the radiating flange to quickly carry heat away. This structure of CPU cooling device is effective in use, however, it needs much installation space. Because the radiating flange 2 is mounted on the CPU 1 at the top and the fan 3 is fastened to the radiating flange 2 at the top, the combined height of the CPU 1, the radiating flange 2, and the fan 3 relatively increases the height of the mainframe of the computer system or the like.
SUMMARY OF THE INVENTION The present invention has been accomplished to provide a CPU cooling device which eliminates the aforesaid problem. According to one aspect of the present invention, the radiating flange has a plurality of fins integrally molded on a flat base plate thereof at the top around a circle, and therefore the mounting process of the CPU cooling device is easy. According to another aspect of the present invention, the fan is mounted on the flat base plate and surrounded by the radiating fins, and therefore the height of the radiating flange is equal to the height of the CPU cooling device. According to still another aspect of the present invention, the radiating fins are radially spaced around the fan, and therefore currents of air caused by the fan flow through the gaps among the radiating fins to quickly carry heat away.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an elevational view of a CPU cooling device according to the preferred embodiment of the present invention; Fig. 2 is an exploded view of the CPU cooling device shown in Figure 1; Fig. 3 is a sectional view of the CPU cooling device shown in Figure 1; and Fig. 4 is an installed view in section a CPU cooling device according to the prior art.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Referring to Figure 2, a CPU cooling device in accordance with the present invention is generally comprised of a radiating flange 4 and a fan 5. The radiating flange 4 comprises a base plate 401 and a plurality of radiating fins 402 integrally molded on the base plate 401 and radially spaced around a circle 403.
As an alternate form of the present invention, the radiating fins 402 at either side of the base plate 401 may be respectively arranged in parallel and disposed perpendicular to the corresponding side of the base plate 401. The diameter of the circle 403 is longer than the maximum outer diameter of the fan 5, and therefore the fan 5 can be received within the radiating fins 402. The fan 5 is a commercially available product, comprised of a stator 502 mounted on the base plate 401 in the center within the circle 403, and a rotor 503 with fan blades 501. The shaft 5031 (see Figure 3) of the rotor 503 is inserted through a center through hole 5021 on the stator 502 and a center through hole 4011 on the base plate 401 and then retained to the base plate 401 by a spring washer (not shown).
When assembled, as shown in Figures 1 and 3, the fan 5 is received within the radiating fins 402, and the topmost edge of the fan 5 does not protrude beyond the elevation of the topmost edge of the radiating fins 402. Therefore, the height of the radiating flange is the total height of the CPU cooling device. During the operation of the CPU, the fan 5 is turned to to cause currents of air, and the currents of air are sent through the gaps 4021;4022;4023 among the radiating fins 402 to carry heat away from the CPU.

Claims (4)

1. A CPU cooling device comprising a radiating flange mounted on the CPU of the mainframe of a computer system, and a fan mounted on said radiating flange and controlled to cause currents of air for removing heat from said CPU, wherein said radiating flange comprises a flat base plate, a plurality of radiating fins spaced on said flat base plate around a circle defining a plurality of air passage holes; said fan is mounted on said flat base plate within said radiating fins and disposed at an elevation below the topmost edge of said radiating fins.
2. The CPU cooling device of claim 1, wherein said radiating fins are integrally molded on said flat base plate.
3. The CPU cooling device of claim 1, wherein said radiating fins are radially spaced from one another around said circle.
4. A CPU cooling device substantially as described herein with reference to the drawings.
4. The CPU cooling device of claim 1, wherein said radiating fins are spaced from one another around said circle along four sides of said flat base plate, the radiating fins at either side of said flat base plate being disposed in parallel with one another and perpendicularly extended from the corresponding side of said flat base plate.
5. A CPU cooling device substantially as described herein with reference to the drawings.
Amendments to the claims have been filed as follows 1. A CPU cooling device comprising a radiating flange mounted on the CPU of the mainframe of a computer system, and a fan mounted on said radiating flange and controlled to cause currents of air for removing heat from said CPU, wherein said radiating flange comprises a flat base plate and a plurality of radiating fins spaced on said flat base plate around a circle defining a plurality of air passage holes; said fan being mounted on said flat base plate within said radiating fins and disposed at an elevation below the topmost edge of said radiating fins and said radiating fins being radially spaced from one another around said circle.
2. A CPU cooling device according to claim 1, wherein said radiating fins are integrally molded on said flat base plate.
3. A CPU cooling device according to claim 1 or claim 2, wherein said radiating fins are spaced from one another around said circle along four sides of said flat base plate, the radiating fins at either side of said flat base plate being disposed in parallel with one another and perpendicularly extended from the corresponding side of said flat base plate.
GB9415495A 1994-03-09 1994-08-01 CPU cooling device Expired - Fee Related GB2287837B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20903794A 1994-03-09 1994-03-09

Publications (3)

Publication Number Publication Date
GB9415495D0 GB9415495D0 (en) 1994-09-21
GB2287837A true GB2287837A (en) 1995-09-27
GB2287837B GB2287837B (en) 1997-10-08

Family

ID=22777064

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9415495A Expired - Fee Related GB2287837B (en) 1994-03-09 1994-08-01 CPU cooling device

Country Status (1)

Country Link
GB (1) GB2287837B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2309775A (en) * 1996-02-01 1997-08-06 Hewlett Packard Co A fan assisted heat sink cooling device
EP0860875A3 (en) * 1997-02-24 1999-01-07 Fujitsu Limited Heat sink and information processor using heat sink
FR2766302A1 (en) * 1997-07-17 1999-01-22 Valeo Climatisation Cooling fin configuration for vehicle radiator
US6006426A (en) * 1997-09-12 1999-12-28 Fujitsu Limited Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
GB2348277A (en) * 1996-02-01 2000-09-27 Hewlett Packard Co A fan assisted heat sink cooling device
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
GB2415545A (en) * 2005-04-29 2005-12-28 Bestec Power Electronics Co Lt Heat dissipating device
CN101364576B (en) * 2008-09-19 2011-07-20 秦彪 Radiator for semi-conductor electronic device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
EP0572326A2 (en) * 1992-05-28 1993-12-01 Fujitsu Limited Heat sink for cooling a heat producing element and application
WO1994000727A1 (en) * 1992-06-23 1994-01-06 Pcubid Computer Technology Inc. Low profile integrated heat sink and fan assembly
WO1994004013A1 (en) * 1992-08-06 1994-02-17 Pfu Limited Cooler for heat generation device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
EP0572326A2 (en) * 1992-05-28 1993-12-01 Fujitsu Limited Heat sink for cooling a heat producing element and application
WO1994000727A1 (en) * 1992-06-23 1994-01-06 Pcubid Computer Technology Inc. Low profile integrated heat sink and fan assembly
WO1994004013A1 (en) * 1992-08-06 1994-02-17 Pfu Limited Cooler for heat generation device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
GB2309775A (en) * 1996-02-01 1997-08-06 Hewlett Packard Co A fan assisted heat sink cooling device
GB2309775B (en) * 1996-02-01 2000-08-23 Hewlett Packard Co Fan assisted heat sink device
GB2348277A (en) * 1996-02-01 2000-09-27 Hewlett Packard Co A fan assisted heat sink cooling device
GB2348277B (en) * 1996-02-01 2001-02-14 Hewlett Packard Co Fan assisted heat sink device
US6227286B1 (en) 1997-02-24 2001-05-08 Fujitsu Limited Heat sink and information processor using heat sink
EP0860875A3 (en) * 1997-02-24 1999-01-07 Fujitsu Limited Heat sink and information processor using heat sink
US7828045B2 (en) 1997-02-24 2010-11-09 Fujitsu Limited Heat sink and information processor using heat sink
US6460608B2 (en) 1997-02-24 2002-10-08 Fujitsu Limited Heat sink and information processor using heat sink
FR2766302A1 (en) * 1997-07-17 1999-01-22 Valeo Climatisation Cooling fin configuration for vehicle radiator
US6006426A (en) * 1997-09-12 1999-12-28 Fujitsu Limited Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
US6240634B1 (en) 1997-09-12 2001-06-05 Fujitsu Limited Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
US6122823A (en) * 1997-09-12 2000-09-26 Fujitsu Limited Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
GB2415545A (en) * 2005-04-29 2005-12-28 Bestec Power Electronics Co Lt Heat dissipating device
GB2415545B (en) * 2005-04-29 2006-06-28 Bestec Power Electronics Co Lt Heat dissipating device
CN101364576B (en) * 2008-09-19 2011-07-20 秦彪 Radiator for semi-conductor electronic device

Also Published As

Publication number Publication date
GB2287837B (en) 1997-10-08
GB9415495D0 (en) 1994-09-21

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20000801