GB2287837B - CPU cooling device - Google Patents

CPU cooling device

Info

Publication number
GB2287837B
GB2287837B GB9415495A GB9415495A GB2287837B GB 2287837 B GB2287837 B GB 2287837B GB 9415495 A GB9415495 A GB 9415495A GB 9415495 A GB9415495 A GB 9415495A GB 2287837 B GB2287837 B GB 2287837B
Authority
GB
United Kingdom
Prior art keywords
cooling device
cpu cooling
cpu
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9415495A
Other versions
GB2287837A (en
GB9415495D0 (en
Inventor
Ming Der Chiou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB9415495D0 publication Critical patent/GB9415495D0/en
Publication of GB2287837A publication Critical patent/GB2287837A/en
Application granted granted Critical
Publication of GB2287837B publication Critical patent/GB2287837B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB9415495A 1994-03-09 1994-08-01 CPU cooling device Expired - Fee Related GB2287837B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20903794A 1994-03-09 1994-03-09

Publications (3)

Publication Number Publication Date
GB9415495D0 GB9415495D0 (en) 1994-09-21
GB2287837A GB2287837A (en) 1995-09-27
GB2287837B true GB2287837B (en) 1997-10-08

Family

ID=22777064

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9415495A Expired - Fee Related GB2287837B (en) 1994-03-09 1994-08-01 CPU cooling device

Country Status (1)

Country Link
GB (1) GB2287837B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2348277B (en) * 1996-02-01 2001-02-14 Hewlett Packard Co Fan assisted heat sink device
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
JP3942248B2 (en) 1997-02-24 2007-07-11 富士通株式会社 Heat sink and information processing apparatus equipped with the same
FR2766302B1 (en) * 1997-07-17 1999-09-24 Valeo Climatisation ELECTRIC MOTOR, ESPECIALLY A MOTOR VEHICLE, WITH COOLING RADIATOR WITH VARIABLE VANE CONFIGURATION
JP2997231B2 (en) * 1997-09-12 2000-01-11 富士通株式会社 Method for manufacturing multi-semiconductor bare chip mounting module
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
GB2415545B (en) * 2005-04-29 2006-06-28 Bestec Power Electronics Co Lt Heat dissipating device
CN101364576B (en) * 2008-09-19 2011-07-20 秦彪 Radiator for semi-conductor electronic device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
EP0572326A2 (en) * 1992-05-28 1993-12-01 Fujitsu Limited Heat sink for cooling a heat producing element and application
WO1994000727A1 (en) * 1992-06-23 1994-01-06 Pcubid Computer Technology Inc. Low profile integrated heat sink and fan assembly
WO1994004013A1 (en) * 1992-08-06 1994-02-17 Pfu Limited Cooler for heat generation device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
EP0572326A2 (en) * 1992-05-28 1993-12-01 Fujitsu Limited Heat sink for cooling a heat producing element and application
WO1994000727A1 (en) * 1992-06-23 1994-01-06 Pcubid Computer Technology Inc. Low profile integrated heat sink and fan assembly
WO1994004013A1 (en) * 1992-08-06 1994-02-17 Pfu Limited Cooler for heat generation device

Also Published As

Publication number Publication date
GB2287837A (en) 1995-09-27
GB9415495D0 (en) 1994-09-21

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20000801