GB2314920B - Heat dissipation device - Google Patents

Heat dissipation device

Info

Publication number
GB2314920B
GB2314920B GB9713341A GB9713341A GB2314920B GB 2314920 B GB2314920 B GB 2314920B GB 9713341 A GB9713341 A GB 9713341A GB 9713341 A GB9713341 A GB 9713341A GB 2314920 B GB2314920 B GB 2314920B
Authority
GB
United Kingdom
Prior art keywords
heat dissipation
dissipation device
heat
dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9713341A
Other versions
GB9713341D0 (en
GB2314920A (en
Inventor
Kazuo Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB9713341D0 publication Critical patent/GB9713341D0/en
Publication of GB2314920A publication Critical patent/GB2314920A/en
Application granted granted Critical
Publication of GB2314920B publication Critical patent/GB2314920B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H05K5/0215—Venting apertures; Constructional details thereof with semi-permeable membranes attached to casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
GB9713341A 1996-06-24 1997-06-24 Heat dissipation device Expired - Fee Related GB2314920B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8162612A JP2861945B2 (en) 1996-06-24 1996-06-24 Heat dissipation structure of sealed device

Publications (3)

Publication Number Publication Date
GB9713341D0 GB9713341D0 (en) 1997-08-27
GB2314920A GB2314920A (en) 1998-01-14
GB2314920B true GB2314920B (en) 2000-12-27

Family

ID=15757915

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9713341A Expired - Fee Related GB2314920B (en) 1996-06-24 1997-06-24 Heat dissipation device

Country Status (6)

Country Link
JP (1) JP2861945B2 (en)
CN (1) CN1121133C (en)
GB (1) GB2314920B (en)
HK (1) HK1005538A1 (en)
ID (1) ID17159A (en)
SG (1) SG54520A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19840761C1 (en) * 1998-09-07 2000-05-04 Daimler Chrysler Ag Method of manufacturing a moisture-proof pressure compensation element for a housing
JP2000353774A (en) 1999-06-11 2000-12-19 Mitsubishi Electric Corp Water evaporating-type heating body cooling device
JP2001044734A (en) * 1999-07-26 2001-02-16 Matsushita Electric Ind Co Ltd Roadside radio equipment
EP1799021B1 (en) * 2005-12-14 2012-06-06 Denso Corporation Waterproof case
FR2905511B1 (en) * 2006-09-05 2008-10-24 Radiotelephone Sfr DEHUMIDIFIER DEVICE FOR RECHARGEABLE ELECTRONIC EQUIPMENT
CN108415236A (en) * 2018-04-13 2018-08-17 广东小天才科技有限公司 Waterproof intelligent wearing equipment and casing thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH336475A (en) * 1957-06-08 1959-02-28 El Re Ma S A Per Lo Sfruttamen Electrical apparatus comprising contact parts enclosed in a non-airtight housing
US4635709A (en) * 1985-12-03 1987-01-13 The United States Of America As Represented By The Secretary Of The Air Force Dual mode heat exchanger
GB2178004A (en) * 1985-07-18 1987-02-04 Tensho Electric Ind Co Semi-conductor wafer container
EP0377067A1 (en) * 1989-01-05 1990-07-11 W.L. Gore & Associates GmbH Shut off device for a sealed housing

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03141091A (en) * 1989-10-25 1991-06-17 Hitachi Ltd Magnetic recording/reproducing device
JP3232748B2 (en) * 1993-03-05 2001-11-26 富士ゼロックス株式会社 PCB shield device
JPH08124756A (en) * 1994-10-19 1996-05-17 Meidensha Corp Dry transformer with heat radiating layer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH336475A (en) * 1957-06-08 1959-02-28 El Re Ma S A Per Lo Sfruttamen Electrical apparatus comprising contact parts enclosed in a non-airtight housing
GB2178004A (en) * 1985-07-18 1987-02-04 Tensho Electric Ind Co Semi-conductor wafer container
US4635709A (en) * 1985-12-03 1987-01-13 The United States Of America As Represented By The Secretary Of The Air Force Dual mode heat exchanger
EP0377067A1 (en) * 1989-01-05 1990-07-11 W.L. Gore & Associates GmbH Shut off device for a sealed housing

Also Published As

Publication number Publication date
ID17159A (en) 1997-12-04
HK1005538A1 (en) 1999-01-15
SG54520A1 (en) 1998-11-16
CN1171530A (en) 1998-01-28
JP2861945B2 (en) 1999-02-24
GB9713341D0 (en) 1997-08-27
GB2314920A (en) 1998-01-14
JPH1013072A (en) 1998-01-16
CN1121133C (en) 2003-09-10

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20120624