CN1171530A - Heat radiation structure of closed type device - Google Patents
Heat radiation structure of closed type device Download PDFInfo
- Publication number
- CN1171530A CN1171530A CN97112183.4A CN97112183A CN1171530A CN 1171530 A CN1171530 A CN 1171530A CN 97112183 A CN97112183 A CN 97112183A CN 1171530 A CN1171530 A CN 1171530A
- Authority
- CN
- China
- Prior art keywords
- closed type
- type device
- thermal radiation
- holes
- thin plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
- H05K5/0215—Venting apertures; Constructional details thereof with semi-permeable membranes attached to casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
In a closed type device composed of upper and lower casings 11, 12, a plurality of through holes 14 having a predetermined size d are formed at predetermined intervals in the upper and lower casings, the through holes serving to release heat from the interior of the device. A thin sheet 13 having water repellent property and air permeability and having a plurality of fine holes is adhesively attached to the inner surfaces of the upper and lower casings so as to cover all of the through holes.
Description
The present invention relates to be used for the thermal radiation arrangement of outdoor a kind of closed type device.
As a kind of heat radiation type structure that is used for outdoor closed type device, a kind of structure of the heat-pipe type cooling apparatus that has adopted, wherein have and in the sleeve pipe of thermal radiation arrangement, be provided with heat pipe with heat collecting sheet and the heat pipe that is provided with tool heat radiation fin in the structural casing outside, for example, at publication number is in the Japan Patent of No.59-43115, disclosed a kind of case shell that is used for electronic installation, it uses heat pipe to make the temperature of this device keep constant, and Figure 1A is the front view of thermal radiation around structure.Figure 1B be among Figure 1A along the profile of III-III line, Fig. 1 C is along the profile of II-II line among Figure 1A.In this prior art, top at case 1, three each three heat pipes of working under different temperatures are provided, heat collecting sheet 4 is installed in the part of the heat pipe 5 that is positioned at case shell 1, and thermal radiation plate 4a is installed in its part that is positioned at case 1 outside, heat pipe 5 gives and integrally assembles earlier heat collecting sheet 4, thermal radiation fin 4a, heat-barrier material 1a and fixed head 7 are to constitute a heat pipe assembly, assembly is fixed on housing 1 as follows, by on assembly top a formed hole put assembly into housing 1, so that corresponding to the shape of heat-barrier material 1a, fixed head 7 usefulness screws are fixed on the case shell 1.Then, the slit around the hole is fixed on assembly on the case shell 1 with the resin fill that is fit to.And, outside assembly, being provided with a sky shade, this closed type thermal radiation arrangement that is used for radio device is using.
As described in above-mentioned prior art, because heat pipe is the assembling of making to cross over the case shell, therefore the problem that exists is to install assembly and has required a sizable space, thus, the size of closed type device just becomes bigger, moreover, owing to use expensive heat pipe cooler and many building blocks, everyone will increase the workload that per hour will finish, and this has just caused the increase cost.
The objective of the invention is to propose a kind of thermal radiation structure of outdoor device of cheapness, its different heat pipe cooler.Do not require installing space, can reduce device size, heat structure is easy to manufacture, and component count also reduces in addition.
Another object of the present invention be to provide the closed type device of a kind of upper shell and the combination of lower house watertight thermal radiation arrangement, wherein be formed with a plurality of through holes and a kind of thin plate with many pores be installed on upper shell and lower house at upper encloser and lower encioser respectively, make it cover those through holes.
Further object of the present invention is to provide a kind of thermal radiation arrangement that is used for closed type device, wherein, is formed with through hole and thin plate that is formed with the network with a lot of mesh of a plurality of preliminary dimensions with predetermined space in upper encloser and lower encioser.
For a better understanding of the present invention with its advantage, now do following description in conjunction with the accompanying drawings, wherein,
Figure 1A is the front view of conventional thermal radiation arrangement;
Figure 1B is along the cutaway view of III-III line among Figure 1A;
Fig. 1 C is along the cutaway view of II-II line among Figure 1A;
Fig. 2 A is the plan view of an embodiment of thermal radiation arrangement of the present invention;
Fig. 2 B is the side view of an embodiment of thermal radiation arrangement of the present invention;
Fig. 2 C is along A-A line cutaway view partly among Fig. 2 A;
Fig. 3 is the part plan view of a thin plate of thermal radiation arrangement of the present invention.
Below, one embodiment of the present of invention will be narrated in conjunction with the accompanying drawings, Fig. 2 A, 2B and 2C have shown a thermal radiation arrangement of the present invention's one closed type device, and Fig. 2 A is that a plan view and Fig. 2 B are side views, Fig. 2 C and Fig. 2 B are a part of cutaway views, and Fig. 3 is the thin portion of a thin plate.
Shown in Fig. 2 A and 2B, thermal radiation arrangement of the present invention is by a upper shell 11, one lower house 12 and one is used for thermal-radiating thin plate 13 and forms, and above-mentioned upper encloser 11 provides a plurality of through holes 14 of predetermined space preliminary dimension d, removes to disperse the heat of thermal radiation arrangement the inside.
Shown in Fig. 2 C, lower encioser 12 has same structure and is formed with a plurality of through holes 14 therein, and above-mentioned thin plate 13 is to have anti-water characteristic by one to constitute with ventilative thin material.As shown in Figure 3, thin plate 13 provides a plurality of pore 13a and can be by the structure of hole 13a radiation housing the inside heat, but prevent that the water and the dust that come from the outside from being entered case, preferably 1 to 10 micron of the size of pore, pore is to prevent swarming into of water droplet, but allow steam to pass freely through at this, the size of water droplet (being rainwater), usually be about 2000 microns, the size of steam is 0.001 micron approximately, one width is that the splicing tape 13b of w sticks on thin plate 13 peripheries, with the thin plate 13 whole inner surfaces that stick on housing 11 and 12, makes it not cover hole 14.For thin plate 13 is bonded on the upper shell 11, with adhesive tape 13b thin plate 13 is bonded at upper encloser 11 inner surfaces, thin plate 13 has covered all holes 14 to apply.The situation of lower encioser 12 also can be handled with above-mentioned identical method.Upper shell 11 and lower house 12 are combined a closed type device, prevent swarming into of water and dust, and the heat of device can freely loose to the outside with activation.
As mentioned above, because the top board and the base plate of upper shell and lower house provide a plurality of through holes.Therefore, the heat that produces in device just can be radiated outside.In addition,, covered all through holes 14, can obtain the required watertight of outdoor device, can prevent the intrusion of dust owing to use thin plate 13 to stick on the inner surface of upper encloser 11 and lower encioser 12 with a plurality of thin through hole 13b.Because thin plate has air permeability, therefore, the heat radiation effect in the case can keep normally carrying out.
The thin plate that is formed with through hole and has many pores at upper shell and lower house is adhered to its inner surface, and since different heat pipes, getable thermal radiation effect.Therefore, a kind of thermal radiation arrangement of cheapness can accomplish to make equipment miniaturization and simplification, and this structure be assembled easily as reducing other component count.
Though, be described in detail preferred embodiment of the present invention, be interpreted as different variations, substitute and conversion does not all break away from spirit of the present invention and claim institute restricted portion.
Claims (3)
1. the thermal radiation arrangement of a closed type device, closed type device is by the same lower house watertight combination of a upper shell, it is characterized in that said upper shell and lower house are formed with a plurality of through holes respectively, and the thin plate with a plurality of pores is pasted on said upper shell and lower house respectively, so that covers all said through holes.
2. according to the thermal radiation arrangement of the said closed type device of claim 1, it is characterized in that said through hole has a size of being scheduled to and is formed with predetermined interval.
3. according to the thermal radiation arrangement of the said closed type device of claim 1, it is characterized in that said thin plate, it is to be made of the network body with a large amount of fine mesh.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8162612A JP2861945B2 (en) | 1996-06-24 | 1996-06-24 | Heat dissipation structure of sealed device |
JP162612/96 | 1996-06-24 | ||
JP162612/1996 | 1996-06-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1171530A true CN1171530A (en) | 1998-01-28 |
CN1121133C CN1121133C (en) | 2003-09-10 |
Family
ID=15757915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN97112183.4A Expired - Fee Related CN1121133C (en) | 1996-06-24 | 1997-06-23 | Heat radiation structure of closed type device |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2861945B2 (en) |
CN (1) | CN1121133C (en) |
GB (1) | GB2314920B (en) |
HK (1) | HK1005538A1 (en) |
ID (1) | ID17159A (en) |
SG (1) | SG54520A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108415236A (en) * | 2018-04-13 | 2018-08-17 | 广东小天才科技有限公司 | Waterproof intelligent wearing equipment and casing thereof |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19840761C1 (en) * | 1998-09-07 | 2000-05-04 | Daimler Chrysler Ag | Method of manufacturing a moisture-proof pressure compensation element for a housing |
JP2000353774A (en) * | 1999-06-11 | 2000-12-19 | Mitsubishi Electric Corp | Water evaporating-type heating body cooling device |
JP2001044734A (en) * | 1999-07-26 | 2001-02-16 | Matsushita Electric Ind Co Ltd | Roadside radio equipment |
US7667973B2 (en) | 2005-12-14 | 2010-02-23 | Denso Corporation | Waterproof case |
FR2905511B1 (en) * | 2006-09-05 | 2008-10-24 | Radiotelephone Sfr | DEHUMIDIFIER DEVICE FOR RECHARGEABLE ELECTRONIC EQUIPMENT |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH336475A (en) * | 1957-06-08 | 1959-02-28 | El Re Ma S A Per Lo Sfruttamen | Electrical apparatus comprising contact parts enclosed in a non-airtight housing |
US4666479A (en) * | 1985-07-18 | 1987-05-19 | Tensho Electric Industrial Co., Ltd. | Semiconductor wafer container |
US4635709A (en) * | 1985-12-03 | 1987-01-13 | The United States Of America As Represented By The Secretary Of The Air Force | Dual mode heat exchanger |
EP0377067A1 (en) * | 1989-01-05 | 1990-07-11 | W.L. Gore & Associates GmbH | Shut off device for a sealed housing |
JPH03141091A (en) * | 1989-10-25 | 1991-06-17 | Hitachi Ltd | Magnetic recording/reproducing device |
JP3232748B2 (en) * | 1993-03-05 | 2001-11-26 | 富士ゼロックス株式会社 | PCB shield device |
JPH08124756A (en) * | 1994-10-19 | 1996-05-17 | Meidensha Corp | Dry transformer with heat radiating layer |
-
1996
- 1996-06-24 JP JP8162612A patent/JP2861945B2/en not_active Expired - Fee Related
-
1997
- 1997-06-19 SG SG1997002097A patent/SG54520A1/en unknown
- 1997-06-23 CN CN97112183.4A patent/CN1121133C/en not_active Expired - Fee Related
- 1997-06-24 ID IDP972172A patent/ID17159A/en unknown
- 1997-06-24 GB GB9713341A patent/GB2314920B/en not_active Expired - Fee Related
-
1998
- 1998-06-01 HK HK98104711A patent/HK1005538A1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108415236A (en) * | 2018-04-13 | 2018-08-17 | 广东小天才科技有限公司 | Waterproof intelligent wearing equipment and casing thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2861945B2 (en) | 1999-02-24 |
GB2314920A (en) | 1998-01-14 |
GB9713341D0 (en) | 1997-08-27 |
HK1005538A1 (en) | 1999-01-15 |
SG54520A1 (en) | 1998-11-16 |
GB2314920B (en) | 2000-12-27 |
JPH1013072A (en) | 1998-01-16 |
ID17159A (en) | 1997-12-04 |
CN1121133C (en) | 2003-09-10 |
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Legal Events
Date | Code | Title | Description |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20030910 Termination date: 20120623 |