CN1171530A - Heat radiation structure of closed type device - Google Patents

Heat radiation structure of closed type device Download PDF

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Publication number
CN1171530A
CN1171530A CN97112183.4A CN97112183A CN1171530A CN 1171530 A CN1171530 A CN 1171530A CN 97112183 A CN97112183 A CN 97112183A CN 1171530 A CN1171530 A CN 1171530A
Authority
CN
China
Prior art keywords
closed type
type device
thermal radiation
holes
thin plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN97112183.4A
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Chinese (zh)
Other versions
CN1121133C (en
Inventor
小松和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of CN1171530A publication Critical patent/CN1171530A/en
Application granted granted Critical
Publication of CN1121133C publication Critical patent/CN1121133C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0213Venting apertures; Constructional details thereof
    • H05K5/0215Venting apertures; Constructional details thereof with semi-permeable membranes attached to casings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In a closed type device composed of upper and lower casings 11, 12, a plurality of through holes 14 having a predetermined size d are formed at predetermined intervals in the upper and lower casings, the through holes serving to release heat from the interior of the device. A thin sheet 13 having water repellent property and air permeability and having a plurality of fine holes is adhesively attached to the inner surfaces of the upper and lower casings so as to cover all of the through holes.

Description

The thermal radiation arrangement of closed type device
The present invention relates to be used for the thermal radiation arrangement of outdoor a kind of closed type device.
As a kind of heat radiation type structure that is used for outdoor closed type device, a kind of structure of the heat-pipe type cooling apparatus that has adopted, wherein have and in the sleeve pipe of thermal radiation arrangement, be provided with heat pipe with heat collecting sheet and the heat pipe that is provided with tool heat radiation fin in the structural casing outside, for example, at publication number is in the Japan Patent of No.59-43115, disclosed a kind of case shell that is used for electronic installation, it uses heat pipe to make the temperature of this device keep constant, and Figure 1A is the front view of thermal radiation around structure.Figure 1B be among Figure 1A along the profile of III-III line, Fig. 1 C is along the profile of II-II line among Figure 1A.In this prior art, top at case 1, three each three heat pipes of working under different temperatures are provided, heat collecting sheet 4 is installed in the part of the heat pipe 5 that is positioned at case shell 1, and thermal radiation plate 4a is installed in its part that is positioned at case 1 outside, heat pipe 5 gives and integrally assembles earlier heat collecting sheet 4, thermal radiation fin 4a, heat-barrier material 1a and fixed head 7 are to constitute a heat pipe assembly, assembly is fixed on housing 1 as follows, by on assembly top a formed hole put assembly into housing 1, so that corresponding to the shape of heat-barrier material 1a, fixed head 7 usefulness screws are fixed on the case shell 1.Then, the slit around the hole is fixed on assembly on the case shell 1 with the resin fill that is fit to.And, outside assembly, being provided with a sky shade, this closed type thermal radiation arrangement that is used for radio device is using.
As described in above-mentioned prior art, because heat pipe is the assembling of making to cross over the case shell, therefore the problem that exists is to install assembly and has required a sizable space, thus, the size of closed type device just becomes bigger, moreover, owing to use expensive heat pipe cooler and many building blocks, everyone will increase the workload that per hour will finish, and this has just caused the increase cost.
The objective of the invention is to propose a kind of thermal radiation structure of outdoor device of cheapness, its different heat pipe cooler.Do not require installing space, can reduce device size, heat structure is easy to manufacture, and component count also reduces in addition.
Another object of the present invention be to provide the closed type device of a kind of upper shell and the combination of lower house watertight thermal radiation arrangement, wherein be formed with a plurality of through holes and a kind of thin plate with many pores be installed on upper shell and lower house at upper encloser and lower encioser respectively, make it cover those through holes.
Further object of the present invention is to provide a kind of thermal radiation arrangement that is used for closed type device, wherein, is formed with through hole and thin plate that is formed with the network with a lot of mesh of a plurality of preliminary dimensions with predetermined space in upper encloser and lower encioser.
For a better understanding of the present invention with its advantage, now do following description in conjunction with the accompanying drawings, wherein,
Figure 1A is the front view of conventional thermal radiation arrangement;
Figure 1B is along the cutaway view of III-III line among Figure 1A;
Fig. 1 C is along the cutaway view of II-II line among Figure 1A;
Fig. 2 A is the plan view of an embodiment of thermal radiation arrangement of the present invention;
Fig. 2 B is the side view of an embodiment of thermal radiation arrangement of the present invention;
Fig. 2 C is along A-A line cutaway view partly among Fig. 2 A;
Fig. 3 is the part plan view of a thin plate of thermal radiation arrangement of the present invention.
Below, one embodiment of the present of invention will be narrated in conjunction with the accompanying drawings, Fig. 2 A, 2B and 2C have shown a thermal radiation arrangement of the present invention's one closed type device, and Fig. 2 A is that a plan view and Fig. 2 B are side views, Fig. 2 C and Fig. 2 B are a part of cutaway views, and Fig. 3 is the thin portion of a thin plate.
Shown in Fig. 2 A and 2B, thermal radiation arrangement of the present invention is by a upper shell 11, one lower house 12 and one is used for thermal-radiating thin plate 13 and forms, and above-mentioned upper encloser 11 provides a plurality of through holes 14 of predetermined space preliminary dimension d, removes to disperse the heat of thermal radiation arrangement the inside.
Shown in Fig. 2 C, lower encioser 12 has same structure and is formed with a plurality of through holes 14 therein, and above-mentioned thin plate 13 is to have anti-water characteristic by one to constitute with ventilative thin material.As shown in Figure 3, thin plate 13 provides a plurality of pore 13a and can be by the structure of hole 13a radiation housing the inside heat, but prevent that the water and the dust that come from the outside from being entered case, preferably 1 to 10 micron of the size of pore, pore is to prevent swarming into of water droplet, but allow steam to pass freely through at this, the size of water droplet (being rainwater), usually be about 2000 microns, the size of steam is 0.001 micron approximately, one width is that the splicing tape 13b of w sticks on thin plate 13 peripheries, with the thin plate 13 whole inner surfaces that stick on housing 11 and 12, makes it not cover hole 14.For thin plate 13 is bonded on the upper shell 11, with adhesive tape 13b thin plate 13 is bonded at upper encloser 11 inner surfaces, thin plate 13 has covered all holes 14 to apply.The situation of lower encioser 12 also can be handled with above-mentioned identical method.Upper shell 11 and lower house 12 are combined a closed type device, prevent swarming into of water and dust, and the heat of device can freely loose to the outside with activation.
As mentioned above, because the top board and the base plate of upper shell and lower house provide a plurality of through holes.Therefore, the heat that produces in device just can be radiated outside.In addition,, covered all through holes 14, can obtain the required watertight of outdoor device, can prevent the intrusion of dust owing to use thin plate 13 to stick on the inner surface of upper encloser 11 and lower encioser 12 with a plurality of thin through hole 13b.Because thin plate has air permeability, therefore, the heat radiation effect in the case can keep normally carrying out.
The thin plate that is formed with through hole and has many pores at upper shell and lower house is adhered to its inner surface, and since different heat pipes, getable thermal radiation effect.Therefore, a kind of thermal radiation arrangement of cheapness can accomplish to make equipment miniaturization and simplification, and this structure be assembled easily as reducing other component count.
Though, be described in detail preferred embodiment of the present invention, be interpreted as different variations, substitute and conversion does not all break away from spirit of the present invention and claim institute restricted portion.

Claims (3)

1. the thermal radiation arrangement of a closed type device, closed type device is by the same lower house watertight combination of a upper shell, it is characterized in that said upper shell and lower house are formed with a plurality of through holes respectively, and the thin plate with a plurality of pores is pasted on said upper shell and lower house respectively, so that covers all said through holes.
2. according to the thermal radiation arrangement of the said closed type device of claim 1, it is characterized in that said through hole has a size of being scheduled to and is formed with predetermined interval.
3. according to the thermal radiation arrangement of the said closed type device of claim 1, it is characterized in that said thin plate, it is to be made of the network body with a large amount of fine mesh.
CN97112183.4A 1996-06-24 1997-06-23 Heat radiation structure of closed type device Expired - Fee Related CN1121133C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8162612A JP2861945B2 (en) 1996-06-24 1996-06-24 Heat dissipation structure of sealed device
JP162612/1996 1996-06-24
JP162612/96 1996-06-24

Publications (2)

Publication Number Publication Date
CN1171530A true CN1171530A (en) 1998-01-28
CN1121133C CN1121133C (en) 2003-09-10

Family

ID=15757915

Family Applications (1)

Application Number Title Priority Date Filing Date
CN97112183.4A Expired - Fee Related CN1121133C (en) 1996-06-24 1997-06-23 Heat radiation structure of closed type device

Country Status (6)

Country Link
JP (1) JP2861945B2 (en)
CN (1) CN1121133C (en)
GB (1) GB2314920B (en)
HK (1) HK1005538A1 (en)
ID (1) ID17159A (en)
SG (1) SG54520A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108415236A (en) * 2018-04-13 2018-08-17 广东小天才科技有限公司 Waterproof intelligent wearable device and its casing

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19840761C1 (en) * 1998-09-07 2000-05-04 Daimler Chrysler Ag Method of manufacturing a moisture-proof pressure compensation element for a housing
JP2000353774A (en) 1999-06-11 2000-12-19 Mitsubishi Electric Corp Water evaporating-type heating body cooling device
JP2001044734A (en) * 1999-07-26 2001-02-16 Matsushita Electric Ind Co Ltd Roadside radio equipment
EP1799021B1 (en) * 2005-12-14 2012-06-06 Denso Corporation Waterproof case
FR2905511B1 (en) * 2006-09-05 2008-10-24 Radiotelephone Sfr DEHUMIDIFIER DEVICE FOR RECHARGEABLE ELECTRONIC EQUIPMENT

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH336475A (en) * 1957-06-08 1959-02-28 El Re Ma S A Per Lo Sfruttamen Electrical apparatus comprising contact parts enclosed in a non-airtight housing
US4666479A (en) * 1985-07-18 1987-05-19 Tensho Electric Industrial Co., Ltd. Semiconductor wafer container
US4635709A (en) * 1985-12-03 1987-01-13 The United States Of America As Represented By The Secretary Of The Air Force Dual mode heat exchanger
EP0377067A1 (en) * 1989-01-05 1990-07-11 W.L. Gore & Associates GmbH Shut off device for a sealed housing
JPH03141091A (en) * 1989-10-25 1991-06-17 Hitachi Ltd Magnetic recording/reproducing device
JP3232748B2 (en) * 1993-03-05 2001-11-26 富士ゼロックス株式会社 PCB shield device
JPH08124756A (en) * 1994-10-19 1996-05-17 Meidensha Corp Dry transformer with heat radiating layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108415236A (en) * 2018-04-13 2018-08-17 广东小天才科技有限公司 Waterproof intelligent wearable device and its casing

Also Published As

Publication number Publication date
GB2314920A (en) 1998-01-14
CN1121133C (en) 2003-09-10
JPH1013072A (en) 1998-01-16
ID17159A (en) 1997-12-04
GB2314920B (en) 2000-12-27
SG54520A1 (en) 1998-11-16
JP2861945B2 (en) 1999-02-24
HK1005538A1 (en) 1999-01-15
GB9713341D0 (en) 1997-08-27

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20030910

Termination date: 20120623