ID17159A - STRUCTURED HEAT STRUCTURE TOOL CLOSED TYPE. - Google Patents

STRUCTURED HEAT STRUCTURE TOOL CLOSED TYPE.

Info

Publication number
ID17159A
ID17159A IDP972172A ID972172A ID17159A ID 17159 A ID17159 A ID 17159A ID P972172 A IDP972172 A ID P972172A ID 972172 A ID972172 A ID 972172A ID 17159 A ID17159 A ID 17159A
Authority
ID
Indonesia
Prior art keywords
closed type
heat structure
structure tool
structured heat
tool closed
Prior art date
Application number
IDP972172A
Other languages
Indonesian (id)
Inventor
Kazuo Komatsu
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Publication of ID17159A publication Critical patent/ID17159A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H05K5/0215—Venting apertures; Constructional details thereof with semi-permeable membranes attached to casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
IDP972172A 1996-06-24 1997-06-24 STRUCTURED HEAT STRUCTURE TOOL CLOSED TYPE. ID17159A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8162612A JP2861945B2 (en) 1996-06-24 1996-06-24 Heat dissipation structure of sealed device

Publications (1)

Publication Number Publication Date
ID17159A true ID17159A (en) 1997-12-04

Family

ID=15757915

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP972172A ID17159A (en) 1996-06-24 1997-06-24 STRUCTURED HEAT STRUCTURE TOOL CLOSED TYPE.

Country Status (6)

Country Link
JP (1) JP2861945B2 (en)
CN (1) CN1121133C (en)
GB (1) GB2314920B (en)
HK (1) HK1005538A1 (en)
ID (1) ID17159A (en)
SG (1) SG54520A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19840761C1 (en) * 1998-09-07 2000-05-04 Daimler Chrysler Ag Method of manufacturing a moisture-proof pressure compensation element for a housing
JP2000353774A (en) 1999-06-11 2000-12-19 Mitsubishi Electric Corp Water evaporating-type heating body cooling device
JP2001044734A (en) * 1999-07-26 2001-02-16 Matsushita Electric Ind Co Ltd Roadside radio equipment
EP1799021B1 (en) * 2005-12-14 2012-06-06 Denso Corporation Waterproof case
FR2905511B1 (en) * 2006-09-05 2008-10-24 Radiotelephone Sfr DEHUMIDIFIER DEVICE FOR RECHARGEABLE ELECTRONIC EQUIPMENT
CN108415236A (en) * 2018-04-13 2018-08-17 广东小天才科技有限公司 Waterproof intelligent wearable device and its casing

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH336475A (en) * 1957-06-08 1959-02-28 El Re Ma S A Per Lo Sfruttamen Electrical apparatus comprising contact parts enclosed in a non-airtight housing
US4666479A (en) * 1985-07-18 1987-05-19 Tensho Electric Industrial Co., Ltd. Semiconductor wafer container
US4635709A (en) * 1985-12-03 1987-01-13 The United States Of America As Represented By The Secretary Of The Air Force Dual mode heat exchanger
EP0377067A1 (en) * 1989-01-05 1990-07-11 W.L. Gore & Associates GmbH Shut off device for a sealed housing
JPH03141091A (en) * 1989-10-25 1991-06-17 Hitachi Ltd Magnetic recording/reproducing device
JP3232748B2 (en) * 1993-03-05 2001-11-26 富士ゼロックス株式会社 PCB shield device
JPH08124756A (en) * 1994-10-19 1996-05-17 Meidensha Corp Dry transformer with heat radiating layer

Also Published As

Publication number Publication date
CN1171530A (en) 1998-01-28
GB2314920A (en) 1998-01-14
CN1121133C (en) 2003-09-10
JPH1013072A (en) 1998-01-16
GB2314920B (en) 2000-12-27
SG54520A1 (en) 1998-11-16
JP2861945B2 (en) 1999-02-24
HK1005538A1 (en) 1999-01-15
GB9713341D0 (en) 1997-08-27

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